Frameless high-reliability directional sound production and display device

Abstract

The utility model discloses a frameless high-reliability directional sounding and display device, which comprises a first base material and a second base material, the first base material and the second base material respectively comprise a functional area and a wiring area, the functional area is provided with a conductive layer, the wiring area is positioned on one side of the functional area, and the conductive layer is positioned on the other side of the functional area. The wiring area of the first base material is provided with a first conductive island communicated with the conductive layer of the functional area, and the wiring area of the second base material is provided with a second conductive island isolated from the conductive layer of the functional area and a third conductive island communicated with the conductive layer. The first conductive island is at least partially overlapped with the second conductive island after the first base material and the second base material are attached, and the first conductive island, the second conductive island and the third conductive island are led out through the flexible circuit board. According to the utility model, the design that the functional area is integrally transparent and frameless is realized, the maximum screen-to-body ratio of the combination of the directional sound production device and the display screen is realized, and the sound pressure level and high reliability of the whole directional sound production device are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of directional sound generation, and in particular to a frameless, high-reliability directional sound generation and display device. Background Art

[0002] At present, with the development of ultra-thin electronic devices such as mobile phones and computers, the traditional speakers are too large to further reduce the size of electronic devices. The screen sound device can produce sound through the vibration of the screen, which is conducive to the further miniaturization of electronic devices. The screen directional sound device can further spread the sound emitted by the screen to a specific area, which is more conducive to protecting the privacy of electronic device users and preventing the sound from disturbing others.

[0003] The existing screen directional sound-emitting device includes a vibration layer, a supporting structure and a substrate layer. The vibration layer and the substrate layer are bonded to each other, and the supporting structure is supported between the vibration layer and the substrate layer. At least one electrode layer is provided on the vibration layer and the substrate layer to be connected to an external driving circuit. The external circuit supplies power, applies a voltage signal to the substrate layer and the vibration layer, drives the vibration layer to vibrate up and down, and emits an ultrasonic signal. The ultrasonic signal is self-demodulated by the air to produce audible sound.

[0004] There are existing studies that combine screen directional sound with displays, so that the display can integrate multiple functions such as screen directional sound and display, and the two functions do not interfere with each other. However, the existing screen directional sound device requires wiring on the frame, so the entire directional sound device cannot be fully transparent and frameless. Therefore, the appearance will have a visual experience of reduced directional sound area and display area combined with the display screen. In order to meet the needs of increasing directional sound and display area under the same size, the narrow frame design of directional sound devices has become a development trend, and is developing towards frameless directional sound devices.

[0005] In the previous patent with application number CN202310315602.5 and patent name "A borderless display directional sound screen and its tensioning and bonding process", the borderless design is achieved by folding the vibration membrane and hiding the edge wiring on the side of the device. However, the disadvantage of this folding scheme is that the reliability is low: the folded conductive layer is prone to short circuit, which can easily lead to the failure of the vibration membrane. Therefore, it is necessary to provide a high-reliability borderless screen directional sound device design to overcome the low reliability disadvantages of the above scheme. Utility Model Content

[0006] The utility model aims to provide a frameless, high-reliability directional sound and display device.

[0007] To achieve the above-mentioned purpose, the utility model proposes a borderless and highly reliable directional sound-emitting device, comprising a first substrate and a second substrate bonded together, the first substrate and the second substrate both comprising a functional area and a routing area, the functional area being provided with a conductive layer, the routing area being located on one side of the functional area, the routing area of ​​the first substrate being provided with at least one first conductive island connected to the conductive layer of the functional area, the routing area of ​​the second substrate being provided with at least one second conductive island isolated from the conductive layer of the functional area and at least one third conductive island connected to the conductive layer, the first conductive island being at least partially overlapped with the second conductive island after the first substrate and the second substrate are bonded together, and the first conductive island, the second conductive island and the third conductive island are led out through a flexible circuit board.

[0008] In a preferred embodiment, the routing areas of the first substrate and the second substrate are both provided with edge routing lines connected to the conductive layers in the respective functional areas.

