Printed circuit board for notebook keyboard
By using a multi-layer bonding structure printed circuit board in the backlit keyboard of the laptop, the MiniLED control circuit and key conduction circuit are integrated, the complexity of the circuit layer structure and assembly problems are solved, cost reduction and quality improvement are achieved, and the product is enhanced. Market competitiveness.
Patent Information
- Application Number
- CN202322555537.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-19
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-09-19
AI Technical Summary
The circuit layer structure of the backlit keyboard of existing laptops is complex, the assembly process is troublesome, the total thickness of the finished product is thick, the cost of manufacturing materials is high, and the processing cost is relatively high, resulting in low quality consistency of the finished product output.
Printed circuit boards with multi-layer bonding structures include stainless steel substrate support layer, substrate isolation insulation layer and conductive circuit layer. MiniLED control circuit and key conduction circuit are set. MiniLED light emitting devices are placed on the conductive circuit layer and passed through stainless steel. The substrate support layer integrates the circuit layer, simplifying the assembly process and reducing costs.
It realizes structural integration, simplifies assembly processes, reduces production costs, improves product stability and quality consistency, and through the reasonable design of MiniLED light sources, energy consumption and cost are reduced, and the market competitiveness of the product is enhanced.
Smart Images
Figure CN222147872U_ABST
Abstract
Description
Technical Field
[0001] The utility model specifically relates to a printed circuit board used for a notebook keyboard. Background Art
[0002] A keyboard is a device for inputting commands and data to operate a device. It also refers to a set of function keys that are arranged by the system to operate a machine or device. The keyboard is the most commonly used and most important input device. English letters, numbers, punctuation marks, etc. can be input into the computer through the keyboard, thereby issuing commands to the computer, inputting data, etc. In the prior art, tablet computers and laptops widely use independent keyboards as input devices to improve portability and flexibility.
[0003] Currently, the backlight keyboard of laptop computers on the market consists of a keyboard functional structure part and a keyboard backlight part; the keyboard functional structure part mainly includes a supporting layer and a keyboard flexible circuit layer; the keyboard backlight part mainly includes a backlight flexible circuit layer. This type of laptop computer backlight keyboard includes multiple parts, the circuit layer structure is complex, the assembly process is cumbersome, the total thickness of the finished product is relatively thick, the manufacturing material cost is high, the processing cost is relatively high, and the quality consistency of the output finished product is low.
[0004] Therefore, there is a need for a new technical solution for printed circuit boards for notebook keyboards to solve the problems of current solutions for notebook computer backlight keyboards, such as complex circuit layer structure, cumbersome assembly process, thick total thickness of the finished product, high manufacturing material cost, high processing cost and low quality consistency of the finished product. Utility Model Content
[0005] The utility model provides a printed circuit board for a notebook keyboard, which solves the problems of the current solution of the notebook computer backlight keyboard, namely, complex circuit layer structure, cumbersome assembly process, thick total thickness of the finished product, high manufacturing material cost, high processing cost and low quality consistency of the output finished product.
[0006] In order to solve the above problems, the utility model provides a printed circuit board for a notebook keyboard, comprising:
[0007] The printed circuit board has a multi-layer bonding structure, in which a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer are sequentially bonded to each other, wherein a MiniLED control circuit and a key conduction circuit are arranged on the conductive circuit layer, and the MiniLED light-emitting device is arranged at a preset position on the MiniLED control circuit of the conductive circuit layer. The thickness of the stainless steel substrate support layer is less than or equal to 50μm, the thickness of the substrate isolation insulating layer is 5μm to 50μm, and the thickness of the conductive circuit layer is 3μm to 10μm.
[0008] Furthermore, the printed circuit board may further include: a keyboard key conductive film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers;
[0009] The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer bonded to each other in sequence, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device is provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a first conductive circuit layer and a first substrate isolation insulating layer are provided above the stainless steel substrate support layer from far to near, and a MiniLED light-emitting device, a second conductive circuit layer and a second substrate isolation insulating layer are provided below the stainless steel substrate support layer from far to near; wherein the first conductive circuit layer is provided with a key conduction circuit, and the second conductive circuit layer is provided with a MiniLED control circuit.
