Chip bearing device and sequencing equipment

Abstract

The utility model relates to the technical field of chip sequencing, and discloses a chip bearing device and sequencing equipment, the chip bearing device comprises a pedestal, the lower side of the pedestal is provided with a mounting groove, and the groove bottom of the mounting groove is provided with a communication groove penetrating through the pedestal along the longitudinal direction; the chip table is detachably connected to the upper side of the table base; the semiconductor chilling plate is located in the communicating groove and attached to the bottom wall of the chip table; the heat dissipation assembly is located on the lower side of the semiconductor chilling plate; and the elastic piece is arranged between the heat dissipation assembly and the bottom plate and is suitable for tightly pressing the semiconductor chilling plate towards the direction of the chip table. According to the utility model, the problem that the sequencing result is influenced due to deformation caused by non-uniform temperature at the chip table is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip sequencing, and in particular to a chip carrying device and sequencing equipment. Background Art

[0002] Gene sequencing is a new gene detection technology that can analyze gene sequences from blood and saliva, and thus facilitate the analysis of gene sequences, which is of great significance to the fields of biology and medicine. The chip stage and semiconductor refrigerator are both core components of modern chip sequencing equipment. The chip stage is mainly used to carry the chip to allow samples to interact with reagents, and the semiconductor refrigerator is mainly used to control the temperature of the chip.

[0003] In the related art, the semiconductor cooling sheet is attached to the bottom of the chip stage and is directly mounted on the chip stage by bolts.

[0004] However, since the bolts are good conductors of heat and the two ends of the bolts are located on the hot and cold sides of the semiconductor refrigerator respectively, it is easy to cause the cooling effect of the refrigerator to decrease, shorten the life of the refrigerator, and make the temperature at the chip stage uneven, causing the chip stage and chip to deform, affecting the sequencing results. Utility Model Content

[0005] In view of this, the utility model provides a chip carrier and a sequencing device to solve the problems of reduced cooling effect and life of the cooling plate, and deformation of the chip stage due to uneven temperature, which affects the sequencing results.

[0006] In the first aspect, the utility model provides a chip carrier device, comprising: a seat, having a mounting groove on the lower side, the bottom of the mounting groove having a connecting groove passing through the seat; a chip stage, detachably connected to the upper side of the seat; a semiconductor cooling plate, located in the connecting groove and fitted with the bottom wall of the chip stage; a heat dissipation component, located on the lower side of the semiconductor cooling plate; a bottom plate, located on the lower side of the heat dissipation component and fixedly connected to the bottom wall of the seat; an elastic member, spaced between the heat dissipation component and the bottom plate, suitable for pressing the semiconductor cooling plate toward the chip stage.

[0007] Beneficial effects: by setting up a base and locating the semiconductor refrigeration plate in the connecting groove, the cold end of the semiconductor refrigeration plate and the chip stage are located on the upper side of the base, and the hot end of the semiconductor refrigeration plate, the heat dissipation component and the bottom plate are located on the lower side of the base, the structure located at the cold end of the semiconductor refrigeration plate is isolated from the structure located at the hot end of the semiconductor refrigeration plate, and by connecting the chip stage to the upper side of the base, the base supports the semiconductor refrigeration plate and the heat dissipation component and is connected to the lower side of the chip stage, thereby avoiding direct heat conduction between the cold end structure of the semiconductor refrigeration plate and the hot end structure of the semiconductor refrigeration plate, thereby reducing deformation of the chip stage due to uneven temperature, and avoiding the reduction in the effect and life of the semiconductor refrigeration plate. In addition, since there is no direct connection between the semiconductor refrigeration plate and the heat dissipation component and the base, and the chip stage is directly installed on the base, when deformation occurs, the semiconductor refrigeration plate and the heat dissipation component can be deformed and transmitted downward, and the deformation is absorbed by the elastic member, thereby avoiding the deformation from being transmitted to the chip stage, causing the chip stage to deform and affecting the sequencing results.

