Wire drawing die with multiple coatings

Abstract

The utility model belongs to the technical field of wire-drawing dies, and particularly relates to a wire-drawing die with multiple coatings, which comprises a support, a placing groove is arranged in the center of the support, threaded grooves penetrating through the placing groove are arranged on the front side and the rear side of the support, and connecting grooves communicated with the placing groove are arranged on the left side and the right side of the support. The mold part is connected to the support and used for drawing and reducing the diameter of a wire rod, the heat conduction part is arranged in the connecting groove and used for guiding out heat generated by mold working, the mold part comprises a sizing mold connected into the threaded groove and a coating mold arranged in the containing groove, the outer side of the sizing mold is provided with an external thread matched with the threaded groove in a threaded mode, and the outer side of the coating mold is provided with an external thread matched with the threaded groove in a threaded mode. And the coating mold is placed in the placing groove through clamping fit of the clamping buckle and the embedding groove, so that the coating mold is convenient to disassemble, assemble and replace, and then the variable-diameter wire drawing device is suitable for variable-diameter wire drawing of workpieces with different sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of wire drawing dies, in particular to a wire drawing die with a multi-layer coating. Background Art

[0002] A wire drawing die is a tool that forces metal to pass through the die under external force during metal pressure processing, compresses the metal cross-sectional area and obtains the required cross-sectional area shape and size. A gradient wire drawing die is a tool that has a variable size of the inner hole of the die.

[0003] When the die is in use, a large amount of heat will be generated due to the large friction and vibration during the wire drawing process. If the die temperature is too high during long-term operation, the processing quality and die life will be affected. Therefore, the wire drawing die is a very easy-to-wear die with a high replacement frequency. For this reason, a wire drawing die with a multi-layer coating is provided, which can be easily replaced and can export the heat generated by the die. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] Therefore, the purpose of the utility model is to provide a wire drawing die with a multi-layer coating, and a screw-fit connection method, which is convenient for replacing the sizing die, and then the coating die is placed in the placement groove through the snap-fit ​​and slot-fitting combination, which is convenient for disassembly, assembly and replacement of the coating die, and thus suitable for variable diameter drawing of workpieces of different sizes.

[0006] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0007] A wire drawing die with a multi-layer coating, comprising:

[0008] As a bracket connected to the base frame, a placement groove is opened in the central position of the bracket, and thread grooves penetrating the placement groove are opened on the front and rear sides of the bracket, and connecting grooves connected to the placement groove are opened on the left and right sides of the bracket;

[0009] The die component is connected to the bracket to reduce the diameter of the wire rod by drawing;

[0010] The heat-conducting component is placed in the connecting groove to conduct away the heat generated by the working of the mold.

[0011] As a preferred solution of a wire drawing die with a multi-layer coating described in the utility model, the die component includes a sizing die connected to the thread groove, and a coating die placed in the placement groove, and the outer side of the sizing die is provided with an external thread that is threaded with the thread groove.

[0012] As a preferred solution of a wire drawing die with a multi-layer coating described in the utility model, the heat-conducting component includes a connecting frame clamped in a connecting groove, and a plurality of groups of heat-conducting fins are linearly and equidistantly connected on the outer side of the connecting frame, and the outer side of the heat-conducting fins is arranged in contact with the coating die.

[0013] As a preferred solution of a wire drawing die with a multi-layer coating described in the utility model, wherein: the outer side of the sizing die is integrally connected with a handle, the top of the coating die is integrally connected with multiple sets of buckles, and the placement groove is connected with an embedding groove that fits with the buckle.

[0014] As a preferred solution of a wire drawing die with a multi-layer coating described in the utility model, wherein: the outer side of the bracket is connected to a cooling component, the cooling component includes a cold water tank connected to the outer side of the bracket, a circulating pump is connected to the cold water tank, the output port of the circulating pump is connected to a curved water cooling pipe, the curved water cooling pipe is passed through the inner side of the heat-conducting fin, and the end of the curved water cooling pipe is connected to the cold water tank.

[0015] As a preferred solution of the wire drawing die with multi-layer coating described in the utility model, in order to prevent the temperature of the coolant in the cold water tank from rising, multiple groups of semiconductor refrigeration plates are connected to the outside of the cold water tank.

