Wafer scribing machine

Abstract

The utility model provides a wafer scribing machine which comprises a base, a wafer bearing mechanism and a wafer scribing mechanism, a mounting groove is formed in the base, and a first guide rail and a second guide rail are arranged on supporting surfaces on the two sides of the mounting groove. The wafer bearing mechanism comprises a first translation driving module, a rotation driving module, a moving platform and a wafer bearing table, the first translation driving module is arranged in the mounting groove, and the moving platform is slidably connected to the first guide rail and the second guide rail. The rotation driving module is located in the installation hole of the mobile platform, and the wafer bearing platform is installed on the driving end of the rotation driving module. The first translation driving module and the rotation driving module are used for driving the wafer bearing table to translate and rotate, and the wafer scribing mechanism is used for scribing a wafer on the wafer bearing table. The rotary driving module is mounted in the mounting groove, so that the height difference between the wafer bearing table and the supporting surfaces on the two sides is reduced, the surface inclination of the wafer bearing table is reduced, and the scribing precision of the wafer scribing machine is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular to a wafer dicing machine. Background Art

[0002] During the chip production process, a dicing machine is needed to slice the wafer to divide the wafer into individual chips.

[0003] In order to achieve wafer cutting, the wafer carrier will be slidably installed on the angle adjustment component, and the angle adjustment component is installed on the transverse movement module. In order to ensure the stability of the wafer carrier, the two sides of the angle adjustment component need to be slidably connected to the guide rails on both sides of the transverse movement module.

[0004] Since an angle adjustment component is installed between the guide rails and the wafer carrier table, the height difference between the guide rails on both sides and the upper surface of the wafer carrier table is relatively large. During actual processing and assembly, there is usually an allowable height deviation between the guide rails on both sides. However, this height deviation will cause the inclination of the wafer carrier table surface to be magnified due to the large height difference between the guide rails and the upper surface of the wafer carrier table, thereby affecting the accuracy of wafer cutting. Utility Model Content

[0005] In view of the above problems existing in the traditional wafer dicing machine, the present application provides a wafer dicing machine, and its detailed technical solution is as follows:

[0006] A wafer dicing machine comprises a base, a wafer carrying mechanism and a wafer dicing mechanism, wherein:

[0007] The base comprises a mounting portion, a first side support portion and a second side support portion, wherein a mounting groove with an opening facing upward is arranged in the middle of the mounting portion along a first horizontal direction, two support surfaces of the mounting portion are respectively located on opposite sides of the mounting groove, and a first guide rail and a second guide rail extending along the first horizontal direction are respectively installed on the two support surfaces of the mounting portion; the first side support portion and the second side support portion are symmetrically arranged on both sides of the mounting portion along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction;

[0008] The wafer carrying mechanism includes a first translation driving module, a rotation driving module, a moving platform and a wafer carrying table, wherein:

[0009] The first translation driving module is arranged in the installation groove;

[0010] One end of the mobile platform is slidably connected to the first guide rail, the other end of the mobile platform is slidably connected to the second guide rail, the bottom of the mobile platform is connected to the driving end of the first translation driving module, and a mounting hole is formed in the mobile platform and penetrates the mobile platform from top to bottom;

[0011] The rotation driving module is mounted on the driving end of the first translation driving module and is located in the mounting hole, and the driving end of the rotation driving module extends upwardly out of the mounting hole;

[0012] The wafer carrier is horizontally mounted on the driving end of the rotary driving module;

[0013] The first translation drive module is used to drive the mobile platform and the wafer carrier to translate synchronously along the first horizontal direction; the rotation drive module is used to drive the wafer carrier to rotate in a horizontal plane;

[0014] The wafer scribing mechanism is supported on the first side supporting part and the second side supporting part, and the wafer scribing mechanism is used for scribing the wafer carried on the wafer carrying table.

[0015] The wafer dicing machine provided by the present application has a mounting groove with an opening facing upward in the mounting portion of the base, and the rotating drive module of the wafer bearing mechanism is installed in the mounting groove, thereby reducing the height difference between the wafer bearing platform and the supporting surfaces on both sides of the mounting portion. When there is an allowable height error between the two supporting surfaces of the mounting portion, the height difference between the wafer bearing platform and the supporting surfaces on both sides of the mounting portion becomes smaller, thereby reducing the influence of the height error of the two supporting surfaces on the inclination of the surface of the wafer bearing platform, thereby improving the dicing accuracy. In addition, since the error of the wafer bearing platform is reduced, and then the design of slidingly mounting the mobile platform on the two supporting surfaces of the mounting portion makes the wafer dicing machine provided by the present application compatible with larger wafer specifications, such as 12 inches, 14 inches, 16 inches and even 20 inches.

[0016] In some embodiments, the first translation drive module includes a first mounting plate, a first motor, a first screw and a first screw nut, wherein the first screw is connected to the driving end of the first motor and extends along the first horizontal direction, the first screw nut is threaded on the first screw and fixed to the bottom of the first mounting plate, and when the first motor drives the first screw to rotate, it drives the first screw nut and the first mounting plate to translate along the first screw, and the bottom of the mobile platform and the bottom of the wafer carrier are fixedly connected to the top of the first mounting plate.

