Novel high-temperature-resistant double-sided circuit board

Abstract

The utility model discloses a novel high-temperature-resistant double-sided circuit board, and particularly relates to the field of circuit boards, the novel high-temperature-resistant double-sided circuit board comprises a mounting frame, one end of the mounting frame is provided with a heat dissipation mechanism, two sides of the mounting frame are both provided with limiting sleeves, and heat dissipation fins are uniformly inserted in the limiting sleeves. And bearing seats are arranged in the centers of the two sides in the mounting frame correspondingly, and heat transfer plates are mounted at the top ends and the bottom ends of the bearing seats correspondingly. According to the double-sided circuit board, the radiating fins, the heat conducting plate and the heat transfer plate are arranged, the circuit board is attached to the heat transfer plate, the heat transfer plate is installed on the bearing seat, the two sides of the heat transfer plate are in contact with the radiating fins, and heat generated by the circuit board can be transferred to the radiating fins through the heat transfer plate when the double-sided circuit board is used, so that heat energy in the double-sided circuit board is rapidly reduced, and the service life of the double-sided circuit board is prolonged. Therefore, the service life of the double-sided circuit board is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and more specifically, to a novel high-temperature resistant double-sided circuit board. Background Art

[0002] High temperature resistant double-sided circuit board is a transitional product between single-layer circuit board and multi-layer circuit board. There are wiring on both sides of this circuit board. There is copper on both sides of the double-sided circuit board, which can be connected through holes.

[0003] After searching, the existing patent (publication number: CN 212544154 U) discloses a new type of high-temperature resistant double-sided circuit board. By setting a heat sink, after a long period of use on the surface of the double-sided circuit board body, the heat generated inside it is directed to the two sides of the mounting groove through the heat sink, thereby quickly reducing the heat energy inside the double-sided circuit board body and extending its service life.

[0004] When the existing double-sided circuit board is working, a lot of heat will be generated on both sides, causing the circuit board to be in a high temperature state, shortening the service life of the circuit board, so it is necessary to enhance its heat dissipation performance; and the above-cited patent document only achieves heat dissipation by adding a heat sink between the two circuit boards, which can only perform passive heat dissipation, and cannot perform graded heat dissipation according to the actual temperature during use, and the heat dissipation effect is poor;

[0005] Therefore, a new type of high temperature resistant double-sided circuit board is proposed to solve the above problems. Utility Model Content

[0006] In order to overcome the above-mentioned defects of the prior art, the embodiments of the present invention provide a novel high temperature resistant double-sided circuit board to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a novel high-temperature resistant double-sided circuit board, comprising a mounting frame, a heat dissipation mechanism is mounted on one end of the mounting frame, and limiting sleeves are arranged on both sides of the mounting frame, and heat dissipation fins are evenly inserted in the limiting sleeves, and supporting seats are arranged at the central positions of both sides of the interior of the mounting frame, and heat transfer plates are mounted on the top and bottom ends of the supporting seats;

[0008] Heat conducting plates are evenly arranged between the heat transfer plates, and cooling pipes are installed between the heat transfer plates. Circuit boards are installed at the top and bottom ends of the installation frame, and a dust filter plate is fixed at one end of the installation frame away from the heat dissipation mechanism. A temperature sensor is installed at the middle position of the support seat close to the heat conducting plate.

[0009] Preferably, a vent is provided at a central position of the installation frame near one end of the heat dissipation mechanism, and functional cavities are provided in the installation frame on both sides of the vent, and inspection covers are installed by bolts at positions near the functional cavities on both sides of the installation frame.

[0010] Preferably, a circulation pump and a water outlet pipe are respectively provided inside the functional cavity, and the water outlet pipe is connected to one end of the cooling pipe, the other end of the cooling pipe is connected to the output end of the circulation pump, and a water inlet pipe is installed at the input end of the circulation pump, and the water inlet pipe and the water outlet pipe both pass through the inspection cover.

