Power semiconductor module test fixture and power semiconductor module test device
By designing a power semiconductor module test fixture and using conductive lines and switching switches to test power terminals in different control modes, the problem of defective product detection during the IGBT module packaging process is solved, improving the yield after packaging and reducing cost waste.
Patent Information
- Application Number
- CN202420449513.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-08
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-03-08
AI Technical Summary
The prior art is difficult to detect defective products in advance during the packaging process of IGBT modules, resulting in the entire set of modules being judged as defective products, which increases the packaging cost and how to improve the yield after packaging.
A power semiconductor module test fixture is designed, including a base, a test circuit board, an insulating base, a conductive dielectric part and a switching switch, which is electrically connected to the power terminal and the signal terminal through a conductive line, allowing the power to be tested in different control modes. The performance of the terminals can quickly detect defective products.
By detecting the performance of power terminals in advance, it can save the waste of subsequent processes, improve the yield after module packaging, reduce cost waste, and achieve a fast and convenient testing process.
Smart Images
Figure CN222145156U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a testing fixture, in particular to a test on power terminals in a power semiconductor module. Background Art
[0002] At present, the IGBT module process mainly includes two tests, one is the CP (ChipProbe) test for IGBT wafers, and the other is the FT (FinalTest) test after the module is packaged, which is performed at the beginning and end of the entire process. However, a group of IGBT modules is composed of multiple IGBT chips. If one of the chips is abnormal, the entire group of modules will be judged as defective. How to improve the yield of the packaged modules and reduce the waste of packaging costs is particularly important.
[0003] Between the CP test and the FT test, and before the glue filling and capping, it is necessary to insert a test on the power terminals, so as to detect defective products early, thereby saving waste in the second half of the process and improving the yield of the module after packaging.
[0004] Therefore, there is an urgent need for a test fixture and a test device that can detect power terminals on a power semiconductor module. Utility Model Content
[0005] The utility model aims to provide a power semiconductor module test fixture, which can test the performance of power terminals of the power semiconductor module under different control modes, and the test is fast and convenient.
[0006] In order to achieve the above-mentioned purpose, the utility model provides a power semiconductor module test fixture, the power semiconductor module also exposes power terminals and signal terminals, including a base, a test circuit board, an insulating seat, a first conductive medium part, a second conductive medium part, a test interface and a switching switch, the test circuit board is installed on the base and is provided with a conductive circuit, the conductive circuit has a terminal test area corresponding to the power terminal to be tested and a signal transmission area corresponding to the signal terminal, the insulating seat is used to install the power semiconductor module and has a power terminal slot for the power terminal to extend into and a signal terminal slot for the signal terminal to extend into; the first The bottom of the conductive medium part is electrically connected to the terminal test area, the top passes through the insulating seat and is exposed in the power terminal slot, and is electrically in contact with the power terminal when the power terminal is extended into the power terminal slot; the bottom of the second conductive medium part is electrically connected to the signal transmission area, the top passes through the insulating seat and extends into the signal terminal slot, and is electrically in contact with the signal terminal when the signal terminal is extended into the signal terminal slot; the switching switch and the test interface are coupled to the conductive circuit, and operating part of the switching switch can switch different terminal test areas to part of the test interfaces, and the signal transmission area is electrically connected to part of the test interfaces.
[0007] Preferably, operating part of the switching switch can switch the signal transmission area to part of the test interface. Different control modes can be switched directly by operating the switching switch, and the operation is fast and convenient.
[0008] Preferably, each of the terminal test areas has two mutually non-conductive test partitions, and the first conductive medium portion corresponds to the power terminal to be tested one-to-one and includes two conductive groups corresponding to the two test partitions. This solution divides the terminal test area corresponding to the power terminal on the conductive line into two, and one switching end of each switching switch corresponds to one terminal test area, which effectively prevents interference caused by the wiring relationship of different switching schemes, and can test the performance of a power terminal under multiple different control modes.
[0009] Specifically, a positioning groove for installing and positioning the power semiconductor module is formed on the insulating seat, and the first conductive medium part includes a plurality of probes arranged at intervals in the positioning groove, at least one of the probes in the first conductive medium part forms one conductive group, and the remaining probes form another conductive group. The first conductive medium part formed by the plurality of probes arranged at intervals makes the electrical contact between the power terminal and the first conductive medium part stable.
