Chip suction nozzle assembly with low damage rate
By introducing buffering and adjustment mechanisms into the chip nozzle assembly, the stability of the nozzle assembly under external impact and vibration is solved, and a longer service life and higher absorption efficiency are achieved, adapting to the needs of different chip shapes.
Patent Information
- Application Number
- CN202420937385.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-30
AI Technical Summary
The existing chip nozzle assembly is prone to damage under external impact or pressure, resulting in reduced equipment stability and shortened service life. The lack of fine-tuning mechanism design leads to unstable absorption efficiency, affecting the quality and efficiency of chip manufacturing.
A low-damage rate chip nozzle assembly including a buffer mechanism and a regulating mechanism is designed. The regulating mechanism reduces damage to the nozzle head through a buffer groove and a regulating spring. The regulating mechanism realizes fine adjustment of the nozzle tube and air cavity capacity control through a knob and a damping spring. .
It extends the service cycle of the suction nozzle head, improves the stability and suction efficiency of the equipment, and can adapt to chips of different shapes to ensure the accuracy of suction efficiency and quantity.
Smart Images

Figure CN222138045U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing and sorting, in particular to a chip suction nozzle component with a low damage rate. Background Art
[0002] In the chip manufacturing industry, nozzle assemblies are an important device for handling and transferring chips. They are usually used in automated assembly lines to move chips from one location to another, or to handle chips in different processing steps;
[0003] However, the nozzle head is easily damaged when subjected to external impact or pressure, resulting in decreased equipment stability, shortened service life, and increased maintenance costs. The lack of a fine-tuning mechanism design makes it difficult to accurately control the air cavity capacity inside the nozzle tube, resulting in unstable suction efficiency. Over- or under-suction may occur, affecting the quality and efficiency of chip manufacturing. The lack of a damping spring and a fine-tuning mechanism design makes the equipment susceptible to external vibrations during operation, resulting in instability of the fixing rod, affecting the precise positioning and suction efficiency of the nozzle body. In view of this, we propose a chip nozzle assembly with a low damage rate to solve the existing problems. Utility Model Content
[0004] The utility model aims to provide a chip suction nozzle assembly with a low damage rate to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip suction nozzle assembly with a low damage rate, comprising a suction nozzle body, a suction nozzle tube, an adjustment mechanism, a mounting piece, a buffer mechanism and a suction nozzle head, wherein a suction nozzle tube is arranged on one side of the suction nozzle body, and a mounting piece is arranged on a side of the suction nozzle body away from the suction nozzle tube, an adjustment mechanism for threaded adjustment is arranged on the upper side of the suction nozzle body, and a buffer mechanism is arranged below the suction nozzle body, and the suction nozzle tube is connected to an external air pump;
[0006] The buffer mechanism includes a fixed seat, a mounting seat, a buffer groove, a buffer spring and a groove. A fixed seat is arranged under the suction nozzle body, and sliding grooves are opened on both sides of the fixed seat. The fixed seat is slidably connected to the mounting seat through the sliding grooves. The inner surface of the mounting seat is a threaded structure, and the suction nozzle head is threadedly connected to the mounting seat.
[0007] Preferably, a buffer groove is provided in the fixing seat, and a groove is also provided on the outer wall of the buffer groove of the mounting seat, a buffer spring is provided in the groove, and a connecting pipe is provided in the fixing seat.
[0008] Preferably, the adjustment mechanism includes a knob, a rotating shaft, a fixed block, a threaded rod, a damping spring, a guide block, a fixed rod, a fixed plate, a top block and a connecting groove, a rotating shaft is provided on the upper side of the suction nozzle body, a knob is movably connected to the upper side of the rotating shaft, a fixed block is provided in the knob, and a guide block is provided in the suction nozzle body, a fixed rod is slidably connected to the guide block, a threaded rod is fixedly connected to the upper side of the fixed rod, and a fixed plate is provided between the threaded rod and the fixed rod.
[0009] Preferably, the interior of the fixing block is a threaded structure, and the threads of the fixing block and the threaded rod cooperate with each other, and a damping spring is arranged on the fixing rod between the fixing plate and the guide block.
[0010] Preferably, a top block is provided on a side of the fixing rod away from the fixing block, and a connecting groove is provided in the connecting pipe, and the top block and the connecting groove cooperate with each other.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] 1. The design of the buffer mechanism enables the nozzle head under the nozzle body to reduce damage through the buffer groove and buffer spring when it is subjected to external impact or pressure, thereby protecting the stability and life of the nozzle head and extending its service life. At the same time, by rotating the nozzle head, the nozzle head can be threaded on the mounting seat, and then the nozzle head can be replaced to adapt to chips of different shapes.
