Semiconductor variable-temperature tank

Abstract

The utility model provides a semiconductor variable temperature tank, including variable temperature tank body, control module, semiconductor refrigeration device, heat dissipation subassembly, stroke microswitch and temperature measurement subassembly, variable temperature tank body includes bottom frame, outer cover and inner barrel, bottom frame is installed in the outer cover bottom, the inner barrel is installed in the outer cover, and the inner barrel is installed in the outer cover. A stroke microswitch is installed on the side wall of the inner barrel, a semiconductor refrigeration device is installed on the outer side face of the inner barrel, the cold end face of the semiconductor refrigeration device is attached to the inner barrel, the hot end face of the semiconductor refrigeration device is attached to the heat dissipation assembly, a temperature measuring assembly is installed on the bottom face of the inner barrel, and an end face probe is installed on the temperature measuring assembly. The end face probe penetrates through the bottom face of the inner barrel from bottom to top and abuts against an object needing temperature changing. Compared with program control, starting or stopping of the temperature control function is lower in cost and higher in reliability, the temperature can be detected in real time, and temperature control accuracy is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control structures, in particular to a semiconductor temperature-changing tank. Background Art

[0002] Semiconductor refrigeration technology has the characteristics of small size, compact structure, no vibration, environmental protection, quietness, precise temperature control, and easy installation. As semiconductor refrigeration technology is recognized by more and more people, semiconductor refrigeration devices are increasingly used in terminal products. At present, semiconductor terminal application products mainly include refrigerators, freezers, ice cream machines, refrigeration cups, etc.

[0003] Existing semiconductor refrigeration devices are usually composed of an inner barrel, a box body, a semiconductor refrigeration device and a heat dissipation component; the cold end surface of the semiconductor refrigeration device is close to one side of the inner barrel, which is convenient for transmitting cold air to the inner barrel, thereby reducing the temperature of the inner barrel; the hot end surface of the semiconductor refrigeration device is close to the heat dissipation component, which is convenient for the heat generated by the semiconductor refrigeration device to be discharged outward along the heat dissipation component, thereby maintaining a constant temperature of the inner barrel.

[0004] The existing tanks rely on control panels or manual on / off switches to start and shut down the whole machine, and the temperature sensor is generally built into the inner barrel. The former requires manual adjustment or program adaptation, which is prone to negligence or carelessness. Although program control is accurate, it is costly and has poor reliability in complex or extreme environments. The latter temperature cannot reflect the temperature of the object to be changed in real time, and errors will occur when precise temperature control is required.

[0005] A new type of semiconductor temperature changing device is now needed to solve the above-mentioned problems. Utility Model Content

[0006] The utility model provides a semiconductor temperature-variable tank, which solves the problems of inconvenient startup control of the existing refrigeration tank and inaccurate detection of objects requiring temperature change by technically transforming the existing temperature control device, and can meet the temperature control needs of the medical and chemical industries.

[0007] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0008] A semiconductor temperature-changing tank comprises a temperature-changing tank body, a control module, a semiconductor refrigeration device, a heat dissipation component, a travel micro switch and a temperature measuring component. The temperature-changing tank body comprises a bottom frame, an outer cover and an inner barrel. The bottom frame is installed at the bottom of the outer cover, the inner barrel is installed inside the outer cover, the travel micro switch is installed on the side wall of the inner barrel, the semiconductor refrigeration device is installed on the outer side of the inner barrel, the cold end face of the semiconductor refrigeration device is fitted with the inner barrel, and the hot end face of the semiconductor refrigeration device is fitted with the heat dissipation component, the bottom surface of the inner barrel is installed, and the temperature measuring component is installed with an end face probe, the end face probe passes through the bottom surface of the inner barrel from bottom to top and is arranged in contact with the object to be temperature-changed, and the temperature measuring component, the semiconductor refrigeration device, the heat dissipation component, the travel micro switch and the control module are electrically connected.