[0010] Furthermore, the printed circuit board may further include: a keyboard key conductive film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers;
[0011] The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer bonded to each other in sequence, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device is provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a MiniLED light-emitting device, a second conductive circuit layer, a second substrate isolation insulating layer, a first conductive circuit layer and a first substrate isolation insulating layer are provided on the stainless steel substrate support layer from far to near, wherein the second conductive circuit layer is provided with a MiniLED control circuit, and the first conductive circuit layer is provided with a key conduction circuit.
[0012] Furthermore, the printed circuit board may further include: a keyboard key conductive film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers;
[0013] The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer bonded to each other in sequence, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device is provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a second conductive circuit layer, a second substrate isolation insulating layer, a MiniLED light-emitting device, a first conductive circuit layer and a first substrate isolation insulating layer are provided on the stainless steel substrate support layer from far to near, wherein the first conductive circuit layer is provided with a MiniLED control circuit, and the second conductive circuit layer is provided with a key conduction circuit.
[0014] Furthermore, the printed circuit board may further include: a keyboard key conduction thin film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers;
[0015] The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is that a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer are bonded to each other in sequence, wherein a MiniLED control circuit and a key conduction circuit are arranged on the conductive circuit layer, and the MiniLED light-emitting device is arranged at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a first MiniLED light-emitting device, a first conductive circuit layer and a first substrate isolation insulating layer are arranged above the stainless steel substrate support layer from far to near, and a second MiniLED light-emitting device, a second conductive circuit layer and a second substrate isolation insulating layer are arranged below the stainless steel substrate support layer from far to near; wherein the first conductive circuit layer is provided with a key conduction circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device.
[0016] Furthermore, the above-mentioned printed circuit board may also include: the stainless steel substrate support layer is provided with a first keycap key core structure installation hole; the substrate isolation insulating layer is bonded to the stainless steel substrate support layer, and the corresponding position of the first keycap key core structure installation hole is provided on the stainless steel substrate support layer, and the substrate isolation insulating layer is provided with a second keycap key core structure installation hole, wherein the size of the second keycap key core structure installation hole is smaller than or equal to the first keycap key core structure installation hole, and the straight line formed by connecting the center of the second keycap key core structure installation hole and the center of the first keycap key core structure installation hole is perpendicular to the stainless steel substrate support layer.
[0017] Furthermore, the above-mentioned printed circuit board may also include: the conductive circuit layer is also provided with a third keycap key core structure installation hole, the conductive circuit layer is bonded to the substrate isolation insulating layer, and the corresponding position of the second keycap key core structure installation hole is set on the substrate isolation insulating layer, and the conductive circuit layer is provided with a third keycap key core structure installation hole, wherein the size of the third keycap key core structure installation hole is greater than or equal to the first keycap key core structure installation hole, and the straight line formed by connecting the center of the third keycap key core structure installation hole and the center of the first keycap key core structure installation hole is perpendicular to the stainless steel substrate support layer.
[0018] Furthermore, the above-mentioned printed circuit board may also include: the keyboard key conductive film circuit layer is provided with a fourth keycap key core structure mounting hole and a key conductive contact, and the key conductive contact is arranged outside the position of the fourth keycap key core structure mounting hole on the keyboard key conductive film circuit layer; the keyboard key conductive film circuit layer is joined to the conductive circuit layer, and the corresponding position of the third keycap key core structure mounting hole is arranged on the conductive circuit layer, the keyboard key conductive film circuit layer is provided with a fourth keycap key core structure mounting hole, and the straight line formed by connecting the center of the fourth keycap key core structure mounting hole and the center of the third keycap key core structure mounting hole is perpendicular to the stainless steel substrate support layer.
[0019] Furthermore, the printed circuit board may also include: there are multiple key conduction contacts, and the multiple key conduction contacts are evenly arranged around the fourth keycap key core structure installation hole position on the keyboard key conduction film circuit layer.
[0020] Through the above scheme, the application of this application has the following advantages:
[0021] Structural integrity: A printed circuit board with an integrated structure formed by sequentially bonding a stainless steel substrate support layer, a substrate isolation insulation layer and a conductive circuit layer can replace the support layer in a traditional laptop backlight keyboard, and the MiniLED circuit and part or all of the key conduction circuit can be arranged in a mixed single-layer circuit or multi-layer circuit manner on the same side or on both sides of a printed circuit board based on a stainless steel substrate.