[0009] In a preferred embodiment, the first conductive island includes a first crimping portion and a first connecting portion, the second conductive island includes a second crimping portion and a second connecting portion, the third conductive island includes a third crimping portion and a third connecting portion electrically connected to the second conductive layer, the first connecting portion overlaps with the second connecting portion after the first substrate and the second substrate are bonded together, and the first crimping portion, the second crimping portion and the third crimping portion are crimped out through a flexible circuit board.

[0010] In a preferred embodiment, the first substrate includes a first substrate layer, a first conductive layer, and a first edge routing. The first conductive layer is formed on the bottom surface of the first substrate layer close to the second substrate, and covers the entire functional area of ​​the first substrate and partially covers the routing area of ​​the first substrate; the first edge routing is arranged in the routing area of ​​the first substrate and covers the first conductive layer located in the routing area.

[0011] In a preferred embodiment, the first substrate further includes an adhesive layer, which is formed on the bottom surface of the first conductive layer close to the second substrate and covers the first conductive layer and the first edge trace except the first conductive island.

[0012] In a preferred embodiment, the second substrate includes a second substrate layer, a second conductive layer, a second edge routing and an insulating layer, the second conductive layer is formed on the top surface of the second substrate layer close to the first substrate, and covers the entire functional area of ​​the second substrate and partially covers the routing area of ​​the second substrate, the portion covering the routing area forms a second edge routing formation area connected to the conductive layer of the functional area, a second conductive island and a third conductive island isolated from the conductive layer of the functional area; the second edge routing covers the second edge routing formation area; the insulating layer is formed on the top surface of the second conductive layer close to the first substrate, and covers the second conductive layer and the second edge routing except the second conductive island and the third conductive island.

[0013] In a preferred embodiment, the second substrate further includes a microstructure, which is formed on the insulating layer located in the functional area of ​​the second substrate, and the microstructure is fixed to the first substrate through the adhesive layer. After fixation, an air gap required for vibration and sound generation is formed between the first substrate and the second substrate.

[0014] In a preferred embodiment, the first substrate layer and the second substrate layer are both flexible substrate layers or both hard substrate layers, or one of them is a flexible substrate layer and the other is a hard substrate layer.

[0015] In a preferred embodiment, the functional areas of the first substrate and the second substrate are both transparent.

[0016] In a preferred embodiment, the directional sound-emitting device is partitioned into multiple sound-emitting channels, the sound-emitting channels are insulated and isolated from each other, and the routing area of ​​each sound-emitting channel is located on one side of the functional area and includes at least the first conductive island, the second conductive island and the third conductive island.

[0017] On the other hand, the utility model proposes a directional sound display device, comprising the above-mentioned directional sound device and a display screen, wherein the directional sound device is integrated with the display screen or is externally mounted on the display screen.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] 1. The utility model arranges the wiring of the directional sound device on one side of the functional area, realizes the overall transparent and frameless design of the functional area, and realizes the maximum screen-to-body ratio of directional sound and the combination with the display screen; in addition, compared with the traditional wiring in the functional area, the crimping of the flexible circuit board (FPC) is also in the functional area, and the film material of the functional area is prone to wrinkles, thereby affecting its flatness. The utility model concentrates all the wiring on one side of the functional area and separates it from the functional area. Therefore, when crimping the FPC, the fitting flatness of the functional area will not be affected at all, so it is beneficial to ensure the sound pressure level and high reliability of the entire directional sound device. In addition, because the substrate of the utility model does not need to be folded, the reliability of the entire directional sound device is also improved.

[0020] 2. The utility model can be combined with a display screen to realize a borderless display screen and integrate multiple functions such as directional sound and display, thereby meeting the market demand for the development trend of borderless display screens. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the planar structure of the first substrate (unpartitioned) of the directional sound-emitting device in a specific embodiment of the utility model;

[0022] Figure 2 It is a schematic diagram of the planar structure of the second substrate (unpartitioned) of the directional sound-emitting device in a specific embodiment of the utility model;

[0023] Figure 3 for Figure 1 The first substrate and Figure 2 A schematic diagram of a planar structure in which a second substrate is bonded to the substrate;

[0024] Figure 4 It is a schematic diagram of the structure of the upper and lower stacked layers of a directional sound-emitting device in a specific embodiment of the utility model;

[0025] Figure 5 It is a schematic plan view of the structure of a directional sound-emitting device in a specific embodiment of the utility model, which is divided into two areas.

