Acrylic adhesive tape with low thermal resistance
By introducing a multi-layer heat dissipation structure and material combination into the acrylic tape, the high thermal resistance problem of acrylic tape on electronic products is solved, effective heat conduction and dissipation is achieved, and the equipment is protected from overheating damage.
Patent Information
- Application Number
- CN202420055302.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-10
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-01-10
AI Technical Summary
The use of acrylic tape on electronic products may cause overheating and damage to the equipment and cannot effectively dissipate heat due to its high thermal resistance.
A kind of acrylic tape with low thermal resistance is designed, including a adhesive backing layer, release paper, wrapping layer, protective layer and heat dissipation mechanism. The heat dissipation mechanism includes a heat absorption layer, a transition layer, a heat dissipation layer and a heat dissipation micropore, using pure copper, Silicon nitride and graphene materials improve heat conduction and dispersion efficiency through multi-layer structure and micropore design.
It achieves good adhesion and weather resistance, while effectively transferring heat, improves heat dissipation efficiency, prevents equipment from overheating and damage, and improves equipment performance and reliability.
Smart Images
Figure CN222160053U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of adhesive tapes, in particular to an acrylic adhesive tape with low thermal resistance. Background Art
[0002] Acrylic tape has the effects of waterproofing, shock absorption, heat resistance, and sound insulation. It has the characteristics of strong adhesion and good weather resistance. It is easy to die-cut and has good adhesion to difficult-to-stick surfaces such as plastic, metal, wood, paper, and silicone. However, when it is used on some electronic products, due to its high thermal resistance, it is not conducive to the heat dissipation of the sticking position, which may cause overheating and damage to the equipment. In view of this, the utility model proposes an acrylic tape with low thermal resistance. Utility Model Content
[0003] The utility model aims to propose an acrylic tape with low thermal resistance to address the problem that the acrylic tape in the background technology has high thermal resistance, is not conducive to heat dissipation at the pasting position, and may cause overheating and damage to the equipment.
[0004] The technical solution of the utility model: an acrylic tape with low thermal resistance, comprising: a main body, the main body comprising a back adhesive layer, a release paper is arranged on one side of the back adhesive layer, the main body further comprises a wrapping layer arranged on the side of the back adhesive layer away from the release paper, and a protective layer is further connected to the side of the wrapping layer away from the back adhesive layer;
[0005] A heat dissipation mechanism for heat dissipation, the heat dissipation mechanism is arranged on the side of the adhesive layer away from the release paper, the heat dissipation mechanism includes a plurality of mounting grooves opened in the adhesive layer, a contact layer is installed in the mounting groove, the contact layer includes a heat absorbing block arranged in the mounting groove, a heat conducting plate fixedly connected to the heat absorbing block is also installed on the side of the heat absorbing block away from the release paper, the heat conducting plate is located on the side of the adhesive layer away from the release paper, the heat dissipation mechanism also includes a heat absorbing layer, a transition layer, and a heat dissipation layer, the heat absorbing layer is arranged on the side of the contact layer away from the release paper, the transition layer is arranged on the side of the heat absorbing layer away from the contact layer, the heat dissipation layer is arranged on the side of the transition layer away from the heat absorbing layer, the heat absorbing layer, the transition layer, and the heat dissipation layer are all installed between the adhesive layer and the protective layer, the heat dissipation mechanism also includes a plurality of heat dissipation micropores opened on the protective layer, and the heat dissipation micropores are equidistantly distributed.
[0006] Optionally, one side of the contact layer is embedded in the heat absorption layer.
[0007] Optionally, the heat dissipation mechanism also includes a first adhesive layer, a second adhesive layer, and a third adhesive layer, wherein the first adhesive layer is arranged between the heat absorption layer and the transition layer, the second adhesive layer is arranged between the transition layer and the heat dissipation layer, and the third adhesive layer is arranged between the third adhesive layer and the protective layer.
[0008] Optionally, the contact layer and the heat absorption layer are both made of pure copper material, the transition layer is made of silicon nitride material, and the heat dissipation layer is made of graphene material.
[0009] Optionally, the wrapping layer and the protective layer are both made of acrylic material.
[0010] Compared with the prior art, the utility model has the following beneficial technical effects:
[0011] The utility model provides a back adhesive layer so that the main body can be pasted and has good adhesion and weather resistance. Meanwhile, the release paper is provided to ensure good adhesion before the back adhesive layer is pasted.