[0022] Ease of processing: The use of a stainless steel-based printed circuit board greatly reduces the assembly process of the notebook computer backlight keyboard, eliminating many of the original alignment, bonding, and assembly processes between the functional layers and structural layers of the notebook computer backlight keyboard. And due to the extremely low temperature expansion and contraction of the stainless steel substrate, the MiniLED light-emitting device can be easily placed on the stainless steel-based circuit board through a general attachment and welding process, which reduces the difficulty of production, improves the product yield, and reduces production costs.
[0023] Product stability: The existing laptop backlight keyboard is composed of a keyboard functional structure part and a keyboard backlight part joined by a film or glue. By setting a printed circuit board with a stainless steel substrate, a large number of semi-automatic or manual film or glue joining processes between the original stacked structures are eliminated, which greatly improves the stability of the laptop backlight keyboard.
[0024] In summary, the present application has the advantages of simple and efficient circuit design of structurally integrated printed circuit boards, simplicity of processing without adaptation and adjustment, and reduction of material types in the printed circuit board processing process. In addition, by setting a circuit board with a stainless steel substrate, a large number of semi-automatic or manual film or glue bonding processes between the original stacked structures are eliminated, thereby greatly improving the stability of the notebook computer backlight keyboard. At the same time, by having an application scheme with a MiniLED light source under each key, the brightness requirement of a single MiniLED light source can be reduced. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness, thereby achieving the goals of reducing product costs, improving production efficiency and increasing product market competitiveness, making the present application have broad application prospects and economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0026] Figure 1 Shown is a schematic diagram of the structure decomposition of a printed circuit board for a notebook keyboard of the present application;
[0027] Figure 2 Shown is a schematic diagram of the structural decomposition of an embodiment of a printed circuit board of the present application;
[0028] Figure 3 Shown is a schematic diagram of the structure decomposition of another embodiment of the printed circuit board of the present application;
[0029] Figure 4 Shown is a schematic diagram of the structural decomposition of yet another embodiment of the printed circuit board of the present application. DETAILED DESCRIPTION
[0030] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.
[0031] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.
[0032] The main design idea of this application is that the printed circuit board with a stainless steel substrate as the circuit support layer has the following advantages: high temperature resistance: the printed circuit board with a stainless steel substrate as the circuit support layer has excellent high temperature performance. When the circuit board is running in a high temperature environment, the support layer generally has a large thermal deformation, which affects the performance and life of the circuit board. However, the circuit board with a stainless steel substrate as the circuit support layer has a very small deformation due to high temperature and can operate stably for a long time in a high temperature environment; high strength: the printed circuit board with a stainless steel substrate as the circuit support layer has a high strength. When the circuit board is hit or vibrated in a mechanical environment, part of the support layer is prone to aging and fracture problems. The stainless steel substrate as the circuit support layer can effectively protect the circuit board; long life: due to the high temperature resistance and high strength of the printed circuit board with a stainless steel substrate as the circuit support layer, the life of the circuit board is effectively extended. At the same time, the printed circuit board with a stainless steel substrate as the circuit support layer is also corrosion-resistant, which can effectively prevent the circuit board from chemical corrosion, further increasing the life of the circuit board; better heat dissipation performance: due to the high thermal conductivity of the stainless steel support layer, it can better discharge heat from the circuit board, thereby improving the heat dissipation performance of the circuit board. In summary, printed circuit boards with stainless steel substrates as the circuit support layer have the advantages of high temperature resistance, high strength, long life, and good heat dissipation performance. In high temperature, mechanical and chemical environments, using stainless steel substrates as the circuit support layer can better protect the circuit board, thereby improving the reliability and life of the circuit board.
[0033] This application uses stainless steel substrate materials to combine the stainless steel substrate support layer, MiniLED control circuit and key conduction circuit into one. By integrating the MiniLED control circuit and the key conduction circuit through the stainless steel substrate material, part or all of the key conduction circuit can be set on a printed circuit board based on the stainless steel substrate. After the key conduction circuit is greatly integrated, only conductive material needs to be set under the key cap structure to trigger the key function. This application has the advantages of simple and efficient circuit design, eliminating adaptation and adjustment, and reducing the types of materials in the printed circuit board processing process, so as to achieve the goal of effectively adjusting the thickness and structure of the notebook computer backlight keyboard, reducing production costs, improving production efficiency and increasing product market competitiveness. In addition, reducing the adaptation and adjustment steps also simplifies the production process, and reducing the types of materials can reduce the complexity of inventory management, reduce the cost of material procurement and management, and improve production efficiency.