[0011] Preferably, mounting holes are provided at the four corners of the circuit board, and the circuit board is fitted with the heat transfer plate, corresponding threaded holes are provided at the top and bottom ends of the support seat near the mounting holes, and through holes corresponding to the mounting holes are provided at the four corners of the heat transfer plate, fastening bolts are provided in the mounting holes, and the fastening bolts pass through the through holes of the heat transfer plate and are threadedly connected with the threaded holes.

[0012] Preferably, the heat dissipation mechanism includes a shell, mounting flanges located on both sides of the shell and a heat dissipation fan arranged inside the shell, and the shell is detachably connected to the mounting frame through bolts and mounting flanges, and filters are arranged at both ends of the shell.

[0013] Preferably, slots are evenly arranged inside the limiting sleeve, and the shapes of the slots match the heat dissipation fins. Long screws are horizontally passed through the limiting sleeve, and the long screws all pass through the heat dissipation fins.

[0014] Preferably, the height of the supporting seat is consistent with the height of the heat dissipation fins, and the inside of the supporting seat is provided with a mounting groove whose shape matches the heat dissipation fins, and the inner side wall of the mounting groove is provided with thermal conductive silicone grease.

[0015] Preferably, the cooling tube is serpentine-shaped, and the cooling tube is spaced apart from the heat transfer plate. The cooling tube is a flat tube design, and the upper and lower surfaces of the cooling tube are both in contact with the heat transfer plate.

[0016] Technical effects and advantages of the utility model:

[0017] 1. Compared with the prior art, the new high-temperature resistant double-sided circuit board is provided with heat dissipation fins, heat conducting plates and heat transfer plates. The circuit board is fitted with the heat transfer plates, and the heat transfer plates are installed on the supporting seat, and both sides of the heat transfer plates are in contact with the heat dissipation fins. When in use, the heat generated by the circuit board can be transferred to the heat dissipation fins through the heat transfer plates, thereby quickly reducing the heat energy inside the double-sided circuit board, thereby extending the service life of the double-sided circuit board.

[0018] 2. Compared with the prior art, the new high-temperature resistant double-sided circuit board uses a temperature sensor, a heat dissipation mechanism and a cooling pipe. When in use, the temperature sensor can detect the internal temperature of the double-sided circuit board. If the temperature is too high and the heat dissipation fins and the heat transfer plate cannot dissipate heat in time, the heat dissipation fan in the heat dissipation mechanism will start to air-cool the double-sided circuit board. If the detected temperature is still too high, the circulating pump will start to pump coolant into the cooling pipe to liquid-cool the double-sided circuit board. The cooling pipe is in contact with the heat transfer plate, so the coolant can take away the heat on the heat transfer plate when it flows, thereby achieving enhanced heat dissipation of the double-sided circuit board. Gradual heat dissipation is performed according to actual usage, with better heat dissipation effect, stronger high temperature resistance, and better energy saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the appearance structure of the utility model.

[0020] Figure 2 It is a schematic diagram of the internal structure of the utility model.

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the utility model in top view.

[0022] The accompanying drawings are marked as follows: 1. installation frame; 101. ventilation port; 102. functional cavity; 2. cooling fins; 3. circuit board; 301. installation hole; 4. heat dissipation mechanism; 401. shell; 402. cooling fan; 403. filter; 404. installation flange; 5. water inlet pipe; 6. long screw; 7. limit sleeve; 8. heat conduction plate; 9. support seat; 901. threaded hole; 10. heat transfer plate; 11. dust filter plate; 12. thermal grease; 13. circulation pump; 14. water outlet pipe; 15. cooling pipe; 16. slot; 17. inspection cover; 18. fastening bolt; 19. installation slot; 20. temperature sensor. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1

