Welding controller dynamic protection circuit and system

Abstract

The utility model provides a dynamic protection circuit and system for a welding controller, which relates to the technical field of electronics and comprises an MCU (Microprogrammed Control Unit) control module, an integrated processing module, a voltage attenuation module, an AD (Analog to Digital) conversion module, an IGBT (Insulated Gate Bipolar Translator) driving module, an SCR (Selective Catalytic Reduction) driving module and a switching power supply module, the MCU control module is electrically connected with the integrated processing module, the AD conversion module, the IGBT driving module and the switching power supply module, the integrated processing module is electrically connected with the IGBT driving module, the SCR driving module and the switching power supply module, the voltage attenuation module is electrically connected with the AD conversion module, the IGBT driving module is electrically connected with the switching power supply module, and the SCR driving module is electrically connected with the voltage attenuation module. The SCR driving module is electrically connected with the switching power supply module, the IGBT driving module is used for receiving a first control signal and adjusting a working voltage output to the IGBT, and the SCR driving module is used for receiving a second control signal and outputting a preset constant voltage to the SCR. According to the utility model, the working stability of the welding controller can be improved.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a welding controller dynamic protection circuit and system. Background Art

[0002] Resistance welding is a type of welding method that uses resistance heat as energy, including electroslag welding that uses slag resistance heat as energy and resistance welding that uses solid resistance heat as energy. Resistance welding is generally a welding method that places the workpiece under a certain electrode pressure and uses the resistance heat generated when the current passes through the workpiece to melt the contact surface between the two workpieces to achieve connection. A larger current is usually used. In order to prevent arcing on the contact surface and to forge the weld metal, pressure must always be applied during the welding process.

[0003] A Chinese patent application with publication number CN204595477U discloses an automatic laser welding controller for small brackets. Manual welding of small brackets for automobiles is time-consuming and labor-intensive, and it is difficult to ensure the welding quality. The utility model includes a power module, a processor module, a display module and an execution module; the power module stabilizes the input voltage into voltage VCC2, voltage VCC and voltage VCC1, and supplies power to the processor module, the display module and the execution module respectively; the processor module outputs control instructions to the execution module, and the execution module controls the speed and stroke of the laser welding of the bracket; the display module displays the speed and stroke parameters of the laser welding of the bracket. However, the above scheme cannot accurately control the voltage of the IGBT and SCR, which can easily cause overvoltage damage to the connected load device. Therefore, it is very necessary to provide a dynamic protection circuit and system for a welding controller to improve the precise control of the input IGBT and SCR voltages, thereby improving the working stability of the welding controller. Utility Model Content

[0004] In view of this, the utility model proposes a dynamic protection circuit and system for a welding controller. By setting an MCU control module, an integrated processing module, an IGBT drive module and an SCR drive module, when the output voltages of the IGBT drive module and the SCR drive module are unbalanced, the MCU control module and the integrated processing module control the IGBT drive module and the SCR drive module to adjust the corresponding output voltages to improve the precise control of the input IGBT and SCR voltages, thereby improving the working stability of the welding controller.

[0005] In the first aspect, the utility model provides a welding controller dynamic protection circuit, including an MCU control module, an integrated processing module, a voltage attenuation module, an AD conversion module, an IGBT drive module, an SCR drive module and a switch power supply module, wherein:

[0006] The MCU control module is electrically connected to the integrated processing module, the AD conversion module, the IGBT drive module and the switch power module respectively; the integrated processing module is electrically connected to the IGBT drive module, the SCR drive module and the switch power module; the voltage attenuation module is electrically connected to the AD conversion module; the IGBT drive module is electrically connected to the switch power module; and the SCR drive module is electrically connected to the switch power module;

[0007] The integrated processing module is used to receive the modulation signal sent by the MCU control module and send a first control signal and a second control signal to the SCR drive module and the IGBT drive module respectively; the IGBT drive module is used to receive the first control signal and adjust the operating voltage output to the IGBT; the SCR drive module is used to receive the second control signal and output a preset constant voltage to the SCR.

[0008] On the basis of the above technical solution, preferably, the IGBT drive module includes an optocoupler drive unit, a voltage conversion unit and a voltage regulation unit, the optocoupler drive unit is respectively connected to the MCU control module, the integrated processing module, the switching power supply module, the voltage conversion unit and the voltage regulation unit, and the voltage conversion unit is respectively connected to the switching power supply module and the voltage regulation unit.

[0009] On the basis of the above technical solution, preferably, the optocoupler drive unit includes an optocoupler drive chip, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first diode, a second diode, a first resistor and a first MOS tube, the first pin and the fourth pin of the optocoupler drive chip are connected to the MCU control module, the second pin and the third pin of the optocoupler drive chip are connected to the integrated processing module, the fifth pin, the sixth pin, the seventh pin and the eighth pin of the optocoupler drive chip are commonly connected to the voltage conversion unit, one end of the first capacitor and one end of the second capacitor, the ninth pin of the optocoupler drive chip is respectively connected to the cathode of the first diode, the cathode of the first diode, the cathode of the second diode and the cathode of the third diode. The cathode of the second diode, the drain of the first MOS tube and the voltage regulating unit are connected, the ninth pin of the optocoupler driver chip is respectively connected to the other end of the first capacitor, the other end of the second capacitor, the anode of the first diode, the anode of the second diode and the EMTR end, the eleventh pin of the optocoupler driver chip is respectively connected to one end of the third capacitor and the voltage regulating unit, the other end of the third capacitor is respectively connected to one end of the fourth capacitor, one end of the first resistor and the gate of the first MOS tube, and the other end of the fourth capacitor is respectively connected to the other end of the first resistor, the source of the first MOS tube and the EMTR end.