[0017] A first translation driving module with simple structure and stable driving is provided, which can drive a mobile platform and a wafer carrier to translate stably along a first horizontal direction.

[0018] In some embodiments, a first column is disposed at the first end of the first mounting plate, and a second column is disposed at the second end of the first mounting plate, and an avoidance space for avoiding the rotating drive module is formed between the first column and the second column; the bottom of the mobile platform is fixedly mounted on the upper ends of the first column and the second column.

[0019] An avoidance space for the rotation drive module is formed between the mobile platform and the mounting plate, and finally the bottom of the rotation drive module is installed on the first mounting plate.

[0020] In some embodiments, the rotary drive module includes a rotary motor, and a plurality of first mounting holes are circumferentially arranged at the bottom of the rotary motor; a plurality of second mounting holes corresponding to the first mounting holes are arranged on the first mounting plate; and the rotary motor is fixed to the first mounting plate via a first bolt passing through the first mounting hole and the corresponding second mounting hole.

[0021] The connection strength between the rotary drive module and the first mounting plate is ensured, and the disassembly, assembly and maintenance of the rotary drive module are facilitated.

[0022] In some embodiments, a plurality of clamping assemblies are provided on the mobile platform and are arranged circumferentially on the peripheral side of the wafer carrier, and the clamping assemblies are used to clamp the wafer carrier; the clamping assemblies include a clamping drive and a clamping block, the clamping drive is installed on the mobile platform, the clamping block is connected to the driving end of the clamping drive, and the clamping drive is used to drive the clamping block to move toward or away from the wafer carrier to clamp or release the wafer carrier.

[0023] After completing the angle adjustment of the wafer carrier, the clamping assembly can realize the clamping and positioning of the wafer carrier to prevent the wafer carrier from accidentally rotating during the dicing process.

[0024] In some embodiments, the wafer slicing mechanism includes a first support seat, a second support seat, a mounting beam and a slicing part, wherein: the first support seat and the second support seat are respectively arranged on the first side support part and the second side support part, and an avoidance space for avoiding the wafer carrying mechanism is formed between the first support seat and the second support seat; one end of the mounting beam is fixedly mounted on the first support seat, and the second end of the mounting beam is fixedly mounted on the second support seat, and the upper surface of the mounting beam is provided with a third guide rail and a fourth guide rail extending along the second horizontal direction; the slicing part includes a mounting seat, a second translation drive module, a lifting drive module and a slicing knife assembly, wherein: the mounting seat is slidably mounted on the third guide rail and the fourth guide rail, and is connected to the driving end of the second translation drive module arranged on the mounting beam, and the second translation drive module is used to drive the mounting seat to slide along the third guide rail and the fourth guide rail; the lifting drive module is installed on the mounting seat, the slicing knife assembly is connected to the driving end of the lifting drive module, and the lifting drive module is used to drive the slicing knife assembly to rise and fall.

[0025] The third guide rail and the fourth guide rail supporting the dicing blade assembly are installed on the upper surface of the mounting crossbeam, so that the loads borne by the third guide rail and the fourth guide rail are equivalent, and therefore, the deformations produced by the third guide rail and the fourth guide rail after being compressed are basically the same, thereby greatly reducing the influence on the dicing height and dicing angle of the blade of the dicing blade assembly. In addition, since the third guide rail and the fourth guide rail are installed on the same horizontal plane, there will be no lateral deviation between the third guide rail and the fourth guide rail, thereby not amplifying the vertical angle error of the blade, and can reduce the distance between the mounting plane of the first guide rail and the second guide rail and the wafer supporting platform below, thereby reducing the error caused to the dicing blade assembly by the processing error of the mounting plane of the first guide rail and the second guide rail.

[0026] In some embodiments, the first support seat and the second support seat have the same structure, a rectangular mounting groove is opened on the first support seat, a third mounting hole is set at the bottom of the mounting groove and extends vertically to the lower surface of the first support seat, and a fourth mounting hole corresponding to the third mounting hole is set on the base, and the first support seat is fixed to the base by a second bolt passing through the third mounting hole and the fourth mounting hole.

[0027] It facilitates the disassembly and assembly of the first support seat and the second support seat, and ensures the connection strength between the first support seat, the second support seat and the base. The design of the rectangular mounting groove facilitates the release of the mechanical stress generated by the bolts during installation, thereby improving the deformation resistance of the first support seat and the second support seat.

[0028] In some embodiments, the second translation drive module is located between the third guide rail and the fourth guide rail, and the second translation drive module includes a second motor, a second screw rod and a second screw rod nut, wherein the second screw rod is connected to the driving end of the second motor and extends along the second horizontal direction, the second screw rod nut is threaded on the second screw rod and fixed to the bottom of the mounting base, and when the second motor drives the second screw rod to rotate, it drives the second screw rod nut and the mounting base to translate along the second screw rod.

[0029] A second translation driving module with a simple structure and stable driving is provided to ensure stable translation of the mounting seat along the second horizontal direction.