[0026] The accompanying drawings are marked as follows:

[0027] 1. First substrate, 11. First functional area, 12. First routing area, 13. First substrate layer, 14. First conductive layer, 15. First edge routing, 16. Adhesive layer, 17. First non-conductive area, 18. First conductive island, 181. First crimping part, 182. First connecting part, 2. Second substrate, 21. Second functional area, 22. Second routing area, 23. Second substrate layer, 24. Second conductive layer, 25. Second edge routing, 26. Insulating layer, 27. Second non-conductive area, 28. Second conductive island, 281. Second crimping part, 282. Second connecting part, 29. Third conductive island, 291. Third crimping part, 292. Third connecting part, 3. Microstructure, 4. Flexible circuit board, 5. Protective layer. DETAILED DESCRIPTION

[0028] The specific implementation modes of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0029] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0030] Combination Figure 1 to Figure 4 As shown, the utility model discloses a frameless and highly reliable directional sound-emitting device, comprising a first substrate 1 and a second substrate 2 which are bonded together. After bonding, the first substrate 1 or the second substrate 2 vibrates up and down to emit sound under the action of the loaded driving voltage. The utility model redesigns the wiring of the directional sound-emitting device, which not only realizes the overall transparent and frameless design of the functional area, and realizes the maximum screen-to-body ratio of the directional sound-emitting device combined with the display screen, but also helps to ensure the sound pressure level and high reliability of the entire directional sound-emitting device.

[0031] Specifically, Figure 1 and Figure 2 As shown, the first substrate 1 and the second substrate 2 are divided into functional areas and routing areas. Different from the existing design in which the routing area is set on a circle of borders around the functional area or the routing area is folded to the side, the utility model sets the routing area only on one side of the functional area, which can ensure the overall transparency and borderless design of the functional area, as well as high sound pressure level and high reliability. For the convenience of description, the functional areas of the first substrate 1 and the second substrate 2 are respectively defined as the first functional area 11 and the second functional area 21, and the routing areas of the first substrate 1 and the second substrate 2 are respectively defined as the first routing area 12 and the second routing area 22.

[0032] In a specific embodiment, in combination Figure 1 and Figure 4As shown, the first substrate 1 includes a first substrate layer 13, a first conductive layer 14, a first edge wiring 15 and an adhesive layer 16, wherein the first conductive layer 14 is formed on a surface of the first substrate layer 13 close to the second substrate 2, and covers the first functional area 11 of the first substrate 1 and at least part of the first wiring area 12. In implementation, the first conductive layer 14 can be first formed on the first substrate layer 13 on the entire surface, and then the first non-conductive area 17 is etched in the first wiring area 12 of the first substrate 1 by etching or exposure and development processes, and the areas of the first wiring area 12 other than the first non-conductive area 17 respectively form the first edge wiring forming area and the first conductive island 18. The first non-conductive area 17 can also be directly reserved when the first conductive layer 14 is formed on the first substrate layer 13, that is, the first conductive layer 14 is set in all areas of the first substrate layer 13 other than the first non-conductive area 17. Alternatively, the first non-conductive area 17 does not need to be formed, and the first conductive layer 14 can be directly formed on the entire surface of the first substrate layer 13 , as long as the first edge wiring forming area and the first conductive island 18 are reserved in the first wiring area 12 of the first substrate layer 13 .

[0033] The first edge wiring 15 is formed on the first edge wiring formation area, and is used to enhance the conductivity of the first conductive layer 14. In implementation, the first edge wiring 15 is arranged at the edge of the first wiring area 12 close to the first functional area 11, and even the edge coincides with the boundary line between the first wiring area 12 and the first functional area 11. In implementation, the first edge wiring 15 can be a conductive copper wiring or a silver paste wiring, wherein, when preparing the conductive copper wiring, a mask can be used to make an edge pattern first, and then the entire surface is copper plated, exposed, developed and etched. The silver paste wiring can be realized by a silk screen process.