[0010] Further preferably, the voltage conversion unit includes a voltage conversion chip, a fifth capacitor, a sixth capacitor, a second resistor, a third diode and a fourth diode, the first pin of the voltage conversion chip is connected to the switching power supply module, the first pin of the voltage conversion chip is grounded, the third pin of the voltage conversion chip is respectively connected to one end of the sixth capacitor, the positive electrode of the fourth diode, the optocoupler drive unit and the voltage regulating unit, the fourth pin of the voltage conversion chip is connected to the common end of the fifth capacitor and the sixth capacitor, the fifth pin of the voltage conversion chip is respectively connected to the other end of the fifth capacitor, one end of the second resistor, the negative electrode of the third diode, the optocoupler drive unit and the voltage regulating unit, and the common end of the second resistor and the fourth diode is respectively connected to the positive electrode and the EMTR end of the third diode.

[0011] Further preferably, the voltage regulating unit includes a first transistor, a second transistor, a third resistor, a fourth resistor, a fifth diode and a first terminal, the first ends of the first terminals are respectively connected to the optocoupler driving units, the second ends of the first terminals are respectively connected to one end of the fifth diode, the common end of the third resistor and the fourth resistor, and the common end of the first transistor and the second transistor, the third end of the first terminal is respectively connected to the other end of the fifth diode and the EMTR end, the collectors of the first transistor and the second transistor are both connected to the voltage conversion unit, and the bases of the first transistor and the second transistor are commonly connected to the optocoupler driving unit.

[0012] Further preferably, the SCR driving module includes a signal isolation unit, a signal coupling unit, a power isolation unit and a load driving unit, the signal isolation unit is respectively connected to the signal coupling unit, the power isolation unit, the integrated processing module and the switching power supply module, the signal coupling unit is respectively connected to the power isolation unit, the switching power supply module and the integrated processing module, the power isolation unit is connected to the switching power supply module, and the load driving unit is connected to the power isolation unit.

[0013] Further preferably, the signal isolation unit includes a signal isolation chip, a sixth resistor, a seventh resistor, an eighth resistor, a seventh capacitor and an eighth capacitor, the first pin of the signal isolation chip is respectively connected to the common end of the sixth resistor, the seventh resistor and the eighth resistor, the switching power supply module and one end of the seventh capacitor, the second pin of the signal isolation chip is respectively connected to the other end of the eighth resistor and the integrated processing module, the third pin of the signal isolation chip is respectively connected to the other end of the seventh resistor and the integrated processing module, the fourth pin of the signal isolation chip is respectively connected to the other end of the sixth resistor and the integrated processing module, the fifth pin of the signal isolation chip is respectively connected to the other end of the seventh capacitor and the GND end, the sixth pin of the signal isolation chip is respectively connected to one end of the eighth capacitor and the GND end, the seventh pin, the eighth pin and the ninth pin of the signal isolation chip are all connected to the load driving unit, and the tenth pin of the signal isolation chip is respectively connected to the other end of the eighth capacitor and the switching power supply module.

[0014] Further preferably, the signal coupling unit includes a photocoupler and a second MOS tube, a first end of the photocoupler is connected to the switching power supply module, a second end of the photocoupler is connected to the drain of the second MOS tube, the source of the second MOS tube is grounded, a gate of the second MOS tube is connected to the integrated processing module, a third end of the photocoupler is respectively connected to the signal isolation unit and the GND end, and a fourth end of the photocoupler is connected to the power isolation unit.

[0015] Further preferably, the power isolation unit includes a power isolation chip, a ninth capacitor, a tenth capacitor and a tenth resistor, the first pin of the power isolation chip is respectively connected to the switching power supply module and one end of the ninth capacitor, the second pin of the power isolation chip is respectively connected to the other end of the ninth capacitor and the GND end, the third pin of the power isolation chip and the first common end of the tenth capacitor and the tenth resistor are commonly grounded, and the fourth pin of the power isolation chip and the second common end of the tenth capacitor and the tenth resistor are commonly connected to the signal isolation unit, the signal coupling unit and the load driving unit.

[0016] In a second aspect, the present application provides a welding controller dynamic protection system, which includes a welding controller dynamic protection circuit as described in any one of the first aspects.

[0017] The welding controller dynamic protection circuit and system provided by the utility model have the following beneficial effects compared with the prior art:

[0018] (1) By setting an MCU control module, an integrated processing module, an IGBT driving module and an SCR driving module, when the output voltages of the IGBT driving module and the SCR driving module are unbalanced, the MCU control module and the integrated processing module control the IGBT driving module and the SCR driving module to adjust the corresponding output voltages to improve the precise control of the input IGBT and SCR voltages, thereby improving the working stability of the welding controller;

[0019] (2) Transistors Q601 and Q602 are set in the voltage regulation unit to control the voltage range of the IGBT driver module to ensure that the voltage of the gate control signal output by the IGBT driver module is controlled between +15V and -10V. At the same time, a transient voltage suppression diode TZ1 is set to ensure that when the output voltage exceeds 18V, the input voltage is conducted to the ground to protect the IGBT. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the framework of the dynamic protection circuit of the welding controller provided by the utility model;

[0022] Figure 2 The original circuit diagram of the MCU control module provided by the utility model;

[0023] Figure 3 The original circuit diagram of the integrated processing module provided by the utility model;

[0024] Figure 4 The original circuit diagram of the voltage attenuation module provided by the utility model;

[0025] Figure 5 The original circuit diagram of the AD conversion module provided by the utility model;

[0026] Figure 6 The original circuit diagram of the IGBT drive module provided by the utility model;

[0027] Figure 7 The original circuit diagram of the SCR drive module provided by the utility model;

[0028] Figure 8 The original circuit diagram of the signal isolation unit, signal coupling unit and power isolation unit provided by the utility model;

[0029] Fig. 9 The original circuit diagram of the power isolation unit provided by the utility model;

[0030] Fig.10 This is the original circuit diagram of the switching power supply module provided by the utility model.