[0030] In some embodiments, the lifting drive module includes a lifting drive member and a connecting plate, wherein: the lifting drive member is installed on the first side of the mounting seat, the upper end of the connecting plate is slidably installed on the mounting seat and connected to the driving end of the lifting drive member; the dicing knife assembly is installed at the lower end of the connecting plate; the lifting drive module also includes a fifth guide rail and a sixth guide rail vertically installed on the mounting seat, and the upper end of the connecting plate is slidably installed on the fifth guide rail and the sixth guide rail through four sliders symmetrically arranged in pairs.

[0031] The sliding connection stability between the connecting plate and the mounting seat is improved to ensure that the connecting plate can be stably lifted and lowered in the vertical direction.

[0032] In some embodiments, the connecting plate includes an upper connecting plate and a lower connecting plate. The upper connecting plate is slidably mounted on a mounting seat and connected to a driving end of a lifting drive member. The upper end of the lower connecting plate is fixedly connected to the upper connecting plate, and the lower end of the lower connecting plate is fixedly connected to a fixed end of a slicing knife assembly.

[0033] The connection plate is arranged as a split structure consisting of an upper connection plate and a lower connection plate, which facilitates the processing of the connection plate and reduces the processing difficulty.

[0034] In some embodiments, the material of the lower connecting plate is different from that of the upper connecting plate, and the thermal expansion coefficient of the lower connecting plate is lower than that of the upper connecting plate.

[0035] The upper and lower connecting plates can be made of different materials. The lower connecting plate is made of a material with a low thermal expansion coefficient to avoid significant expansion and deformation of the lower connecting plate due to heat during the dicing process, which affects the dicing accuracy.

[0036] In some embodiments, the dicing knife assembly is located on a first side of the mounting base, and a counterweight mechanism is disposed on a second side of the mounting base opposite to the first side.

[0037] This ensures that the weight borne by both sides of the mounting base is equal, thereby improving the structural symmetry and stability of the wafer dicing mechanism.

[0038] In some embodiments, the dicing parts are arranged into two groups, and the dicing knife assemblies of the two groups of dicing parts are arranged symmetrically.

[0039] The two groups of dicing units perform dicing simultaneously or alternately, which improves the dicing efficiency. The dicing blade components of the two groups of dicing units are symmetrically arranged, which further improves the structural symmetry and stability of the wafer dicing mechanism.

[0040] In some embodiments, the first support base, the second support base and the mounting crossbeam are all integrally formed rectangular parallelepiped castings.

[0041] On the one hand, it facilitates the processing and forming of the first support seat, the second support seat and the mounting crossbeam. On the other hand, it improves the structural strength and anti-deformation ability of the first support seat, the second support seat and the mounting crossbeam. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic diagram of the three-dimensional structure of a wafer dicing machine in an embodiment of the present application;

[0043] Figure 2 Schematic diagram of the top view of the wafer dicing machine in the embodiment of the present application;

[0044] Figure 3 It is a schematic diagram of the three-dimensional structure of the base and the wafer carrying mechanism in the embodiment of the present application;

[0045] Figure 4 It is a schematic diagram of the assembly structure of the rotation drive module and the first mounting plate in the embodiment of the present application;

[0046] Figure 5 It is a schematic diagram of the three-dimensional structure of the base and the wafer dicing mechanism in the embodiment of the present application;

[0047] Figure 6 Schematic diagram of the top view of the base and wafer dicing mechanism in the embodiment of the present application;

[0048] Figure 7 It is a schematic diagram of the side structure of the base and the wafer dicing mechanism in the embodiment of the present application;

[0049] Figures 1 to 7 Included:

[0050] Base 1:

[0051] The mounting portion 11, the mounting groove 12, the first guide rail 13, the second guide rail 14, the first side support portion 15, and the second side support portion 16;

[0052] Wafer carrying mechanism 2:

[0053] The first translation driving module 21 includes a first mounting plate 211 , a first motor 212 , and a first screw rod 213 ;

[0054] Rotation drive module 22: a rotation motor 221 and a first bolt 222;

[0055] Mobile platform 23;

[0056] Wafer carrier 24;

[0057] First column 25;

[0058] The second column 26;

[0059] A clamping assembly 27;

[0060] Wafer dicing mechanism 3:

[0061] First support seat 31: mounting groove 311, second bolt 312;

[0062] The second support seat 32

[0063] Installation of beam 33

[0064] Slicing section 34:

[0065] Mounting seat 341, second translation driving module 342, second motor 342a, second screw rod 342b, lifting driving module 343, dicing knife assembly 344, blade driving motor 344a, blade 344b, lifting driving member 345, connecting plate 346, upper connecting plate 346a, lower connecting plate 346b, fifth guide rail 347, sixth guide rail 348, slider 349;

[0066] The third guide rail 35;

[0067] The fourth guide rail 36 . DETAILED DESCRIPTION

[0068] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0069] like Figure 1 to Figure 2 As shown, the wafer dicing machine in the embodiment of the present application includes a base 1, a wafer carrying mechanism 2 and a wafer dicing mechanism 3, wherein:

[0070] The base 1 includes a mounting portion 11, a first side support portion 15 and a second side support portion 16, wherein a mounting groove 12 with an opening facing upward is provided in the middle of the mounting portion 11 along a first horizontal direction (such as the X-axis direction in the figure), two supporting surfaces of the mounting portion 11 are respectively located on opposite sides of the mounting groove 12, and a first guide rail 13 and a second guide rail 14 extending along the first horizontal direction are respectively installed on the two supporting surfaces of the mounting portion 11. The first side support portion 15 and the second side support portion 16 are symmetrically provided on both sides of the mounting portion 11 along a second horizontal direction (such as the Y-axis direction in the figure), and the second horizontal direction is perpendicular to the first horizontal direction.

