Domain controller and movable platform

Abstract

The utility model provides a domain controller and a movable platform, and the domain controller comprises a housing, a heat dissipation assembly and a circuit board are stacked in the housing, one side, facing the heat dissipation assembly, of the circuit board is provided with a first chip, the heat dissipation assembly is provided with a first heat dissipation boss, and one side, deviating from the circuit board, of the heat dissipation assembly is also provided with an elastic member in a compressed state. The first end of the elastic piece abuts against the shell, the second end of the elastic piece abuts against the heat dissipation assembly so that the first heat dissipation boss can abut against the first chip, the shell is provided with a supporting part, and the supporting part abuts against the circuit board. The elastic piece in the compressed state is arranged on the side, away from the circuit board, of the heat dissipation assembly, so that the first heat dissipation boss tightly abuts against the first chip, and the distance between the first heat dissipation boss and the first chip is reduced; the shell is provided with the corresponding supporting parts to support the circuit board, so that the stress borne by the circuit board is reduced, and the risk of cracking of the first chip is reduced.

Description

Technical Field

[0001] The present application relates to chip assembly technology, and in particular to a domain controller and a mobile platform. Background Art

[0002] A domain controller is a key network server that manages and controls computers, users, and resources within a domain. In the automotive field, the domain controller is responsible for managing and controlling various functions of the vehicle, including but not limited to powertrain, chassis control, and information processing for the smart cockpit.

[0003] Since the domain controller needs to process a large amount of information, the heat dissipation performance of the domain controller directly affects its information processing capabilities. In the solution of the related art, in order to improve the heat dissipation performance of the domain controller, the gap between the heat sink and the chip can be compressed to reduce the thickness of the thermal conductive layer between the chip and the heat sink, so as to guide the heat of the chip into the heat sink as soon as possible. However, the above solution increases the stress on the chip and the circuit board, and there is a risk of chip cracking. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the related art, the purpose of the present application is to provide a domain controller and a movable platform. The present application can reduce the stress on the chip and the circuit board while reducing the gap between the chip and the heat sink, so as to reduce the risk of chip cracking.

[0005] On the one hand, the present application provides a domain controller, comprising a shell, a heat dissipation assembly and a circuit board stacked in the shell, a first chip being provided on a side of the circuit board facing the heat dissipation assembly, a first heat dissipation boss being provided on the heat dissipation assembly, and an elastic member in a compressed state being provided on a side of the heat dissipation assembly away from the circuit board, a first end of the elastic member abutting against the shell, a second end of the elastic member abutting against the heat dissipation assembly, so that the first heat dissipation boss abuts against the first chip, a supporting portion being provided on the shell, and the supporting portion abutting against the circuit board.

[0006] In a possible implementation, the elastic member includes a spring, the housing is provided with a mounting groove, and the spring is disposed in the mounting groove.

[0007] In a possible implementation, the elastic member includes a sealing ring or a spring, and the elastic member is arranged along the circumference of the heat dissipation assembly.

[0008] In one possible implementation, the housing includes a bottom cover and an upper shell, the circuit board is arranged close to the bottom cover, the support portion is arranged on the bottom cover, and the bottom cover, the upper shell and the circuit board are connected by a first fastener to compress the elastic member between the upper shell and the heat dissipation assembly.

[0009] In a possible implementation manner, in a plane parallel to the circuit board, a projection of the first chip is located within a projection range of the support portion.

[0010] In a possible implementation, a plurality of second chips are provided on the side of the circuit board facing the heat dissipation component, and the plurality of second chips are arranged around the first chip. A plurality of second heat dissipation bosses are also provided on the heat dissipation component, and the plurality of second heat dissipation bosses correspond one-to-one to the plurality of second chips.

[0011] In a possible implementation, a first heat-conducting layer is filled between the first heat-dissipating boss and the first chip, and a second heat-conducting layer is filled between the second heat-dissipating boss and the second chip, and the thickness of the second heat-conducting layer is greater than that of the first heat-conducting layer.

