Laser light source device for LED (light-emitting diode) patch packaging

Abstract

The utility model relates to the technical field of laser light sources, and discloses an LED paster packaged laser light source device which comprises a box body, a main groove is formed in one side of the upper surface of the box body, an auxiliary groove is formed in the other side of the upper surface of the box body, a semiconductor laser chip is fixedly connected to the inner bottom wall of the main groove, and the semiconductor laser chip is fixedly connected to the inner bottom wall of the auxiliary groove. Protection assemblies are fixedly connected to the two sides of the outer surface of the box body; through the arrangement of the protection assembly and the vibration isolation foot pad, vibration transmission between the bottom of the device and a mounting surface is reduced, the fixing stability is improved, when the cushioning roller is subjected to lateral impact, the cushioning roller can rotate along the auxiliary bearing, change the transmission direction of force and conduct cushioning and force unloading, protection on the whole device is improved, and the service life of the cushioning roller is prolonged. Impact force is prevented from directly acting on the outer surface of the device, meanwhile, the servo motor drives the heat dissipation fan blades to rotate, wind power is generated to conduct auxiliary heat dissipation on the light source device, the overall heat dissipation performance is improved, the junction temperature is reduced, and the service life of the device is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of laser light sources, in particular to a laser light source device packaged with an LED chip. Background Art

[0002] The SMD packaged laser light source device is a SMD lighting device that uses laser light source technology. This device usually packages the laser light source chip in a small SMD package, which can be easily applied to various lighting scenarios. In actual use, the laser light source has the characteristics of high light efficiency and high brightness, and can provide excellent lighting effects.

[0003] In existing laser light source devices, since the optical elements and electronic devices inside the laser light source device are sensitive to shock and vibration, if the laser light source device is subjected to vibration and shock during transportation, installation and use, it will cause damage to the entire internal components, thereby affecting the service life of the equipment. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a laser light source device packaged with an LED chip.

[0005] The utility model is implemented by the following technical scheme: a laser light source device of LED patch packaging, comprising a box body, a main groove is opened on one side of the upper surface of the box body, a secondary groove is opened on the other side of the upper surface of the box body, a semiconductor laser chip is fixedly connected to the inner bottom wall of the main groove, and protective components are fixedly connected to both sides of the outer surface of the box body;

[0006] The protection component includes a vibration isolation pad, both sides of the upper surface of the vibration isolation pad are rotatably connected to a damping roller through auxiliary bearings, the top of the damping roller is rotatably connected to an extension block, and a plurality of packaging brackets are fixedly connected to the middle of the upper surface of the vibration isolation pad, and the top of the packaging bracket is fixedly connected to the outer surface of the box.

[0007] Through the above technical scheme, the vibration isolation pads are set up to reduce the vibration transmission between the bottom of the device and the installation surface, thereby improving the stability of the system. When the shock-absorbing roller is subjected to a lateral impact, it will rotate along the auxiliary bearing to change the direction of force transmission, perform the shock-absorbing and force-unloading function, and improve the overall protection of the light source device. The packaging bracket can further provide anti-collision protection for the light source device to prevent external forces from directly acting on the outer surface of the light source device.

[0008] As a further improvement of the above solution, the inner bottom wall of the auxiliary groove is provided with a plurality of conductive blocks, and the semiconductor laser chip is fixedly connected to the surface of the conductive blocks through metal wires.

[0009] Through the above technical solution, the semiconductor laser chip is connected to the conductive block through a metal wire. When the conductive block is energized, the semiconductor laser chip can emit light, and the semiconductor laser chip can generate a high-brightness laser beam, which can be used in various scenarios with high-brightness requirements, such as lighting, display, communication, etc.

[0010] As a further improvement of the above solution, a support frame is sleeved on the outer surface of the metal wire, and the bottom of the support frame is fixedly connected to the upper surface of the box.

[0011] Through the above technical solution, the support frame can fix the metal wire to prevent the metal wire from loosening and shifting due to external force impact, thereby ensuring the stability of the metal wire fixation.

[0012] As a further improvement of the above solution, a mounting seat is fixedly connected to one side of the upper surface of the box body, and an auxiliary groove is opened on the top of one side of the mounting seat.

[0013] Through the above technical solution, an auxiliary groove is opened inside the mounting seat, which can protect the device installed in the auxiliary groove, avoid the problem that the device is directly exposed to the outside and is susceptible to external impact, protect the device and extend its service life.