[0034] This application ensures that each key has an application scheme of MiniLED light source, which can reduce the brightness requirement of a single MiniLED light source. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness. Among them, the MiniLED light-emitting device can be set on the same side of the key conduction circuit to form front light emission, or on the back side of the key conduction circuit, and the light source is evenly reflected to the front side of the membrane keyboard trigger circuit by setting a diffusion film and a reflection film.
[0035] This application makes use of the extremely low temperature creep characteristics of the stainless steel substrate to make MiniLED applications that require high mounting accuracy easy to implement, reduce production difficulty, and improve production efficiency.
[0036] In summary, the present application has the advantages of simple and efficient circuit design of structurally integrated printed circuit boards, simplicity of processing without adaptation and adjustment, and reduction of material types in the printed circuit board processing process. In addition, by setting a printed circuit board with a stainless steel substrate, a large number of semi-automatic or manual film or glue bonding processes between the original stacked structures are eliminated, thereby greatly improving the stability of the notebook computer backlight keyboard. At the same time, by ensuring that each key has an application scheme of a MiniLED light source, the brightness requirement of a single MiniLED light source can be reduced. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness, thereby achieving the goals of reducing product costs, improving production efficiency and increasing product market competitiveness, making the present application have broad application prospects and economic benefits.
[0037] like Figure 1As shown, the printed circuit board for the notebook keyboard of the present application, the printed circuit board 30 has a multi-layer bonding structure, the multi-layer bonding structure is a stainless steel substrate support layer 301, a substrate isolation insulation layer 302 and a conductive circuit layer 303 are sequentially bonded to each other, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device 40 is provided at a preset position on the MiniLED control circuit of the conductive circuit layer. The thickness of the stainless steel substrate support layer is less than or equal to 50μm, the thickness of the substrate isolation insulation layer is 5μm to 50μm, and the thickness of the conductive circuit layer is 3μm to 10μm.
[0038] The present application forms an integrated structure by sequentially bonding a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer, which can replace the support layer in a traditional laptop backlight keyboard, and arrange the MiniLED circuit and part or all of the key conduction circuit in a mixed single-layer circuit or multi-layer circuit manner on the same side or both sides of a printed circuit board based on a stainless steel substrate; a large number of semi-automatic or manual film or glue bonding processes between the original stacked structures are eliminated, thereby greatly improving the stability of the laptop backlight keyboard; at the same time, the thickness and structure of the laptop backlight keyboard can be effectively adjusted, reducing the total thickness of the finished product.
[0039] The stainless steel substrate support layer may be made of a ferritic stainless steel foil with a heat dissipation coefficient higher than 16 W or an austenitic stainless steel foil with a heat dissipation coefficient higher than 16 W. By using a ferritic stainless steel foil with a heat dissipation coefficient higher than 16 W or an austenitic stainless steel foil with a heat dissipation coefficient higher than 16 W, the printed circuit board based on stainless steel metal of the present application has the characteristics of high heat dissipation and high heat load.
[0040] Among them, the thickness of the stainless steel substrate support layer can be set to be less than 50μm; the setting of the thickness of the stainless steel substrate support layer less than 50μm can reduce the thickness of the printed circuit board and meet the trend of the demand for thinner backlight keyboards of laptop computers.
[0041] In one embodiment of the present application, the printed circuit board further comprises: a keyboard key conduction film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers;
[0042] The stainless steel substrate support layer, the substrate isolation insulating layer and the conductive circuit layer are sequentially joined to form an integrated structure, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and a plurality of MiniLED light-emitting devices are each provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: Figure 2As shown, a keyboard key conduction thin film circuit layer 20, a first conductive circuit layer 303 and a first substrate isolation insulating layer 302 are arranged above the stainless steel substrate support layer 301 from far to near, and a plurality of MiniLED light-emitting devices 40, a second conductive circuit layer 303 and a second substrate isolation insulating layer 302 are arranged below the stainless steel substrate support layer 301 from far to near; wherein the first conductive circuit layer is provided with a key conduction circuit, and the second conductive circuit layer is provided with a MiniLED control circuit. In this embodiment, the MiniLED control circuit and the key conduction circuit are separated on different conductive circuit layers through two conductive circuit layers. The MiniLED light-emitting device is arranged on the second conductive circuit layer (i.e., the back of the key conduction circuit). By arranging a diffusion film and a reflective film, the light source is evenly reflected to the front of the membrane keyboard trigger circuit. Each key is ensured to have an application scheme of a MiniLED light source, which can reduce the brightness requirement of a single MiniLED light source. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness. At the same time, the structure of this embodiment can achieve the purpose of effectively adjusting the thickness and structure of the notebook computer backlight keyboard.
