Wafer detection feeding device

Abstract

The utility model discloses a wafer detection feeding device which comprises a rack, a material box module, a swing arm module and a wafer positioning module are arranged on the rack, the material box module and the wafer positioning module are oppositely arranged on the two sides of the rack, and the swing arm module is arranged in the middle of the rack; a horizontal moving mechanism is arranged on the rack, the swing arm module comprises double swing arms which are arranged up and down, the double swing arms are slidably arranged on the horizontal moving mechanism, a lifting mechanism is further arranged in the middle of the rack, a rotating mechanism is arranged below the horizontal moving mechanism, and the horizontal moving mechanism is arranged on the lifting mechanism through the rotating mechanism; the wafer positioning module comprises a fixed seat, an adsorption platform and deviation rectifying blocks; the deviation rectifying blocks are oppositely arranged and are respectively arranged on two sides of the adsorption platform; the height of the swing arm is adjusted by arranging the swing arm module on the lifting mechanism, so that the swing arm corresponds to the position of the wafer needing to be fed in the material box, the material box does not need to be moved, and the stability of the wafer in the material box is ensured. And the wafer positioning module is arranged to rectify the deviation of the wafer, so that the position alignment of the subsequently transferred wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a wafer detection and feeding device. Background Art

[0002] In wafer processing, each device involves the loading process. When the swing arm transfers the wafer, the material box usually moves up and down so that the swing arm corresponds to the wafer position. However, the movement of the material box usually makes the internal wafer unstable, easy to tilt or fall, and multiple adjustments and alignments are prone to errors. In addition, during the loading process, the direction of the wafer is prone to tilt, affecting the subsequent processing position. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the utility model provides a wafer detection and loading device, which adjusts the height of the swing arm by setting a swing arm module on a lifting mechanism, so as to correspond to the position of the wafer required to be loaded in the material box, without moving the material box, thereby ensuring the stability of the wafer in the material box. A wafer positioning module is also provided to correct the deviation of the wafer to ensure the alignment of the subsequent transfer wafer position.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A wafer inspection and loading device comprises a frame, on which a material box module, a swing arm module and a wafer positioning module are provided, the material box module and the wafer positioning module are arranged on both sides of the frame opposite to each other, and the swing arm module is arranged in the middle of the frame; a horizontal moving mechanism is also provided on the frame, the swing arm module comprises a double swing arm arranged up and down, the double swing arm is slidably arranged on the horizontal moving mechanism, a lifting mechanism is also provided in the middle of the frame, a rotating mechanism is provided below the horizontal moving mechanism, and the horizontal moving mechanism is arranged on the lifting mechanism through the rotating mechanism; the wafer positioning module comprises a fixed seat, an adsorption platform and two correction blocks, the fixed seat is arranged on the frame, a supporting platform is provided on the fixed seat, the correction block is movably arranged on the supporting platform through a correction slide rail, and the two correction blocks are arranged opposite to each other and are respectively arranged on both sides of the adsorption platform.

[0006] As a further improvement of the above technical solution, the wafer positioning module also includes a code reading mechanism, which is fixedly mounted on the fixing seat and is aligned downwardly with the adsorption platform.

[0007] As a further improvement of the above technical solution, a plurality of adsorption channels are provided on the adsorption platform, and the adsorption channels are used to generate negative pressure.

[0008] As a further improvement of the above technical solution, the adsorption platform is arranged on the fixed seat through a platform lifting component, and the platform lifting component is used to drive the adsorption platform to rise and fall.

[0009] As a further improvement of the above technical solution, the material box module includes a material box and a mobile platform, the material box is arranged on the mobile platform, the mobile platform is arranged on the frame through a movable track, the mobile platform is used to drive the material box to slide, and the material box is provided with a plurality of placement positions for placing wafers.

[0010] As a further improvement of the above technical solution, the double swing arm is configured as a first swing arm and a second swing arm, the first swing arm is configured above the second swing arm, and the first swing arm and the second swing arm are both configured in the middle of the frame.

[0011] As a further improvement of the above technical solution, the ends of the first swing arm and the second swing arm are both arc forks, and the diameter of the arc in the arc fork is larger than the diameter of the adsorption platform.