[0025] As attached Figure 1 and Figure 2A novel high temperature resistant double-sided circuit board is shown, comprising a mounting frame 1, a heat dissipation mechanism 4 is mounted on one end of the mounting frame 1, and limiting sleeves 7 are arranged on both sides of the mounting frame 1, and heat dissipation fins 2 are evenly inserted in the limiting sleeves 7, and supporting seats 9 are arranged at the central positions of both sides of the mounting frame 1, and heat transfer plates 10 are mounted on the top and bottom ends of the supporting seats 9;

[0026] Heat conducting plates 8 are evenly arranged between the heat transfer plates 10, and cooling pipes 15 are installed between the heat transfer plates 10. Circuit boards 3 are installed at the top and bottom ends of the installation frame 1, and a dust filter plate 11 is fixed to the end of the installation frame 1 away from the heat dissipation mechanism 4. A temperature sensor 20 is installed at the middle position of the support seat 9 close to the heat conducting plate 8.

[0027] Among them: the heat dissipation fins 2 and the heat transfer plate 10 can perform basic heat dissipation for the circuit board 3, the temperature sensor 20 can detect the temperature in the cavity between the circuit boards 3, if the temperature is too high, the heat dissipation fan 402 in the heat dissipation mechanism 4 is started to air-cool the circuit board 3, if the detected temperature is still too high, the coolant is pumped into the cooling pipe 15 to liquid-cool the circuit board 3, and the heat dissipation is graded according to the actual use situation, the heat dissipation effect is better, the high temperature resistance is stronger, and it can better save energy.

[0028] Embodiment 2

[0029] Based on the first embodiment, the solution in the first embodiment is further detailed in combination with the following specific working methods. Figures 1 to 3 As shown, see the following description for details:

[0030] As a preferred embodiment, a vent 101 is provided at a central position of the installation frame 1 near one end of the heat dissipation mechanism 4, and functional cavities 102 are provided in the installation frame 1 on both sides of the vent 101, and inspection covers 17 are installed by bolts at positions near the functional cavities 102 on both sides of the installation frame 1; further, the inspection cover 17 is provided to facilitate opening the functional cavity 102 and to facilitate inspection and maintenance of the circulating pump 13 therein, and the vent 101 is provided to facilitate air cooling of the interior of the installation frame 1 by the heat dissipation mechanism 4, and the design is more reasonable.

[0031] As a preferred embodiment, a circulating pump 13 and a water outlet pipe 14 are respectively provided inside the functional cavity 102, and the water outlet pipe 14 is connected to one end of the cooling pipe 15, and the other end of the cooling pipe 15 is connected to the output end of the circulating pump 13, and a water inlet pipe 5 is installed at the input end of the circulating pump 13, and both the water inlet pipe 5 and the water outlet pipe 14 pass through the inspection cover 17; further, the circulating pump 13 is turned on, and coolant is pumped into the cooling pipe 15, and the coolant is discharged from the water outlet pipe 14, and the cooling pipe 15 is in contact with the heat transfer plate 10, so the coolant can take away the heat on the heat transfer plate 10 when flowing, so as to realize liquid cooling of the device and better heat dissipation effect.

[0032] As a preferred embodiment, mounting holes 301 are provided at the four corners of the circuit board 3, and the circuit board 3 is fitted with the heat transfer plate 10, corresponding threaded holes 901 are provided at the top and bottom of the supporting seat 9 near the mounting holes 301, and through holes corresponding to the mounting holes 301 are provided at the four corners of the heat transfer plate 10, and fastening bolts 18 are provided in the mounting holes 301, and the fastening bolts 18 pass through the through holes of the heat transfer plate 10 and are threadedly connected with the threaded holes 901; further, the circuit board 3 and the heat transfer plate 10 are assembled with the supporting seat 9 by means of the fastening bolts 18, and the disassembly and assembly are very convenient, which makes it more convenient to inspect and maintain the device.