[0008] In an optional embodiment, it further includes a plurality of limit rods, which are located on a side of the heat dissipation assembly away from the semiconductor refrigeration plate. The elastic member includes a plurality of elastic members, which are respectively mounted on the plurality of limit rods. The base plate and one of the heat dissipation assembly are connected to the limit rod, and the other is provided with a mounting hole for the limit rod to pass through.

[0009] Beneficial effect: The elastic part is limited by the limit rod, which reduces the displacement and flipping of the elastic part during operation, which may lead to the failure of the elastic part. At the same time, the end of the limit rod is inserted into the mounting hole, which also limits the relative position between the heat dissipation component and the base plate, avoiding the displacement of the heat dissipation component during the deformation process of thermal expansion and contraction, and the possibility of accumulation of displacement and structural disintegration during long-term use.

[0010] In an optional implementation, the limiting rod is fixed on the heat dissipation assembly, and the mounting hole is provided on the base plate.

[0011] Beneficial effect: By setting the mounting hole on the base plate and passing the limiting rod set on the heat dissipation assembly through the mounting hole, when the displacement caused by the deformation is absorbed by the elastic member, the limiting rod moves downward with the heat dissipation assembly. Compared with the solution in which the mounting hole is set on the heat dissipation assembly, the space occupied in the mounting slot is reduced, and the occurrence of structural interference is reduced.

[0012] In an optional embodiment, the upper side of the base has a receiving groove, the receiving groove is arranged opposite to the installation groove and is connected to the connecting groove, and the chip stage is located in the receiving groove and is detachably connected to the groove bottom.

[0013] Beneficial effect: By setting the accommodating groove to limit the installation position of the chip stage, the possibility of the chip stage protruding from the surface of the platform and causing interference can be avoided, and the structure of the platform can be made more compact, thereby improving space utilization.

[0014] In an optional embodiment, the heat dissipation assembly includes a heat dissipation block and a water cooling block, the water cooling block is mounted on the heat dissipation block, and the semiconductor refrigeration sheet abuts against the heat dissipation block.

[0015] Beneficial effect: The heat dissipation component adopts a combination of a heat dissipation block and a water cooling block, which can more efficiently discharge the heat from the hot end of the semiconductor refrigeration plate, avoiding the situation where heat accumulation causes the working efficiency of the semiconductor refrigeration plate to decrease.

[0016] In an optional embodiment, the heat sink has a plurality of heat sinks on a side away from the semiconductor refrigeration plate, the heat sink has a receiving cavity suitable for accommodating the heat sink, the water cooling block closes the receiving cavity, and the water cooling block is provided with a water inlet and a water outlet connected to the receiving cavity.

[0017] Beneficial effect: By arranging the heat sink and the water cooling block together, the heat sink quickly conducts the temperature of the hot end of the semiconductor refrigeration plate, and the water cooling block quickly takes away the heat conducted to the heat sink through the flowing medium, thereby achieving efficient heat dissipation.

[0018] In an optional embodiment, a drainage block is provided on the water cooling block, the drainage block passes through and extends out of the bottom plate, and the water inlet and the water outlet are both located on the drainage block and on the side where the drainage block extends out of the bottom plate.

[0019] Beneficial effect: By providing a drainage block and making the drainage block pass through and extend out of the bottom plate, it is convenient for workers to install and remove the water pipes of the water cooling block, avoiding the situation where workers operate the water pipes in a small space.

[0020] In an optional embodiment, two limit bars are provided on a side of the heat dissipation block facing the semiconductor cooling plate, and the semiconductor cooling plate is located between the two limit bars and respectively abuts against the two limit bars.

[0021] Beneficial effect: During installation, the semiconductor refrigeration plate and the heat sink are pressed tightly to ensure good heat transfer effect. At the same time, two limit strips are used to limit the relative position between the semiconductor refrigeration plate and the heat sink to avoid the possibility of the semiconductor refrigeration plate deviating from its original position under the pressing force.

[0022] In an optional embodiment, the seat has connecting grooves on two opposite sides suitable for connecting to a manifold block, and the groove walls of the connecting grooves have reagent delivery holes extending toward the chip stage.