[0012] In a possible implementation, the heat dissipation assembly includes a heat spreader and a heat dissipation assembly body, the heat spreader is arranged on a side of the heat dissipation assembly body facing the circuit board, and the first heat dissipation boss and multiple second heat dissipation bosses are all arranged on the heat spreader.

[0013] In a possible implementation, a plurality of limiting holes are provided on the heat dissipation component body, a plurality of limiting posts are provided on the upper shell, the plurality of limiting posts correspond to the plurality of limiting holes one by one, and the limiting posts are inserted into the corresponding limiting holes.

[0014] On the other hand, the present application provides a mobile platform, comprising the domain controller as described above.

[0015] The present application provides a domain controller and a movable platform, the domain controller includes a shell, a heat dissipation component and a circuit board are stacked inside the shell, a first chip is provided on the side of the circuit board facing the heat dissipation component, a first heat dissipation boss is provided on the heat dissipation component, and an elastic member in a compressed state is provided on the side of the heat dissipation component away from the circuit board, the first end of the elastic member abuts on the shell, and the second end of the elastic member abuts on the heat dissipation component so that the first heat dissipation boss abuts against the first chip, and a supporting portion is provided on the shell, and the supporting portion abuts against the circuit board. The present application arranges an elastic member in a compressed state on the side of the heat dissipation component away from the circuit board, so that the first heat dissipation boss is tightly abutted against the first chip, so as to reduce the distance between the first heat dissipation boss and the first chip; a corresponding supporting portion is provided on the shell to support the circuit board, so as to reduce the stress borne by the circuit board, so as to reduce the risk of cracking of the first chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technical descriptions. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 An exploded view of a domain controller provided in an embodiment of the present application;

[0018] Figure 2 A cross-sectional view of a domain controller provided in one embodiment of the present application;

[0019] Figure 3 Another cross-sectional view of a domain controller provided by an embodiment of the present application;

[0020] Figure 4 A simplified structural diagram of an upper housing provided in an embodiment of the present application at a first viewing angle;

[0021] Figure 5 A simplified structural diagram of an upper housing provided in an embodiment of the present application at a second viewing angle;

[0022] Figure 6 A partial structural diagram of a heat dissipation assembly provided in one embodiment of the present application;

[0023] Figure 7 A simplified structural diagram of a circuit board provided in one embodiment of the present application;

[0024] Figure 8 A simplified structural diagram of a bottom cover provided in one embodiment of the present application.

[0025] Reference numerals:

[0026] 110-upper housing; 111-installation slot; 112-limiting column; 113-heat dissipation hole; 114-second threaded hole; 115-thermal conductive adhesive slot; 116-fan fixing structure; 120-bottom cover; 121-supporting part; 122-first threaded hole;

[0027] 200-heat dissipation assembly; 210-heat sink; 211-first heat dissipation boss; 212-second heat dissipation boss; 220-heat dissipation assembly body; 221-limiting hole; 230-heat dissipation fin; 240-fan; 250-fan cover;

[0028] 300 - circuit board; 310 - first chip; 320 - second chip; 330 - through hole;

[0029] 400-elastic parts;

[0030] 500-first fastener;

[0031] 610-first heat conducting layer; 620-second heat conducting layer;

[0032] 700-thermal conductive adhesive layer;

[0033] 800 - Second fastener. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0035] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] As described in the background technology, in order to reduce the gap between the heat sink and the chip, the thickness of the heat-conducting layer filled between the chip and the heat sink is reduced in the related art solutions, so that the circuit board and the chip are subjected to greater stress. For example, in some solutions, a spring can be set on the side of the heat sink away from the chip, and the elastic force of the spring can be used to push the heat sink against the chip; however, this solution causes the pressure to be ultimately transmitted to the circuit board, and there is a risk of chip cracking.

[0037] In view of this, an embodiment of the present application aims to provide a domain controller and a movable platform, by arranging an elastic member in a compressed state on the side of the heat dissipation component away from the circuit board, so as to tightly abut the first heat dissipation boss against the first chip to reduce the distance between the first heat dissipation boss and the first chip; and a corresponding support portion is also arranged on the outer casing to support the circuit board, thereby reducing the stress borne by the circuit board and reducing the risk of cracking of the first chip.