[0031] Explanation of the accompanying drawings: 1. MCU control module; 2. Integrated processing module; 3. Voltage attenuation module; 4. AD conversion module; 5. IGBT drive module; 51. Optocoupler drive unit; 52. Voltage conversion unit; 53. Voltage regulation unit; 6. SCR drive module; 61. Signal isolation unit; 62. Signal coupling unit; 63. Power isolation unit; 64. Load drive unit; 7. Switching power supply module. DETAILED DESCRIPTION

[0032] The following will be combined with the implementation of the utility model to clearly and completely describe the technical solutions in the implementation of the utility model. Obviously, the described implementation is only a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] The utility model discloses a welding controller dynamic protection circuit, referring to Figure 1 The welding controller dynamic protection circuit includes an MCU control module 1, an integrated processing module 2, a voltage attenuation module 3, an AD conversion module 4, an IGBT drive module 5, an SCR drive module 6 and a switch power supply module 7, wherein:

[0034] The MCU control module 1 is electrically connected to the integrated processing module 2 , the AD conversion module 4 , the IGBT driving module 5 and the switch power supply module 7 respectively. The MCU control module 1 is used to send a modulation signal to the integrated processing module 2 . Figure 2 1 is a circuit schematic diagram of the MCU control module 1, and the MCU control module 1 can select a digital signal controller of model DSP56F827.

[0035] The integrated processing module 2 is electrically connected to the IGBT driving module 5, the SCR driving module 6 and the switching power supply module 7. The integrated processing module 2 is used to receive the modulation signal and send the first control signal and the second control signal to the SCR driving module 6 and the IGBT driving module 5 respectively. Figure 3 This is the circuit principle intention of the integrated processing module 2, and the integrated processing module 2 can use a programming logic chip with model number XC9572XL10.

[0036] In this embodiment, the voltage attenuation module 3 is electrically connected to the AD conversion module 4. Figure 4 is a circuit schematic diagram of the voltage attenuation module 3, wherein the voltage attenuation module 3 includes three line voltage attenuators and one DC bus voltage attenuator. Figure 5 : is the circuit schematic diagram of the AD conversion module 4. The AD conversion module 4 can select the LTC1863 analog-to-digital converter of model.

[0037] The IGBT driving module 5 is electrically connected to the switch power module 7 . The IGBT driving module 5 is used to receive the first control signal and adjust the operating voltage output to the IGBT.

[0038] In this embodiment, the IGBT driving module 5 includes an optocoupler driving unit 51, a voltage conversion unit 52 and a voltage regulating unit 53. The optocoupler driving unit 51 is respectively connected to the MCU control module 1, the integrated processing module 2, the switching power supply module 7, the voltage conversion unit 52 and the voltage regulating unit 53. The voltage conversion unit 52 is respectively connected to the switching power supply module 7 and the voltage regulating unit 53.

[0039] The optocoupler driving unit 51 includes an optocoupler driving chip, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first diode, a second diode, a first resistor and a first MOS tube. The first pin and the fourth pin of the optocoupler driving chip are connected to the MCU control module 1, the second pin and the third pin of the optocoupler driving chip are connected to the integrated processing module 2, the fifth pin, the sixth pin, the seventh pin and the eighth pin of the optocoupler driving chip are commonly connected to the voltage conversion unit 52, one end of the first capacitor and one end of the second capacitor, the ninth pin of the optocoupler driving chip is respectively connected to the cathode of the first diode, the cathode of the second diode, the drain of the first MOS tube and the voltage regulating unit 53, the ninth pin of the optocoupler driving chip is respectively connected to the other end of the first capacitor, the other end of the second capacitor, the anode of the first diode, the anode of the second diode and the EMTR end, the eleventh pin of the optocoupler driving chip is respectively connected to one end of the third capacitor and the voltage regulating unit 53, the other end of the third capacitor is respectively connected to one end of the fourth capacitor, one end of the first resistor and the gate of the first MOS tube, and the other end of the fourth capacitor is respectively connected to the other end of the first resistor, the source of the first MOS tube and the EMTR end.

[0040] The voltage conversion unit 52 includes a voltage conversion chip, a fifth capacitor, a sixth capacitor, a second resistor, a third diode and a fourth diode. The first pin of the voltage conversion chip is connected to the switching power supply module 7, the first pin of the voltage conversion chip is grounded, the third pin of the voltage conversion chip is respectively connected to one end of the sixth capacitor, the positive electrode of the fourth diode, the optocoupler drive unit 51 and the voltage regulating unit 53, the fourth pin of the voltage conversion chip is connected to the common end of the fifth capacitor and the sixth capacitor, the fifth pin of the voltage conversion chip is respectively connected to the other end of the fifth capacitor, one end of the second resistor, the negative electrode of the third diode, the optocoupler drive unit 51 and the voltage regulating unit 53, and the common end of the second resistor and the fourth diode is respectively connected to the positive electrode and the EMTR end of the third diode.