[0034] The first conductive island 18 is mainly used as a pin of the first conductive layer 14 of the first functional area 11. In implementation, the first conductive island 18 can be directly a part of the first conductive layer 14, or the first conductive island 18 can be formed by stacking a wiring on a part of the first conductive layer 14 of the first wiring area 12. The first conductive island 18 is electrically connected to the first conductive layer 14 in the first functional area 11, or the two are directly integrally formed. In one embodiment, the first conductive island 18 specifically includes a first crimping portion 181 and a first connecting portion 182.

[0035] The adhesive layer 16 is formed on the side of the first conductive layer 14 close to the second substrate 2, and covers the first conductive layer 14 and the first edge trace 15 except the first conductive island 18, that is, as long as the first conductive island 18 is exposed. The adhesive layer 16 is mainly used to fix the first substrate 1 and the second substrate 2. During preparation, the adhesive layer 16 can be made of UV glue, and can be realized by silk screen printing or printing or coating process, and the adhesive layer 16 is not cured before the first substrate 1 and the second substrate 2 are bonded. If cured, the curing time is generally higher than the UV curing time, and the curing temperature for LCD products generally needs to be lower than 85°, otherwise the high temperature will cause a loss of polarization effect of the polarizer.

[0036] In a specific embodiment, in combination Figure 2 and Figure 4 As shown, the second substrate 2 includes a second substrate layer 23, a second conductive layer 24, a second edge wiring 25, an insulating layer 26 and a microstructure 3, wherein the second conductive layer 24 is formed on a surface of the second substrate layer 23 close to the first substrate 1, and covers the second functional area 21 of the second substrate 2 and at least part of the second wiring area 22. Similarly, in implementation, the second conductive layer 24 can be first formed on the second substrate layer 23 on the entire surface, and then the second non-conductive area 27 is etched in the second wiring area 22 of the second substrate 2 by etching or exposure and development processes, and the areas of the second wiring area 22 other than the second non-conductive area 27 form the second edge wiring forming area and the second conductive island 28 and the third conductive island 29. The second non-conductive area 27 can also be directly reserved when the second conductive layer 24 is formed on the second substrate layer 23, that is, the second conductive layer 24 is set in all areas of the second substrate layer 23 other than the second non-conductive area 27. Alternatively, the second non-conductive area 27 does not need to be formed, and the second conductive layer 24 can be directly formed on the entire surface of the second substrate layer 23 , as long as the second edge wiring formation area, the second conductive island 28 and the third conductive island 29 are reserved in the second wiring area 22 of the second substrate 2 .

[0037] The second edge routing 25 is formed on the second edge routing formation area, and is used to enhance the conductivity of the second conductive layer 24. Similar to the first edge routing 15, during implementation, the second edge routing 25 is arranged at the edge of the second routing area 22 close to the second functional area 21, and even the edge coincides with the boundary line between the second routing area 22 and the second functional area 21. During implementation, the second edge routing 25 can also be a conductive copper routing or a silver paste routing, wherein, when preparing the conductive copper routing, a mask can be used to make an edge pattern first, and then the entire surface is copper plated, exposed, developed and etched. The silver paste routing can be realized by a silk screen process.

[0038] The second conductive island 28 is mainly used to be electrically connected to the first conductive island 18 of the first substrate 1. In implementation, the second conductive island 28 can be directly a part of the second conductive layer 24, or the second conductive island 28 can be formed by superimposing the second edge trace 25 on a part of the second conductive layer 24 in the second trace area 22. The second conductive island 28 is insulated and isolated from the second conductive layer 24 in the second functional area 21, specifically, by the second non-conductive area 27. In one embodiment, the second conductive island 28 specifically includes a second crimping portion 281 and a second connecting portion 282.