[0010] More preferably, each of the first conductive medium parts has eight probes, and the eight probes form a rectangular electrical connection area with three probes as a side. This solution allows the electrical connection area to match and contact the power terminal, further ensuring the electrical connection stability between the power terminal and the first conductive medium part.
[0011] More preferably, the probe is columnar and the top of the probe forms an electrical contact head with an area larger than that of the middle of the probe, thereby effectively increasing the contact area between the probe and the first conductive medium portion.
[0012] Specifically, the top of the electrical contact is covered with a plurality of protrusions, which are cones, such as cones, prisms, pyramids, etc. This solution makes the table surface of the electrical contact a rough surface to prevent the power terminal from slipping on the electrical contact.
[0013] Preferably, the second conductive medium part is an elastic terminal group, each of which has a plurality of elastic terminals, and the top of the elastic terminal has an elastic arm, which extends into the signal terminal slot and forms a plug-in slot for clamping the power terminal between the plurality of elastic arms, and the signal terminal is plugged into and electrically connected with the plug-in slot when it extends into the signal terminal slot. The plug-in slot formed between the elastic terminal groups allows the signal terminal to stably extend into the plug-in slot and maintain electrical connection with the elastic terminal group.
[0014] Preferably, a positioning groove for installing and positioning the power semiconductor module is formed on the insulating seat, the power terminal groove and the signal terminal groove are formed at the bottom of the positioning groove, and a through hole for the first conductive medium part and the second conductive medium part to pass through is formed at the bottom of the power terminal groove.
[0015] Preferably, the switching switch is a DIP switch, and of course, it can also be other types of switching switches.
[0016] Preferably, the test interface is a BNC wiring plug, but it can also be other types of plugs such as a banana plug.
[0017] Preferably, the insulating seat is further provided with four positioning posts corresponding to the positioning holes at the four corners of the power semiconductor module.
[0018] The utility model also discloses a power semiconductor module testing device, comprising a test fixture and a pressure plate assembly, wherein the test fixture is the power semiconductor module test fixture described above, and the pressure plate assembly is located above the test fixture and can be moved downward to clamp and position the power semiconductor module between the pressure plate assembly and the test fixture.
[0019] Compared with the prior art, in the test fixture of the present invention, different test interfaces can be electrically connected to the power terminals and signal terminals of the power semiconductor on the test fixture through the test partitions and the signal delivery area, so that the test fixture can directly give the signal terminal a corresponding control signal from the test interface to put the power semiconductor in a working state, thereby testing the performance of the power terminal. On the other hand, the test fixture of the present invention also has a switching switch, which can freely switch different test partitions to the test interface and different signal delivery areas to the test interface, so that the tester can toggle the switching switch to put the power semiconductor module in different control modes, thereby testing the performance of the power terminal under different control modes, without plugging in too many test interfaces, and the test is fast and convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a three-dimensional diagram of the power semiconductor module in Example 1 of the utility model installed on the test fixture.
[0021] Figure 2 It is a three-dimensional diagram of the power semiconductor module in Example 1 of the utility model being separated from the test fixture.
[0022] Figure 3 yes Figure 2 Enlarged view of part a.
[0023] Figure 4 It is a top view of the test fixture in Example 1 of the utility model.
[0024] Figure 5 yes Figure 4 Enlarged view of part b.
[0025] Figure 6 It is a three-dimensional diagram of the first type of power semiconductor module.
[0026] Figure 7 It is a circuit diagram of a conductive circuit on a test circuit board according to Embodiment 1 of the utility model.
[0027] Figure 8 It is a structural diagram of the first conductive medium part in Example 1 of the utility model.
[0028] Fig. 9 It is a three-dimensional diagram of the power semiconductor module in Example 2 of the utility model being separated from the test fixture.
[0029] Fig.10 It is a top view of the test fixture in Example 2 of the utility model.
[0030] Fig.11 is a perspective view of a second type of power semiconductor module.
[0031] Fig.12It is a structural diagram of the first conductive medium part in Example 2 of the utility model. DETAILED DESCRIPTION
[0032] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation modes and the accompanying drawings.