[0041] The voltage regulating unit 53 includes a first transistor, a second transistor, a third resistor, a fourth resistor, a fifth diode and a first terminal. The first ends of the first terminals are respectively connected to the optocoupler driving unit 51, the second ends of the first terminals are respectively connected to one end of the fifth diode, the common end of the third resistor and the fourth resistor, and the common end of the first transistor and the second transistor, the third end of the first terminal is respectively connected to the other end of the fifth diode and the EMTR end, the collectors of the first transistor and the second transistor are both connected to the voltage conversion unit 52, and the base of the first transistor and the base of the second transistor are commonly connected to the optocoupler driving unit 51.

[0042] For example, see Figure 6 , the specific circuit structure of the IGBT driving module 5 is described in detail below.

[0043] In a possible example, the IGBT driving module 5 includes a resistor R601, a resistor R602, a resistor R603, a resistor R604, a resistor R605, a resistor R606, a resistor R607, a resistor R608, a resistor R609, a resistor R610, a resistor R611, a resistor R650, a resistor R651, a resistor R652, a capacitor C604, a capacitor C610, a capacitor C611, a capacitor C612, a capacitor C613, a capacitor C614, a capacitor C615, a capacitor C616, a capacitor C617, a capacitor C618, a capacitor C619, a capacitor C620, and a capacitor C621. Capacitor C621, capacitor C622, capacitor C623, capacitor C625, capacitor C626, capacitor C627, capacitor C628, capacitor C629, capacitor C651, capacitor C652, capacitor C653, capacitor C654, capacitor C655, transient voltage suppression diode TZ1, diode D601, Zener diode D603, Zener diode D604, Zener diode D651, Zener diode D652, transistor Q601, transistor Q602, MOS tube Q650, optocoupler driver chip U601, voltage conversion chip U602 and terminal J21.

[0044] Among them, the optocoupler driver chip U601 corresponds to the optocoupler driver chip, the capacitor C626 corresponds to the first capacitor, the capacitor C627 corresponds to the second capacitor, the capacitor C651 corresponds to the third capacitor, the capacitor C653 corresponds to the fourth capacitor, the Zener diode D652 corresponds to the first diode, the Zener diode D651 corresponds to the second diode, the resistor R650 corresponds to the first resistor, the MOS tube Q650 corresponds to the first MOS tube, the voltage conversion chip U602 corresponds to the voltage conversion chip, the capacitor C613 corresponds to the fifth capacitor, the capacitor C621 corresponds to the sixth capacitor, the resistor R611 corresponds to the second resistor, the Zener diode D603 corresponds to the third diode, the Zener diode D604 corresponds to the fourth diode, the transistor Q601 corresponds to the first transistor, the transistor Q602 corresponds to the second transistor, the resistor R606 corresponds to the third resistor, the resistor R609 corresponds to the fourth resistor, the transient voltage suppression diode TZ1 corresponds to the fifth diode, and the terminal JP21 corresponds to the first terminal.

[0045] The VIN+ pin of the optocoupler driver chip U601 is connected to the MCU control module 1 and one end of the resistor R604 respectively, and the VIN- pin of the optocoupler driver chip U601 is connected to the integrated processing module 2 and one end of the resistor R603 respectively. The pins are connected to the integrated processing module 2 and one end of the resistor R602 respectively, and the optocoupler driver chip U601 The pins are respectively connected to the MCU control module 1 and one end of the resistor R601, the resistor R601, the resistor R602, the resistor R603, the VCC pin of the optocoupler driver chip U601, the capacitor C625 and the common end of the capacitor C610 are respectively connected to the switching power supply module 7 and one end of the capacitor C604, the other end of the resistor R604 is respectively connected to the capacitor C655, the capacitor C625 and the common end of the capacitor C610, the VLED1- pin of the optocoupler driver chip U601 and the GND end, the other end of the resistor R601 is connected to the other end of the capacitor C655, the VLED1+ pin of the optocoupler driver chip U601 is connected to the air, and the VEE pin of the optocoupler driver chip U601 is respectively connected to the voltage conversion unit The optocoupler driver chip U601 is connected to the common end of capacitor C651, one end of capacitor C652 and one end of capacitor C629 and resistor R607, the VC pin of the optocoupler driver chip U601 is connected to the VCC2 pin of the optocoupler driver chip U601, the other end of capacitor C628, voltage conversion unit 52 and capacitor C626, the DESAT pin of the optocoupler driver chip U601 is connected to the common end of capacitor C611, Zener diode D652 and Zener diode D651, resistor R651 and the drain of MOS tube Q650, the DESA pin of the optocoupler driver chip U601 is connected to the common end of capacitor C651, one end of capacitor C652 and capacitor C629 and resistor R607, the VC pin of the optocoupler driver chip U601 is connected to the VCC2 pin of the optocoupler driver chip U601, the other end of capacitor C628, voltage conversion unit 52 and capacitor C626, the DESAT pin of the optocoupler driver chip U601 is connected to the common end of capacitor C611, Zener diode D652 and Zener diode D651, resistor R651 and the drain of MOS tube Q650, the DESA pin of the optocoupler driver chip U601 is connected to the common end of capacitor C651, resistor R651 and the drain of MOS tube Q650, the DESA pin of the optocoupler driver chip U601 is connected to the common end of capacitor C651, one end of capacitor C652 and capacitor C629 and resistor R607, the VC pin of the optocoupler driver chip U601 is connected to the VCC2 pin of the optocoupler driver chip U601, the other end of capacitor C628, voltage conversion unit 52 and capacitor C626, the DESAT pin of the optocoupler The T pins are connected to VLED2+ respectively, the VE pin of the optocoupler driver chip U601 is connected to the common end of capacitor C626, capacitor C627, capacitor C611, voltage regulator diode D652 and voltage regulator diode D651 and the EMTR1 end respectively, the common end of capacitor C651 and capacitor C653, the common end of capacitor C652 and capacitor C654 and one end of resistor R650 are connected to the gate of MOS tube Q650, the common end of capacitor C653 and capacitor C654, the other end of resistor R650 and the source of MOS tube Q650 are connected to the EMTR1 end, and the other end of resistor R651 is connected to the sixth pin of terminal J21 through resistor R652 and diode D601 in sequence. The third pin, the fourth pin and the fifth pin of the terminal J21 are all connected to empty, the second pin of the terminal J21 is respectively connected to one end of the transient voltage suppression diode TZ1, one end of the resistor R610, the common end of the resistor R606 and the resistor R609, and the common end of the resistor R605 and the resistor R608, the first pin of the terminal J21 is respectively connected to the other end of the transient voltage suppression diode TZ1, the other end of the resistor R610 and the EMTR1 end, the common end of the resistor R605 and the resistor R606 is connected to the emitter of the transistor Q601, the common end of the resistor R608 and the resistor R609 is connected to the emitter of the transistor Q602, and the collector of the transistor Q601 is connected to the voltage conversion unit 52,The collector of transistor Q602 is connected to the common end of capacitor C629 and capacitor C612 and voltage conversion unit 52 respectively, and the base of transistor Q601 and the base of transistor Q602 are connected to the common end of resistor R607 and capacitor C612.