[0012] As a further improvement of the above technical solution, adsorption holes are provided on the upper surfaces of both ends of the arc fork, and the adsorption holes are used to generate negative pressure.

[0013] As a further improvement of the above technical solution, a transmission belt and a slide rail are respectively provided on both sides of the horizontal moving mechanism, the first swing arm and the second swing arm are respectively arranged on the slide rails through sliders, the first swing arm and the second swing arm are clamped on the transmission belt, and the transmission belt drives the first swing arm and the second swing arm to move.

[0014] As a further improvement of the above technical solution, the lifting mechanism includes a vertical guide rail and a vertical slider, the vertical guide rail is arranged below the frame, the rotating mechanism is arranged on the vertical slider through the vertical slider, and the vertical slider is driven to lift and lower through a screw assembly.

[0015] The beneficial effects of the utility model are: when the wafer is placed on the adsorption platform for deflection correction and code reading, the next wafer is grabbed and transferred back and forth in sequence through the double swing arms; the action rhythm is improved and the production efficiency is improved. In addition, in the process of grabbing the wafer, the swing arm is adjusted in position through the horizontal movement mechanism, the rotation mechanism and the lifting mechanism, and the material box does not need to move up and down to align the swing arm, so as to ensure the stability of the wafer in the material box. In addition, a wafer positioning module is provided to first correct the wafer during the loading process to ensure the alignment of the position of the subsequent transferred wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0017] Figure 1This is the assembly diagram of the utility model Figure 1 ;

[0018] Figure 2 This is the assembly diagram of the utility model Figure 2 ;

[0019] Figure 3 yes Figure 1 The enlarged schematic diagram at A in the middle;

[0020] Figure 4 yes Figure 1 The enlarged schematic diagram of point B in the middle;

[0021] Figure 5 yes Figure 2 Enlarged schematic diagram at point C in the middle.

[0022] Explanation of the reference numerals: 1-frame; 2-material box module; 21-material box; 22-moving platform; 23-moving track; 3-swing arm module; 311-first swing arm; 312-second swing arm; 313-adsorption hole; 32-horizontal moving mechanism; 321-slide rail; 322-transmission belt; 33-rotation mechanism; 34-lifting mechanism; 341-vertical guide rail; 342-vertical slider; 4-wafer positioning module; 41-fixed seat; 42-adsorption platform; 421-platform lifting assembly; 43-supporting platform; 431-correction slide rail; 44-correction block; 45-code reading mechanism. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the concept, specific structure and technical effects of the utility model in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the utility model. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the utility model can be combined interchangeably without conflicting with each other.

[0024] Please refer to Figure 1 as well as Figure 2The utility model provides a wafer inspection and loading device, comprising a frame 1, wherein the frame 1 is used to carry various components in the device. The frame 1 is provided with a material box module 2, a swing arm module 3 and a wafer positioning module 4, wherein the material box module 2 is used to accommodate wafers for convenient wafer loading; the swing arm module 3 is used to grab wafers for loading; the wafer positioning module 4 is used to position the wafer and correct the direction to ensure that the subsequent wafer loading is in the correct position and direction.

[0025] The material box module 2 and the wafer positioning module 4 are arranged on both sides of the frame 1 opposite to each other, and the swing arm module 3 is arranged in the middle of the frame 1. The swing arm module 3 transfers the wafer from the material box module 2 to the wafer positioning module 4 by grabbing the wafer and rotating.

[0026] The swing arm module 3 includes a double swing arm arranged up and down, and the double swing arm can be slidably arranged on a horizontal moving mechanism 32, and the horizontal moving mechanism 32 can drive the double swing arm to move. A lifting mechanism 34 is also provided in the middle of the frame 1, which is used to drive the double swing arm to lift and lower, so as to facilitate adjustment and alignment of the wafers in the material box 21. A rotating mechanism 33 is provided below the horizontal moving mechanism 32, which is used to drive the horizontal moving mechanism 32 to rotate, thereby changing the direction of the double swing arm.