[0043] In another embodiment of the present application, the printed circuit board further comprises: a keyboard key conductive film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers;
[0044] The stainless steel substrate support layer, the substrate isolation insulating layer and the conductive circuit layer are sequentially joined to form an integrated structure, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and a plurality of MiniLED light-emitting devices are each provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: Figure 3As shown, the keyboard key conduction film circuit layer 20, a plurality of MiniLED light-emitting devices 40, a second conductive circuit layer 303, a second substrate isolation insulating layer 302, a first conductive circuit layer 303 and a first substrate isolation insulating layer 302 are arranged on the stainless steel substrate support layer 301 from far to near, wherein the second conductive circuit layer is provided with a MiniLED control circuit, and the first conductive circuit layer is provided with a key conduction circuit. In this embodiment, the MiniLED control circuit and the key conduction circuit are placed on different conductive circuit layers through two conductive circuit layers, and the MiniLED light-emitting device can be arranged on the same surface of the key conduction circuit to form front light emission. Each key is ensured to have an application scheme of a MiniLED light source, which can reduce the brightness requirement of a single MiniLED light source. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness; at the same time, the structure of this embodiment can achieve the purpose of effectively adjusting the thickness and structure of the notebook computer backlight keyboard.
[0045] In another embodiment of the present application, the printed circuit board further comprises: a keyboard key conductive film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers;
[0046] The stainless steel substrate support layer, substrate isolation insulating layer and conductive circuit layer are sequentially joined to each other to form an integrated structure, wherein a MiniLED control circuit and a key conduction circuit are arranged on the conductive circuit layer, and a plurality of MiniLED light-emitting devices are respectively arranged at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a second conductive circuit layer, a second substrate isolation insulating layer, a plurality of MiniLED light-emitting devices, a first conductive circuit layer and a first substrate isolation insulating layer are arranged on the stainless steel substrate support layer from far to near, wherein the first conductive circuit layer is provided with a MiniLED control circuit, and the second conductive circuit layer is provided with a key conduction circuit. In this embodiment, the MiniLED control circuit and the key conduction circuit are separated on different conductive circuit layers through two conductive circuit layers. The MiniLED light-emitting device can be arranged on the same side of the key conduction circuit to form front light emission. Each key is ensured to have an application scheme of a MiniLED light source, which can reduce the brightness requirement of a single MiniLED light source. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness. At the same time, the structure of this embodiment can achieve the purpose of effectively adjusting the thickness and structure of the backlight keyboard of a laptop computer.
[0047] In another embodiment of the present application, the printed circuit board further comprises: a keyboard key conduction thin film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers; the MiniLED light-emitting devices are disposed on different conductive circuit layers;
[0048] The stainless steel substrate support layer, the substrate isolation insulating layer and the conductive circuit layer are sequentially joined to form an integrated structure, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and a plurality of MiniLED light-emitting devices are each provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: Figure 4 As shown, a keyboard key conduction thin film circuit layer 20, a plurality of first MiniLED light-emitting devices 40, a first conductive circuit layer 303 and a first substrate isolation insulating layer 302 are arranged above the stainless steel substrate support layer 301 from far to near, and a plurality of second MiniLED light-emitting devices 40, a second conductive circuit layer 303 and a second substrate isolation insulating layer 302 are arranged below the stainless steel substrate support layer 301 from far to near; wherein, the first conductive circuit layer is provided with a key conduction circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device. In this embodiment, two conductive circuit layers are used to arrange part of the MiniLED control circuit and the key conduction circuit on the first conductive circuit layer (that is, the MiniLED light-emitting device can be arranged on the same side of the key conduction circuit to form front light emission), and part of the MiniLED light-emitting device is arranged on the second conductive circuit layer (that is, the back side of the key conduction circuit). By arranging a diffusion film and a reflective film, the light source is evenly reflected to the front side of the membrane keyboard trigger circuit; such a setting can meet the needs of users who have high requirements for the brightness of notebook keyboards. Each key is ensured to have an application solution of MiniLED light and reflection enhanced light source, which can reduce the brightness requirement of a single MiniLED light source. On the one hand, ordinary or even secondary light-emitting diodes can be used, and because the backlight source is close to the target, the energy consumption can be greatly reduced by reducing the brightness; at the same time, the structure of this embodiment can achieve the purpose of effectively adjusting the thickness and structure of the notebook computer backlight keyboard.