[0013] 2. The operator can drive the fixed block to rotate by manually turning the knob, and the fixed block cooperates with the threaded rod thread, thereby driving the fixed rod to move vertically in the guide block. The damping spring is installed between the fixed plate and the guide block, which provides a certain elastic support and buffering effect, which helps to maintain the stability of the fixed rod and reduce unnecessary vibration caused by external force. The fixed rod is vertically downward to make the top block and the connecting groove of the connecting pipe cooperate with each other, which can be used to accurately fine-tune the nozzle tube of the nozzle body and adjust the internal air cavity capacity of the nozzle tube. The operator can accurately control the suction efficiency and suction volume of the nozzle body to meet the absorption of different chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0015] Figure 2 It is a side view of the nozzle body of the utility model;
[0016] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure along the AA direction;
[0017] Figure 4 for Figure 3 Schematic diagram of the locally enlarged structure of A in the middle.
[0018] In the figure: 1. nozzle body; 2. nozzle tube; 3. adjustment mechanism; 301. knob; 302. rotating shaft; 303. fixed block; 304. threaded rod; 305. damping spring; 306. guide block; 307. fixed rod; 308. fixed plate; 309. top block; 310. connecting groove; 4. mounting part; 5. buffer mechanism; 501. fixed seat; 502. mounting seat; 503. buffer groove; 504. buffer spring; 505. groove; 6. nozzle head; 7. connecting tube. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.
[0020] like Figure 1-Figure 4 As shown, the present invention proposes a chip nozzle assembly with a low damage rate, comprising a nozzle body 1, a nozzle tube 2, an adjustment mechanism 3, a mounting member 4, a buffer mechanism 5 and a nozzle head 6, wherein the nozzle body 1 is provided with a nozzle tube 2 on one side, and a mounting member 4 is provided on a side of the nozzle body 1 away from the nozzle tube 2, a threaded adjustment mechanism 3 is provided on the upper side of the nozzle body 1, and a buffer mechanism 5 is provided below the nozzle body 1, and the nozzle tube 2 is connected to an external air pump;
[0021] The buffer mechanism 5 includes a fixed seat 501, a mounting seat 502, a buffer groove 503, a buffer spring 504 and a groove 505. The fixed seat 501 is arranged below the suction nozzle body 1. Sliding grooves 506 are opened on both sides of the fixed seat 501. The fixed seat 501 is slidably connected to the mounting seat 502 through the sliding grooves 506. The inner surface of the mounting seat 502 is a threaded structure, and the suction nozzle head 6 is threadedly connected to the mounting seat 502.
[0022] In an optional embodiment, a buffer groove 503 is provided in the fixing seat 501, and a groove 505 is provided on the outer wall of the buffer groove 503 of the mounting seat 502, a buffer spring 504 is provided in the groove 505, and a connecting pipe 7 is provided in the fixing seat 501;
[0023] The design of the buffer mechanism 5 enables the nozzle head 6 below the nozzle body 1 to reduce damage through the buffer groove 503 and the buffer spring 504 when subjected to external impact or pressure, thereby protecting the stability and life of the nozzle head 6 and extending its service life. At the same time, by rotating the nozzle head 6, the nozzle head 6 can be threadedly rotated on the mounting seat 502, and then the nozzle head 6 can be replaced to adapt to chips of different shapes.
[0024] In an optional embodiment, the adjustment mechanism 3 includes a knob 301, a rotating shaft 302, a fixed block 303, a threaded rod 304, a damping spring 305, a guide block 306, a fixed rod 307, a fixed plate 308, a top block 309 and a connecting groove 310, and a rotating shaft 302 is arranged on the upper side of the suction nozzle body 1, and the knob 301 is movably connected to the upper side of the rotating shaft 302, a fixed block 303 is arranged in the knob 301, and a guide block 306 is arranged in the suction nozzle body 1, a fixed rod 307 is slidably connected to the guide block 306, a threaded rod 304 is fixedly connected to the upper side of the fixed rod 307, and a fixed plate 308 is arranged between the threaded rod 304 and the fixed rod 307.
[0025] In an optional embodiment, the interior of the fixing block 303 is a threaded structure, and the threads of the fixing block 303 and the threaded rod 304 cooperate with each other, and a damping spring 305 is provided on the fixing rod 307 between the fixing plate 308 and the guide block 306 .
[0026] In an optional embodiment, a top block 309 is provided on a side of the fixing rod 307 away from the fixing block 303, and a connecting groove 310 is provided in the connecting pipe 7, and the top block 309 and the connecting groove 310 cooperate with each other;
[0027] The operator can drive the fixed block 303 to rotate by manually turning the knob 301, and the fixed block 303 and the threaded rod 304 threads cooperate with each other, thereby driving the fixed rod 307 to move vertically in the guide block 306. The damping spring 305 is installed between the fixed plate 308 and the guide block 306, which provides a certain elastic support and buffering effect, which helps to maintain the stability of the fixed rod 307 and reduce unnecessary vibration caused by external forces. The fixed rod 307 vertically downward makes the top block 309 cooperate with the connecting groove 310 of the connecting tube 7, which can be used to accurately fine-tune the nozzle tube 2 of the nozzle body 1 and adjust the internal air cavity capacity of the nozzle tube 2. The operator can accurately control the suction efficiency and suction volume of the nozzle body 1 to meet the absorption of different chips.