[0023] Beneficial effect: By setting a connecting groove on the base, the reagent delivery structure of the manifold block is integrated with the chip stage on the base, so there is no need to set up a reagent delivery structure and reagent delivery pipeline separately, which improves space utilization and reduces the total number of parts assembled in the equipment, reduces assembly time, and thus improves convenience.

[0024] In an optional embodiment, a temperature sensor is provided at the heat dissipation component, and the temperature sensor is suitable for monitoring the temperature at the heat dissipation component.

[0025] Beneficial effect: By setting a temperature sensor to monitor the temperature of the heat dissipation component in real time, the staff can monitor the working status of the semiconductor refrigerator, which is helpful to prevent the semiconductor refrigerator from being overloaded, causing errors in sequencing results and reducing the life of the semiconductor refrigerator.

[0026] In an optional embodiment, the elastic member is a disc spring, and the semiconductor cooling sheet is a semiconductor cooling sheet.

[0027] Beneficial effects: The disc spring has a large deformation capacity per unit volume, has a good deformation range in a small space, and can provide continuous and reliable pressure for the semiconductor cooling plate to press against the chip table.

[0028] In a second aspect, the utility model further provides a sequencing device, including: the above-mentioned chip carrying device.

[0029] Beneficial effect: The semiconductor refrigeration sheet and the heat dissipation component are arranged between the chip stage and the base plate, and the chip stage and the base are fastened together, and at the same time, they cooperate with the elastic part to realize the compression and heat transfer between the chip stage and the refrigeration sheet, thereby avoiding the situation where the semiconductor refrigeration sheet or the heat dissipation component is directly installed on the chip stage by bolts, which causes the heat transfer to affect the sequencing results. At the same time, when deformation occurs due to temperature changes, the deformation is transferred to the elastic part through the slight displacement of the semiconductor refrigeration sheet and the heat dissipation component, and the deformation is absorbed by the elastic part, thereby further avoiding the possibility that the deformation of the chip stage and the chip affects the sequencing results. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 This is a schematic diagram of the exploded structure of a chip carrier device according to an embodiment of the utility model;

[0032] Figure 2 for Figure 1 A schematic diagram of a top-down perspective;

[0033] Figure 3 The figure is a schematic cross-sectional structure diagram of a chip carrying device according to an embodiment of the utility model.

[0034] Description of reference numerals:

[0035] 100, base; 101, mounting groove; 102, connecting groove; 103, connecting groove; 104, accommodating groove; 1041, positioning groove; 200, chip stage; 201, positioning ear; 202, covering groove; 300, semiconductor cooling plate; 400, heat dissipation component; 401, limiting rod; 402, heat dissipation block; 4021, limiting strip; 4022, heat sink; 403, water cooling block; 4031, drainage block; 404, water outlet, 405, water inlet; 500, bottom plate; 501, mounting hole; 600, elastic member. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0037] The chip sequencer is one of the main instruments used in gene sequencing. Its main functions include heating and cooling gene chips, transporting reagents and samples and making them undergo biochemical reactions with gene chips, taking pictures of the chip reaction results and analyzing the photographed results. Therefore, the chip sequencer generally includes a chip platform that carries the gene chip and provides a reaction site for the gene chip, a manifold device for transporting reagents and samples, a semiconductor refrigerator for controlling the temperature of the chip platform, and other functional structures.

[0038] In some sequencers in the related art, since the semiconductor refrigerator needs to be attached to the chip stage for efficient heat exchange with the chip stage, the hot end structure of the semiconductor refrigerator is directly connected to the chip stage by bolts, thereby pressing the semiconductor refrigerator against the chip stage.

[0039] However, since the bolts themselves have good thermal conductivity, the structure at the hot end of the semiconductor refrigeration plate can easily transfer heat to the chip stage, causing the chip stage, which has a lower temperature, to rise in temperature near the bolts, causing the chip stage and the gene chip placed on the chip stage to deform, affecting the photography results, thereby causing inaccurate sequencing results and other adverse situations.