[0009] Preferably, a mounting hole is provided on the bottom surface of the inner barrel, a support base is installed on the inner thread of the mounting hole, a spring is installed in the middle of the support base, the upper end of the spring is arranged to abut against the bottom surface of the end face probe, and the upper end of the end face probe extends from the mounting hole to the inner cavity of the inner barrel.

[0010] Preferably, the outer cover is made of stainless steel, and the space between the outer cover and the inner barrel is filled with thermal insulation material.

[0011] Preferably, the semiconductor refrigeration device includes a TEC component and a cooling block component. A straight end surface is provided on the outer side of the inner barrel, and a cooling block component is fitted on the straight end surface. The other end of the cooling block component facing away from the outer side of the inner barrel is fitted with the TEC component, and the other end of the TEC component facing away from the heat conductive block component is connected to the heat dissipation component.

[0012] Preferably, the cooling block assembly is made of heat-conducting metal aluminum.

[0013] Preferably, the heat dissipation component includes a heat sink and a heat dissipation fan, the heat sink is fixedly mounted on the outer side of the outer cover, and the TEC component is arranged in contact with the bottom surface of the heat sink, a fan mounting frame is installed on the heat sink, a heat dissipation fan is installed on the fan mounting frame, and the heat dissipation fan is arranged directly opposite the heat sink.

[0014] Preferably, a temperature protector is installed on the bottom surface of the inner barrel, and the temperature protector is electrically connected to the control module.

[0015] The beneficial effects of the utility model are:

[0016] The utility model installs a push-type travel micro switch on the inner barrel. When the object to be temperature-changed is put into the inner barrel, the switch is pressed and the whole machine is powered on. When the object to be temperature-changed is taken out, the push-type switch pops up and the whole machine is powered off. This method is mechanical on and off, and is associated with the object to be temperature-controlled, avoiding the situation of failure to start or early start. Compared with program control, it has lower cost and higher reliability.

[0017] The utility model is provided with a floating end probe at the bottom of the inner barrel. When the object to be changed in temperature is placed in the inner barrel, the object to be changed in temperature presses down the end probe to detect the temperature change in real time. When the object to be changed in temperature is taken out, the whole machine is powered off, the semiconductor refrigeration device stops working, and the end probe pops up. The temperature probe for detecting the temperature change of the object in the present application is set as an end probe installed on the bottom of the inner barrel. When the object to be changed in temperature is placed in the inner barrel, the end probe is pressed down to ensure that it is pressed tightly with the object to be changed in temperature, and its temperature is detected in real time to ensure the accuracy of temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the utility model;

[0019] Figure 2 It is an explosion schematic diagram of the utility model;

[0020] Figure 3 This is a schematic diagram of the installation of the bottom end probe of the utility model;

[0021] Description of the accompanying figures: variable temperature tank body 1, bottom frame 11, outer cover 12, inner barrel 13, mounting hole 131, control module 2, semiconductor refrigeration device 3, TEC assembly 31, cooling block assembly 32, heat dissipation assembly 4, heat sink 41, cooling fan 42, fan mounting bracket 43, travel micro switch 5, end probe 6, support base 61, spring 7, temperature protector 8. DETAILED DESCRIPTION

[0022] The specific contents of the utility model are described in detail below with reference to the accompanying drawings and embodiments.

[0023] See also Figure 1-3 As shown, the utility model provides a semiconductor temperature-changing tank, comprising a temperature-changing tank body 1, a control module 2, a semiconductor refrigeration device 3, a heat dissipation component 4, a travel micro switch 5 and a temperature measuring component, the temperature-changing tank body 1 comprises a bottom frame 11, an outer cover 12 and an inner barrel 13, the bottom frame 11 is installed at the bottom of the outer cover 12, the inner barrel 13 is installed inside the outer cover 12, the side wall of the inner barrel 13 is installed with a travel micro switch 5, the outer side of the inner barrel 13 is installed with a semiconductor refrigeration device 3, the cold end face of the semiconductor refrigeration device 3 is in contact with the inner barrel 13, the hot end face of the semiconductor refrigeration device 3 is in contact with the heat dissipation component 4, the bottom surface of the inner barrel 13 is installed with a temperature measuring component, the temperature measuring component is installed with an end face probe 6, the end face probe 6 passes through the bottom surface of the inner barrel 13 from bottom to top and is arranged in contact with the object to be temperature-changed, the temperature measuring component, the semiconductor refrigeration device 3, the heat dissipation component 4, the travel micro switch 5 and the control module 2 are electrically connected.