[0014] As a further improvement of the above solution, a servo motor is fixedly connected to the middle of the inner bottom wall of the auxiliary groove, a transmission shaft is fixedly connected to the output end of the servo motor, and a heat dissipation fan blade is fixedly connected to one end of the transmission shaft.

[0015] Through the above technical solution, the servo motor is started to drive the transmission shaft to rotate, and the transmission shaft drives the heat dissipation fan blades to rotate, thereby generating wind force, which assists in cooling the light source device, improves the overall heat dissipation performance, reduces the junction temperature, and extends the service life of the device.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The utility model provides a protective component and a vibration isolation foot pad, so that the bottom of the device reduces the vibration transmission between the mounting surface and the fixing stability, and the damping roller will rotate along the auxiliary bearing when subjected to a lateral impact, so as to change the force transmission direction, perform damping and force unloading, and improve the protection of the entire device, and avoid the impact force directly acting on the outer surface of the device. At the same time, the servo motor drives the heat dissipation fan blades to rotate, and generates wind force to assist in the heat dissipation of the light source device, thereby improving the overall heat dissipation performance, reducing the junction temperature, and extending the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the structure of the utility model;

[0020] Figure 3 It is a schematic diagram of the structure of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the protective component of the utility model.

[0022] Description of main symbols:

[0023] 1. Box body; 2. Main slot; 3. Sub-slot; 4. Semiconductor laser chip; 5. Protection component; 501. Vibration isolation pad; 502. Auxiliary bearing; 503. Shock-absorbing roller; 504. Extension block; 505. Packaging bracket; 6. Conductive block; 7. Metal wire; 8. Support frame; 9. Mounting seat; 10. Auxiliary groove; 11. Servo motor; 12. Drive shaft; 13. Cooling fan blades. DETAILED DESCRIPTION

[0024] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0025] Example:

[0026] Please combine Figure 1-4 The laser light source device of an LED chip package of the present embodiment comprises a box body 1, a main groove 2 is formed on one side of the upper surface of the box body 1, a secondary groove 3 is formed on the other side of the upper surface of the box body 1, a semiconductor laser chip 4 is fixedly connected to the inner bottom wall of the main groove 2, and protective components 5 are fixedly connected to both sides of the outer surface of the box body 1;

[0027] The protection component 5 includes a vibration isolation pad 501, both sides of the upper surface of the vibration isolation pad 501 are rotatably connected to a shock absorbing roller 503 through an auxiliary bearing 502, the top of the shock absorbing roller 503 is rotatably connected to an extension block 504, and a plurality of packaging brackets 505 are fixedly connected to the middle of the upper surface of the vibration isolation pad 501, and the top of the packaging bracket 505 is fixedly connected to the outer surface of the box body 1. Through the provision of the vibration isolation pad 501, the vibration transmission between the bottom of the device and the mounting surface is reduced, thereby improving the stability of the system, and when the shock absorbing roller 503 is subjected to a lateral impact, it will rotate along the auxiliary bearing 502 to change the direction of force transmission, perform a shock absorbing and force unloading function, and improve the overall protection of the light source device, and the packaging bracket 505 can further provide anti-collision protection for the light source device to prevent external forces from directly acting on the outer surface of the light source device.

[0028] The inner bottom wall of the sub-groove 3 is provided with a plurality of conductive blocks 6, and the semiconductor laser chip 4 is fixedly connected to the surface of the conductive block 6 through a metal wire 7. The semiconductor laser chip 4 is connected to the conductive block 6 through the metal wire 7. When the conductive block 6 is energized, the semiconductor laser chip 4 can emit light, and the semiconductor laser chip 4 can generate a high-brightness laser beam, which can be suitable for various scenarios with high-brightness requirements, such as lighting, display, communication, etc.

[0029] The outer surface of the metal wire 7 is sleeved with a support frame 8, and the bottom of the support frame 8 is fixedly connected to the upper surface of the box body 1. The support frame 8 can fix the metal wire 7 to prevent the metal wire 7 from loosening and shifting due to external force impact, thereby ensuring the stability of the fixation of the metal wire 7.

[0030] A mounting seat 9 is fixedly connected to one side of the upper surface of the box body 1, an auxiliary groove 10 is opened at the top of one side of the mounting seat 9, and an auxiliary groove 10 is opened inside the mounting seat 9, which can protect the components installed in the auxiliary groove 10, avoid the problem that the components are directly exposed to the outside and are easily impacted by external forces, protect the components, and extend the service life.