[0027] Furthermore, the horizontal moving mechanism 32 is arranged on the lifting mechanism 34 through the rotating mechanism 33, so that the lifting mechanism 34 drives the rotating mechanism 33, the horizontal moving mechanism 32 and the double swing arm to move up and down together. The height of the double swing arm can be changed by lifting, so that it is convenient to align the wafer for loading and convenient to lower the wafer when placing the wafer into the wafer positioning module 4.

[0028] The wafer positioning module 4 includes a fixed seat 41, an adsorption platform 42 and two correction blocks 44. The fixed seat 41 is arranged on the frame 1, and each component of the wafer positioning module 4 is supported on the fixed seat 41. The correction blocks 44 are arranged relatively and correspond to the adsorption platform 42, and are respectively arranged on both sides of the adsorption platform 42. A support platform 43 is arranged on the fixed seat 41, and the correction block 44 is movably arranged on the support platform 43 through a correction slide rail 431. The correction block 44 moves relatively to the support platform 43 to correct the wafer on the support platform 43.

[0029] By setting the swing arm module 3 on the lifting mechanism 34 to adjust the height of the double swing arms, the height of the double swing arms can be adjusted to correspond to the position of the wafer to be loaded in the material box 21, without moving the material box 21, thereby ensuring the stability of the wafers in the material box 21. A wafer positioning module 4 is provided to correct the deviation of the wafer to ensure the alignment of the subsequent transfer wafer position.

[0030] Please refer to Figure 1 , Figure 3 as well as Figure 5 When the wafer is loaded, it will first be sent to the adsorption platform 42 in the wafer positioning module 4 for correction, wherein the adsorption platform 42 is provided with a plurality of adsorption channels, and the adsorption channels are used to generate negative pressure. The adsorption platform 42 is connected to an external negative pressure device. When the wafer is placed on the adsorption platform 42, the adsorption channel generates negative pressure to adsorb the wafer on the adsorption platform 42.

[0031] The wafer positioning module 4 also includes a code reading mechanism 45, which is used to photograph the status of the wafer and read the wafer code. The code reading mechanism 45 is fixedly mounted on the fixing seat 41. The code reading mechanism 45 of the fixing frame is suspended above the adsorption platform 42, so that the code reading mechanism 45 is downwardly aligned with the adsorption platform 42. The code reading device can photograph the placement of the wafer, determine whether the wafer is in the correct position, and facilitate direct adjustment on the adsorption platform 42.

[0032] Furthermore, in order to adjust the wafer, the adsorption platform 42 is arranged on the fixed seat 41 through a platform lifting component 421, and the platform lifting component 421 is used to drive the adsorption platform 42 to rise and fall. When it is necessary to perform code reading detection on the wafer, the adsorption platform 42 can adjust a suitable height position through the platform lifting component 421 to perform code reading detection to ensure accurate code reading.

[0033] When the swing arm module 3 places the wafer, the adsorption platform 42 assists in lifting and lowering, and moves relative to the swing arm, so that the wafer is adsorbed on the adsorption platform 42; when the swing arm picks up the wafer again, the adsorption platform 42 relatively descends, so that the wafer is lifted by the swing arm. Then, the correction block 44 moves relative to the wafer direction to correct the wafer and return the wafer position to the center.

[0034] Please refer to Figure 1 , Figure 3 as well as Figure 4 The swing arm module 4 is used to transfer the wafers in the material box 21 to the wafer positioning module 4, and then transfer the positioned wafers to the next processing equipment. The double swing arms are respectively set as the first swing arm 311 and the second swing arm 312, the first swing arm 311 is set above the second swing arm 312, and the first swing arm 311 and the second swing arm 312 are both set in the middle of the frame 1, at different heights at the same position.

[0035] The ends of the first swing arm 311 and the second swing arm 312 are both arc forks, which can extend under the wafer to lift the wafer. The diameter of the arc inside the arc fork is smaller than the diameter of the wafer, so that the fork can lift the wafer, and the arc shape just matches the shape of the wafer, making the wafer more stable in the swing arm. At the same time, the arc diameter inside the arc fork is larger than the diameter of the adsorption platform 42, so that the adsorption platform 42 can pass through the arc of the swing arm to lift and adsorb the wafer, and the swing arm is lowered from the periphery of the adsorption platform 42 to unload the wafer.

