Heat dissipation structure, live broadcast machine and audio and video equipment

Abstract

The embodiment of the utility model discloses a heat dissipation structure, a live broadcast machine and audio and video equipment, the heat dissipation structure comprises a frame body, a heat dissipation sheet, a temperature equalizing sheet and a flow guide assembly, based on this, in the use process, an electronic device can be connected to the frame body, the frame body plays a role of skeleton supporting, when the electronic device works, on one hand, heat energy can be transmitted to the heat dissipation sheet, and on the other hand, heat energy is transmitted to the heat dissipation sheet; on the other hand, the flow guide assembly can be started, airflow can be introduced through the flow guide assembly, and part of heat energy can be taken away through introduction of the airflow and air exhaust; according to the heat dissipation structure provided by the embodiment of the invention, heat dissipation can be carried out on the electronic device in two modes of heat energy transfer through the heat dissipation fins and air flow heat dissipation, and the heat dissipation efficiency can be greatly improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of audio and video acquisition technology, and in particular to a heat dissipation structure, a live broadcast machine, and audio and video equipment. Background Art

[0002] With the increasing frequency of use of mobile terminals such as mobile phones and tablet computers, as well as the increase in the power of devices in mobile terminals, it is difficult for mobile terminals in traditional technologies to ensure heat dissipation efficiency when used for a long time.

[0003] Take the live streaming industry as an example. With the rapid development of Internet technology, the live streaming industry has shown explosive growth in recent years. From the emergence of live streaming platforms to the innovation of various live streaming content, live streaming is gradually becoming an indispensable part of people's lives. Currently, mobile phones are usually used as live streaming devices. Continuous and long-term use of mobile phones will increase the temperature of the phone, affecting the performance of the phone and thus affecting the live streaming effect. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art or related technology.

[0005] To this end, a first aspect of the utility model provides a heat dissipation structure.

[0006] A second aspect of the present invention provides a live broadcast machine.

[0007] A third aspect of the utility model provides an audio and video device.

[0008] In view of this, according to a first aspect of an embodiment of the present application, a heat dissipation structure is proposed, comprising:

[0009] A frame, wherein electronic components are arranged in the frame;

[0010] A heat sink, the heat sink is connected to the frame and is used to contact the electronic device;

[0011] A temperature balancing plate, the temperature balancing plate is connected to the frame and is located on a side of the heat sink away from the electronic device;

[0012] A flow guide component is connected to a side of the frame away from the heat sink and is used to form an airflow to dissipate heat for the electronic device.

[0013] In a feasible implementation manner, a hollow portion is formed on the frame, and the heat sink covers the hollow portion.

[0014] In a feasible implementation manner, the heat sink comprises a VC heat sink;

[0015] The temperature-balancing sheet includes a graphene sheet.

[0016] In a feasible implementation manner, the flow guide component includes:

[0017] A bracket, the bracket being connected to the frame;

[0018] A fan, the fan being connected to the bracket;

[0019] The cover plate assembly is connected to the bracket, and the fan is located between the cover plate assembly and the bracket to form an air duct.

[0020] In a feasible implementation manner, the flow guide component further includes:

[0021] An air inlet, the air inlet is formed on the bracket and is located on one side of the bracket;

[0022] An air outlet, the air outlet being arranged on one side of the bracket;

[0023] Wherein, the air inlet and the air outlet are both connected to the air duct.

[0024] In a feasible implementation manner, the flow guide component further includes:

[0025] a first dustproof net, wherein the first dustproof net covers the air inlet;

[0026] A second dustproof net is provided, wherein the second dustproof net covers the air outlet.

[0027] In a feasible implementation manner, the bracket is embedded in the frame, and a through hole is formed in a region of the frame opposite to the air outlet.

[0028] In a feasible implementation manner, the cover plate assembly includes:

[0029] a first cover plate, wherein the first cover plate covers the electronic device;

[0030] A second cover plate is disposed adjacent to the first cover plate.

[0031] According to a second aspect of an embodiment of the present application, a live broadcast machine is provided, characterized in that it includes:

[0032] A heat dissipation structure as described in any of the above technical solutions.