[0071] The wafer carrying mechanism 2 includes a first translation driving module 21, a rotation driving module 22, a moving platform 23 and a wafer carrying table 24, wherein:

[0072] The first translation driving module 21 is disposed in the mounting groove 12 .

[0073] One end of the mobile platform 23 is slidably connected to the first guide rail 13, and the other end of the mobile platform 23 is slidably connected to the second guide rail 14. The bottom of the mobile platform 23 is connected to the driving end of the first translation driving module 21, and a mounting hole is formed in the mobile platform 23 that passes through the mobile platform from top to bottom.

[0074] The rotation driving module 22 is mounted on the driving end of the first translation driving module 21 and is located in the mounting hole. The driving end of the rotation driving module 22 extends upward out of the mounting hole.

[0075] The wafer support platform 24 is horizontally mounted on the driving end of the rotation driving module 22 .

[0076] The first translation driving module 21 is used to drive the moving platform 23 and the wafer carrying platform 24 to translate synchronously along a first horizontal direction. The rotation driving module 22 is used to drive the wafer carrying platform 24 to rotate in a horizontal plane.

[0077] The wafer scribing mechanism 3 is supported on the first side supporting portion 15 and the second side supporting portion 16 . The wafer scribing mechanism 3 is used to scribing the wafer carried on the wafer carrying table 24 .

[0078] The working process of the wafer changer in the embodiment of the present application is as follows:

[0079] First, the wafer to be processed is mounted and fixed on the wafer carrying table 24 .

[0080] Next, the first translation drive module 21 drives the mobile platform 23 and the wafer carrier 24 to translate synchronously along the first horizontal direction to adjust the wafer to be processed to the dicing position. In addition, the rotation drive module 22 drives the wafer carrier 24 to rotate in the horizontal plane to adjust the angle of the wafer to be processed.

[0081] Finally, the wafer dicing mechanism 3 dices the wafer while it is moving along the first horizontal direction.

[0082] In the wafer dicing machine provided in the embodiment of the present application, a mounting groove 12 with an upward opening is provided in the mounting portion 11 of the base 1, and a rotating drive module 22 of the wafer supporting mechanism 2 is installed in the mounting groove 12, thereby reducing the height difference between the wafer supporting platform 24 and the supporting surfaces on both sides of the mounting portion 11. When there is an allowable height error between the two supporting surfaces of the mounting portion 11, the height difference between the wafer supporting platform 24 and the supporting surfaces on both sides of the mounting portion 11 becomes smaller, thereby reducing the influence of the height error of the two supporting surfaces on the inclination of the surface of the wafer supporting platform 24, thereby improving the dicing accuracy.

[0083] like Figure 3As shown, optionally, the first translation drive module 21 includes a first mounting plate 211, a first motor 212, a first screw rod 213 and a first screw rod nut, wherein the first screw rod 213 is connected to the driving end of the first motor 212 and extends along the first horizontal direction, and the first screw rod nut is screwed on the first screw rod 213 and fixed to the bottom of the first mounting plate 211. When the first motor 212 drives the first screw rod 213 to rotate, it drives the first screw rod nut and the first mounting plate 211 to translate along the first screw rod, and the bottom of the mobile platform 23 and the bottom of the wafer carrier 24 are fixedly connected to the top of the first mounting plate 211. Of course, the first translation drive module 21 can also adopt existing linear drive modules of other structures, as long as it can drive the mobile platform 23 and the wafer carrier 24 to translate along the first horizontal direction. It can be seen that by installing the first translation module 21 in the mounting groove 12 and sliding the mobile platform 23 on the two supporting surfaces of the mounting portion 11, the height difference between the two supporting surfaces and the wafer carrier 24 is reduced, thereby reducing the influence of the processing error of the supporting surface on the wafer carrier 24. In addition, the design of the mobile platform 23 being mounted above the mounting groove 12 is convenient for replacement, so that the wafer dicing machine provided in the present application can be compatible with larger wafer specifications, such as 12 inches, 14 inches, 16 inches and even 20 inches.

[0084] Optionally, a first column 25 is disposed at the first end of the first mounting plate 211, and a second column 26 is disposed at the second end of the first mounting plate 211, and an escape space for the rotation drive module 22 is formed between the first column 25 and the second column 26. The bottom of the mobile platform 23 is fixedly mounted on the upper ends of the first column 25 and the second column 26. In this way, it is ensured that the bottom of the rotation drive module 22 is connected to the first mounting plate 211.