[0038] The contents of the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the contents of the present application in more detail.

[0039] Figure 1 An exploded view of a domain controller provided in an embodiment of the present application; Figure 2 A cross-sectional view of a domain controller provided in one embodiment of the present application; Figure 3 Another cross-sectional view of a domain controller provided by an embodiment of the present application; Figure 4 A simplified structural diagram of an upper housing provided in an embodiment of the present application at a first viewing angle;

[0040] Figure 5A simplified structural diagram of an upper housing provided in an embodiment of the present application at a second viewing angle; Figure 6 A partial structural diagram of a heat dissipation assembly provided in one embodiment of the present application; Figure 7 A simplified structural diagram of a circuit board provided in one embodiment of the present application; Figure 8 A simplified structural diagram of a bottom cover provided in one embodiment of the present application.

[0041] Please refer to Figure 1-Figure 8 The embodiment of the present application provides a domain controller, including a housing, the shape of which can be set according to assembly requirements, for example, it can be prismatic or cylindrical. The housing can, for example, include a bottom cover 120 and an upper shell 110, and the upper shell 110 and the bottom cover 120 can be assembled into a housing. A heat dissipation component 200 and a circuit board 300 are stacked in the housing, and the circuit board 300 is arranged close to the bottom cover 120. The heat dissipation component 200 is used to export the heat generated by the circuit board 300 when it is working, thereby ensuring the information processing capability of the domain controller.

[0042] Specifically, the side of the circuit board 300 facing the heat dissipation component 200 is provided with a first chip 310, which is the main chip and undertakes the main information processing work, so the heat generated by it is also relatively large. The heat dissipation component 200 is provided with a first heat dissipation boss 211, and the side of the heat dissipation component 200 away from the circuit board 300 is also provided with an elastic member 400 in a compressed state, the first end of the elastic member 400 abuts on the housing, and the second end of the elastic member 400 abuts on the heat dissipation component 200, so as to use the elastic force of the elastic member 400 to abut the first heat dissipation boss 211 with the first chip 310, so as to reduce the gap between the first heat dissipation boss 211 and the first chip 310, thereby facilitating the heat dissipation speed of the first chip 310. The designed compression stroke of the elastic member 400 in the embodiment of the present application covers the sum of the height tolerance fluctuation of the first chip 310, the manufacturing tolerance during the assembly process of the upper shell 110 and the circuit board 300, and the manufacturing tolerance of the first heat dissipation boss 211, thereby ensuring that the gap between the first heat dissipation boss 211 and the first chip 310 after assembly is as small as possible.

[0043] In the embodiment of the present application, a support portion 121 is provided on the housing, the support portion 121 is provided on the bottom cover 120, and the support portion 121 abuts against the circuit board 300. It can be understood that the first chip 310 is provided on the first side of the circuit board 300, and the support portion 121 abuts against the second side of the circuit board 300 opposite to the first side, so that the support portion 121 can be used to provide a supporting force to the circuit board 300, so as to reduce the pressure exerted by the elastic member 400 on the circuit board 300, so as to reduce the risk of cracking of the first chip 310. Alternatively, it can be understood that by providing the support portion 121, the pressure exerted by the elastic member 400 is finally transmitted to the bottom cover 120, thereby reducing the stress exerted on the circuit board 300, and preventing the circuit board 300 from being bent and causing the first chip 310 to crack.

[0044] Optionally, the support portion 121 of the embodiment of the present application includes a protrusion disposed on the bottom cover 120. In a plane parallel to the circuit board 300, the projection of the first chip 310 is located within the projection range of the support portion 121, so that the projection area of ​​the support portion 121 completely covers the projection area of ​​the first chip 310, so as to provide a stable supporting force to the first chip 310.

