Power supply circuit structure for screen, screen assembly and electronic equipment
By setting a barrier on the substrate of the screen to block heat transfer, the screen brightness attenuation problem is solved, the heat dissipation speed of the substrate is delayed, the reaction rate of the conductive glue is ensured, the screen brightness attenuation is reduced, and the user experience is improved.
Patent Information
- Application Number
- CN202420392942.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-02-28
AI Technical Summary
As the screen increases in use, the brightness will attenuate, affecting the user experience. It is mainly due to the rapid heat dissipation of the substrate that the conductive glue fails to respond sufficiently, resulting in an increase in the current transmission impedance, which in turn causes the brightness to decay.
A barrier is provided on the substrate to prevent part of the heat transfer, slow down the heat transfer speed, keep the substrate at a temperature, ensure that the conductive glue fully reacts, thereby improving the fullness of the conductive particles and reducing the screen brightness attenuation.
By setting the barrier part, the heat dissipation speed of the substrate is delayed, the reaction rate of the conductive adhesive is maintained, the screen brightness attenuation is reduced, and the user experience is improved.
Smart Images
Figure CN222147882U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic device manufacturing, and in particular to a power supply circuit structure for a screen, a screen assembly and an electronic device. Background Art
[0002] For screens in related technologies, as the user's usage time increases, the screen brightness will decay, affecting the user experience. Utility Model Content
[0003] The purpose of the present disclosure is to provide a power supply circuit structure for a screen, a screen assembly and an electronic device to solve the problems in the above-mentioned related technologies.
[0004] In order to achieve the above-mentioned purpose, one aspect of the present disclosure provides a power supply circuit structure for a screen, including a substrate and a connector, wherein the connector is connected to the substrate through a conductive adhesive, and a blocking portion is provided on the substrate, wherein the blocking portion is configured to block part of the heat transfer so as to reduce the heat transfer rate of the substrate.
[0005] Optionally, the connecting member is configured as a gold finger, the gold finger is connected to the substrate via the conductive adhesive, and the blocking portion does not overlap with a projection of the gold finger vertically falling on the substrate.
[0006] Optionally, the number of the gold fingers is at least two, at least two of the gold fingers are arranged at intervals along the first direction, and at least one blocking portion is arranged between two adjacent gold fingers.
[0007] Optionally, the number of the blocking portion is one; or,
[0008] There are multiple blocking parts, and the multiple blocking parts are arranged at intervals along the first direction and / or the second direction.
[0009] Optionally, there are multiple blocking parts, and the multiple blocking parts are arranged at intervals along a first direction and a second direction to form an array structure, and the first direction is perpendicular to the second direction.
[0010] Optionally, in the first direction, the straight-line distances between two adjacent blocking portions are equal; and / or,
[0011] In the second direction, the straight-line distances between two adjacent blocking portions are equal.
[0012] Optionally, the blocking portion is configured as a groove or a through hole opened on the substrate.
[0013] Optionally, the substrate has two surfaces arranged opposite to each other in a third direction;
[0014] Wherein, the groove is located on one side of the substrate, or,
[0015] The through hole penetrates the substrate along the third direction.
[0016] A second aspect of the present disclosure also provides a screen assembly, comprising the above-mentioned power supply circuit structure for the screen.
[0017] The third aspect of the present disclosure also provides an electronic device, comprising the above-mentioned power supply circuit structure for the screen, or the above-mentioned screen assembly.
[0018] The above technical solution, by arranging a blocking portion on the substrate, the blocking portion can block part of the heat transfer, thereby slowing down the heat transfer speed on the substrate, reducing the speed at which the substrate dissipates heat to the outside, slowing down the temperature drop of the substrate, and allowing the substrate to maintain its temperature. As a result, the conductive glue connected to the substrate can be heated and fully react, thereby increasing the reaction rate of the conductive glue, thereby increasing the fullness of the conductive particles of the conductive glue, so that the impedance of the connection between the substrate and other components through the conductive glue will not increase, thereby reducing the problem of screen brightness attenuation and ensuring the user experience.
[0019] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:
[0021] Figure 1 It is a structural schematic diagram from one perspective of a power supply circuit structure of an embodiment of the present invention.
[0022] Figure 2 This is an embodiment of the present disclosure Figure 1 Section view of the AA plane.
[0023] Description of Reference Numerals
[0024] 1. substrate, 2. connector, 21. gold finger, 3. conductive adhesive, 4. blocking part, X, first direction, Y, second direction, Z, third direction. DETAILED DESCRIPTION
[0025] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.
[0026] In the present disclosure, unless otherwise stated, directional words such as "upper, lower, left, right" are usually defined by the direction of the drawing, and "inner" and "outer" refer to the inside and outside of the relevant parts. In addition, the terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance.
[0027] In the description of the present disclosure, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.
[0028] like Figure 1 and Figure 2 As shown, one aspect of the present disclosure provides a power supply circuit structure for a screen, including a substrate 1 and a connector 2, wherein the connector 2 is connected to the substrate 1 via a conductive adhesive 3, and a blocking portion 4 is provided on the substrate 1, wherein the blocking portion 4 is configured to block part of the heat transfer so as to reduce the heat transfer rate of the substrate 1.