[0049] It also includes: the stainless steel substrate support layer is provided with a first keycap key core structure installation hole; the substrate isolation insulation layer is bonded to the stainless steel substrate support layer, and a corresponding position of the first keycap key core structure installation hole is provided on the stainless steel substrate support layer, and the substrate isolation insulation layer is provided with a second keycap key core structure installation hole, wherein the size of the second keycap key core structure installation hole is smaller than or equal to the first keycap key core structure installation hole, and the center of the second keycap key core structure installation hole is connected to the center of the first keycap key core structure installation hole to form a straight line perpendicular to the stainless steel substrate support layer. The above arrangement facilitates the installation of keyboard keycaps on the printed circuit board of the laptop keyboard.
[0050] The substrate isolation insulating layer is an insulating composite material with a temperature resistance of more than 230 degrees Celsius and a low dielectric constant. The insulating composite material includes: thermoplastic polyimide (TPI), thermoplastic polyurethane rubber (TPU), polyamide (PA), which is used to block the stainless steel substrate support layer and the conductive circuit layer to form an electrical insulation and non-conduction function. The advantage of setting the size of the second keycap key core structure installation hole to be smaller than or equal to the first keycap key core structure installation hole is that when the key pin passes through the substrate isolation insulating layer, the excess adhesive material will form an insulating protective layer between the stainless steel substrate support layer and the conductive circuit layer, avoiding short circuits between the key pins and making the overall circuit work more stable. The straight line formed by connecting the center of the second keycap key core structure installation hole and the center of the first keycap key core structure installation hole is perpendicular to the setting of the stainless steel substrate support layer, which is convenient for installing the keyboard keycap on the printed circuit board of the laptop keyboard.
[0051] It also includes: the conductive circuit layer is also provided with a third keycap key core structure installation hole, the conductive circuit layer is bonded to the substrate isolation insulating layer, and the corresponding position of the second keycap key core structure installation hole is set on the substrate isolation insulating layer, and the conductive circuit layer is provided with a third keycap key core structure installation hole, wherein the size of the third keycap key core structure installation hole is greater than or equal to the first keycap key core structure installation hole, and the center of the third keycap key core structure installation hole and the center of the first keycap key core structure installation hole are connected to form a straight line perpendicular to the stainless steel substrate support layer; the MiniLED light-emitting device is set at a preset position on the MiniLED control circuit of the conductive circuit layer by attachment welding. The above arrangement facilitates the installation of keyboard keycaps on the printed circuit board of the laptop keyboard. The size of the third keycap key core structure installation hole is set to be greater than or equal to the first keycap key core structure installation hole, which is convenient for processing and operation, and is convenient for installing keyboard keycaps on the printed circuit board of the laptop keyboard.
[0052] The shapes of the first keycap key core structure installation hole, the second keycap key core structure installation hole and the third keycap key core structure installation hole are adapted to each other, so it is convenient to install the keyboard keycap on the printed circuit board of the notebook computer keyboard.
[0053] Further comprising: the keyboard key conductive film circuit layer is provided with a fourth keycap key core structure installation hole and a key conductive contact, the key conductive contact is provided outside the location of the fourth keycap key core structure installation hole on the keyboard key conductive film circuit layer; the keyboard key conductive film circuit layer is joined with the conductive circuit layer, the corresponding position of the third keycap key core structure installation hole is provided on the conductive circuit layer, the keyboard key conductive film circuit layer is provided with a fourth keycap key core structure installation hole, the center of the fourth keycap key core structure installation hole and the center of the third keycap key core structure installation hole are connected to form a straight line perpendicular to the stainless steel substrate support layer. The above arrangement facilitates the installation of keyboard keycaps on the printed circuit board of the laptop keyboard.