[0033] Embodiment 1:
[0034] refer to Figure 1 and Figure 2 The utility model provides a test fixture 1 for a power semiconductor module 2, the test fixture 1 comprising a base 11, a test circuit board 12, an insulating seat 13, a first conductive medium portion 14, a second conductive medium portion 15, a test interface 16 and a switch 17. Figure 6 The power semiconductor module 2 also has a power terminal 21 and a signal terminal 22 exposed.
[0035] refer to Figure 7 The test circuit board 12 is mounted on the base 11 and is provided with a conductive circuit 18, wherein the conductive circuit 18 has a terminal test area 181 corresponding to the power terminal 21 to be tested and a signal transmission area 182 corresponding to the signal terminal 22. Figure 2 and Figure 4 The insulating seat 13 is used to install the power semiconductor module 2 and has a power terminal groove 131 for the power terminal 21 to extend into and a signal terminal groove 132 for the signal terminal 22 to extend into.
[0036] refer to Figure 3 and Figure 5 The bottom of the first conductive medium portion 14 is electrically connected to the terminal test area 181, the top passes through the insulating seat 13 and is exposed in the power terminal groove 131, and is electrically in contact with the power terminal 21 when the power terminal 21 extends into the power terminal groove 131; the bottom of the second conductive medium portion 15 is electrically connected to the signal transmission area 182, the top passes through the insulating seat 13 and extends into the signal terminal groove 132, and is electrically connected to the signal terminal 22 when the signal terminal 22 extends into the signal terminal groove 132.
[0037] Among them, a positioning groove 133 for installing and positioning the power semiconductor module 2 is formed on the insulating seat 13, and the power terminal groove 131 and the signal terminal groove 132 are formed at the bottom of the positioning groove 133, and a through hole for the first conductive medium part 14 and the second conductive medium part 15 to pass through is formed at the bottom of the power terminal groove 131.
[0038] refer to Figure 4 and Figure 7, the switching switch 17 and the test interface 16 are coupled to the conductive circuit 18, and the operation of the switching switch 17 can switch different terminal test areas 181 to part of the test interface 16, and the signal transmission area 182 is electrically connected to part of the test interface 16. Among them, the operation of the switching switch 17 can switch the signal transmission area 182 to part of the test interface 16. Different control modes can be switched directly by operating the switching switch 17, and the operation is fast and convenient. For example, the first switching switch 17 can switch the terminal test area 181 corresponding to the first power terminal 21 and the terminal test area 181 corresponding to the second power terminal 21 to the first test interface 16.
[0039] Preferably, each of the terminal test areas 181 has two mutually non-conductive test partitions 1811 and 1812 , and the first conductive medium portion 14 corresponds one-to-one to the power terminals 21 to be tested and includes two conductive groups 141 and 142 corresponding to the two test partitions 1811 and 1812 .
[0040] For example, Figure 4 Six switches 17 from left to right, six test interfaces 16, and Figure 6 Among the three power terminals 21 from right to left and the four signal terminals 22 from left to right: the first switching switch 17 can switch the test partition 1811 corresponding to the first power terminal 21 and the test partition 1811 corresponding to the second power terminal 21 to the first test interface 16. The second switching switch 17 can switch the test partition 1812 corresponding to the first power terminal 21 and the test partition 1812 corresponding to the second power terminal 21 to the second test interface 16. The third switching switch 17 can switch the test partition 1811 corresponding to the first power terminal 21 and the test partition 1811 corresponding to the third power terminal 21 to the third test interface 16. The fourth switching switch 17 can switch the test partition 1812 corresponding to the first power terminal 21 and the test partition 1812 corresponding to the third power terminal 21 to the fourth test interface 16. That is to say, in the switching switch 17 that switches the power terminal 21, the switching switch 17 corresponds to the test interface 16, and each switching switch 17 switches the terminal test area 181 corresponding to a different power terminal 21 to the corresponding test interface 16. The two test partitions 1812 divided from the same terminal test area 181 are respectively coupled to different switching switches 17, so that the same power terminal 21 can be connected to different test interfaces 16.
[0041] The signal transmission area 182 is also divided into a first signal area and a second signal area, and the fifth switching switch 17 can switch the first signal area corresponding to the first signal terminal 22 and the first signal area corresponding to the fourth signal terminal 22 to the fifth test interface 16. The sixth switching switch 17 can switch the second signal area corresponding to the first signal terminal 22 and the second signal area corresponding to the fourth signal terminal 22 to the sixth test interface 16. The first signal terminal 22 and the fourth signal terminal 22 are control terminals of the power semiconductor module 2, respectively.