[0085] Optionally, the first mounting plate 211 is a rectangular plate. In order to improve the support stability of the mobile platform 23, two first columns 25 and two second columns 26 are each provided, wherein the two first columns 25 are provided at two adjacent corners of the first mounting plate 211, and the two second columns 26 are provided at the other two corners of the first mounting plate 211, and are symmetrically arranged in pairs at the bottom of the mobile platform 23 to provide stable support for the mobile platform 23.

[0086] like Figure 4 As shown, the rotary drive module 22 includes a rotary motor 221, and a plurality of first mounting holes are arranged at the bottom of the rotary motor 221 along the circumferential direction. A plurality of second mounting holes corresponding to the first mounting holes are arranged on the first mounting plate 211. The rotary motor 221 is fixed to the first mounting plate 211 by first bolts 222 penetrating the first mounting holes and the corresponding second mounting holes. Such arrangement can ensure the connection strength between the rotary drive module 22 and the first mounting plate 211, and facilitate the disassembly, assembly and maintenance of the rotary drive module 22. Figure 4 The connecting line of the three first mounting holes forms an isosceles triangle, wherein the first mounting hole corresponding to the top angle is fixedly connected to the first mounting plate 211, and the two first mounting holes corresponding to the bottom angle are fixedly connected to the first mounting plate 211 through tightening bolts. The horizontality of the bearing surface of the rotating drive module 22 is adjusted by adjusting the tightness of the two tightening bolts respectively.

[0087] Optionally, the rotary motor 221 includes a DD motor. The DD motor has stable driving and high driving accuracy, thereby improving the angle adjustment accuracy of the wafer carrier 24. Of course, the rotary drive module 22 can also adopt other existing structures that can drive the wafer carrier 24 to rotate in a horizontal plane, such as a rotary drive module composed of a motor, a synchronous pulley and a synchronous belt.

[0088] Optionally, adsorption holes for adsorbing the wafer are provided on the bearing surface of the wafer bearing platform 24. In this way, the wafer bearing platform 24 can adsorb and fix the wafer to ensure the dicing effect.

[0089] like Figure 3 As shown, optionally, the mobile platform 23 is provided with a plurality of (such as Figure 1 The four (four) clamping assemblies 27 are arranged circumferentially on the peripheral side of the wafer carrier 24, and the clamping assemblies 27 are used to clamp the wafer carrier 24. After the rotation drive module 22 completes the angle adjustment of the wafer carrier 24, the clamping assemblies 27 can realize the clamping positioning of the wafer carrier 24 to prevent the wafer carrier 24 from accidentally rotating during the dicing process.

[0090] Optionally, the clamping assembly 27 includes a clamping driver and a clamping block, the clamping driver is mounted on the mobile platform 23, the clamping block is connected to the driving end of the clamping driver, and the clamping driver is used to drive the clamping block to move toward or away from the wafer carrier to clamp or release the wafer plate on the wafer carrier 24. In a possible implementation, the clamping driver is a rotary cylinder or a rotary motor, and the clamping driver drives the clamping block to rotate, and when the rotary block rotates to a high position, the wafer plate on the wafer carrier is released; when the rotary block rotates to a low position, the wafer plate on the wafer carrier is clamped.

[0091] As known to those skilled in the art, the wafer dicing mechanism of a conventional wafer dicing machine generally includes a vertical mounting plate, two horizontal rails are arranged on the same side of the vertical mounting plate, and the dicing assembly is installed on the two horizontal rails arranged on the upper and lower sides through a slider. In actual dicing production, since the dicing assembly is relatively heavy, the slider is affected by the gravity of the dicing assembly, which easily causes different deformations of the upper and lower rails, thereby affecting the dicing height and dicing angle of the blade of the dicing assembly, thereby affecting the wafer cutting accuracy, and as the equipment runs, the accuracy impact will become greater and greater. In addition, the dicing assembly includes a blade and a driving unit, and the blade is installed on the rail through the driving unit and the slider. The driving unit causes a relatively large vertical height difference between the blade and the rail. When the mounting surface of the upper and lower rails produces an allowable error in the lateral direction or the upper and lower rails produce a deviation in the lateral direction due to deformation, the vertical angle of the blade will be magnified, thereby affecting the wafer cutting accuracy.

[0092] In view of this, optional, such as Figures 5 to 7 As shown, the wafer dicing mechanism 3 in the embodiment of the present application includes a first support seat 31, a second support seat 32, a mounting beam 33 and a dicing portion 34, wherein: the first support seat 31 and the second support seat 32 are respectively arranged on the first side support portion 15 and the second side support portion 16, and an escape space for evading the wafer bearing mechanism 2 is formed between the first support seat 31 and the second support seat 32. One end of the mounting beam 33 is fixedly mounted on the first support seat 31, and the second end of the mounting beam 33 is fixedly mounted on the second support seat 32. The upper surface of the mounting beam 33 is provided with a third guide rail 35 and a fourth guide rail 36 extending along the second horizontal direction.