[0039] The third conductive island 29 is mainly used as a pin of the second conductive layer 24 of the second functional area 21. In implementation, the third conductive island 29 can be directly a part of the second conductive layer 24, or the third conductive island 29 can be formed by superimposing edge routing on a part of the second conductive layer 24 of the second routing area 22. The third conductive island 29 is electrically connected to the second conductive layer 24 in the second functional area 21, or the two are directly integrally formed. In one embodiment, the third conductive island 29 specifically includes a third crimping portion 291 and a third connecting portion 292. After the first substrate 1 and the second substrate 2 are bonded, the first connection part 182 and the second connection part 282 are overlapped to lead out the first conductive layer 14 of the first functional area 11; the third connection part 292 leads out the second conductive layer 24 of the second functional area 21, and finally, the first crimping part 181, the second crimping part 281 and the third crimping part 291 are crimped and led out through the flexible circuit board 4, that is, the first conductive layer 14 of the first functional area 11 and the second conductive layer 24 of the second functional area 21 are led out through the flexible circuit board 4. Compared with the traditional method of routing in the functional area so that the crimping of the flexible circuit board (FPC) is also in the functional area, the film material of the functional area is prone to wrinkles, thereby affecting its flatness. The utility model concentrates all the routing on one side of the functional area and separates it from the functional area, so the crimping of the FPC will not affect the flatness of the functional area at all, so it is conducive to ensuring the sound pressure level and high reliability of the entire directional sound-emitting device.

[0040] The insulating layer 26 is formed on the side of the second conductive layer 24 close to the first substrate 1, and covers the second conductive layer 24 and the second edge trace 25 except the second conductive island 28 and the third conductive island 29, that is, only the second conductive island 28 and the third conductive island 29 need to be exposed. The insulating layer 26 is mainly used to insulate and isolate the second conductive layer 24 from the first conductive layer 14. During preparation, the insulating layer 26 can be an OC insulating layer, and can be realized by exposure and development, silk screen printing, spray printing, or spin coating.

[0041] The microstructure 3 is formed on the insulating layer 26 located in the functional area of ​​the second substrate 2, and the microstructure 3 is fixed to the first substrate 1 through the above-mentioned adhesive layer 16. After fixation, an air gap required for vibration and sound generation is formed between the first substrate 1 and the second substrate 2. Because the adhesive layer 16 is kept dry or completely uncured before contacting the microstructure 3, the microstructure 3 can be embedded in the adhesive layer 16 after contacting the microstructure 3. After embedding, a triangular slope will be formed around the bottom of the microstructure 3. The ramp can fix the microstructure 3 and the adhesive layer 16 with high retention effect and good product reliability. During implementation, the microstructure 3 can select non-polarized or polarized electrolyte materials, preferably non-polarized electrolyte materials, and polarized dielectric materials are preferably high dielectric symmetry materials. And the microstructure 3 can be realized by any one of the processes of exposure and development process, silk screen process, and 2D / 3D printing process, preferably using a high-precision exposure and development process. Compared with the existing design of only coating an adhesive layer on the microstructure 3 for small-area bonding, the present invention adopts a structural design of fixing the microstructure 3 to the first substrate 1 with a whole-surface adhesive layer 16. Due to the large bonding area, the reliability is high, thereby ensuring the acoustic effect of the entire device. However, the existing design of small-area bonding on the microstructure has the following disadvantages: 1. The adhesive layer 16 is easy to fall off. The reason is: the bonding area is small, and each bonding area is the size of each microstructure. The microstructure 3 is designed to have a high visualization effect, and its single particle diameter is preferably less than 20um, and the maximum diameter of a cluster is less than 100um. The small bonding area and thin bonding layer cause the product to fall off due to uneven stress in the reliability environment and the customer's use environment, affecting the acoustic effect.

[0042] During implementation, the first substrate layer 13 and the second substrate layer 23 may both be flexible substrate layers or both be hard substrate layers, or one of them may be a flexible substrate layer and the other may be a hard substrate layer. For example, the first substrate layer 13 and the second substrate layer 23 may both be made of any one of polyethylene terephthalate (PET), polyimide film (CPI), ultra-thin flexible glass (UTG), and glass. The first conductive layer 14 and the second conductive layer 24 may be made of any one of ITO (indium tin oxide), METAL MESH (metal mesh), AG (silver), nano silver and other plating layers.