[0033] As a preferred embodiment, the heat dissipation mechanism 4 includes a shell 401, mounting flanges 404 located on both sides of the shell 401 and a heat dissipation fan 402 arranged inside the shell 401, and the shell 401 is detachably connected to the mounting frame 1 through bolts and the mounting flange 404, and filters 403 are arranged at both ends of the shell 401; further, when the heat dissipation fan 402 in the heat dissipation mechanism 4 is started, the circuit board 3 can be cooled by air, and the two-layer filter 403 design can prevent dust or impurities from entering between the two circuit boards 3 and affecting the operation of the circuit boards 3, and the design is more reasonable.

[0034] As a preferred embodiment, slots 16 are evenly opened inside the limiting sleeve 7, and the shape of the slots 16 matches the heat sink 2. Long screws 6 are horizontally passed through the limiting sleeve 7, and the long screws 6 all pass through the heat sink 2. Furthermore, the matching design makes the connection between the heat sink 2 and the slots 16 more stable and less prone to tilting or shaking. The design of the long screws 6 can further fix the heat sink fins 2 to prevent the heat sink fins 2 from falling off, and the design is more reasonable.

[0035] As a preferred embodiment, the height of the support seat 9 is consistent with the height of the heat dissipating fins 2, and the interior of the support seat 9 is provided with a mounting groove 19 whose shape matches the heat dissipating fins 2, and the inner wall of the mounting groove 19 is provided with thermal grease 12; further, the highly consistent design makes it possible for the top and bottom ends of the heat dissipating fins 2 to be flush with the upper and lower surfaces of the support seat 9 after the heat dissipating fins 2 are inserted into the mounting groove 19, so that the heat transfer plate 10 can contact the heat dissipating fins 2 to facilitate heat transfer, and the design of the thermal grease 12 makes the heat transfer efficiency between the heat transfer plate 10 and the heat dissipating fins 2 higher.

[0036] As a preferred embodiment, the cooling tube 15 is serpentine, and the cooling tube 15 is spaced apart from the heat conducting plate 8. The cooling tube 15 is a flat tube design, and the upper and lower surfaces of the cooling tube 15 are both in contact with the heat transfer plate 10. Furthermore, the flat tube design makes the contact area between the cooling tube 15 and the heat transfer plate 10 larger, which can better take away the heat generated by the circuit board 3 during operation, and the heat dissipation performance of the device is better.

[0037] The working process of the utility model is as follows:

[0038] When in use, first use the mounting flange 404 and bolts to fix the heat dissipation mechanism 4 to the mounting frame 1, then insert the heat dissipation fins 2 through the slots 16 and into the mounting grooves 19, then use the fastening bolts 18 to connect the lower heat transfer plate 10 and the circuit board 3 to the bottom of the support seat 9, then clamp the heat conduction plate 8 with the heat transfer plate 10, bypass the serpentine cooling pipe 15 through the gap between the heat conduction plates 8, and connect the two ends of the cooling pipe 15 to the output end of the circulation pump 13 and the water outlet pipe 14 respectively, and finally use the fastening bolts 18 to connect the upper heat transfer plate 10 and the circuit board 3 to the top of the support seat 9 to complete the entire assembly process. When in use The heat generated by the circuit board 3 can be transferred to the heat dissipation fins 2 through the heat transfer plate 10, thereby quickly reducing the heat energy inside the circuit board 3. The temperature sensor 20 can detect the internal temperature of the circuit board 3. If the temperature is too high, the heat dissipation fan 402 in the heat dissipation mechanism 4 is started to cool the circuit board 3. If the detected temperature is still too high, the circulation pump 13 is turned on to pump coolant into the cooling pipe 15 to liquid-cool the circuit board 3. The cooling pipe 15 is in contact with the heat transfer plate 10, so the coolant can take away the heat on the heat transfer plate 10 when it flows. The heat dissipation is performed in stages according to the actual usage, the heat dissipation effect is better, and energy can be better saved.