[0024] Furthermore, in order to achieve more accurate real-time detection of the object temperature, the bottom surface of the inner barrel 13 is provided with a mounting hole 131, and a support base 61 is installed in the inner thread of the mounting hole 131. A spring 7 is installed in the middle of the support base 61, and the upper end of the spring 7 is set against the bottom surface of the end probe 6. The upper end of the end probe 6 extends from the mounting hole 131 to the inner cavity of the inner barrel 13. The temperature measurement component is a temperature sensor, and the probe of the temperature sensor is provided with a floating end probe 6. When the object to be changed in temperature is placed in the inner barrel 13, the object to be changed in temperature presses down the end probe 6, and the temperature change can be detected in real time. When the object to be changed in temperature is lifted, the end probe 6 stops measuring the temperature. The temperature measurement accuracy is higher.

[0025] Furthermore, in order to obtain a better thermal insulation effect, the outer cover 12 is made of stainless steel, and a thermal insulation material is filled between the outer cover 12 and the inner barrel 13. The thermal insulation material is foamed rubber, which has a good thermal insulation effect, is light in weight, and has a low cost.

[0026] Furthermore, in order to realize rapid temperature control of the semiconductor refrigeration device 3, the semiconductor refrigeration device 3 includes a TEC component 31 and a cooling block component 32. The outer side surface of the inner barrel 13 is provided with a straight end surface, and the cooling block component 32 is fitted on the straight end surface. The other end of the cooling block component 32 facing away from the outer side surface of the inner barrel is fitted with the TEC component 31, and the other end of the TEC component 31 facing away from the heat conductive block TEC component 31 is connected to the heat dissipation component 4.

[0027] The semiconductor refrigeration device 3 of the present application has the following effects:

[0028] 1. The temperature response is accurate, and the temperature difference range of the overall object that needs to be changed is ±0.2.

[0029] 2. The temperature can be raised or lowered, and the temperature can be switched by controlling the polarity of the power supply to the refrigerator.

[0030] 3. Small impact from the environment, suitable for environments ranging from -20 to 80°C.

[0031] 4. The reaction rate is fast. After precooling, it only takes 1-2 minutes for the liquid to cool down to the set temperature.

[0032] Furthermore, the cooling block assembly 32 is made of heat-conducting metal aluminum.

[0033] Furthermore, in order to obtain a better heat dissipation effect, the heat dissipation component 4 includes a heat sink 41 and a heat dissipation fan 42. The heat sink 41 is fixedly installed on the outer side of the outer cover 12, and the TEC component 31 is arranged in contact with the bottom surface of the heat sink 41. A fan mounting frame 43 is installed on the heat sink 41, and a heat dissipation fan 42 is installed on the fan mounting frame 43. The heat dissipation fan 42 is arranged directly opposite the heat sink 41.

[0034] Furthermore, a temperature protector 8 is installed on the bottom surface of the inner barrel 13, and the temperature protector 8 is electrically connected to the control module 2. When the appliance is working normally, the bimetallic strip of the temperature protector 8 is in a free state, and the contact is in a closed / open state. When the temperature reaches the action temperature, the bimetallic strip of the temperature protector 8 generates internal stress due to heat and quickly acts, opens / closes the contact, cuts off / connects the circuit, and thus plays a role in temperature control. When the appliance cools to the reset temperature, the contact automatically closes / opens, and the normal working state is restored.