[0046] The Vin+ pin of the voltage conversion chip U602 is respectively connected to one end of the capacitor C618 and the switching power supply module 7, the Vin- pin of the voltage conversion chip U602 is respectively connected to the other end of the capacitor C618 and the GND end, the Vout- pin of the voltage conversion chip U602 is respectively connected to the common end of the capacitor C621, the capacitor C622, the capacitor C623, the voltage zener diode D604, the capacitor C619 and the capacitor C620, the optocoupler driving unit 51 and the voltage regulating unit 53, the COM pin of the voltage conversion chip U602 is connected to the common end of the capacitor C621 and the capacitor C613, and the voltage conversion The Vout+ pin of chip U602 is respectively connected to the common end of capacitor C613, capacitor C614, capacitor C615, resistor R611, capacitor C616, capacitor C617 and the Zener diode D603, the optocoupler driving unit 51 and the voltage regulating unit 53; the common end of capacitor C614 and capacitor C622, the common end of capacitor C615 and capacitor C623, the common end of resistor R611 and Zener diode D604, the common end of capacitor C616 and capacitor C619, the common end of capacitor C617 and capacitor C620 and the positive electrode of Zener diode D604 are connected to the EMTR1 end.

[0047] In one example, the optocoupler driver chip U601 is a 2.0A gate drive optocoupler, integrated with (VCE) desaturation detection and fault status feedback chip. Pins 1 and 2 of the optocoupler driver chip U601 send control signals through the MCU control module 1, and are given an initial state through pull-up and pull-down resistors. IGBTFIRE1 is pulled down to ground through a 10K resistor R604, and the IGBTFEN signal is pulled up to +5V through a 10K resistor R603. The reset signal IGBTFRSN is pulled up to +5V through a 10K resistor R602, and the alarm signal IFAULTN1 is pulled up to +5V through a 10K resistor R601. Capacitors are arranged around the chip for filtering. Pin 14 of the optocoupler driver chip U601 outputs a CLTR signal, and a series resistor and diode are connected to ensure that this signal is unidirectionally turned on and the current size is controlled. Pin 11 of the optocoupler driver chip U601 is used to control the GATE signal. The conditioning circuit is designed to act as an amplifier to obtain the required driving voltage, to increase the output current capability, and finally to isolate the power circuit from the control circuit. Transistors Q601 and Q602 perform voltage range control to ensure that the voltage of the gate control signal is between +15V and -10V. At the same time, a transient voltage suppression diode TZ1 is set to ensure that when the voltage exceeds 18V, the input voltage is conducted to the ground to protect the IGBT.

[0048] The SCR driving module 6 is electrically connected to the switch power module 7 , and the SCR driving module 6 is used to receive the second control signal and output a preset constant voltage to the SCR.

[0049] In this embodiment, if Figure 7 As shown, the SCR driving module 6 includes a signal isolation unit 61, a signal coupling unit 62, a power isolation unit 63 and a load driving unit 64. The signal isolation unit 61 is respectively connected to the signal coupling unit 62, the power isolation unit 63, the integrated processing module 2 and the switching power supply module 7. The signal coupling unit 62 is respectively connected to the power isolation unit 63, the switching power supply module 7 and the integrated processing module 2. The power isolation unit 63 is connected to the switching power supply module 7, and the load driving unit 64 is connected to the power isolation unit 63.

[0050] The signal isolation unit 61 includes a signal isolation chip, a sixth resistor, a seventh resistor, an eighth resistor, a seventh capacitor and an eighth capacitor. The first pin of the signal isolation chip is respectively connected to the common end of the sixth resistor, the seventh resistor and the eighth resistor, the switching power supply module 7 and one end of the seventh capacitor. The second pin of the signal isolation chip is respectively connected to the other end of the eighth resistor and the integrated processing module 2. The third pin of the signal isolation chip is respectively connected to the other end of the seventh resistor and the integrated processing module 2. The fourth pin of the signal isolation chip is respectively connected to the other end of the sixth resistor and the integrated processing module 2. The fifth pin of the signal isolation chip is respectively connected to the other end of the seventh capacitor and the GND end. The sixth pin of the signal isolation chip is respectively connected to one end of the eighth capacitor and the GND end. The seventh pin, the eighth pin and the ninth pin of the signal isolation chip are all connected to the load driving unit 64. The tenth pin of the signal isolation chip is respectively connected to the other end of the eighth capacitor and the switching power supply module 7.