[0036] Furthermore, the upper surfaces of both ends of the arc fork of the swing arm are provided with adsorption holes 313, and the adsorption holes 313 are used to generate negative pressure. By connecting with an external adsorption device, the adsorption holes 313 generate negative pressure, thereby stably adsorbing the wafer on the swing arm.

[0037] The horizontal moving mechanism 32 is provided with a transmission belt 322 and a slide rail 321 on both sides, respectively. The first swing arm 311 and the second swing arm 312 are respectively arranged on the slide rails 321 on both sides through sliders, and the first swing arm 311 and the second swing arm 312 can move on the slide rails 321.

[0038] A transmission belt 322 is provided on the outer side of the slide rail 321, and the first swing arm 311 and the second swing arm 312 are clamped on the transmission belt 322, and the transmission belt 322 drives the first swing arm 311 and the second swing arm 312 to move. The transmission belt 322 is provided on a synchronous wheel, and a driving device is provided at the bottom of the horizontal moving mechanism 32 to control the synchronous wheel to drive the belt transmission, so that the first swing arm 311 and the second swing arm 312 follow the movement of the belt, so that the first swing arm 311 and the second swing arm 312 can achieve the function of moving and transporting wafers.

[0039] The double swing arm is translated through the horizontal moving mechanism 32, the rotating mechanism 33 rotates the horizontal moving mechanism 32 and the swing arm as a whole, and the lifting mechanism 34 drives the rotating mechanism 33 up and down. The lifting mechanism 34 includes a vertical guide rail 341 and a vertical slider 342. The vertical guide rail 341 is arranged below the middle of the frame 1. The rotating mechanism 33 is arranged on the vertical guide rail 341 through the vertical slider 342 and can move on the vertical guide rail 341. Among them, the vertical slider 342 is driven to rise and fall by a screw assembly. The screw is arranged behind the vertical guide rail 341, and the screw nut is connected to the vertical slider 342. The screw is driven to rotate by a servo motor, so that the screw nut moves up and down, and the corresponding position of the double swing arm is accurately adjusted by the screw assembly.

[0040] Please continue to refer to Figure 1 as well as Figure 2The material box module 2 is arranged at the end of the frame 1 and is arranged opposite to the wafer positioning module 4. The material box module 2 includes a material box 21 and a moving platform 22, and the material box 21 is arranged on the moving platform 22.

[0041] The frame 1 is provided with a moving track 23, and the moving platform 22 is provided on the frame 1 through the moving track 23, and the moving platform 22 drives the material box 21 to slide on the moving track 23. Among them, the material box 21 is provided with a plurality of placement positions for placing wafers, and a material box 21 can store multiple wafers. When the material box module 2 needs to replace the material box 21, the material box 21 can be moved to the outside of the frame 1 by pulling the moving platform 22 for easy replacement.

[0042] When wafers are stored in the material box 21, the swing arm module 3 starts to drive the double swing arms to transfer the wafers in the material box 21 and load them into the next processing equipment. The rotating mechanism 33 transfers the double swing arms to the direction of the material box 21, and the horizontal moving mechanism 32 extends the first swing arm 311 into the material box 21, and the lifting mechanism 34 drives to lift the wafers; the horizontal moving mechanism 32 is recovered, and then the double swing arms are transferred to the wafer positioning module 4 through the rotating mechanism 33, and the first swing arm 311 is extended above the adsorption platform 42 through the horizontal moving mechanism 32, and the lifting mechanism 34 lowers the double swing arms to place the wafer on the adsorption platform 42.

[0043] When the wafer is placed on the adsorption platform 42 for deflection correction and code reading, the rotating mechanism 33 transfers the double swing arm to the direction of the material box 21, and the horizontal moving mechanism 32 extends the second swing arm 312 into the material box 21 to grab the second wafer; after the first wafer is positioned, the double swing arm is transferred to the wafer positioning module 4 through the rotating mechanism 33, and the first swing arm 311 is extended under the adsorption platform 42 through the horizontal moving mechanism 32 to lift the wafer, and the rotating mechanism 33 transfers the double swing arm to the processing equipment direction on the side of the wafer detection and loading device to unload the wafer. The rotating mechanism 33 transfers the double swing arm back to the wafer positioning module 4 again, and the horizontal moving mechanism 32 extends the second swing arm 312 above the adsorption platform 42, and the lifting mechanism 34 lowers the double swing arm to place the second wafer on the adsorption platform 42.