[0029] Among them, since the substrate 1 is generally designed as a large piece of metal, the metal has strong thermal conductivity. At the same time, when the area is large, the heat will be quickly transferred in the substrate 1 and dissipated to the outside through the substrate 1, resulting in a rapid drop in temperature on the substrate 1. The connector 2 connected to the substrate 1 is often bonded and fixed with conductive glue 3. After analyzing the reasons for the attenuation of screen brightness, it was found that during production, the temperature of the substrate 1 dropped too quickly, causing the conductive glue 3 to not react completely, resulting in incomplete and blurred conductive particles, which in turn led to an increase in the voltage drop between the substrate 1 and the corresponding connecting parts, that is, the impedance increased. The increased impedance leads to reduced current transmission, which in turn leads to the problem of brightness attenuation.
[0030] In the above technical solution, by arranging a blocking portion 4 on the substrate 1, the blocking portion 4 can block part of the heat transfer, thereby slowing down the heat transfer speed on the substrate 1, so that the speed at which the substrate 1 radiates heat to the outside is reduced, and the temperature drop of the substrate 1 is slowed down, so that the substrate 1 maintains the temperature, thereby the conductive glue 3 connected to the substrate 1 can be heated and fully react, and the reaction rate of the conductive glue 3 is improved, thereby improving the fullness of the conductive particles of the conductive glue 3, so that the impedance of the connection between the substrate 1 and other components through the conductive glue 3 will not increase, thereby reducing the problem of screen brightness attenuation and ensuring the user experience.
[0031] Optionally, in one embodiment of the present disclosure, the connector 2 is configured as a gold finger 21, the gold finger 21 is connected to the substrate 1 via a conductive adhesive 3, and the blocking portion 4 does not overlap with the projection of the gold finger 21 vertically falling on the substrate 1. This arrangement can avoid interference with the current transmission of the gold finger 21.
[0032] It can be understood that the regional position of the blocking part 4 on the substrate 1 does not overlap with the regional position of the projection of the gold finger 21 falling vertically on the substrate 1, so that when the gold finger 21 is connected to the external circuit, the substrate 1 will not be disturbed by the blocking part 4 when transmitting conductive particles, thereby ensuring current transmission and avoiding affecting performance.
[0033] Among them, the gold finger 21 is bonded to the substrate 1 through the conductive glue 3. The blocking part 4 provided on the substrate 1 allows the conductive glue 3 to fully react during hot pressing and fixation, thereby avoiding the increase of impedance at the connection between the gold finger 21 and the substrate 1, thereby greatly reducing the problem of brightness attenuation of the screen as the use time goes by. It should be noted that the connector 2 can also be other components, and can also be connected to the substrate 1 through the conductive glue 3, and no excessive restrictions are imposed here.
[0034] Optionally, in one embodiment of the present disclosure, the number of the gold fingers 21 is at least two, at least two gold fingers 21 are arranged at intervals along the first direction X, and at least one blocking portion 4 is arranged between two adjacent gold fingers 21. By such an arrangement, it can be ensured that the conductive glue 3 connecting the two adjacent gold fingers 21 and the substrate 1 can be fully reacted by the temperature, thereby improving the reaction rate of the conductive glue 3 between the entire gold finger 21 and the substrate 1, and further reducing the problem of screen brightness attenuation.
[0035] It is understandable that the blocking portion 4 is not directly between two adjacent gold fingers 21 , but between the projections of two adjacent gold fingers 21 that fall vertically on the substrate 1 , and the blocking portion 4 does not overlap with the projections of the gold fingers 21 .
[0036] Optionally, in some examples, when there are multiple gold fingers 21, the multiple gold fingers 21 are spaced apart along the first direction X, the straight-line distance between two adjacent gold fingers 21 may be equal or unequal, and a blocking portion 4 may be provided between only some of the two adjacent gold fingers 21, or a blocking portion 4 may be provided between all the two adjacent gold fingers 21. In other examples, when there are two gold fingers 21, a blocking portion 4 is provided between the two gold fingers 21.
[0037] Optionally, in another embodiment of the present disclosure, when the connector 2 is other component structures, the blocking portion 4 can be arranged at the side of the connector 2 to ensure sufficient reaction of the conductive adhesive 3 .
[0038] Optionally, in one embodiment of the present disclosure, the number of the blocking part 4 is one. The blocking part 4 can be located near the connector 2 and the conductive adhesive 3, and can ensure the temperature of the substrate 1 near the conductive adhesive 3. Of course, the specific position of the blocking part 4 can be set according to actual needs.
[0039] Optionally, in another embodiment of the present disclosure, there are multiple blocking portions 4, and the multiple blocking portions 4 are arranged at intervals along the first direction X and / or the second direction Y. By providing multiple blocking portions 4, the heat dissipation capacity of the substrate 1 can be further reduced to maintain the temperature of the substrate 1.
[0040] It can be understood that the plurality of blocking portions 4 can be arranged at intervals along the first direction X, or can be arranged at intervals along the second direction Y, or can be arranged at intervals along both the first direction X and the second direction Y.