[0045] In other possible implementations, the support portion 121 includes a steel patch structure, such as a rib, disposed on the bottom cover 120 . A plurality of ribs disposed at intervals may be disposed on the bottom cover 120 , thereby utilizing the plurality of ribs to provide a stable supporting force to the first chip 310 .

[0046] In one possible implementation, the elastic member 400 of the embodiment of the present application includes a spring, and a mounting groove 111 is provided on the outer shell. The spring is arranged in the mounting groove 111, so that the mounting groove can be used to impose circumferential restrictions on the spring to prevent the spring from becoming unstable and falling during installation and use.

[0047] For example, the number and position of the springs can be determined based on the shape of the heat dissipation component 200. For example, multiple springs can be provided, and the multiple springs are distributed along the circumference of the heat dissipation component 200 to better abut the heat dissipation component 200 against the circuit board 300 and make the force uniform everywhere. Figure 1 , Figure 5 and Figure 6 As shown, in the embodiment of the present application, the heat dissipation assembly 200 is generally in the shape of a quadrangular prism, so four springs can be provided, corresponding to the four corners of the heat dissipation assembly 200; correspondingly, four installation grooves 111 can be provided on the upper shell 110, respectively used to install the four springs.

[0048] In another possible implementation, the elastic member 400 may further include a sealing ring or a spring, and the elastic member 400 may be continuously arranged along the circumference of the heat dissipation assembly 200 to push the heat dissipation assembly 200 against the circuit board 300 .

[0049] In the embodiment of the present application, the elastic member 400 can be kept in a compressed state by the assembly structure of the domain controller itself. For example, the bottom cover 120, the upper housing 110 and the circuit board 300 of the embodiment of the present application are connected by the first fastener 500 to compress the elastic member 400 between the upper housing 110 and the heat dissipation assembly 200. Please refer to Figure 1 , Figure 3 , Figure 5 , Figure 7 and Figure 8 In the embodiment of the present application, a plurality of first threaded holes 122 are provided on the bottom cover 120, and the first threaded holes 122 may be convex, so as to provide partial support force to the circuit board 300 by using the first threaded holes 122, and further reduce the stress borne by the circuit board 300. A plurality of through holes 330 corresponding to the first threaded holes 122 are provided on the circuit board 300. A plurality of second threaded holes 114 corresponding to the first threaded holes 122 and the through holes 330 are provided on the upper shell 110. During assembly, the first fastener 500 passes through the first threaded holes 122, the through holes 330 and the second threaded holes 114 in sequence, and then connects the bottom cover 120, the upper shell 110 and the circuit board 300 as a whole, and compresses the elastic member 400 between the upper shell 110 and the heat dissipation assembly 200. The use of the first fastener 500 to lock the circuit board 300 with the housing can also prevent the circuit board 300 from bending and deformation.

[0050] Optionally, in the embodiment of the present application, a first heat-conducting layer 610 is filled between the first heat-dissipating boss 211 and the first chip 310. The first heat-conducting layer 610 may be, for example, a heat-conducting adhesive layer, such as a heat-conducting silicone layer. It is understandable that, due to the presence of the elastic member 400, the gap between the first heat-dissipating boss 211 and the first chip 310 is very small (approaching zero match), so the thickness of the first heat-conducting layer 610 is very thin; by providing the first heat-conducting layer 610, the heat dissipation speed of the first chip 310 to the first heat-dissipating boss 211 can be accelerated, eliminating the influence of the thermal resistance of the small gap between the first heat-dissipating boss 211 and the first chip 310.

[0051] like Figure 1 , such as 2, Figure 6 and Figure 7 As shown, the circuit board 300 of the embodiment of the present application is further provided with a plurality of second chips 320 on one side facing the heat dissipation assembly 200. The second chips 320 are auxiliary chips that can assist the first chip 310 in processing information; the plurality of second chips 320 can be arranged around the first chip 310. The heat dissipation assembly 200 is further provided with a plurality of second heat dissipation bosses 212, which correspond one-to-one to the plurality of second chips 320, so that the plurality of second heat dissipation bosses 212 are used to dissipate heat for the plurality of second chips 320.