[0051] The signal coupling unit 62 includes a photoelectric coupler and a second MOS tube, a first end of the photoelectric coupler is connected to the switching power supply module 7, a second end of the photoelectric coupler is connected to the drain of the second MOS tube, a source of the second MOS tube is grounded, a gate of the second MOS tube is connected to the integrated processing module 2, a third end of the photoelectric coupler is respectively connected to the signal isolation unit 61 and the GND end, and a fourth end of the photoelectric coupler is connected to the power isolation unit 63.

[0052] The power isolation unit 63 includes a power isolation chip, a ninth capacitor, a tenth capacitor and a tenth resistor. The first pin of the power isolation chip is respectively connected to the switching power supply module 7 and one end of the ninth capacitor, the second pin of the power isolation chip is respectively connected to the other end of the ninth capacitor and the GND end, the third pin of the power isolation chip and the first common end of the tenth capacitor and the tenth resistor are commonly grounded, and the fourth pin of the power isolation chip and the second common end of the tenth capacitor and the tenth resistor are commonly connected to the signal isolation unit 61, the signal coupling unit 62 and the load driving unit 64.

[0053] For example, see Figure 8 The specific circuit structures of the signal isolation unit 61, the signal coupling unit 62 and the power isolation unit 63 are described in detail below.

[0054] In a possible example, the signal isolation unit 61, the signal coupling unit 62 and the power isolation unit 63 include a resistor R9, a resistor R10, a resistor R11, a resistor R12, a resistor R13, a resistor R33, a resistor R34, a resistor R35, a resistor R36, a resistor R93, a capacitor C216, a capacitor C219, a capacitor C316, a capacitor C319, a capacitor C416, a capacitor C419, a MOS tube Q2, a signal isolation chip U1, an optical coupler U2 and a power isolation chip U29. Among them, the signal isolation chip U1 corresponds to the isolation chip, the resistor R9 corresponds to the sixth resistor, the resistor R10 corresponds to the seventh resistor, the resistor R11 corresponds to the eighth resistor, the capacitor C219 corresponds to the seventh capacitor, the capacitor C319 corresponds to the eighth capacitor, the optical coupler U2 corresponds to the photoelectric coupler, the MOS tube Q2 corresponds to the second MOS tube, the power isolation chip U29 corresponds to the power isolation chip, the capacitor C316 corresponds to the ninth capacitor, the capacitor C419 corresponds to the tenth capacitor, and the resistor R34 corresponds to the tenth resistor.

[0055] The VDD1 pin of the signal isolation chip U1 is respectively connected to one end of the capacitor C219, the common end of the resistor R9, the resistor R10 and the resistor R11, and the switching power supply module 7. The VIA pin, the VIB pin and the VIC pin of the signal isolation chip U1 are all connected to the integrated processing module 2. The NC pin of the signal isolation chip U1 is connected to air. The GND1 pin of the signal isolation chip U1 is respectively connected to the other end and the GND end of the capacitor C219. The GND2 pin of the signal isolation chip U1 is respectively connected to one end and the GND end of the capacitor C319. The VE2 pin of the signal isolation chip U1 is respectively connected to the third end of the optical coupler U2. The first end of the optical coupler U2 is connected to the switch power supply module 7 through the resistor R12, the second end of the optical coupler U2 is connected to the drain of the MOS tube Q2, the source of the MOS tube Q2 is grounded, the gate of the MOS tube Q2 is connected to the integrated processing module 2 through the resistor R13, and the fourth end of the optical coupler U2 is connected to the power isolation unit 63.

[0056] The Vin+ pin of the power isolation chip U29 is respectively connected to the first common end of capacitor C216, capacitor C316 and capacitor C416 and the switching power supply module 7, the Vin- pin of the power isolation chip U29 is respectively connected to the second common end and GND end of capacitor C216, capacitor C316 and capacitor C416, the Vout- pin of the power isolation chip U29 and the first common end of capacitor C419, resistor R33, resistor R34, resistor R35 and resistor R36 are commonly grounded, the COM pin of the power isolation chip U29 is connected to air, and the Vout- pin of the power isolation chip U29 and the second common end of capacitor C419, resistor R33, resistor R34, resistor R35 and resistor R36 are commonly connected to the signal isolation unit 61, the signal coupling unit 62 and the load driving unit 64.

[0057] For example, see Fig. 9 , the specific circuit structure of the load driving unit 64 is described in detail below.

[0058] In a possible example, the load driving unit 64 includes a resistor R201, a resistor R202, a resistor R203, a resistor R204, a resistor R205, a resistor R206, a resistor R207, a resistor R208, a resistor R209, a resistor R301, a resistor R302, a resistor R303, a resistor R304, a resistor R305, a resistor R306, a resistor R307, a resistor R308, a resistor R309, a resistor R401, a resistor R402, a resistor R403, a resistor R404, a resistor R405, a resistor R406, a resistor R407, a resistor R408, a resistor R409, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C66, a capacitor C67, a capacitor C201, a capacitor C301, a capacitor C401, a terminal J11, a terminal J12, and a terminal J12.