[0042] The power semiconductor module 2 is an IGBT module, and the control terminal is the G terminal. The first power terminal 21 is the C power terminal, the second power terminal 21 is the E power terminal, and the third power terminal 21 is the C power terminal.
[0043] The first conductive medium portion 14 includes a plurality of probes 140 arranged at intervals in the positioning groove 133, at least the probes form one conductive group 141, and the remaining probes 140 form another conductive group 142. The conductive group 141 corresponds to the shape and position of the test partition 1811 and is electrically connected, and the conductive group 142 corresponds to the shape and position of the test partition 1812 and is electrically connected. The first conductive medium portion 14 formed by the plurality of probes 140 arranged at intervals makes the electrical contact between the power terminal 21 and the first conductive medium portion 14 stable. Figure 3 and Figure 8 Each of the first conductive medium parts 14 has eight probes 140, and the eight probes 149 form a rectangular electrical connection area with three probes as one side. Among the eight probes 140, one probe 140 located in the middle of one side is a conductive group 141. The remaining seven probes 140 form another conductive group 142, which are electrically connected together through the test partition 1812.
[0044] refer to Figure 3 The probe 140 is columnar and the top of the probe 140 forms an electrical contact 143 with a larger area than the middle of the probe. Specifically, the top of the electrical contact 143 is covered with a plurality of protrusions 144, and the protrusions 144 are cones, such as cones, prisms, pyramids, etc. This solution makes the table of the electrical contact a rough surface to prevent the power terminal 21 from slipping on the electrical contact.
[0045] refer to Figure 5The second conductive medium part 15 is an elastic terminal group, each of which has a plurality of elastic terminals. The top of the elastic terminal has an elastic arm 151, and the elastic arm 151 extends into the signal terminal groove 132 and forms a plug-in groove 152 for clamping the power terminal 21 between the plurality of elastic arms 151. When the signal terminal 22 extends into the signal terminal groove 132, it is plugged into and electrically connected with the plug-in groove 152.
[0046] refer to Figure 1 and Figure 2 The switch 17 is a dip switch, and of course, it can also be other types of switches. The test interface 16 is a BNC wiring plug, and of course, it can also be other types of plugs such as banana plugs. The insulating seat 13 is also provided with four positioning columns 134 corresponding to the positioning holes at the four corners of the power semiconductor module 2.
[0047] Figures 1 to 8 This is the test fixture 1 suitable for the first type of power semiconductor module 2 in embodiment 1. Different from embodiment 1, Figures 9 to 12 This is a test jig 1 a suitable for the second type of power semiconductor module 2 a in the second embodiment.
[0048] Embodiment 2:
[0049] Different from the first embodiment, the positions of the power terminals 21 a and the signal terminals 22 a on the second type of power semiconductor module 2 a are different, and the shape and size of the signal terminals 22 a are different.
[0050] refer to Fig. 9 and Fig.10 In order to accommodate the signal terminal 22a, in the power semiconductor module 2a, the insulating seat 13 is further provided with a guide groove 134 connected to the signal terminal groove 132, and the elastic arm 151 is installed in the guide groove 134 so as to be movable along its longitudinal direction. When the signal terminal 22 extends into the signal terminal groove 132 and is plugged into the plug-in groove 152, the elastic arm 151 is pushed to both sides, so that the elastic arm 151 moves along the guide wall 134 to expand the plug-in groove 152. In this embodiment, the two signal terminal grooves 132 of two adjacent signal terminals 22a are connected together.
[0051] refer to Fig.12The first conductive medium portion 14 includes a plurality of probes 140 arranged at intervals in the positioning groove 133, at least the probes form one conductive group 141, and the remaining probes 140 form another conductive group 142. The conductive group 141 corresponds to the shape and position of the test partition 1811 and is electrically connected, and the conductive group 142 corresponds to the shape and position of the test partition 1812 and is electrically connected. The first conductive medium portion 14 formed by the plurality of probes 140 arranged at intervals makes the electrical contact between the power terminal 21 and the first conductive medium portion 14 stable. Figure 3 and Figure 8 Each of the first conductive medium parts 14 has eight probes 140, and the eight probes 149 form a rectangular electrical connection area with three probes as one side. Among the eight probes 140, a probe 140 located at a corner is a conductive group 141. The remaining seven probes 140 form another conductive group 142, which are electrically connected together through the test partition 1812.