[0052] Furthermore, a second heat-conducting layer 620 is filled between the second heat-dissipating boss 212 and the second chip 320. The second heat-conducting layer 620 may be, for example, a heat-conducting adhesive layer, such as a heat-conducting silicone layer. The second heat-conducting layer 620 may accelerate the heat dissipation speed of the second chip 320 to the second heat-dissipating boss 212. Since the first chip 310 is used as a reference in the embodiment of the present application, the gap between the first heat-dissipating boss 211 and the first chip 310 is first considered during the design so that the two are kept in a zero-matching state. Therefore, the gap between the second heat-dissipating boss 212 and the second chip 320 is greater than the gap between the first heat-dissipating boss 211 and the first chip 310, and the thickness of the second heat-conducting layer 620 is also greater than the thickness of the first heat-conducting layer 610.

[0053] like Figure 6 As shown, the heat dissipation assembly 200 of the embodiment of the present application includes a heat spreader 210 and a heat dissipation assembly body 220. The heat spreader 210 is arranged on the side of the heat dissipation assembly body 220 facing the circuit board 300. The heat spreader 210 can evenly guide heat to various parts of the heat dissipation assembly body 220, thereby facilitating the improvement of heat dissipation capacity. The first heat dissipation boss 211 and the plurality of second heat dissipation bosses 212 are all arranged on the heat spreader 210.

[0054] Optionally, the heat sink 210 and the heat dissipation component body 220 of the embodiment of the present application can be welded to form a whole.

[0055] Furthermore, in the embodiment of the present application, a plurality of limiting holes 221 are provided on the heat dissipation component main body 220, and a plurality of limiting columns 112 are provided on the upper shell 110. The plurality of limiting columns 112 correspond one-to-one to the plurality of limiting holes 221, and the limiting columns 112 are inserted into the corresponding limiting holes 221 to realize the positioning of the heat dissipation component 200 during installation.

[0056] In order to further improve the heat dissipation capacity of the heat dissipation assembly 200, the heat dissipation assembly 200 of the embodiment of the present application also includes a plurality of heat dissipation fins 230, and the plurality of heat dissipation fins 230 are arranged on the side of the heat dissipation assembly body 220 away from the circuit board 300; the upper shell 110 is also provided with a heat dissipation via 113, and the plurality of heat dissipation fins 230 are passed through the heat dissipation via 113, so that the heat of the heat dissipation assembly body 220 can be dissipated to the external environment as quickly as possible.

[0057] Furthermore, in the embodiment of the present application, a thermal conductive adhesive layer 700 is filled between the upper shell 110 and the heat dissipation component body 220. The thermal conductive adhesive layer 700 can introduce part of the heat of the heat dissipation component body 220 into the upper shell 110, thereby improving the heat dissipation capability.

[0058] Specifically, Figure 1 , Figure 2 and Figure 5As shown, a thermal conductive adhesive groove 115 is provided in the upper shell 110 of the embodiment of the present application, and the thermal conductive adhesive layer 700 can be filled into the thermal conductive adhesive groove 115. After the outer shell is assembled, the thermal conductive adhesive layer 700 is in contact with the heat dissipation component body 220, thereby conducting the heat of the heat dissipation component body 220 to the upper shell 110.

[0059] Optionally, the thermal conductive adhesive layer 700 of the embodiment of the present application can be located on the side of the elastic member 400 facing the heat dissipation fin 230, so as to facilitate the glue gun to extend into the upper shell 110 and inject glue into the thermal conductive adhesive groove 115 to avoid interference between the glue gun and other components.

[0060] like Figure 1 As shown, the heat dissipation assembly 200 of the embodiment of the present application also includes a fan 240. The fan 240 is arranged on the side of the heat dissipation fin 230 away from the circuit board 300, for example, it can be located in the heat dissipation hole 113 in the upper shell 110. The fan 240 is used to export the heat of the heat dissipation fin 230 to the external environment, thereby increasing the heat conduction speed to improve the heat dissipation capacity.