[0035] In this embodiment, a push-type micro switch is installed on the inner barrel. When the object to be temperature-controlled is put into the inner barrel, the switch is pressed and the whole machine is powered on. When the object to be temperature-controlled is taken out, the push-type switch pops up and the whole machine is powered off. This method is mechanical on and off, and is associated with the object to be temperature-controlled, avoiding the situation of failure to start or early start. Compared with program control, it has lower cost and higher reliability.

[0036] In addition, in this embodiment, a floating end probe is arranged at the bottom of the inner barrel. When the object to be changed in temperature is placed in the inner barrel, the object to be changed in temperature presses down the end probe to detect the temperature change in real time. When the object to be changed in temperature is taken out, the whole machine is powered off, the semiconductor refrigeration device stops working, and the end probe pops up. The temperature probe for detecting the temperature change of the object in this application is set as an end probe installed on the bottom of the inner barrel. When the object to be changed in temperature is placed in the inner barrel, the end probe is pressed down to ensure that it is pressed tightly against the object to be changed in temperature, and its temperature is detected in real time to ensure the accuracy of temperature control.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

[0038] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0039] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. A semiconductor temperature-changing tank, characterized in that: It includes a temperature-variable tank body, a control module, a semiconductor refrigeration device, a heat dissipation component, a travel micro switch and a temperature measuring component. The temperature-variable tank body includes a bottom frame, an outer cover and an inner barrel. The bottom frame is installed at the bottom of the outer cover, the inner barrel is installed inside the outer cover, the travel micro switch is installed on the side wall of the inner barrel, the semiconductor refrigeration device is installed on the outer side of the inner barrel, the cold end face of the semiconductor refrigeration device is fitted with the inner barrel, and the hot end face of the semiconductor refrigeration device is fitted with the heat dissipation component, the bottom surface of the inner barrel is installed, and the temperature measuring component is installed with an end face probe, and the end face probe passes through the bottom surface of the inner barrel from bottom to top and is arranged to contact the object to be temperature changed. The temperature measuring component, the semiconductor refrigeration device, the heat dissipation component, the travel micro switch and the control module are electrically connected.

2. A semiconductor temperature-variable tank according to claim 1, characterized in that: The bottom surface of the inner barrel is provided with an installation hole, the inner thread of the installation hole is provided with a support base, the middle part of the support base is provided with a spring, the upper end of the spring is arranged to abut against the bottom surface of the end face probe, and the upper end of the end face probe extends from the installation hole into the inner cavity of the inner barrel.

3. A semiconductor temperature-variable tank according to claim 1, characterized in that: The outer cover is made of stainless steel, and the space between the outer cover and the inner barrel is filled with heat-insulating materials.

4. A semiconductor temperature-variable tank according to claim 1, characterized in that: The semiconductor refrigeration device includes a TEC component and a cooling block component. A straight end surface is provided on the outer side of the inner barrel, and a cooling block component is fitted on the straight end surface. The other end of the cooling block component away from the outer side of the inner barrel is fitted with the TEC component, and the other end of the TEC component away from the heat conductive block component is connected to the heat dissipation component.

5. A semiconductor temperature-variable tank according to claim 4, characterized in that: The cooling block assembly is made of heat-conducting metal aluminum.

6. A semiconductor temperature-variable tank according to claim 1, characterized in that: The heat dissipation component includes a heat sink and a heat dissipation fan. The heat sink is fixedly installed on the outer side of the outer cover, and the TEC component is arranged in contact with the bottom surface of the heat sink. A fan mounting frame is installed on the heat sink, and a heat dissipation fan is installed on the fan mounting frame. The heat dissipation fan is arranged directly opposite the heat sink.

7. A semiconductor temperature-variable tank according to claim 1, characterized in that: A temperature protector is installed on the bottom surface of the inner barrel, and the temperature protector is electrically connected to the control module.

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