[0052] The utility model also discloses a testing device for a power semiconductor module 2, 2a, which includes a testing fixture 1, 1a and a pressure plate assembly, wherein the pressure plate assembly is located above the testing fixture and can be moved downward to clamp and position the power semiconductor module 2, 2a between the pressure plate assembly and the testing fixture 1, 1a.
[0053] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.
Claims
1. A power semiconductor module test fixture, wherein the power semiconductor module also has power terminals and signal terminals exposed, characterized in that: The invention comprises a base, a test circuit board, an insulating base, a first conductive medium part, a second conductive medium part, a test interface and a switching switch. The test circuit board is mounted on the base and a conductive circuit is arranged thereon. The conductive circuit has a terminal test area corresponding to the power terminal to be tested and a signal transmission area corresponding to the signal terminal. The insulating base is used to mount a power semiconductor module and has a power terminal slot for the power terminal to extend into and a signal terminal slot for the signal terminal to extend into. The bottom of the first conductive medium part is electrically connected to the terminal test area, the top of the first conductive medium part passes through the insulating base and is exposed in the power terminal slot, and is in electrical contact with the power terminal when the power terminal is extended into the power terminal slot. The bottom of the second conductive medium part is electrically connected to the signal transmission area, the top of the second conductive medium part passes through the insulating base and is extended into the signal terminal slot, and is in electrical contact with the signal terminal when the signal terminal is extended into the signal terminal slot. The switching switch and the test interface are coupled to the conductive circuit. The switching switch can be operated to switch different terminal test areas to part of the test interface, and the signal transmission area is electrically connected to part of the test interface.
2. The power semiconductor module test fixture as claimed in claim 1, characterized in that: Operating part of the switching switches can switch the signal transmission area to part of the test interface.
3. The power semiconductor module test fixture as claimed in claim 1, characterized in that: Each of the terminal test areas has two test partitions that are not electrically conductive to each other. The first conductive medium portion corresponds one-to-one to the power terminals to be tested and includes two conductive groups corresponding to the two test partitions.
4. The power semiconductor module test fixture as claimed in claim 3, characterized in that: A positioning groove for installing and positioning the power semiconductor module is formed on the insulating seat. The first conductive medium part includes a plurality of probes arranged at intervals in the positioning groove. At least one of the probes in the first conductive medium part forms one conductive group, and the remaining probes form another conductive group.
5. The power semiconductor module test fixture as claimed in claim 4, characterized in that: The probe is in a columnar shape, and the top of the probe forms an electrical contact head with a larger area than the middle of the probe.
6. The power semiconductor module test fixture as claimed in claim 5, characterized in that: The top of the electrical contact is covered with a plurality of protrusions, and the protrusions are cones.
7. The power semiconductor module test fixture as claimed in claim 4, characterized in that: Each of the first conductive medium parts has eight probes, and the eight probes form a rectangular electrical connection area with three probes as one side.
8. The power semiconductor module test fixture as claimed in claim 1, characterized in that: The second conductive medium portion is an elastic terminal group, each of the elastic terminal groups has a plurality of elastic terminals, the top of the elastic terminal has an elastic arm, the elastic arm extends into the signal terminal slot and forms a plug-in slot for clamping the power terminal between the plurality of elastic arms, and the signal terminal is plugged into and electrically connected with the plug-in slot when extending into the signal terminal slot.
9. The power semiconductor module test fixture as claimed in claim 1, characterized in that: The insulating seat is formed with a positioning groove for installing and positioning the power semiconductor module, the bottom of the positioning groove is provided with the power terminal groove and the signal terminal groove, and the bottom of the power terminal groove is provided with a through hole for the first conductive medium part and the second conductive medium part to pass through.
10. A power semiconductor module testing device, characterized in that: The invention comprises a test fixture and a pressure plate assembly, wherein the test fixture is a power semiconductor module test fixture as described in any one of claims 1 to 9, and the pressure plate assembly is located above the test fixture and can be moved downward to clamp and position the power semiconductor module between the pressure plate assembly and the test fixture.