[0039] Finally: The above are only preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A novel high temperature resistant double-sided circuit board, comprising a mounting frame (1), characterized in that: A heat dissipation mechanism (4) is installed at one end of the installation frame (1), and limiting sleeves (7) are provided on both sides of the installation frame (1), and heat dissipation fins (2) are evenly inserted in the limiting sleeves (7). Support seats (9) are provided at the central positions of both sides of the interior of the installation frame (1), and heat transfer plates (10) are installed at the top and bottom of the support seats (9); Heat conducting plates (8) are evenly arranged between the heat transfer plates (10), and cooling pipes (15) are installed between the heat transfer plates (10). Circuit boards (3) are installed at the top and bottom ends of the installation frame (1), and a dust filter plate (11) is fixed at one end of the installation frame (1) away from the heat dissipation mechanism (4). A temperature sensor (20) is installed at the middle position of the support seat (9) on one side close to the heat conducting plate (8).

2. A novel high temperature resistant double-sided circuit board according to claim 1, characterized in that: A vent (101) is provided at a central position of one end of the installation frame (1) close to the heat dissipation mechanism (4), and functional cavities (102) are provided in the installation frame (1) on both sides of the vent (101), and inspection covers (17) are installed by bolts at positions close to the functional cavities (102) on both sides of the installation frame (1).

3. The novel high temperature resistant double-sided circuit board according to claim 2 is characterized in that: A circulation pump (13) and a water outlet pipe (14) are respectively arranged inside the functional cavity (102), and the water outlet pipe (14) is connected to one end of a cooling pipe (15), and the other end of the cooling pipe (15) is connected to the output end of the circulation pump (13), and a water inlet pipe (5) is installed at the input end of the circulation pump (13), and the water inlet pipe (5) and the water outlet pipe (14) both pass through the inspection cover (17).

4. The novel high temperature resistant double-sided circuit board according to claim 1 is characterized in that: The four corners of the circuit board (3) are provided with mounting holes (301), and the circuit board (3) is fitted with the heat transfer plate (10); corresponding threaded holes (901) are provided at the top and bottom of the support seat (9) near the mounting holes (301); and through holes corresponding to the mounting holes (301) are provided at the four corners of the heat transfer plate (10); fastening bolts (18) are provided in the mounting holes (301), and the fastening bolts (18) pass through the through holes of the heat transfer plate (10) and are threadedly connected to the threaded holes (901).

5. The novel high temperature resistant double-sided circuit board according to claim 1 is characterized in that: The heat dissipation mechanism (4) comprises a shell (401), mounting flanges (404) located on both sides of the shell (401), and a heat dissipation fan (402) arranged inside the shell (401), and the shell (401) is detachably connected to the mounting frame (1) via bolts and the mounting flanges (404), and filters (403) are arranged at both ends of the shell (401).

6. The novel high temperature resistant double-sided circuit board according to claim 1 is characterized in that: The limiting sleeve (7) is evenly provided with slots (16) inside, and the shape of the slots (16) matches the heat dissipation fins (2). The limiting sleeve (7) is horizontally penetrated by long screws (6), and the long screws (6) all penetrate the heat dissipation fins (2).

7. The novel high temperature resistant double-sided circuit board according to claim 1 is characterized in that: The height of the support seat (9) is consistent with the height of the heat dissipation fins (2), and the interior of the support seat (9) is provided with a mounting groove (19) whose shape matches the heat dissipation fins (2), and the inner side wall of the mounting groove (19) is provided with thermal conductive silicone grease (12).

8. The novel high temperature resistant double-sided circuit board according to claim 1 is characterized in that: The cooling pipe (15) is serpentine-shaped, and the cooling pipe (15) is spaced apart from the heat transfer plate (8). The cooling pipe (15) is a flat tube design, and the upper and lower surfaces of the cooling pipe (15) are both in contact with the heat transfer plate (10).

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