[0041] Optionally, in an embodiment of the present disclosure, there are multiple blocking parts 4, and the multiple blocking parts 4 are arranged at intervals along the first direction X and the second direction Y to form an array structure, and the first direction X and the second direction Y are perpendicular.
[0042] Optionally, in an embodiment of the present disclosure, in the first direction X, the straight-line distances between two adjacent blocking portions 4 are equal; and / or,
[0043] In the second direction Y, the straight-line distances between two adjacent blocking portions 4 are equal.
[0044] By configuring in this way, the plurality of blocking parts 4 are evenly distributed, so that the temperature of the entire substrate 1 can be kept uniform, which is beneficial for the conductive adhesive 3 to fully react and maintain the reaction uniformity, thereby improving the brightness uniformity of the screen.
[0045] It can be understood that the blocking parts 4 can be distributed at equal intervals along the first direction X, can be distributed at equal intervals along the second direction Y, or can be distributed at equal intervals along both the first direction X and the second direction Y.
[0046] Optionally, in one embodiment of the present disclosure, the blocking portion 4 is configured as a groove or a through hole opened on the substrate 1. By setting the position where the groove or through hole is set to be blocked, the substrate 1 can be divided into multiple small units, thereby slowing down the transfer of heat.
[0047] It is understandable that when there are multiple blocking parts 4, the blocking parts 4 are grooves or through holes that can separate the substrate 1 into a grid structure. The grooves or through holes formed on the substrate 1 can be deposited using a set mesh structure.
[0048] Optionally, in one embodiment of the present disclosure, the substrate 1 has two surfaces arranged opposite to each other in the third direction Z; wherein the groove is located on one side of the substrate 1, or,
[0049] The through hole penetrates the substrate 1 along the third direction.
[0050] By configuring in this way, the barrier effect on the substrate 1 can be improved, the heat dissipation performance of the substrate 1 can be effectively reduced, and the temperature of the substrate 1 can be maintained.
[0051] Optionally, in one embodiment of the present disclosure, the notch of the groove or the opening of the through hole is configured as a square, a circle, a rectangle or a polygon. Of course, the notch of the groove or the opening of the through hole can also be other irregular shapes.
[0052] Optionally, in another embodiment of the present disclosure, the through hole or the groove may be located on a side edge of the substrate 1 .
[0053] Optionally, in another embodiment of the present disclosure, the blocking portion 4 may be constructed as a channel or a thermal insulation material, and the channel or the thermal insulation material is disposed inside the substrate 1, and heat transfer is blocked by the channel or the thermal insulation material, thereby reducing the heat dissipation performance of the substrate 1 and maintaining the temperature of the substrate 1.
[0054] A second aspect of the present disclosure also provides a screen assembly, comprising the above-mentioned power supply circuit structure for the screen.
[0055] The third aspect of the present disclosure also provides an electronic device, comprising the above-mentioned power supply circuit structure for the screen, or the above-mentioned screen assembly.
[0056] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0057] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.
[0058] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.
Claims
1. A power supply circuit structure for a screen, characterized in that: The invention comprises a substrate and a connecting piece, wherein the connecting piece is connected to the substrate through a conductive adhesive, and a blocking part is arranged on the substrate, wherein the blocking part is arranged to block part of the heat transfer so as to reduce the heat transfer speed of the substrate.
2. The power supply circuit structure for a screen according to claim 1, characterized in that: The connecting piece is configured as a gold finger, the gold finger is connected to the substrate through the conductive adhesive, and the blocking portion and the projection of the gold finger vertically falling on the substrate do not overlap.
3. The power supply circuit structure for a screen according to claim 2, characterized in that: The number of the gold fingers is at least two, at least two of the gold fingers are arranged at intervals along the first direction, and at least one blocking portion is arranged between two adjacent gold fingers.
4. The power supply circuit structure for a screen according to claim 1, characterized in that: The number of the blocking portion is one; or, There are multiple blocking parts, and the multiple blocking parts are arranged at intervals along the first direction and / or the second direction.
5. The power supply circuit structure for a screen according to claim 4, characterized in that: There are multiple blocking parts, and the multiple blocking parts are arranged at intervals along a first direction and a second direction to form an array structure, and the first direction is perpendicular to the second direction.
6. The power supply circuit structure for a screen according to claim 5, characterized in that: In the first direction, the straight-line distances between two adjacent blocking portions are equal; and / or, In the second direction, the straight-line distances between two adjacent blocking portions are equal.
7. The power supply circuit structure for a screen according to any one of claims 1 to 6, characterized in that: The blocking portion is configured as a groove or a through hole opened on the substrate.
8. The power supply circuit structure for a screen according to claim 7, characterized in that: The substrate has two surfaces arranged opposite to each other in a third direction; Wherein, the groove is located on one side of the substrate, or, The through hole penetrates the substrate along the third direction.
9. A screen assembly, characterized in that: It comprises a power supply circuit structure for a screen as described in any one of claims 1-8.
10. An electronic device, characterized in that: It comprises a power supply circuit structure for a screen as described in any one of claims 1 to 8, or a screen assembly as described in claim 9.