[0033] In a feasible implementation manner, the live broadcast machine further includes:

[0034] A main control board is connected to the frame, and the chip, memory and storage on the main control board are arranged toward the heat sink.

[0035] In a feasible implementation, the live broadcast machine includes:

[0036] a first silicone layer, wherein the first silicone layer covers the chip, the memory and the storage;

[0037] a metal layer, the metal layer being connected to the first silicone layer;

[0038] A second silicone layer is connected to the metal layer and the heat sink.

[0039] In a feasible implementation manner, the live broadcast machine further includes:

[0040] A shielding cover is provided to cover at least a portion of the main control board, and at least a portion of the shielding cover is located in the air duct of the air guide component.

[0041] According to a third aspect of an embodiment of the present application, an audio and video device is proposed, comprising a heat dissipation structure as described in any of the above technical solutions.

[0042] Compared with the prior art, the present invention has at least the following beneficial effects:

[0043] The heat dissipation structure provided in the embodiment of the present application includes a frame, a heat sink, a temperature equalizer and a guide component. Based on this, during use, the electronic device can be connected to the frame, and the frame plays the role of a skeleton support. When the electronic device is operating, the heat energy will be transferred to the heat sink on the one hand, and then dissipated through the temperature equalizer. On the other hand, the guide component can be turned on, and the guide component can introduce airflow. Part of the heat energy can be taken away by the introduction and exhaust of airflow. Based on this, the heat dissipation structure provided in the embodiment of the present application can dissipate heat for the electronic device through two methods: heat transfer from the heat sink and airflow heat dissipation, which can greatly improve the heat dissipation efficiency. Taking a mobile terminal that uses the heat dissipation structure provided in the embodiment of the present application as an example, even if the mobile terminal is used for a long time, the heat dissipation effect of the mobile terminal can be guaranteed, thereby ensuring the stability of the operation of the mobile terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0045] Figure 1 A schematic structural diagram of a heat dissipation structure of an embodiment provided in the present application;

[0046] Figure 2A schematic structural diagram of a disassembled state of a heat dissipation structure of an embodiment provided in the present application;

[0047] Figure 3 A schematic structural diagram of a frame and a temperature-dissipating plate of a heat dissipation structure according to an embodiment of the present application;

[0048] Figure 4 A schematic structural diagram of a disassembled state of a frame and a temperature-distributing plate of a heat dissipation structure according to an embodiment of the present application;

[0049] Figure 5 A schematic structural diagram of a frame and a heat sink of a heat dissipation structure according to an embodiment of the present application;

[0050] Figure 6 A schematic structural diagram of a guide component of a heat dissipation structure of an embodiment provided in the present application from a first angle;

[0051] Figure 7 A schematic structural diagram of a guide component of a heat dissipation structure provided in an embodiment of the present application from a second angle;

[0052] Figure 8 A schematic structural diagram of a disassembled state of a guide component of a heat dissipation structure according to an embodiment of the present application from a first angle;

[0053] Fig. 9 A schematic structural diagram of a disassembled state of a guide component of a heat dissipation structure according to an embodiment of the present application from a second angle;

[0054] Fig.10 A schematic structural diagram of the fan arrangement position of a guide assembly of a heat dissipation structure according to an embodiment of the present application;

[0055] Fig.11 A schematic structural diagram of a live broadcast machine according to an embodiment of the present application;

[0056] Fig.12 A schematic structural diagram of a disassembled state of a live broadcast machine according to an embodiment of the present application;

[0057] Fig.13 A schematic structural diagram of a cross-section of a live broadcast machine at one angle according to an embodiment of the present application;

[0058] Fig.14 for Fig.13 A local enlarged schematic diagram of the middle A;

[0059] Fig.15 A schematic structural diagram of a main control board and a second silicone layer of a live broadcast machine in a disassembled state according to an embodiment of the present application;

[0060] Fig.16 A schematic structural diagram of the main control board and the second silicone layer of a live broadcast machine according to an embodiment of the present application.