[0043] In addition, if Figure 4As shown, when the above-mentioned directional sound device is used in the field of vehicle-mounted, industrial control or electronics, in order to meet the effect of preventing the surface of the directional sound device or the display device attached thereto from being scratched by touch, a protective layer 5 is also provided on the surface of the first substrate layer 13 away from the second substrate 2. The protective layer can be any one or more of AG (anti-glare), AR (anti-reflection), AF (anti-fingerprint), and HC (hardening) coating treatment. In an implementation case, the surface of the first substrate layer 13 is treated with 10um hardening (HC), and the surface pencil hardness can reach 750g, 2H or more.

[0044] Preferably, the functional areas of the first substrate 1 and the second substrate 2 of the present invention are both transparent, so that the overall transparency and frameless design of the functional areas can be achieved.

[0045] In addition, if Figure 5 As shown, the directional sound device can also be divided into multiple sound channels, which are insulated and isolated from each other, and the routing area of ​​each sound channel is located on one side of the functional area, and each sound channel includes at least a first conductive island 18, a second conductive island 28 and a third conductive island 29. For example, a screen is divided into two left and right sound channels, and the two sound channels are insulated and isolated from each other. Specifically, the insulation isolation of adjacent sound channels can be achieved by setting a non-conductive area between the first conductive layer 14 and the second conductive layer 24.

[0046] In a specific embodiment, the total thickness of the entire insulating layer 26 on the second substrate 2 and the adhesive layer 16 on the first substrate 1 can be 5um to 10um. The lower the thickness, the greater the Coulomb force of the electric field. The total thickness of the first substrate 1 is 120um to 130um. The height of the microstructure 3 is 6um to 9um, the spacing is 2.2mm to 2.6mm, and the shape can be a single point or a single cluster of multiple points. The size of a single point is preferably less than 20um, the maximum diameter of a single cluster is less than 100um, and the total width is less than 130um. The smaller the microstructure 3, the higher the visibility of the directional sound-emitting device formed as a whole.

[0047] The utility model discloses a directional sound display device, including the above-mentioned directional sound device and a display screen (not shown), wherein the directional sound device is integrated with the display screen or is externally mounted on the display screen. The display screen can be an existing more mature touch display screen or a folding display screen, etc. The utility model is combined with the display screen to realize the borderless display screen and multiple functions such as directional sound and display, thereby meeting the market demand for the development trend of borderless display screens.

[0048] The advantages of the present invention are as follows: 1. The present invention arranges the wiring of the directional sound device on one side of the functional area, realizing the overall transparent and frameless design of the functional area, realizing the maximum screen-to-body ratio of directional sound and the combination with the display screen; in addition, compared with the traditional wiring in the functional area, the crimping of the flexible circuit board (FPC) is also in the functional area, and the film material of the functional area is prone to wrinkles, thereby affecting its flatness. The present invention concentrates all the wiring on one side of the functional area and separates it from the functional area, so the crimping of the FPC will not affect the flatness of the functional area at all, so it is conducive to ensuring the sound pressure level and high reliability of the entire directional sound device. In addition, because the substrate of the present invention does not need to be folded, the reliability of the entire directional sound device is also improved. 2. The present invention can be combined with a display screen to realize the frameless display screen and the integration of multiple functions such as directional sound and display, meeting the market demand for the development trend of frameless display screens.

[0049] The foregoing description of specific exemplary embodiments of the utility model is for the purpose of illustration and illustration. These descriptions are not intended to limit the utility model to the precise form disclosed, and it is clear that many changes and variations can be made based on the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the utility model and its practical application, so that those skilled in the art can realize and utilize various different exemplary embodiments of the utility model and various different options and changes. The scope of the utility model is intended to be defined by the claims and their equivalents.