[0040] The present application proposes a chip carrier device, which isolates the structure at the cold end of the semiconductor refrigeration plate from the structure at the hot end by adjusting the layout and connection relationship of the installation structure, and blocks the transfer of heat by avoiding direct connection between the two parts of the structure, thereby reducing the adverse conditions caused by heat conduction to the chip stage.

[0041] Combine the following Figures 1 to 3 , describing an embodiment of the utility model.

[0042] According to an embodiment of the present utility model, on the one hand, refer to Figures 1 to 3 , provides a chip carrier device, including: a base 100, having a mounting groove 101 on the lower side, the bottom of the mounting groove 101 having a connecting groove 102 that passes through the base 100 in the longitudinal direction; a chip stage 200, detachably connected to the upper side of the base 100; a semiconductor cooling plate 300, located in the connecting groove 102 and attached to the bottom wall of the chip stage 200; a heat dissipation component 400, located on the lower side of the semiconductor cooling plate 300; a bottom plate 500, located on the lower side of the heat dissipation component 400 and fixedly connected to the bottom wall of the base 100; a plurality of elastic members 600, spaced between the heat dissipation component 400 and the bottom plate 500, suitable for pressing the semiconductor cooling plate 300 toward the chip stage 200.

[0043] It should be noted that the semiconductor refrigeration sheet 300 may be a semiconductor refrigeration sheet having a cold end and a hot end, and its main function includes transferring the heat from the cold end to the hot end, thereby controlling the temperature of the chip stage 200. In some embodiments not shown, it may also be other devices with heat transfer function. This embodiment does not limit the specific structure of the heat dissipation component 400. The heat dissipation component 400 may be a water-cooled radiator. In some embodiments not shown, the heat dissipation component 400 may also be an air-cooled radiator or other structures with heat dissipation function. In the case where the heat dissipation component 400 is a water-cooled heat dissipation component 400, a connection block with a water inlet is provided on the heat dissipation component 400 and extends downward, and a clearance groove is provided on the bottom plate 500 for the connection block to pass through the clearance groove and extend out of the mounting groove 101, thereby facilitating the connection of the cooling water pipe.

[0044] In addition, specifically, the bottom plate 500 is fixedly mounted on the bottom wall of the pedestal 100 by fasteners, and the fasteners may be screws, or may be parts with fastening functions such as bolts and pins.

[0045] In this embodiment, by setting the pedestal 100, and positioning the semiconductor cooling sheet 300 in the connecting groove 102, positioning the cold end of the semiconductor cooling sheet 300 and the chip stage 200 on the upper side of the pedestal 100, positioning the hot end of the semiconductor cooling sheet 300, the heat dissipation assembly 400, and the bottom plate 500 on the lower side of the pedestal 100, the structure at the cold end of the semiconductor cooling sheet 300 is isolated from the structure at the hot end of the semiconductor cooling sheet 300, and by connecting the chip stage 200 to the upper side of the pedestal 100, the base supports the semiconductor cooling sheet 300 and the heat dissipation assembly 400 and is connected to the lower side of the chip stage 200, thereby avoiding the cold end structure of the semiconductor cooling sheet 300 from being in contact with the semiconductor cooling sheet 300. Direct heat conduction between the hot end structure of the semiconductor cooling plate 300 reduces deformation of the chip stage 200 due to uneven temperature, and avoids the reduction in the effect and life of the semiconductor cooling plate 300. In addition, since there is no direct connection between the semiconductor cooling plate 300 and the heat dissipation component 400 and the base 100, and the chip stage 200 is directly installed on the base 100, when deformation occurs, the semiconductor cooling plate 300 and the heat dissipation component 400 can transfer the deformation downward, and the elastic member 600 will absorb the deformation, thereby avoiding the deformation from being transferred to the chip stage 200, causing the chip stage 200 to deform and affect the sequencing results.

[0046] Specifically, the chip stage 200 can be rectangular, and the four corners of the chip stage 200 are connected to the pedestal 100 by screws. The shape of the connecting groove 102 matches the shape of the semiconductor cooling plate 300. The semiconductor cooling plate 300 is located in the connecting groove 102, and the two ends in the thickness direction extend from the notch of the connecting groove 102 by an equal distance. The bottom plate 500 covers the notch of the mounting groove 101 and is connected to the bottom wall of the pedestal 100 by screws. The pedestal 100 is made of a polymer material with a heat-insulating effect, thereby further reducing the heat transfer between the structure at the cold end and the structure at the hot end of the semiconductor cooling plate 300.