[0093] The dicing unit 34 includes a mounting seat 341, a second translation driving module 342, a lifting driving module 343 and a dicing blade assembly 344, wherein: the mounting seat 341 is slidably mounted on the third guide rail 35 and the fourth guide rail 36, and is connected to the driving end of the second translation driving module 342 disposed on the mounting crossbeam 33, and the second translation driving module 342 is used to drive the mounting seat 341 to slide along the third guide rail 35 and the fourth guide rail 36. The lifting driving module 343 is mounted on the mounting seat 341, and the dicing blade assembly 344 is connected to the driving end of the lifting driving module 343, and the lifting driving module 343 is used to drive the dicing blade assembly 344 to rise and fall.

[0094] Since the third guide rail 35 and the fourth guide rail 36 supporting the dicing blade assembly 344 are installed on the upper surface of the mounting crossbeam 33, the third guide rail 35 and the fourth guide rail 36 are on the same horizontal plane. In this way, the weight loads borne by the third guide rail 35 and the fourth guide rail 36 are equivalent, so the deformations produced by the third guide rail 35 and the fourth guide rail 36 after being compressed are basically the same, so that the influence on the dicing height and dicing angle of the blade of the dicing blade assembly 344 is greatly reduced. In addition, since the third guide rail 35 and the fourth guide rail 36 are installed on the same horizontal plane, there will be no lateral deviation between the third guide rail 35 and the fourth guide rail 36, so that the vertical angle error of the blade will not be magnified, and the first guide rail and the second guide rail are installed horizontally compared to the vertical installation, and the distance between the first guide rail and the second guide rail and the wafer is shortened, which reduces the error caused by the machining error of the installation plane of the first guide rail and the second guide rail magnified by the arm length, thereby improving the dicing accuracy.

[0095] In addition, the support structure composed of the base 1, the first support seat 31, the second support seat 32 and the mounting beam 33 has good symmetry and high support strength, so that its deformation resistance is very good, and ultimately improves the slicing accuracy of the blade of the slicing unit.

[0096] In order to facilitate the processing and forming of the first support seat 31, the second support seat 32 and the mounting beam 33, and to further enhance their structural strength and deformation resistance, optionally, the first support seat 31, the second support seat 32 and the mounting beam 33 are all integrally formed rectangular castings.

[0097] like Figure 5 As shown, optionally, the first support seat 31 and the second support seat 32 have the same structure. Taking the first support seat 31 as an example, a rectangular mounting groove 311 is provided on its side wall, and a third mounting hole extending vertically to the lower surface of the first support seat 31 is provided at the bottom of the mounting groove 311, and a fourth mounting hole corresponding to the third mounting hole is provided on the base 1, and the first support seat 31 is fixed to the base 1 through a second bolt 312 that penetrates the third mounting hole and the fourth mounting hole. Such a configuration facilitates the disassembly and assembly of the first support seat 31 and the second support seat 32, and ensures the connection strength between the first support seat 31, the second support seat 32 and the base 1, and the design of the rectangular mounting groove facilitates the release of the mechanical stress generated by the bolts during installation, thereby improving the deformation resistance of the first support seat and the second support seat.

[0098] like Figure 5As shown, optionally, the second translation drive module 342 is located between the third guide rail 35 and the fourth guide rail 36, and the second translation drive module 342 includes a second motor 342a, a second screw rod 342b and a second screw rod nut, wherein the second screw rod 342b is connected to the driving end of the second motor 342a and extends along the second horizontal direction, the second screw rod nut is screwed on the second screw rod 342b and fixed to the bottom of the mounting seat 341, and the second motor 342 drives the second screw rod 342b to rotate, driving the second screw rod nut and the mounting seat 342 to translate along the second screw rod 342b. Of course, the second translation drive module 342 can also adopt other known structures that can drive the mounting seat 342 to translate along the second horizontal direction. Linear drive modules.

[0099] Optional, such as Figure 5 and Figure 7 As shown, the lifting drive module 343 includes a lifting drive member 345 and a connecting plate 346, wherein: the lifting drive member 345 is mounted on the first side of the mounting seat 341, and the upper end of the connecting plate 346 is slidably mounted on the mounting seat 341 and connected to the driving end of the lifting drive member 345. The dicing blade assembly 344 is mounted on the lower end of the connecting plate 346. By setting the lifting drive module 343, the lifting drive module 343 can be stably mounted on the mounting seat 341, and the dicing blade assembly 344 is stably connected to the lifting drive module 343.

[0100] Optionally, the lifting drive module 343 also includes a fifth guide rail 347 and a sixth guide rail 348 vertically installed on the mounting base 341, and the upper end of the connecting plate 346 is slidably installed on the fifth guide rail 347 and the sixth guide rail 348 through four sliders 349 symmetrically arranged in pairs.

[0101] By setting the lifting drive module 343, the sliding connection stability between the connecting plate 346 and the mounting seat 341 is improved, ensuring that the connecting plate 346 can be stably lifted and lowered in the vertical direction.

[0102] Optionally, the connecting plate 346 includes an upper connecting plate 346a and a lower connecting plate 346b, wherein the upper connecting plate 346a is slidably mounted on the mounting seat 341 and connected to the driving end of the lifting drive member 345 arranged on the mounting seat 341, the upper end of the lower connecting plate 346b is fixedly connected to the upper connecting plate 346a, and the lower end of the lower connecting plate 346b is fixedly connected to the fixed end of the slicing knife assembly 344.