[0061] in, Figures 1 to 16 The corresponding relationship between the reference numerals and the component names is as follows:

[0062] 110 frame, 120 heat sink, 130 temperature equalizer, 140 flow guide assembly;

[0063] 111 hollow portion, 141 bracket, 142 fan, 143 cover plate assembly, 145 air inlet, 146 air outlet, 147 first dustproof net, 148 second dustproof net;

[0064] 1431 a first cover plate, 1432 a second cover plate;

[0065] 210 main control board, 220 first silicone layer, 230 metal layer, 240 second silicone layer, 250 shielding cover; 211 chip, 212 memory. DETAILED DESCRIPTION

[0066] In order to better understand the above-mentioned technical scheme, the technical scheme of the embodiments of the present application is described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical scheme of the embodiments of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present application and the technical features in the embodiments may be combined with each other.

[0067] like Figures 1 to 10 As shown, according to the first aspect of an embodiment of the present application, a heat dissipation structure is proposed, including: a frame 110, in which an electronic device is arranged; a heat sink 120, which is connected to the frame 110 and is used to contact the electronic device; a temperature equalizer 130, which is connected to the frame 110 and is located on a side of the heat sink 120 away from the electronic device; and a flow guide component 140, which is connected to a side of the frame 110 away from the heat sink 120, and is used to form an airflow to dissipate heat from the electronic device.

[0068] The heat dissipation structure provided in the embodiment of the present application includes a frame 110, a heat sink 120, a temperature equalizer 130 and a guide assembly 140. Based on this, during use, the electronic device can be connected to the frame 110, and the frame 110 plays the role of a skeleton support. When the electronic device is operating, the heat energy will be transferred to the heat sink 120 on the one hand, and then dissipated through the temperature equalizer 130. On the other hand, the guide assembly 140 can be opened, and the guide assembly 140 can introduce airflow. Part of the heat energy can be taken away by the introduction and exhaust of airflow. Based on this, the heat dissipation structure provided in the embodiment of the present application can dissipate heat for the electronic device in two ways: transferring heat energy through the heat sink 120 and dissipating heat through airflow, which can greatly improve the heat dissipation efficiency. Taking a mobile terminal that uses the heat dissipation structure provided in the embodiment of the present application as an example, even if the mobile terminal is used for a long time, the heat dissipation effect of the mobile terminal can be guaranteed, thereby ensuring the stability of the operation of the mobile terminal.

[0069] It can be understood that, through the provision of the heat sink 120 and the temperature equalizer 130, the heat sink 120 can come into contact with the electronic components that are prone to heat, and the heat energy is transferred to the heat sink 120, and then transferred to the outside of the frame 110 through the temperature equalizer 130. The provision of the temperature equalizer 130 can improve the efficiency of heat energy dissipation.

[0070] like Figures 1 to 5 As shown, in a feasible implementation manner, a hollow portion 111 is formed on the frame 110 , and the heat sink 120 covers the hollow portion 111 .

[0071] In this technical solution, a style of the frame 110 is further provided, a hollow portion 111 can be formed on the frame 110, and then the heat sink 120 covers the hollow portion 111, and the temperature equalizer 130 also covers the hollow portion 111. Based on this, the heat energy transferred to the heat sink 120 can use the hollow portion 111 to directly exchange heat with the external environment after passing through the temperature equalizer 130, which can further improve the heat dissipation efficiency.

[0072] It is understandable that, in order to ensure the heat dissipation efficiency, the temperature-averaging plate 130 covers the hollow portion 111 , and then the heat sink 120 is connected to the temperature-averaging plate 130 . Such a configuration can further improve the heat dissipation efficiency.

[0073] like Figures 1 to 5 As shown, in a feasible implementation, the heat sink 120 includes a VC heat sink 120; and the temperature balancing plate 130 includes a graphene sheet. This configuration further provides a pattern of the heat sink 120 and the temperature balancing plate 130, which can further improve the heat dissipation efficiency.

[0074] like Figures 6 to 10As shown, in a feasible embodiment, the air guide assembly 140 includes: a bracket 141, the bracket 141 is connected to the frame 110; a fan 142, the fan 142 is connected to the bracket 141; a cover assembly 143, the cover assembly 143 is connected to the bracket 141, the fan 142 is located between the cover assembly 143 and the bracket 141 to form an air duct, and the cover assembly 143 covers the electronic device.