[0047] In one embodiment, it also includes a plurality of limit rods 401, which are located on the side of the heat dissipation component 400 away from the semiconductor cooling plate 300. The elastic member 600 includes a plurality of elastic members, which are correspondingly mounted on the plurality of limit rods 401. One of the base plate 500 and the heat dissipation component 400 is connected to the limit rod 401, and the other is provided with a mounting hole 501 for the limit rod 401 to pass through.

[0048] Specifically, the lower side of the heat dissipation assembly 400 is rectangular, and four limiting rods 401 are provided and distributed at the lower side of the four corners, and a set of elastic members 600 are sleeved on each limiting rod 401. As an example, the limiting rod 401 is fixed on the heat dissipation assembly 400, and the mounting hole 501 is opened on the bottom plate 500 and arranged opposite to the limiting rod 401.

[0049] In this embodiment, the elastic member 600 is limited by the limiting rod 401 to reduce the possibility of the elastic member 600 being offset and flipped during operation, which may cause the elastic member 600 to fail to function. At the same time, the end of the limiting rod 401 is inserted into the mounting hole 501 to limit the relative position between the heat dissipation component 400 and the base plate 500, thereby avoiding the position of the heat dissipation component 400 from being offset during the deformation process of thermal expansion and contraction, and avoiding the possibility of the offset accumulating during long-term use and causing the structure to disintegrate.

[0050] In one embodiment, the upper side of the base 100 has a receiving groove 104 , which is arranged opposite to the installation groove 101 and communicated with the communicating groove 102 , and the chip stage 200 is located in the receiving groove 104 and is detachably connected to the groove bottom.

[0051] Specifically, a plurality of positioning ears 201 are provided on the side wall of the chip stage 200, and a positioning groove 1041 adapted to the positioning ears 201 is provided on the groove wall of the receiving groove 104. A covering groove 202 is provided on the side of the chip stage 200 facing the semiconductor cooling sheet 300. The covering groove 202 is surrounded by a strip structure provided around the bottom surface of the chip stage 200 and the bottom wall of the chip stage 200. The covering groove 202 is a semi-enclosed structure that covers the semiconductor cooling sheet 300 from the upper side.

[0052] In this embodiment, the installation position of the chip stage 200 is limited by providing the receiving groove 104, thereby preventing the chip stage 200 from protruding from the surface of the platform 100 and causing interference, and making the structure of the platform 100 more compact and improving space utilization.

[0053] In addition, in this embodiment, by providing a positioning ear 201, it is convenient to position the chip stage 200. During installation, by matching the shape of the positioning ear 201 with the positioning groove 1041, the staff can quickly place the chip stage 200 at the designated installation position, thereby reducing the installation difficulty and improving the assembly speed.

[0054] By providing the covering groove 202 in a semi-enclosed structure to cover the semiconductor cooling plate 300, the chip stage 200 is used to limit the semiconductor cooling plate 300, thereby reducing the deviation of the semiconductor cooling plate 300 and increasing the contact area between the semiconductor cooling plate 300 and the chip stage 200, thereby improving the heat transfer efficiency between the chip stage 200 and the semiconductor cooling plate 300, thereby more efficiently controlling the temperature of the chip stage 200.

[0055] In one embodiment, the heat dissipation assembly 400 includes a heat dissipation block 402 and a water cooling block 403 . The water cooling block 403 is mounted on the heat dissipation block 402 , and the semiconductor cooling sheet 300 is in contact with the heat dissipation block 402 .

[0056] In this embodiment, the heat dissipation component 400 uses a combination of a heat dissipation block 402 and a water cooling block 403, which can more efficiently discharge the heat at the hot end of the semiconductor cooling plate 300, thereby avoiding the situation where heat accumulation causes the efficiency of the semiconductor cooling plate 300 to decrease.