[0059] The first common end of capacitor C67, capacitor C7, capacitor C8 and capacitor C401, one end of resistor R408 and the second pin of terminal J13 are grounded in common, the second common end of capacitor C67, capacitor C7, capacitor C8 and capacitor C401 are respectively connected to one end of resistor R401 and the emitter of transistor Q401, the base of transistor Q401 is connected to the common end of resistor R401 and resistor R402, the other end of resistor R402 is connected to the VOA pin of signal isolation chip U1, the collector of transistor Q401 is connected to the first common end of resistor R403, resistor R404, resistor R405, resistor R406, resistor R407 and resistor R409, the second common end of resistor R403, resistor R404, resistor R405, resistor R406, resistor R407 and resistor R409 are respectively connected to the other end of resistor R408 and the first pin of terminal J13.

[0060] The first common end of capacitor C66, capacitor C5, capacitor C6 and capacitor C301, one end of resistor R308 and the second pin of terminal J12 are grounded in common, the second common end of capacitor C66, capacitor C5, capacitor C6 and capacitor C301 are respectively connected to one end of resistor R301 and the emitter of transistor Q301, the base of transistor Q301 is connected to the common end of resistor R301 and resistor R302, the other end of resistor R302 is connected to the VOB pin of signal isolation chip U1, the collector of transistor Q301 is connected to the first common end of resistor R303, resistor R304, resistor R305, resistor R306, resistor R307 and resistor R309, the second common end of resistor R303, resistor R304, resistor R305, resistor R306, resistor R307 and resistor R309 are respectively connected to the other end of resistor R308 and the first pin of terminal J12.

[0061] The first common end of capacitor C2, capacitor C3, capacitor C4 and capacitor C201, one end of resistor R208 and the second pin of terminal J11 are grounded in common, the second common end of capacitor C2, capacitor C3, capacitor C4 and capacitor C201 are respectively connected to one end of resistor R201 and the emitter of transistor Q201, the base of transistor Q201 is connected to the common end of resistor R201 and resistor R202, the other end of resistor R202 is connected to the VOC pin of signal isolation chip U1, the collector of transistor Q201 is connected to the first common end of resistor R203, resistor R204, resistor R205, resistor R206, resistor R207 and resistor R209, the second common end of resistor R203, resistor R204, resistor R205, resistor R206, resistor R207 and resistor R209 are respectively connected to the other end of resistor R208 and the first pin of terminal J11.

[0062] In one example, the MCU control module 1 outputs SCRF1, SCRF2 and SCRF3 signals, which are pulled up to +5V through a 10K resistor, and input to the SCR driver module 6 through the three-channel digital isolator of the signal isolation chip U1. At the same time, the load capacity of the driving signal is enhanced by driving the transistors Q401, Q301 and Q201, and connected to the J13, J12 and J11 sockets to control the output of the pulse signal and the rectification control of the SCR to ensure that the voltage on the DC bus is constant and stable. Among them, the built-in 100 ohm resistor of the SCR driver module 6 ensures that the gate drive does not exceed 50% of the duty cycle when the gate current is about 150mA, so as not to exceed the rated power of the resistor. The power isolation chip U29 is a +5V power isolation chip, which is conditioned by the power isolation chip U29 and the capacitor C419, the resistor R33, the resistor R34, the resistor R35 and the resistor R36 to ensure that the +5VISO power output by the power isolation chip U29 is stable.

[0063] In this embodiment, Fig.10 The schematic diagram of the circuit of the switching power supply module 7 is shown in FIG. 7 . The switching power supply module 7 includes two voltage regulators of model LTC3406BES5, which simultaneously provide 2.5V, 3.3V and 5V voltages for the dynamic protection circuit of the welding controller.

[0064] The utility model also provides a welding controller dynamic protection system, which includes each of the above-mentioned welding controller dynamic protection circuits.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A welding controller dynamic protection circuit, characterized in that: It comprises an MCU control module (1), an integrated processing module (2), a voltage attenuation module (3), an AD conversion module (4), an IGBT drive module (5), an SCR drive module (6) and a switch power supply module (7), wherein: The MCU control module (1) is electrically connected to the integrated processing module (2), the AD conversion module (4), the IGBT drive module (5) and the switch power module (7) respectively; the integrated processing module (2) is electrically connected to the IGBT drive module (5), the SCR drive module (6) and the switch power module (7); the voltage attenuation module (3) is electrically connected to the AD conversion module (4); the IGBT drive module (5) is electrically connected to the switch power module (7); and the SCR drive module (6) is electrically connected to the switch power module (7); The integrated processing module (2) is used to receive the modulation signal sent by the MCU control module (1) and to send a first control signal and a second control signal to the SCR drive module (6) and the IGBT drive module (5) respectively; the IGBT drive module (5) is used to receive the first control signal and adjust the operating voltage output to the IGBT; and the SCR drive module (6) is used to receive the second control signal and output a preset constant voltage to the SCR.

2. The welding controller dynamic protection circuit as claimed in claim 1, characterized in that: The IGBT drive module (5) comprises an optical coupling drive unit (51), a voltage conversion unit (52) and a voltage regulation unit (53); the optical coupling drive unit (51) is respectively connected to the MCU control module (1), the integrated processing module (2), the switching power supply module (7), the voltage conversion unit (52) and the voltage regulation unit (53); and the voltage conversion unit (52) is respectively connected to the switching power supply module (7) and the voltage regulation unit (53).