[0075] In this technical solution, a style of a guide component 140 is further provided. The guide component 140 may include a bracket 141, a cover component 143 and a fan 142. Based on this, when the bracket 141 is connected to the frame 110, the bracket 141, the cover component 143 and the frame 110 can form an air duct, and then the fan 142 can be turned on to introduce external air into the frame 110 to dissipate heat for electronic devices. The heat energy is carried away by the airflow, which can further improve the heat dissipation efficiency.

[0076] like Figures 6 to 10 As shown, in a feasible embodiment, the air guide component 140 also includes: an air inlet 145, which is formed on the bracket 141 and is located on one side of the bracket 141; an air outlet 146, which is arranged on one side of the bracket 141; wherein the air inlet 145 and the air outlet 146 are both connected to the air duct.

[0077] In this technical solution, an air inlet 145 and an air outlet 146 may also be formed on the bracket 141. Such a configuration facilitates the airflow to enter the heat dissipation structure and at the same time facilitates the airflow to be discharged through the heat dissipation structure, which can further improve the heat dissipation effect.

[0078] In this technical solution, the air inlet 145 is arranged on one side of the bracket 141, and the air outlet 146 is arranged on one side of the bracket 141. With this arrangement, on the one hand, when the airflow enters the heat dissipation structure, it is convenient for the airflow to exchange heat with the area where the electronic devices are located at the first time, which can improve the heat exchange efficiency; on the other hand, it is convenient for the discharge of the airflow, which is beneficial to reducing the volume of the heat dissipation structure and making the heat dissipation structure more compact locally.

[0079] like Figures 6 to 10 As shown, in a feasible implementation manner, the air guide assembly 140 further includes: a first dustproof net 147 , the first dustproof net 147 covers the air inlet 145 ; and a second dustproof net 148 , the second dustproof net 148 covers the air outlet 146 .

[0080] In this technical solution, the air guide component 140 can also include a first dustproof net 147 and a second dustproof net 148 respectively covering the air inlet 145 and the air outlet 146. Such a setting can reduce the probability of dust entering the heat dissipation structure, reduce the probability of dust infecting electronic devices, and ensure the stability of the operation of electronic devices.

[0081] like Figures 6 to 10 As shown, in a feasible implementation manner, the bracket 141 is embedded in the frame 110 , and a through hole is formed in the region of the frame 110 opposite to the air outlet 146 .

[0082] In this technical solution, the bracket 141 is embedded into the frame 110, which further reduces the volume of the heat dissipation structure. Considering that for example, in order to facilitate the discharge of airflow, a through hole can be formed in the area opposite to the air outlet 146 on the frame 110 and the bracket 141.

[0083] like Figures 6 to 10 As shown, in a feasible implementation manner, the cover plate assembly 143 includes: a first cover plate 1431 , the first cover plate 1431 covers the electronic device; and a second cover plate 1432 , the second cover plate 1432 is disposed adjacent to the first cover plate 1431 .

[0084] In this technical solution, a style of a cover assembly 143 is further provided. The cover assembly 143 may include a first cover 1431 and a second cover 1432. This arrangement is based on the consideration that when the electronic device is connected to the frame 110, the electronic device will have different heights. The cover assembly 143 is formed by splicing two cover plates, which makes it easy to avoid thicker areas of the electronic device and to control the shape of the air duct, so that when the airflow enters the heat dissipation structure, it can exchange heat with the electronic device as soon as possible, thereby ensuring heat exchange efficiency.

[0085] like Figures 11 to 16 As shown, according to the second aspect of an embodiment of the present application, a live broadcast machine is proposed, comprising: a heat dissipation structure as in any of the above technical solutions.

[0086] The live broadcast machine provided in the embodiment of the present application includes a heat dissipation structure such as any of the above-mentioned technical solutions, so the live broadcast machine has all the beneficial effects of the heat dissipation structure of the above-mentioned technical solutions.