[0054] There are multiple key conduction contacts, and the multiple key conduction contacts are evenly arranged around the fourth keycap key core structure installation hole on the keyboard key conduction film circuit layer. The arrangement of the multiple key conduction contacts makes it more convenient and sensitive to trigger the key conduction contacts on the keyboard key conduction film circuit layer by pressing the keyboard keycap.
[0055] According to the design of the key conduction circuit, the corresponding type of the keyboard key conduction film circuit layer can be a contact conduction type or an upper and lower film circuit overlap type to achieve triggering. Such a setting can be more flexible and adaptable to a variety of application scenarios, improving user satisfaction.
[0056] Further including: the substrate isolation insulating layer is an insulating composite material with a temperature resistance of more than 230 degrees Celsius and a low dielectric constant, the insulating composite material may include: TPI, TPU or PA, the thickness of the substrate isolation insulating layer is 5μm to 50μm; the above-mentioned insulating composite material includes: TPI, TPU or PA is a mature product with low cost, good insulation performance, and is suitable for temperature control of large-scale production, which is convenient for large-scale production. At the same time, the thickness setting of the substrate isolation insulating layer of the present application can effectively adjust the thickness and structure of the notebook computer backlight keyboard, which can be adapted to rollable flexible production, reducing the total thickness of the finished product, and facilitating large-scale production.
[0057] The material of the conductive circuit layer includes: conductive metal materials of copper foil, aluminum foil, tin foil or silver foil, and the thickness of the conductive circuit layer is 3μm to 10μm. The conductive metal materials of copper foil, aluminum foil, tin foil or silver foil are mature products with low cost. At the same time, the thickness setting of the conductive circuit layer of the present application can effectively adjust the thickness and structure of the notebook computer backlight keyboard, which can be adapted to roll-up flexible production, reduce the total thickness of the finished product, and facilitate large-scale production.
[0058] In the present application, each preferred scheme only focuses on describing the differences from other preferred schemes. As long as the preferred schemes do not conflict, they can be combined arbitrarily. The embodiments formed by the combination are also within the scope disclosed in this specification. Considering the simplicity of the text, this article will no longer separately describe the embodiments formed by the combination.
[0059] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
[0060] In this document, each preferred scheme only focuses on describing the differences from other preferred schemes. As long as the preferred schemes do not conflict, they can be combined arbitrarily. The embodiments formed by the combination are also within the scope disclosed in this specification. Considering the simplicity of the text, this document will no longer separately describe the embodiments formed by the combination.
[0061] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims
1. A printed circuit board for a notebook keyboard, characterized in that: include: The printed circuit board has a multi-layer bonding structure, in which a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer are sequentially bonded to each other, wherein a MiniLED control circuit and a key conduction circuit are arranged on the conductive circuit layer, and the MiniLED light-emitting device is arranged at a preset position on the MiniLED control circuit of the conductive circuit layer. The thickness of the stainless steel substrate support layer is less than or equal to 50μm, the thickness of the substrate isolation insulating layer is 5μm to 50μm, and the thickness of the conductive circuit layer is 3μm to 10μm.
2. The printed circuit board for a notebook keyboard according to claim 1, characterized in that: Also includes: The keyboard keys conduct the thin film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers; The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer bonded to each other in sequence, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device is provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a first conductive circuit layer and a first substrate isolation insulating layer are provided above the stainless steel substrate support layer from far to near, and a MiniLED light-emitting device, a second conductive circuit layer and a second substrate isolation insulating layer are provided below the stainless steel substrate support layer from far to near; wherein the first conductive circuit layer is provided with a key conduction circuit, and the second conductive circuit layer is provided with a MiniLED control circuit.
3. The printed circuit board for a notebook keyboard according to claim 2, characterized in that: Also includes: The keyboard keys conduct the thin film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers; The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer bonded to each other in sequence, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device is provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a MiniLED light-emitting device, a second conductive circuit layer, a second substrate isolation insulating layer, a first conductive circuit layer and a first substrate isolation insulating layer are provided on the stainless steel substrate support layer from far to near, wherein the second conductive circuit layer is provided with a MiniLED control circuit, and the first conductive circuit layer is provided with a key conduction circuit.