[0103] The connection plate 346 is configured as a split structure consisting of an upper connection plate 346a and a lower connection plate 346b, which facilitates the processing of the connection plate 346 and reduces the processing difficulty of the connection plate 346. In addition, the upper connection plate 346a and the lower connection plate 346b can be made of materials with different thermal expansion coefficients, such as the lower connection plate 346b can be made of a material with a low thermal expansion coefficient, thereby avoiding the expansion and deformation of the lower connection plate 346b due to heat during the dicing process, which affects the dicing accuracy.

[0104] Optionally, the lifting drive member 345 includes a third motor, a third screw and a third screw nut, wherein the third screw is connected to the driving end of the third motor and extends in the vertical direction, the third screw nut is screwed on the third screw and fixed to the connecting plate 346, and when the third motor drives the third screw to rotate, the third screw nut and the connecting plate 346 are driven to rise and fall along the third screw. Of course, the lifting drive member 345 can also adopt a linear drive module of other known structures that can drive the connecting plate 346 to rise and fall.

[0105] Optional, such as Figure 5 As shown, the slicing knife assembly 344 includes a blade drive motor 344a and a blade 344b, wherein the blade drive motor 344a is connected to the lower end of the connecting plate 346, and the blade 344b is connected to the driving end of the blade drive motor 344a, and the blade drive motor 344a is used to drive the blade 344b to rotate at high speed in a vertical plane.

[0106] The dicing process of the wafer dicing mechanism 3 is as follows: after the wafer is fixed to the wafer carrier 24 of the wafer carrier mechanism 2. The second translation drive module 342 and the lifting drive module 343 cooperate to drive the dicing knife assembly 344 to translate and lift, so that the blade 344b of the dicing knife assembly 344 moves to the predetermined dicing position. Subsequently, the blade drive motor 344a drives the blade 344b to rotate at high speed in the vertical plane. At the same time, the wafer carrier mechanism adjusts the angle of the wafer, and then drives the wafer to move along the predetermined dicing direction. During the movement of the wafer, the blade 344b dices the wafer along the predetermined dicing route on the wafer.

[0107] like Figure 6 and Figure 7 As shown, optionally, the dicing blade assembly 344 is located on a first side (such as the front side) of the mounting seat 341, and a counterweight mechanism is provided on a second side (such as the rear side) of the mounting seat 341 opposite to the first side. In this way, the weights borne by both sides of the mounting seat 341 are equal, thereby improving the structural symmetry and stability of the wafer dicing mechanism 3.

[0108] Optionally, the dicing unit 34 is arranged in two groups, and the dicing blade assemblies 344 of the two groups of dicing units 34 are arranged symmetrically. The two groups of dicing units 34 perform dicing simultaneously or alternately, thereby improving the dicing efficiency. The dicing blade assemblies 344 of the two groups of dicing units 34 are arranged symmetrically, further improving the structural symmetry and stability of the wafer dicing mechanism 3.

[0109] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer dicing machine, characterized in that: The wafer dicing machine comprises a base, a wafer carrying mechanism and a wafer dicing mechanism, wherein: The base comprises a mounting portion, a first side support portion and a second side support portion, wherein a mounting groove with an opening facing upward is arranged in the middle of the mounting portion along a first horizontal direction, two support surfaces of the mounting portion are respectively located on opposite sides of the mounting groove, and a first guide rail and a second guide rail extending along the first horizontal direction are respectively installed on the two support surfaces of the mounting portion; the first side support portion and the second side support portion are symmetrically arranged on both sides of the mounting portion along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction; The wafer carrying mechanism includes a first translation driving module, a rotation driving module, a moving platform and a wafer carrying table, wherein: The first translation driving module is arranged in the installation groove; One end of the mobile platform is slidably connected to the first guide rail, and the other end of the mobile platform is slidably connected to the second guide rail. The bottom of the mobile platform is connected to the driving end of the first translation driving module, and a mounting hole is formed in the mobile platform and passes through the mobile platform from top to bottom. The rotation driving module is mounted on the driving end of the first translation driving module and is located in the mounting hole, and the driving end of the rotation driving module extends upwardly out of the mounting hole; The wafer carrier is horizontally mounted on the driving end of the rotation driving module; The first translation driving module is used to drive the mobile platform and the wafer carrying platform to translate synchronously along the first horizontal direction; the rotation driving module is used to drive the wafer carrying platform to rotate in a horizontal plane; The wafer scribing mechanism is supported on the first side supporting portion and the second side supporting portion, and the wafer scribing mechanism is used to scribing the wafer carried on the wafer carrying table.

2. The wafer dicing machine according to claim 1, characterized in that: The first translation drive module includes a first mounting plate, a first motor, a first screw and a first screw nut, wherein the first screw is connected to the driving end of the first motor and extends along the first horizontal direction, the first screw nut is screwed on the first screw and fixed to the bottom of the first mounting plate, and when the first motor drives the first screw to rotate, it drives the first screw nut and the first mounting plate to translate along the first screw, and the bottom of the mobile platform and the bottom of the wafer carrier are fixedly connected to the top of the first mounting plate.