[0087] The heat dissipation structure of the live broadcast machine provided in the embodiment of the present application includes a frame 110, a heat sink 120, a temperature equalizer 130 and a guide component 140. Based on this, during use, the electronic device can be connected to the frame 110, and the frame 110 plays the role of a skeleton support. When the electronic device is operating, the heat energy will be transferred to the heat sink 120 on the one hand, and then dissipated through the temperature equalizer 130. On the other hand, the guide component 140 can be opened, and the guide component 140 can introduce airflow. Part of the heat energy can be taken away by the introduction and exhaust of airflow. Based on this, the heat dissipation structure provided in the embodiment of the present application can dissipate heat for the electronic device through two methods: transferring heat energy through the heat sink 120 and heat dissipation by airflow, which can greatly improve the heat dissipation efficiency. Taking the mobile terminal using the heat dissipation structure provided in the embodiment of the present application as an example, even if the mobile terminal is used for a long time, the heat dissipation effect of the mobile terminal can be guaranteed, thereby ensuring the stability of the operation of the mobile terminal.

[0088] The live broadcast machine provided in the embodiment of the present application includes the heat dissipation structure of the above-mentioned technical solution, so the live broadcast machine has a strong heat dissipation capacity. Therefore, the live broadcast machine will not overheat even if it works for a long time, thereby ensuring the stability of the long-term operation of the live broadcast machine and improving the user experience.

[0089] like Figures 11 to 16 As shown, in a feasible implementation, the live broadcast machine also includes: a main control board 210, the main control board 210 is connected to the frame, and the chip 211, memory 212 and storage on the main control board 210 are arranged toward the heat sink 120.

[0090] In this technical solution, the live broadcast machine can also include a main control board 210, which is used to control the devices of the live broadcast machine, such as the camera and the sound card. Further considering that the main control board 210 generates a large amount of heat and is the main source of heat generation for the live broadcast machine, and is also the main component for controlling the operation of the live broadcast machine, the chip 211, memory 212 and storage on the main control board 210 are arranged toward the heat sink 120, and the heat dissipation structure can be used to dissipate the heat for the chip 211, memory 212 (DDR) and storage (emmc) as quickly as possible, thereby ensuring the heat dissipation efficiency and at the same time ensuring the stability of the operation of the live broadcast machine.

[0091] like Figures 11 to 16 As shown, in a feasible embodiment, the live broadcast machine includes: a first silicone layer 220, the first silicone layer 220 covers the chip 211, the memory 212 and the storage; a metal layer 230, the metal layer 230 is connected to the first silicone layer 220; a second silicone layer 240, the second silicone layer 240 is connected to the metal layer 230 and the heat sink 120.

[0092] In this technical solution, the live broadcast machine may also include a first silicone layer 220 and a metal layer 230. The first silicone layer 220 covers the chip 211, the memory 212 and the storage device, and then the metal layer 230 is connected to the first silicone layer 220. Based on this, the heat energy of the chip 211, the memory 212 and the storage device can be transferred to the metal layer 230 through the first silicone layer 220, and then the metal layer 230 can transfer the heat energy to the heat sink 120.

[0093] Furthermore, in order to improve the heat dissipation efficiency, a second silicone layer 240 may be included. The second silicone layer 240 is connected to the heat sink 120 and the metal layer 230, increasing the contact area with the metal layer 230 and the heat sink 120, which can further improve the heat dissipation efficiency.

[0094] It can be understood that the first silicone layer 220 and the second silicone layer 240 are both made of thermally conductive silicone material.

[0095] like Figures 11 to 16 As shown, in a feasible implementation, the live broadcast machine also includes: a shielding cover 250, the shielding cover 250 covers at least a portion of the main control board 210, and at least a portion of the shielding cover 250 is in the air duct of the guide assembly 140.

[0096] In this technical solution, the live broadcast machine may further include a shielding cover 250. The shielding cover 250 can be provided to protect the functional components of the mainboard, thereby ensuring the stability of the operation of the functional components on the main control board 210.

[0097] In this technical solution, at least part of the shielding cover 250 is located in the air duct of the air guide component 140, that is, the shielding cover 250, the cover plate component 143 and the frame can be together enclosed to form a closed air duct. When the fan 142 of the air guide component 140 is turned on, the external airflow will enter the air duct and come into contact with the shielding cover 250. Based on this, the heat energy on the main control board 210 is transferred to the shielding cover 250, and then the shielding cover 250 comes into contact with the airflow. The airflow can take away the heat energy generated by the main control board 210, which can further improve the heat dissipation efficiency of the main control board 210, and at the same time reduce the probability of dust in the external airflow invading the functional components on the main control board 210, thereby ensuring the stability of the operation of the main control board 210.