[0044] When the wafer is placed on the adsorption platform 42 for deflection correction and code reading, the idle double swing arm is used again to grab the next wafer and transfer it back and forth in sequence. Improve the action rhythm and production efficiency. In addition, in the process of grabbing the wafer, the double swing arm is adjusted in position by the horizontal moving mechanism 32, the rotating mechanism 33 and the lifting mechanism 34, and the material box 21 does not need to move up and down to align the double swing arm to ensure the stability of the wafer in the material box 21. In addition, a wafer positioning module 4 is provided to first correct the wafer during the loading process to ensure the alignment of the subsequent transferred wafer positions.

[0045] The above is a specific description of the preferred implementation of the utility model, but the invention of the utility model is not limited to the described embodiments. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the utility model. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A wafer inspection and loading device, characterized in that: The machine comprises a frame, on which a material box module, a swing arm module and a wafer positioning module are provided, the material box module and the wafer positioning module are arranged on both sides of the frame opposite to each other, and the swing arm module is arranged in the middle of the frame; a horizontal moving mechanism is also provided on the frame, the swing arm module comprises double swing arms arranged up and down, the double swing arms are slidably arranged on the horizontal moving mechanism, a lifting mechanism is also provided in the middle of the frame, a rotating mechanism is provided below the horizontal moving mechanism, and the horizontal moving mechanism is arranged on the lifting mechanism through the rotating mechanism; the wafer positioning module comprises a fixed seat, an adsorption platform and two deviation correction blocks, the fixed seat is arranged on the frame, a supporting platform is provided on the fixed seat, the deviation correction block is movably arranged on the supporting platform through a deviation correction slide rail, and the two deviation correction blocks are arranged opposite to each other and are respectively arranged on both sides of the adsorption platform.

2. The wafer inspection and loading device according to claim 1, characterized in that: The wafer positioning module also includes a code reading mechanism, which is fixedly mounted on the fixing seat and is aligned downwardly with the adsorption platform.

3. The wafer inspection and loading device according to claim 1, characterized in that: The adsorption platform is provided with a plurality of adsorption channels, and the adsorption channels are used to generate negative pressure.

4. The wafer inspection and loading device according to claim 1, characterized in that: The adsorption platform is arranged on the fixing seat through a platform lifting component, and the platform lifting component is used for driving the adsorption platform to rise and fall.

5. The wafer inspection and loading device according to claim 1, characterized in that: The material box module includes a material box and a mobile platform, the material box is arranged on the mobile platform, the mobile platform is arranged on the frame through a mobile track, the mobile platform is used to drive the material box to slide, and the material box is provided with a plurality of placement positions for placing wafers.

6. The wafer inspection and loading device according to claim 1, characterized in that: The double swing arm is configured as a first swing arm and a second swing arm, the first swing arm is configured above the second swing arm, and the first swing arm and the second swing arm are both configured in the middle of the frame.

7. The wafer inspection and loading device according to claim 6, characterized in that: The ends of the first swing arm and the second swing arm are both arc forks, and the arc diameter in the arc fork is larger than the diameter of the adsorption platform.

8. The wafer inspection and loading device according to claim 7, characterized in that: The upper surfaces of both ends of the arc fork are provided with adsorption holes, and the adsorption holes are used to generate negative pressure.

9. The wafer inspection and loading device according to claim 6, characterized in that: A transmission belt and a slide rail are respectively provided on both sides of the horizontal moving mechanism. The first swing arm and the second swing arm are respectively arranged on the slide rails through sliders. The first swing arm and the second swing arm are clamped on the transmission belt, and the transmission belt drives the first swing arm and the second swing arm to move.

10. The wafer inspection and loading device according to claim 1, characterized in that: The lifting mechanism comprises a vertical guide rail and a vertical slider, wherein the vertical guide rail is arranged below the frame, and the rotating mechanism is arranged on the vertical guide rail through the vertical slider, and the vertical slider is driven to lift and lower through a screw rod assembly.

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