[0012] Furthermore, by setting the heat absorption layer, transition layer and heat dissipation layer, their thermal resistance is reduced in sequence, which facilitates the discharge of heat from the pasting position, helps conduct and dissipate heat, thereby improving the performance and reliability of the device and protecting the device from overheating damage;
[0013] In summary, the utility model has good adhesion and weather resistance, can effectively transfer heat, improve heat dissipation efficiency, and prevent equipment from overheating and damage. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of an acrylic tape with low thermal resistance;
[0015] Figure 2 It is a schematic diagram of the disassembled structure of the main body.
[0016] Reference numerals:
[0017] 1. Main body; 11. Adhesive layer; 12. Release paper; 13. Wrapping layer; 14. Protective layer;
[0018] 2. heat dissipation mechanism; 21. mounting groove; 22. contact layer; 221. heat absorption block; 222. heat conducting plate; 23. heat absorption layer; 231. first bonding layer; 24. transition layer; 241. second bonding layer; 25. heat dissipation layer; 251. third bonding layer; 26. heat dissipation micropores. DETAILED DESCRIPTION
[0019] The technical solution of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all of the embodiments.
[0020] The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.
[0021] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.
[0022] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0024] Example
[0025] like Figure 1 As shown, the utility model proposes an acrylic tape with low thermal resistance, including a main body 1, and the main body 1 includes a back adhesive layer 11. The back adhesive layer 11 allows the main body 1 to be pasted as a whole and has good adhesion. A release paper 12 is provided on one side of the back adhesive layer 11, and the release paper 12 is used to prevent foreign matter from being attached to the back adhesive layer 11 before pasting, thereby affecting its adhesion. The main body 1 also includes a wrapping layer 13 arranged on the side of the back adhesive layer 11 away from the release paper 12, and a protective layer 14 is also connected to the side of the wrapping layer 13 away from the back adhesive layer 11. The wrapping layer 13 and the protective layer 14 fix the interior and play a certain protective role. The wrapping layer 13 and the protective layer 14 are both made of acrylic material, which has good weather resistance as the surface and is not easy to age, decompose and deform.
[0026] For further information, see Figure 2The above-mentioned adhesive tape also includes a heat dissipation mechanism 2 for heat dissipation, and the heat dissipation mechanism 2 is arranged on the side of the adhesive layer 11 away from the release paper 12. The heat dissipation mechanism 2 includes a plurality of mounting grooves 21 opened in the adhesive layer 11, and the mounting grooves 21 are opened at equal distances and evenly distributed. A contact layer 22 is installed in the mounting groove 21, and the contact layer 22 is used to contact with an object for heat conduction. The contact layer 22 includes a heat absorbing block 221 arranged in the mounting groove 21, and the heat absorbing block 221 fits the object as much as possible, so that the heat of the object is conducted to the heat absorbing block 221. A heat conducting plate 222 fixedly connected to the heat absorbing block 221 is also installed on the side of the heat absorbing block 221 away from the release paper 12, and the heat conducting plate 222 is located on the side of the adhesive layer 11 away from the release paper 12, and the heat conducting plate 222 is used to increase the contact area to facilitate heat transfer. The heat dissipation mechanism 2 also includes a heat absorption layer 23, a transition layer 24, and a heat dissipation layer 25. The heat absorption layer 23 is arranged on the side of the contact layer 22 away from the release paper 12. The contact layer 22 and the heat absorption layer 23 are both made of pure copper material, which has a small thermal resistance, so that heat can be transferred to the contact layer 22 and the heat absorption layer 23 after contacting an object. One side of the contact layer 22 is embedded in the heat absorption layer 23, so that heat can be better transferred and not easily separated. The transition layer 24 is arranged on the side of the heat absorption layer 23 away from the contact layer 22. The transition layer 24 is made of silicon nitride material, and the thermal resistance is smaller than that of the contact layer 22 and the heat absorption layer 23, so that heat can be transferred to the transition layer 24 through the contact layer 22 and the heat absorption layer 23. The heat dissipation layer 25 is arranged on the side of the transition layer 24 away from the heat absorption layer 23. The heat dissipation layer 25 is made of graphene material, and the thermal resistance is extremely small, so that heat can be transferred to the heat dissipation layer 25 for heat dissipation. The heat absorption layer 23, the transition layer 24, and the heat dissipation layer 25 are all installed between the adhesive layer 11 and the protective layer 14 so that they fit closely. The heat dissipation mechanism 2 also includes a first adhesive layer 231, a second adhesive layer 241, and a third adhesive layer 251. The first adhesive layer 231 is arranged between the heat absorption layer 23 and the transition layer 24, and is used to fix the heat absorption layer 23 and the transition layer 24 to prevent separation, so as to facilitate heat transfer. The second adhesive layer 241 is arranged between the transition layer 24 and the heat dissipation layer 25, and is used to fix the transition layer 24 and the heat dissipation layer 25 to prevent separation, so as to facilitate heat transfer. The third adhesive layer 251 is arranged between the third adhesive layer 251 and the protective layer 14, and is used to fix the heat absorption layer 23 and the transition layer 24 to prevent separation. The heat dissipation mechanism 2 also includes a plurality of heat dissipation micropores 26 opened on the protective layer 14, and the heat dissipation micropores 26 are equidistantly distributed. The opening of the heat dissipation micropores 26 facilitates the heat on the heat dissipation layer 25 to be dissipated through the heat dissipation micropores 26, so as to achieve the purpose of heat dissipation.