[0098] like Figures 1 to 16 As shown, according to the third aspect of the embodiment of the present application, an audio and video device is proposed, including a heat dissipation structure as in any of the above technical solutions.

[0099] The audio and video device provided in the embodiment of the present application includes a heat dissipation structure such as any of the above technical solutions, so the audio and video device has all the beneficial effects of the heat dissipation structure of the above technical solutions.

[0100] The heat dissipation structure of the audio and video equipment provided in the embodiment of the present application includes a frame 110, a heat sink 120, a temperature equalizer 130 and a guide component 140. Based on this, during use, the electronic device can be connected to the frame 110, and the frame 110 plays the role of a skeleton support. When the electronic device is operating, the heat energy will be transferred to the heat sink 120 on the one hand, and then dissipated through the temperature equalizer 130. On the other hand, the guide component 140 can be opened, and the guide component 140 can introduce airflow. Part of the heat energy can be taken away by the introduction and exhaust of airflow. Based on this, the heat dissipation structure provided in the embodiment of the present application can dissipate heat for the electronic device in two ways: transferring heat energy through the heat sink 120 and dissipating heat through airflow, which can greatly improve the heat dissipation efficiency. Taking a mobile terminal that uses the heat dissipation structure provided in the embodiment of the present application as an example, even if the mobile terminal is used for a long time, the heat dissipation effect of the mobile terminal can be guaranteed, thereby ensuring the stability of the operation of the mobile terminal.

[0101] The audio and video equipment provided in the embodiment of the present application includes the heat dissipation structure of the above-mentioned technical solution, so the live broadcast machine has a strong heat dissipation capability. Therefore, the audio and video equipment will not overheat even if it works for a long time, thereby ensuring the stability of the long-term operation of the audio and video equipment and improving the user experience.

[0102] In some examples, the audio and video device includes an audio and video acquisition module, and the audio and video acquisition module abuts against the heat sink 120 .

[0103] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0104] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0105] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0106] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: A frame, wherein electronic components are arranged in the frame; A heat sink, the heat sink is connected to the frame and is used to contact the electronic device; A temperature balancing plate, the temperature balancing plate is connected to the frame and is located on a side of the heat sink away from the electronic device; A flow guide component is connected to a side of the frame away from the heat sink and is used to form an airflow to dissipate heat for the electronic device.

2. The heat dissipation structure according to claim 1, characterized in that: A hollow portion is formed on the frame, and the heat sink covers the hollow portion.

3. The heat dissipation structure according to claim 1, characterized in that: The heat sink comprises a VC heat sink; The temperature-balancing sheet includes a graphene sheet.

4. The heat dissipation structure according to claim 1, characterized in that: The flow guide assembly comprises: A bracket, the bracket being connected to the frame; A fan, the fan being connected to the bracket; The cover plate assembly is connected to the bracket, and the fan is located between the cover plate assembly and the bracket to form an air duct.

5. The heat dissipation structure according to claim 4, characterized in that: The flow guide assembly also includes: An air inlet, the air inlet is formed on the bracket and is located on one side of the bracket; An air outlet, the air outlet being arranged on one side of the bracket; Wherein, the air inlet and the air outlet are both connected to the air duct.

6. The heat dissipation structure according to claim 5, characterized in that: The flow guide assembly also includes: a first dustproof net, wherein the first dustproof net covers the air inlet; A second dustproof net is provided, wherein the second dustproof net covers the air outlet.

7. The heat dissipation structure according to claim 5, characterized in that: The bracket is embedded in the frame, and a through hole is formed in a region of the frame opposite to the air outlet.

8. The heat dissipation structure according to claim 4, characterized in that: The cover plate assembly comprises: a first cover plate, wherein the first cover plate covers the electronic device; A second cover plate is disposed adjacent to the first cover plate.

9. A live broadcast machine, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 8.

10. An audio and video device, characterized in that: It comprises the heat dissipation structure as claimed in any one of claims 1 to 8.

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