Claims

1. A borderless, high-reliability directional sound-emitting device, characterized in that: The directional sound-emitting device includes a first substrate and a second substrate bonded together, the first substrate and the second substrate both including a functional area and a wiring area, the functional area is provided with a conductive layer, the wiring area is located on one side of the functional area, the wiring area of ​​the first substrate is provided with at least one first conductive island connected to the conductive layer of the functional area, the wiring area of ​​the second substrate is provided with at least one second conductive island isolated from the conductive layer of the functional area and at least one third conductive island connected to the conductive layer, the first conductive island at least partially overlaps with the second conductive island after the first substrate and the second substrate are bonded together, and the first conductive island, the second conductive island and the third conductive island are led out through a flexible circuit board.

2. A borderless, high-reliability directional sound-emitting device as claimed in claim 1, characterized in that: The routing areas of the first substrate and the second substrate are both provided with edge routing lines connected to the conductive layers in the respective functional areas.

3. A borderless, high-reliability directional sound-emitting device as claimed in claim 1, characterized in that: The first conductive island includes a first crimping portion and a first connecting portion, the second conductive island includes a second crimping portion and a second connecting portion, the third conductive island includes a third crimping portion and a third connecting portion electrically connected to the second conductive layer, the first connecting portion overlaps with the second connecting portion after the first substrate and the second substrate are bonded together, and the first crimping portion, the second crimping portion and the third crimping portion are crimped out through a flexible circuit board.

4. A borderless, high-reliability directional sound-emitting device as claimed in claim 2, characterized in that: The first substrate includes a first substrate layer, a first conductive layer, and a first edge routing. The first conductive layer is formed on the bottom surface of the first substrate layer close to the second substrate, and covers the entire functional area of ​​the first substrate and partially covers the routing area of ​​the first substrate. The first edge routing is arranged in the routing area of ​​the first substrate and covers the first conductive layer located in the routing area.

5. A borderless, high-reliability directional sound-emitting device as claimed in claim 4, characterized in that: The first substrate further includes an adhesive layer, which is formed on the bottom surface of the first conductive layer close to the second substrate and covers the first conductive layer and the first edge wiring except the first conductive island.

6. A borderless, high-reliability directional sound-emitting device as claimed in claim 5, characterized in that: The second substrate includes a second substrate layer, a second conductive layer, a second edge routing and an insulating layer. The second conductive layer is formed on the top surface of the second substrate layer close to the first substrate, and covers the entire functional area of ​​the second substrate and partially covers the routing area of ​​the second substrate. The portion covering the routing area forms a second edge routing formation area connected to the conductive layer of the functional area, a second conductive island and a third conductive island isolated from the conductive layer of the functional area; the second edge routing covers the second edge routing formation area; the insulating layer is formed on the top surface of the second conductive layer close to the first substrate, and covers the second conductive layer and the second edge routing except the second conductive island and the third conductive island.

7. A borderless, high-reliability directional sound-emitting device as claimed in claim 6, characterized in that: The second substrate also includes a microstructure, which is formed on the insulating layer located in the functional area of ​​the second substrate, and the microstructure is fixed to the first substrate through the adhesive layer. After fixation, an air gap required for vibration and sound generation is formed between the first substrate and the second substrate.

8. A borderless, high-reliability directional sound-emitting device as claimed in claim 6, characterized in that: The first substrate layer and the second substrate layer are both flexible substrate layers or both hard substrate layers, or one of them is a flexible substrate layer and the other is a hard substrate layer.

9. A borderless, high-reliability directional sound-emitting device as claimed in claim 1, characterized in that: The directional sound-emitting device is partitioned and divided into a plurality of sound-emitting channels, the sound-emitting channels are insulated and isolated from each other, and the routing area of ​​each sound-emitting channel is located on one side of the functional area and includes at least the first conductive island, the second conductive island and the third conductive island.

10. A directional sound display device, characterized in that: The display device comprises a display screen and the directional sound-emitting device according to any one of claims 1 to 9, wherein the directional sound-emitting device is integrated with the display screen or is externally mounted on the display screen.

Images