[0028] The working principle of the utility model is as follows: when using the device, the operator can drive the fixed block 303 to rotate by manually turning the knob 301, and the fixed block 303 and the threaded rod 304 threads cooperate with each other, thereby driving the fixed rod 307 to move vertically in the guide block 306. The damping spring 305 is installed between the fixed plate 308 and the guide block 306, which provides a certain elastic support and buffering effect, which helps to maintain the stability of the fixed rod 307 and reduce unnecessary vibration caused by external forces. The fixed rod 307 vertically downward makes the top block 309 cooperate with the connecting groove 310 of the connecting pipe 7, which can be used In order to accurately fine-tune the nozzle tube 2 of the nozzle body 1 and adjust the internal air cavity capacity of the nozzle tube 2 for control, the operator can accurately control the suction efficiency and suction volume of the nozzle body 1 to meet the absorption of different chips. The design of the buffer mechanism 5 enables the nozzle head 6 under the nozzle body 1 to reduce damage through the buffer groove 503 and the buffer spring 504 when subjected to external impact or pressure, thereby protecting the stability and life of the nozzle head 6 and extending its service life. At the same time, by rotating the nozzle head 6, the nozzle head 6 can be threadedly rotated on the mounting seat 502, and then the nozzle head 6 can be replaced to adapt to chips of different shapes.
[0029] It should be understood that the above specific embodiments of the present invention are used to illustrate or explain the principles of the present invention, and do not constitute a limitation on the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the claims attached to the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the attached claims, or the equivalent forms of such scope and boundaries.
Claims
1. A chip nozzle assembly with low damage rate, characterized in that: The invention comprises a nozzle body (1), a nozzle tube (2), an adjustment mechanism (3), a mounting member (4), a buffer mechanism (5) and a nozzle head (6); the nozzle body (1) is provided with a nozzle tube (2) on one side, and the nozzle body (1) is provided with a mounting member (4) on a side away from the nozzle tube (2); the nozzle body (1) is provided with an adjustment mechanism (3) with a threaded adjustment on the upper side, and the nozzle body (1) is provided with a buffer mechanism (5) on the lower side; the nozzle tube (2) is connected to an external air pump; The buffer mechanism (5) comprises a fixed seat (501), a mounting seat (502), a buffer groove (503), a buffer spring (504) and a groove (505); a fixed seat (501) is arranged below the suction nozzle body (1); sliding grooves (506) are provided on both sides of the fixed seat (501); the fixed seat (501) is slidably connected to the mounting seat (502) via the sliding grooves (506); the inner surface of the mounting seat (502) is in a threaded structure, and the suction nozzle head (6) is threadedly connected to the mounting seat (502).
2. The chip suction nozzle assembly with low damage rate according to claim 1, characterized in that: The fixing seat (501) is provided with a buffer groove (503), and the mounting seat (502) is also provided with a groove (505) on the outer wall of the buffer groove (503), a buffer spring (504) is arranged in the groove (505), and a connecting pipe (7) is arranged in the fixing seat (501).
3. The chip suction nozzle assembly with low damage rate according to claim 1, characterized in that: The adjusting mechanism (3) comprises a knob (301), a rotating shaft (302), a fixing block (303), a threaded rod (304), a damping spring (305), a guide block (306), a fixing rod (307), a fixing plate (308), a top block (309) and a connecting groove (310); a rotating shaft (302) is arranged on the upper side of the suction nozzle body (1); the rotating shaft (302) is movably connected to the upper side of the rotating shaft (302); a fixing block (303) is arranged inside the knob (301); a guide block (306) is arranged inside the suction nozzle body (1); a fixing rod (307) is slidably connected to the guide block (306); a threaded rod (304) is fixedly connected to the upper side of the fixing rod (307); and a fixing plate (308) is arranged between the threaded rod (304) and the fixing rod (307).
4. The chip suction nozzle assembly with low damage rate according to claim 3, characterized in that: The interior of the fixing block (303) is in a threaded structure, and the threads of the fixing block (303) and the threaded rod (304) cooperate with each other, and a damping spring (305) is arranged on the fixing rod (307) between the fixing plate (308) and the guide block (306).
5. A chip suction nozzle assembly with low damage rate according to claim 4, characterized in that: A top block (309) is provided on the side of the fixing rod (307) away from the fixing block (303), and a connecting groove (310) is provided in the connecting pipe (7), and the top block (309) and the connecting groove (310) cooperate with each other.