3. The wafer dicing machine according to claim 2, characterized in that: A first column is provided at the first end of the first mounting plate, and a second column is provided at the second end of the first mounting plate, and an escape space for evading the rotating drive module is formed between the first column and the second column; the bottom of the mobile platform is fixedly installed on the upper ends of the first column and the second column.

4. The wafer dicing machine according to claim 2, characterized in that: The rotary drive module comprises a rotary motor, and a plurality of first mounting holes are arranged at the bottom of the rotary motor along the circumferential direction; The first mounting plate is provided with a plurality of second mounting holes corresponding one to one with the first mounting holes; The rotating electric machine is fixed to the first mounting plate via a first bolt that penetrates the first mounting hole and the corresponding second mounting hole.

5. The wafer dicing machine according to claim 1, wherein: The mobile platform is provided with a plurality of clamping assemblies arranged circumferentially around the wafer carrier, and the clamping assemblies are used to clamp the wafer carrier; The clamping assembly includes a clamping drive and a clamping block. The clamping drive is installed on the movable platform. The clamping block is connected to the driving end of the clamping drive. The clamping drive is used to drive the clamping block to move toward or away from the wafer carrier to clamp or release the wafer carrier.

6. The wafer dicing machine according to claim 1, characterized in that: The wafer dicing mechanism comprises a first supporting seat, a second supporting seat, a mounting beam and a dicing unit, wherein: The first support seat and the second support seat are respectively arranged on the first side support portion and the second side support portion, and an escape space for escaping the wafer carrying mechanism is formed between the first support seat and the second support seat; One end of the mounting crossbeam is fixedly mounted on the first support seat, and the second end of the mounting crossbeam is fixedly mounted on the second support seat, and the upper surface of the mounting crossbeam is provided with a third guide rail and a fourth guide rail extending along the second horizontal direction; The dicing part includes a mounting seat, a second translation driving module, a lifting driving module and a dicing knife assembly, wherein: the mounting seat is slidably mounted on the third guide rail and the fourth guide rail, and is connected to the driving end of the second translation driving module arranged on the mounting crossbeam, and the second translation driving module is used to drive the mounting seat to slide along the third guide rail and the fourth guide rail; The lifting drive module is installed on the mounting seat, and the dicing knife assembly is connected to the driving end of the lifting drive module. The lifting drive module is used to drive the dicing knife assembly to rise and fall.

7. The wafer dicing machine according to claim 6, characterized in that: The first support seat and the second support seat have the same structure. A rectangular mounting groove is provided on the first support seat. A third mounting hole is provided at the bottom of the mounting groove and extends vertically to the lower surface of the first support seat. A fourth mounting hole corresponding to the third mounting hole is provided on the base. The first support seat is fixed to the base by a second bolt that penetrates the third mounting hole and the fourth mounting hole.

8. The wafer dicing machine according to claim 6, characterized in that: The second translation drive module is located between the third guide rail and the fourth guide rail, and the second translation drive module includes a second motor, a second screw rod and a second screw rod nut, wherein the second screw rod is connected to the driving end of the second motor and extends along the second horizontal direction, the second screw rod nut is threaded on the second screw rod and fixed at the bottom of the mounting seat, and when the second motor drives the second screw rod to rotate, it drives the second screw rod nut and the mounting seat to translate along the second screw rod.

9. The wafer dicing machine according to claim 6, characterized in that: The lifting drive module includes a lifting drive member and a connecting plate, wherein: The lifting drive member is mounted on a first side of the mounting seat, and the upper end of the connecting plate is slidably mounted on the mounting seat and connected to the driving end of the lifting drive member; The dicing knife assembly is mounted on the lower end of the connecting plate; The lifting drive module also includes a fifth guide rail and a sixth guide rail vertically mounted on the mounting seat, and the upper end of the connecting plate is slidably mounted on the fifth guide rail and the sixth guide rail through four sliding blocks symmetrically arranged in pairs.

10. The wafer dicing machine according to claim 9, characterized in that: The connecting plate includes an upper connecting plate and a lower connecting plate. The upper connecting plate is slidably mounted on the mounting seat and connected to the driving end of the lifting drive member. The upper end of the lower connecting plate is fixedly connected to the upper connecting plate, and the lower end of the lower connecting plate is fixedly connected to the fixed end of the dicing knife assembly.

11. The wafer dicing machine according to claim 10, characterized in that: The material of the lower connecting plate is different from that of the upper connecting plate, and the thermal expansion coefficient of the lower connecting plate is lower than the thermal expansion coefficient of the upper connecting plate.

12. The wafer dicing machine according to claim 6, characterized in that: The dicing knife assembly is located on a first side of the mounting seat, and a counterweight mechanism is provided on a second side of the mounting seat opposite to the first side.

13. The wafer dicing machine according to claim 6, characterized in that: The dicing parts are arranged in two groups, and the dicing knife assemblies of the two groups of dicing parts are arranged symmetrically.

14. The wafer dicing machine according to claim 6, characterized in that: The first support seat, the second support seat and the mounting crossbeam are all integrally formed rectangular parallelepiped castings.

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