3. The welding controller dynamic protection circuit as claimed in claim 2, characterized in that: The optocoupler drive unit (51) comprises an optocoupler drive chip, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first diode, a second diode, a first resistor and a first MOS tube, the first pin and the fourth pin of the optocoupler drive chip being connected to the MCU control module (1), the second pin and the third pin of the optocoupler drive chip being connected to the integrated processing module (2), the fifth pin, the sixth pin, the seventh pin and the eighth pin of the optocoupler drive chip being connected to the voltage conversion unit (52), one end of the first capacitor and one end of the second capacitor, the ninth pin of the optocoupler drive chip being connected to the cathode of the first diode and the cathode of the second diode respectively. The negative electrode of the first MOS tube is connected to the negative electrode, the drain electrode of the first MOS tube and the voltage regulating unit (53); the ninth pin of the optical coupling driving chip is respectively connected to the other end of the first capacitor, the other end of the second capacitor, the positive electrode of the first diode, the positive electrode of the second diode and the EMTR end; the eleventh pin of the optical coupling driving chip is respectively connected to one end of the third capacitor and the voltage regulating unit (53); the other end of the third capacitor is respectively connected to one end of the fourth capacitor, one end of the first resistor and the gate electrode of the first MOS tube; the other end of the fourth capacitor is respectively connected to the other end of the first resistor, the source electrode of the first MOS tube and the EMTR end.

4. The welding controller dynamic protection circuit as claimed in claim 2, characterized in that: The voltage conversion unit (52) comprises a voltage conversion chip, a fifth capacitor, a sixth capacitor, a second resistor, a third diode and a fourth diode. The first pin of the voltage conversion chip is connected to the switch power supply module (7), the first pin of the voltage conversion chip is grounded, the third pin of the voltage conversion chip is respectively connected to one end of the sixth capacitor, the positive electrode of the fourth diode, the optical coupling drive unit (51) and the voltage regulation unit (53), the fourth pin of the voltage conversion chip is connected to the common end of the fifth capacitor and the sixth capacitor, the fifth pin of the voltage conversion chip is respectively connected to the other end of the fifth capacitor, one end of the second resistor, the negative electrode of the third diode, the optical coupling drive unit (51) and the voltage regulation unit (53), and the common end of the second resistor and the fourth diode is respectively connected to the positive electrode of the third diode and the EMTR end.

5. The welding controller dynamic protection circuit as claimed in claim 2, characterized in that: The voltage regulating unit (53) comprises a first triode, a second triode, a third resistor, a fourth resistor, a fifth diode and a first terminal, wherein the first end of the first terminal is respectively connected to the optical coupling driving unit (51), the second end of the first terminal is respectively connected to one end of the fifth diode, the common end of the third resistor and the fourth resistor, and the common end of the first triode and the second triode, the third end of the first terminal is respectively connected to the other end of the fifth diode and the EMTR end, the collectors of the first triode and the second triode are both connected to the voltage conversion unit (52), and the base of the first triode and the base of the second triode are commonly connected to the optical coupling driving unit (51).

6. The welding controller dynamic protection circuit as claimed in claim 1, characterized in that: The SCR driving module (6) comprises a signal isolation unit (61), a signal coupling unit (62), a power isolation unit (63) and a load driving unit (64); the signal isolation unit (61) is respectively connected to the signal coupling unit (62), the power isolation unit (63), the integrated processing module (2) and the switching power module (7); the signal coupling unit (62) is respectively connected to the power isolation unit (63), the switching power module (7) and the integrated processing module (2); the power isolation unit (63) is connected to the switching power module (7); and the load driving unit (64) is connected to the power isolation unit (63).

7. The welding controller dynamic protection circuit as claimed in claim 6, characterized in that: The signal isolation unit (61) comprises a signal isolation chip, a sixth resistor, a seventh resistor, an eighth resistor, a seventh capacitor and an eighth capacitor; the first pin of the signal isolation chip is respectively connected to the common end of the sixth resistor, the seventh resistor and the eighth resistor, the switch power module (7) and one end of the seventh capacitor; the second pin of the signal isolation chip is respectively connected to the other end of the eighth resistor and the integrated processing module (2); the third pin of the signal isolation chip is respectively connected to the other end of the seventh resistor and the integrated processing module (2); the fourth pin of the signal isolation chip is respectively connected to the other end of the sixth resistor and the integrated processing module (2); the fifth pin of the signal isolation chip is respectively connected to the other end and the GND end of the seventh capacitor; the sixth pin of the signal isolation chip is respectively connected to one end and the GND end of the eighth capacitor; the seventh pin, the eighth pin and the ninth pin of the signal isolation chip are all connected to the load driving unit (64); and the tenth pin of the signal isolation chip is respectively connected to the other end of the eighth capacitor and the switch power module (7).

8. The welding controller dynamic protection circuit as claimed in claim 6, characterized in that: The signal coupling unit (62) comprises a photoelectric coupler and a second MOS tube, wherein a first end of the photoelectric coupler is connected to the switch power module (7), a second end of the photoelectric coupler is connected to the drain of the second MOS tube, a source of the second MOS tube is grounded, a gate of the second MOS tube is connected to the integrated processing module (2), a third end of the photoelectric coupler is respectively connected to the signal isolation unit (61) and a GND end, and a fourth end of the photoelectric coupler is connected to the power isolation unit (63).

9. The welding controller dynamic protection circuit as claimed in claim 6, characterized in that: The power isolation unit (63) comprises a power isolation chip, a ninth capacitor, a tenth capacitor and a tenth resistor, wherein a first pin of the power isolation chip is respectively connected to the switch power module (7) and one end of the ninth capacitor, a second pin of the power isolation chip is respectively connected to the other end of the ninth capacitor and a GND end, a third pin of the power isolation chip is commonly grounded with a first common end of the tenth capacitor and the tenth resistor, and a fourth pin of the power isolation chip is commonly connected to a second common end of the tenth capacitor and the tenth resistor with the signal isolation unit (61), the signal coupling unit (62) and the load driving unit (64).

10. A welding controller dynamic protection system, characterized in that: It comprises a welding controller dynamic protection circuit as described in any one of claims 1 to 9.

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