[0016] As a preferred solution of a wire drawing die with a multi-layer coating described in the utility model, multiple groups of semiconductor refrigeration plates are arranged equidistantly in a rectangular shape along the outside of the cold water tank, and the cooling end of the semiconductor refrigeration plate is arranged corresponding to the inside of the cold water tank.

[0017] As a preferred solution of the wire drawing die with multi-layer coating described in the utility model, wherein: a through hole connected to the placement groove is opened at the bottom of the bracket, and a ventilation fan is installed in the through hole.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] 1. The screw-fit connection method is convenient for replacing the sizing die. The coating die is placed in the placement groove through the buckle and the embedded groove, which is convenient for disassembly and replacement of the coating die, and thus suitable for diameter-changing wire drawing of workpieces of different sizes;

[0020] 2. During the wire drawing process, the outer side of the heat conducting fin is in contact with the coating die, and the heat generated by the coating die is conducted out through the heat conducting fin to prevent high temperature accumulation from affecting the use of the die;

[0021] 3. The circulating pump transports the coolant to the curved water cooling tube, and the curved water cooling tube exchanges heat with the heat conducting fins to reduce the temperature of the heat conducting fins, thereby improving the heat conducting efficiency of the heat conducting fins and preventing the temperature of the heat conducting fins from rising and affecting the heat conducting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0023] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0024] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of part A of the utility model;

[0026] Figure 4 It is a partial structural schematic diagram of the utility model.

[0027] In the figure: 100 bracket, 110 placement groove, 111 embedding groove, 120 thread groove, 130 connection groove, 200 mold component, 210 sizing mold, 211 external thread, 212 handle, 220 coating mold, 221 buckle, 300 heat conduction component, 310 connecting frame, 320 heat conduction fin, 330 ventilation fan, 400 cooling component, 410 cold water tank, 411 semiconductor refrigeration sheet, 420 circulation pump, 421 curved water cooling pipe. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0030] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0031] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] The utility model provides a wire drawing die with a multi-layer coating, please refer to Figure 1-4 , including a bracket 100, a mold component 200 and a heat conducting component 300;

[0033] Please continue reading Figure 1 , Figure 3 and Figure 4 A bracket 100 is used as a connection to the base frame. A placement groove 110 is provided at the center of the bracket 100. A thread groove 120 penetrating the placement groove 110 is provided at the front and rear sides of the bracket 100. A connection groove 130 connected to the placement groove 110 is provided at the left and right sides of the bracket 100.

[0034] Please continue reading Figure 1-3 , the mold component 200 is connected to the bracket 100 to reduce the diameter of the wire rod by drawing;

[0035] The mold component 200 includes a sizing mold 210 connected to the thread groove 120, and a coating mold 220 placed in the placement groove 110. The sizing mold 210 and the coating mold 220 are arranged correspondingly. The outer side of the sizing mold 210 is provided with an external thread 211 that is screwed with the thread groove 120. The screw-fitting connection mode is convenient for replacing the sizing mold 210, and the top of the coating mold 220 is integrally connected with a plurality of groups of buckles 221. The placement groove 110 is connected with an embedded groove 111 that is snap-fitted with the buckle 221. The buckle 221 is snap-fitted with the embedded groove 111. The coating mold 220 is placed in the placement groove 110, which is convenient for disassembling and replacing the coating mold 220. The outer side of the sizing mold 210 is integrally connected with a handle 212.

[0036] Please continue reading Figure 2 and Figure 4 , the heat-conducting component 300 is placed in the connecting groove 130 to conduct away the heat generated by the working of the mold;

[0037] The heat-conducting component 300 includes a connecting frame 310 that is clamped in the connecting groove 130. A plurality of heat-conducting fins 320 are connected to the outer side of the connecting frame 310 in a linear and equidistant manner. The outer side of the heat-conducting fins 320 is arranged in contact with the coating mold 220. The heat generated by the coating mold 220 during operation is discharged through the arranged heat-conducting fins 320.

[0038] Please continue reading Figure 2 and Figure 4 The outside of the bracket 100 is connected to a cooling component 400, and the cooling component 400 includes a cold water tank 410 threadedly connected to the outside of the bracket 100, and a circulating pump 420 is threadedly connected in the cold water tank 410. The output port of the circulating pump 420 is connected to a curved water cooling pipe 421, and the curved water cooling pipe 421 is penetrated through the inside of the heat-conducting fin 320. The end of the curved water cooling pipe 421 is connected to the cold water tank 410. When the circulating pump 420 works, the coolant is transported to the curved water cooling pipe 421, and the curved water cooling pipe 421 exchanges heat with the heat-conducting fin 320 to reduce the temperature of the heat-conducting fin 320, thereby improving the heat conduction efficiency of the heat-conducting fin 320.