[0061] A fan cover 250 is also connected to the side of the fan 240 facing away from the circuit board 300 . The fan 240 , the fan cover 250 and the upper housing 110 are connected via a second fastener 800 to form an integral body.

[0062] Specifically, if Figure 1 and Figure 4 As shown, a plurality of fan fixing structures 116 are further provided on the upper shell 110 of the embodiment of the present application. The fan fixing structure 116 may include threaded holes or guide columns, etc. Corresponding through holes are provided on the fan cover 250. The second fastener 800 passes through the through holes and is fixed in the threaded holes to connect the fan 240, the fan cover 250 and the upper shell 110 as a whole.

[0063] An embodiment of the present application also provides a mobile platform, including the above-mentioned domain controller.

[0064] Specifically, the mobile platform of the embodiment of the present application can be, for example, a vehicle, and the domain controller is arranged in the vehicle to manage and control various functions of the vehicle by processing data information. Due to the use of the above-mentioned domain controller, it is possible to ensure that the chip has good heat dissipation while reducing the stress on the chip and the circuit board, thereby reducing the risk of chip cracking.

[0065] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0066] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0067] It should be noted that in the description of this application, the terms "first" and "second" are only used to facilitate the description of different components, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0068] The various embodiments or implementation methods in the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0069] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A domain controller, characterized in that: It includes a shell, in which a heat dissipation component and a circuit board are stacked, a first chip is provided on the side of the circuit board facing the heat dissipation component, a first heat dissipation boss is provided on the heat dissipation component, and an elastic member in a compressed state is also provided on the side of the heat dissipation component away from the circuit board, a first end of the elastic member abuts on the shell, and a second end of the elastic member abuts on the heat dissipation component so that the first heat dissipation boss abuts against the first chip, and a supporting portion is provided on the shell, and the supporting portion abuts on the circuit board.

2. The domain controller according to claim 1, characterized in that: The elastic member comprises a spring, the housing is provided with a mounting groove, and the spring is arranged in the mounting groove.

3. The domain controller according to claim 1, characterized in that: The elastic member includes a sealing ring or a spring sheet, and the elastic member is arranged along the circumference of the heat dissipation component.

4. The domain controller according to any one of claims 1 to 3, characterized in that: The housing includes a bottom cover and an upper shell, the circuit board is arranged close to the bottom cover, the support portion is arranged on the bottom cover, and the bottom cover, the upper shell and the circuit board are connected by a first fastener to compress the elastic member between the upper shell and the heat dissipation assembly.

5. The domain controller according to claim 4, characterized in that: In a plane parallel to the circuit board, a projection of the first chip is located within a projection range of the supporting portion.

6. The domain controller according to claim 4, characterized in that: A plurality of second chips are also provided on one side of the circuit board facing the heat dissipation component. The plurality of second chips are arranged around the first chip. A plurality of second heat dissipation bosses are also provided on the heat dissipation component. The plurality of second heat dissipation bosses correspond one-to-one to the plurality of second chips.

7. The domain controller according to claim 6, characterized in that: A first heat-conducting layer is filled between the first heat-dissipating boss and the first chip, and a second heat-conducting layer is filled between the second heat-dissipating boss and the second chip. The thickness of the second heat-conducting layer is greater than that of the first heat-conducting layer.

8. The domain controller according to claim 6, characterized in that: The heat dissipation assembly comprises a heat spreader and a heat dissipation assembly body. The heat spreader is arranged on a side of the heat dissipation assembly body facing the circuit board. The first heat dissipation boss and a plurality of the second heat dissipation bosses are all arranged on the heat spreader.

9. The domain controller according to claim 8, characterized in that: The heat dissipation component body is provided with a plurality of limiting holes, the upper shell is provided with a plurality of limiting posts, the plurality of limiting posts correspond to the plurality of limiting holes one by one, and the limiting posts are inserted into the corresponding limiting holes.

10. A movable platform, characterized in that: Comprising a domain controller as described in any one of claims 1-9.

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