4. The printed circuit board for a notebook keyboard according to claim 2, characterized in that: Also includes: The keyboard keys conduct the thin film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers; The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer bonded to each other in sequence, wherein the conductive circuit layer is provided with a MiniLED control circuit and a key conduction circuit, and the MiniLED light-emitting device is provided at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a second conductive circuit layer, a second substrate isolation insulating layer, a MiniLED light-emitting device, a first conductive circuit layer and a first substrate isolation insulating layer are provided on the stainless steel substrate support layer from far to near, wherein the first conductive circuit layer is provided with a MiniLED control circuit, and the second conductive circuit layer is provided with a key conduction circuit.
5. The printed circuit board for a notebook keyboard according to claim 2, characterized in that: Also includes: The keyboard keys conduct the thin film circuit layer; the substrate isolation insulating layer is two layers, and correspondingly, the conductive circuit layer is also two layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers; The printed circuit board has a multi-layer bonding structure, and the multi-layer bonding structure is that a stainless steel substrate support layer, a substrate isolation insulating layer and a conductive circuit layer are bonded to each other in sequence, wherein a MiniLED control circuit and a key conduction circuit are arranged on the conductive circuit layer, and the MiniLED light-emitting device is arranged at a preset position on the MiniLED control circuit of the conductive circuit layer, specifically referring to: a keyboard key conduction film circuit layer, a first MiniLED light-emitting device, a first conductive circuit layer and a first substrate isolation insulating layer are arranged above the stainless steel substrate support layer from far to near, and a second MiniLED light-emitting device, a second conductive circuit layer and a second substrate isolation insulating layer are arranged below the stainless steel substrate support layer from far to near; wherein the first conductive circuit layer is provided with a key conduction circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device.
6. The printed circuit board for a notebook keyboard according to any one of claims 2 to 5, characterized in that: It also includes: the stainless steel substrate support layer is provided with a first keycap key core structure installation hole; the substrate isolation insulating layer is bonded to the stainless steel substrate support layer, and a corresponding position of the first keycap key core structure installation hole is provided on the stainless steel substrate support layer, and the substrate isolation insulating layer is provided with a second keycap key core structure installation hole, wherein the size of the second keycap key core structure installation hole is smaller than or equal to the first keycap key core structure installation hole, and the straight line formed by connecting the center of the second keycap key core structure installation hole and the center of the first keycap key core structure installation hole is perpendicular to the stainless steel substrate support layer.
7. The printed circuit board for a notebook keyboard according to claim 6, characterized in that: Also includes: The conductive circuit layer is also provided with a third keycap key core structure installation hole, the conductive circuit layer is bonded to the substrate isolation insulating layer, and a corresponding position of the second keycap key core structure installation hole is set on the substrate isolation insulating layer, and the conductive circuit layer is provided with a third keycap key core structure installation hole, wherein the size of the third keycap key core structure installation hole is greater than or equal to the first keycap key core structure installation hole, and the straight line formed by connecting the center of the third keycap key core structure installation hole and the center of the first keycap key core structure installation hole is perpendicular to the stainless steel substrate support layer.
8. The printed circuit board for a notebook keyboard according to claim 7, characterized in that: Further including: the keyboard key conductive film circuit layer is provided with a fourth keycap key core structure mounting hole and a key conductive contact, the key conductive contact is arranged outside the position of the fourth keycap key core structure mounting hole on the keyboard key conductive film circuit layer; the keyboard key conductive film circuit layer is joined to the conductive circuit layer, and the corresponding position of the third keycap key core structure mounting hole is arranged on the conductive circuit layer, the keyboard key conductive film circuit layer is provided with a fourth keycap key core structure mounting hole, and the straight line formed by connecting the center of the fourth keycap key core structure mounting hole and the center of the third keycap key core structure mounting hole is perpendicular to the stainless steel substrate support layer.
9. The printed circuit board for a notebook keyboard according to claim 8, characterized in that: It further includes: there are multiple key conduction contacts, and the multiple key conduction contacts are evenly arranged around the location of the fourth keycap key core structure installation hole on the keyboard key conduction film circuit layer.