[0039] Furthermore, in order to prevent the temperature of the coolant in the cold water tank 410 from rising, multiple groups of semiconductor refrigeration plates 411 are threadedly connected to the outer side of the cold water tank 410. The multiple groups of semiconductor refrigeration plates 411 are arranged equidistantly in a rectangular shape along the outer side of the cold water tank 410, and the cooling end of the semiconductor refrigeration plate 411 is arranged corresponding to the inner side of the cold water tank 410.

[0040] Working principle: When the utility model is in use, the screw-fit connection method facilitates the replacement of the sizing die 210, and the buckle 221 is clipped into the embedded groove 111 to place the coating die 220 in the placement groove 110, which is convenient for disassembly, assembly and replacement of the coating die 220, and thus adapts to the variable diameter wire drawing of workpieces of different sizes. At the same time, during the wire drawing process, the outer side of the heat-conducting fin 320 is arranged in contact with the coating die 220, and the heat generated by the coating die 220 is discharged through the arranged heat-conducting fin 320 to prevent high temperature accumulation from affecting the use of the die.

[0041] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A wire drawing die with a multi-layer coating, characterized in that: include: A bracket (100) is used as a connection base, a placement groove (110) is provided at the center of the bracket (100), and thread grooves (120) penetrating the placement groove (110) are provided on the front and rear sides of the bracket (100), and connection grooves (130) are provided on the left and right sides of the bracket (100) and are connected to the placement groove (110); a mold component (200) is connected to the bracket (100) to reduce the diameter of the wire rod by drawing; The heat-conducting component (300) is disposed in the connecting groove (130) to conduct heat generated by the operation of the mold.

2. A wire drawing die with a multi-layer coating according to claim 1, characterized in that: The mold component (200) comprises a sizing mold (210) connected to the thread groove (120), and a coating mold (220) placed in the placement groove (110); the sizing mold (210) is provided with an external thread (211) on the outside thereof that is threadably matched with the thread groove (120).

3. A wire drawing die with a multi-layer coating according to claim 1, characterized in that: The heat-conducting component (300) comprises a connecting frame (310) mounted in a connecting groove (130), the outer side of the connecting frame (310) being linearly and equidistantly connected to a plurality of groups of heat-conducting fins (320), and the outer side of the heat-conducting fins (320) being arranged in contact with the coating mold (220).

4. A wire drawing die with a multi-layer coating according to claim 2, characterized in that: The outer side of the sizing die (210) is integrally formed with a handle (212), the top of the coating die (220) is integrally formed with a plurality of groups of buckles (221), and the placement groove (110) is connected with an embedding groove (111) that is engaged with the buckles (221).

5. The wire drawing die with a multi-layer coating according to claim 1, characterized in that: The outside of the bracket (100) is connected to a cooling component (400), the cooling component (400) comprises a cold water tank (410) connected to the outside of the bracket (100), the inside of the cold water tank (410) is connected to a circulating pump (420), the output port of the circulating pump (420) is connected to a curved water cooling pipe (421), the curved water cooling pipe (421) is passed through the inside of the heat conducting fin (320), and the end of the curved water cooling pipe (421) is connected to the cold water tank (410).

6. A wire drawing die with a multi-layer coating according to claim 5, characterized in that: In order to prevent the temperature of the coolant in the cold water tank (410) from rising, a plurality of groups of semiconductor cooling sheets (411) are connected to the outside of the cold water tank (410).

7. A wire drawing die with a multi-layer coating according to claim 6, characterized in that: A plurality of groups of the semiconductor refrigeration sheets (411) are arranged in a rectangular and equidistant manner along the outer side of the cold water tank (410), and the refrigeration ends of the semiconductor refrigeration sheets (411) are arranged corresponding to the inner side of the cold water tank (410).

8. The wire drawing die with a multi-layer coating according to claim 3, characterized in that: The bottom of the bracket (100) is provided with a through hole which is in communication with the placement groove (110), and a ventilation fan (330) is installed in the through hole.

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