[0031] A servo motor 11 is fixedly connected to the middle part of the inner bottom wall of the auxiliary groove 10, and a transmission shaft 12 is fixedly connected to the output end of the servo motor 11, and a heat dissipation fan blade 13 is fixedly connected to one end of the transmission shaft 12. The servo motor 11 is started to drive the transmission shaft 12 to rotate, and the transmission shaft 12 drives the heat dissipation fan blade 13 to rotate, thereby generating wind force to assist in the heat dissipation of the light source device, improve the overall heat dissipation performance, reduce the junction temperature, and extend the service life of the device.

[0032] The implementation principle of a laser light source device of an LED patch package in the embodiment of the present application is as follows: first, the semiconductor laser chip 4 is connected to the conductive block 6 through the metal wire 7, and the support frame 8 can fix the metal wire 7 to prevent the metal wire 7 from loosening and shifting due to external force impact, thereby ensuring the stability of the fixation of the metal wire 7. After the conductive block 6 is energized, the semiconductor laser chip 4 can emit light, and the semiconductor laser chip 4 can generate a high-brightness laser beam, which can be suitable for various scenes with high brightness requirements. The vibration isolation foot pad 501 arranged at the bottom can reduce the vibration transmission between the bottom of the device and the mounting surface, thereby improving the fixing stability, and the shock-absorbing roller 503 will rotate along the auxiliary bearing 502 when subjected to a lateral impact to change the force. The transmission direction can be used to cushion the shock and unload the force, thereby improving the protection of the entire device and preventing the impact force from directly acting on the outer surface of the device. The packaging bracket 505 can further provide anti-collision protection for the light source device and prevent external forces from directly acting on the outer surface of the light source device. At the same time, in hot weather, the long-term operation of the light source device will cause the internal temperature to rise. At this time, the servo motor 11 is started to drive the heat dissipation fan blades 13 to rotate, thereby generating wind force to assist in the heat dissipation of the light source device, thereby improving the overall heat dissipation performance, reducing the junction temperature, and extending the service life of the device. In addition, an auxiliary groove 10 is provided inside the mounting seat 9 to protect the device installed in the auxiliary groove 10, thereby preventing the device from being directly exposed to the outside and being easily impacted by external forces, thereby protecting the device.

[0033] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A laser light source device of LED chip packaging, characterized in that: The invention comprises a box body (1), wherein a main groove (2) is provided on one side of the upper surface of the box body (1), a secondary groove (3) is provided on the other side of the upper surface of the box body (1), a semiconductor laser chip (4) is fixedly connected to the inner bottom wall of the main groove (2), and protective components (5) are fixedly connected to both sides of the outer surface of the box body (1); The protection component (5) comprises a vibration isolation foot pad (501), both sides of the upper surface of the vibration isolation foot pad (501) are rotatably connected to a vibration-absorbing roller (503) via an auxiliary bearing (502), the top of the vibration-absorbing roller (503) is rotatably connected to an extension block (504), and a plurality of packaging brackets (505) are fixedly connected to the middle of the upper surface of the vibration isolation foot pad (501), and the top of the packaging bracket (505) is fixedly connected to the outer surface of the box body (1).

2. The laser light source device of an LED chip package as claimed in claim 1, characterized in that: The inner bottom wall of the auxiliary groove (3) is provided with a plurality of conductive blocks (6), and the semiconductor laser chip (4) is fixedly connected to the surface of the conductive block (6) via a metal wire (7).

3. The laser light source device of an LED chip package as claimed in claim 2, characterized in that: The outer surface of the metal wire (7) is sleeved with a support frame (8), and the bottom of the support frame (8) is fixedly connected to the upper surface of the box body (1).

4. The laser light source device of an LED chip package as claimed in claim 1, characterized in that: A mounting seat (9) is fixedly connected to one side of the upper surface of the box body (1), and an auxiliary groove (10) is provided at the top of one side of the mounting seat (9).

5. The laser light source device of an LED chip package as claimed in claim 4, characterized in that: A servo motor (11) is fixedly connected to the middle of the inner bottom wall of the auxiliary groove (10), a transmission shaft (12) is fixedly connected to the output end of the servo motor (11), and a heat dissipation fan blade (13) is fixedly connected to one end of the transmission shaft (12).

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