[0027] In this embodiment, when in use, the release paper 12 is peeled off, and then the wrapping layer 13 and the protective layer 14 are pasted to the object through the adhesive layer 11, and pressed tightly. At this time, the object is tightly fitted with the contact layer 22. Since the contact layer 22 and the heat absorption layer 23 are made of pure copper, the heat of the object is conducted to the heat absorption layer 23 through the contact layer 22. Since the transition layer 24 is made of silicon nitride material and the heat dissipation layer 25 is made of graphene material, the thermal resistance decreases from copper to silicon nitride and then to graphene, so that the heat can be quickly conducted to the heat dissipation layer 25, and through the heat dissipation micropores 26 opened on the protective layer 14, the heat of the heat dissipation layer 25 can be dissipated through the heat dissipation micropores 26, so as to achieve the purpose of heat dissipation, ensure the discharge of heat at the pasting position, improve the performance and reliability of the device, and protect the device from overheating damage.
[0028] The above specific embodiment is only an optional embodiment of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above embodiment, those skilled in the art can make various alternative improvements and combinations to the above specific embodiment.
Claims
1. An acrylic tape with low thermal resistance, characterized in that: include: A main body (1), the main body (1) comprising an adhesive backing layer (11), a release paper (12) being arranged on one side of the adhesive backing layer (11), the main body (1) further comprising a wrapping layer (13) being arranged on a side of the adhesive backing layer (11) away from the release paper (12), the side of the wrapping layer (13) away from the adhesive backing layer (11) being further connected to a protective layer (14); A heat dissipation mechanism (2) for dissipating heat, the heat dissipation mechanism (2) being arranged on a side of the adhesive layer (11) away from the release paper (12), the heat dissipation mechanism (2) comprising a plurality of mounting grooves (21) provided in the adhesive layer (11), a contact layer (22) being installed in the mounting grooves (21), the contact layer (22) comprising a heat absorbing block (221) arranged in the mounting grooves (21), a heat conducting plate (222) fixedly connected to the heat absorbing block (221) being also installed on a side of the adhesive layer (11) away from the release paper (12), the heat conducting plate (222) being located on a side of the adhesive layer (11) away from the release paper (12), the heat dissipation mechanism (2) comprising a plurality of mounting grooves (21) provided in the mounting grooves (21), The heat dissipation mechanism (2) further comprises a heat absorption layer (23), a transition layer (24), and a heat dissipation layer (25); the heat absorption layer (23) is arranged on a side of the contact layer (22) away from the release paper (12); the transition layer (24) is arranged on a side of the heat absorption layer (23) away from the contact layer (22); the heat dissipation layer (25) is arranged on a side of the transition layer (24) away from the heat absorption layer (23); the heat absorption layer (23), the transition layer (24), and the heat dissipation layer (25) are all installed between the back adhesive layer (11) and the protective layer (14); and the heat dissipation mechanism (2) further comprises a plurality of groups of heat dissipation micropores (26) provided on the protective layer (14); and the heat dissipation micropores (26) are equidistantly distributed.
2. The acrylic tape with low thermal resistance according to claim 1, characterized in that: One side of the contact layer (22) is embedded in the heat absorption layer (23).
3. The acrylic tape with low thermal resistance according to claim 1, characterized in that: The heat dissipation mechanism (2) further comprises a first adhesive layer (231), a second adhesive layer (241), and a third adhesive layer (251); the first adhesive layer (231) is arranged between the heat absorption layer (23) and the transition layer (24); the second adhesive layer (241) is arranged between the transition layer (24) and the heat dissipation layer (25); and the third adhesive layer (251) is arranged between the third adhesive layer (251) and the protective layer (14).
4. The acrylic tape with low thermal resistance according to claim 1, characterized in that: The contact layer (22) and the heat absorption layer (23) are both made of pure copper material, the transition layer (24) is made of silicon nitride material, and the heat dissipation layer (25) is made of graphene material.
5. The acrylic tape with low thermal resistance according to claim 1, characterized in that: The wrapping layer (13) and the protective layer (14) are both made of acrylic material.