[0057] In one embodiment, the heat sink 402 has a plurality of heat sinks 4022 on one side away from the semiconductor refrigeration sheet 300, the heat sink 402 has a receiving cavity suitable for receiving the heat sink 4022, the water cooling block 403 closes the receiving cavity, and the water cooling block 403 is provided with a water inlet 405 and a water outlet 404 connected to the receiving cavity.

[0058] In this embodiment, by setting up the heat sink 4022 and the water cooling block 403, the heat sink 4022 quickly conducts the temperature of the hot end of the semiconductor refrigeration plate 300, and the water cooling block 403 quickly takes away the heat conducted to the heat sink 4022 through the flowing medium, thereby achieving efficient heat dissipation.

[0059] In one embodiment, a drainage block 4031 is provided on the water cooling block 403 , and the drainage block 4031 penetrates and extends out of the bottom plate 500 . The water inlet 405 and the water outlet 404 are both located on the drainage block 4031 and on the side where the drainage block 4031 extends out of the bottom plate 500 .

[0060] In this embodiment, by providing the drainage block 4031 and allowing the drainage block 4031 to penetrate and extend out of the bottom plate 500, it is convenient for workers to install and remove the water pipes of the water cooling block 403, avoiding the situation where workers operate the water pipes in a narrow space.

[0061] In one embodiment, two limiting bars 4021 are provided on one side of the heat dissipation block 402 facing the semiconductor cooling plate 300 , and the semiconductor cooling plate 300 is located between the two limiting bars 4021 and abuts against the two limiting bars 4021 respectively.

[0062] In this embodiment, during installation, the semiconductor refrigeration plate 300 and the heat sink 402 are pressed tightly to ensure a good heat transfer effect. At the same time, two limit bars 4021 are used to limit the relative position between the semiconductor refrigeration plate 300 and the heat sink 402 to avoid the possibility of the semiconductor refrigeration plate 300 deviating from its original position under the pressing force.

[0063] In some of the above embodiments, it should be noted that the chip stage 200 is connected to the upper side of the base 100 by screws to obtain positioning, and the semiconductor refrigeration plate 300 is located in a connecting groove 102 of a matching shape and in the covering groove 202, thereby limiting its position in the horizontal direction. The upper side of the heat dissipation component 400 is limited by cooperating with the semiconductor refrigeration plate 300 through the limiting strip 4021, and the lower side of the heat dissipation component 400 is limited by the base plate 500 through the cooperation of the limiting rod 401 and the limiting hole. At the same time, the base plate 500 is connected to the base 100 by screws. Through the mutual limitation of the above components in sequence, the semiconductor refrigeration plate 300 and the refrigerator have a stable position in the horizontal direction, and then the semiconductor refrigeration plate 300 and the refrigerator are accommodated in the groove through the installation groove 101, ensuring that the semiconductor refrigeration plate 300 installation structure can work stably and reliably under long-term working conditions.

[0064] In one embodiment, two opposite sides of the base 100 are provided with connection grooves 103 suitable for connecting to the manifold block, and the groove wall of the connection groove 103 is provided with a reagent delivery hole extending toward the chip stage 200 .

[0065] In this embodiment, by providing a connecting groove 103 on the base 100, the reagent delivery structure of the manifold block and the chip stage 200 are integrated onto the base 100, thereby eliminating the need to separately provide a reagent delivery structure and a reagent delivery pipeline, thereby improving space utilization, reducing the total number of parts assembled in the equipment, reducing assembly time, and thus improving convenience.

[0066] In one embodiment, a temperature sensor is provided at the heat dissipation component 400 , and the temperature sensor is suitable for monitoring the temperature at the heat dissipation component 400 .

[0067] In this embodiment, a temperature sensor is provided to monitor the temperature at the heat dissipation component 400 in real time, so that the staff can monitor the working status of the semiconductor refrigerator 300, which is beneficial to prevent the semiconductor refrigerator 300 from being overloaded, resulting in errors in the sequencing results and a reduction in the life of the semiconductor refrigerator 300.

[0068] It should be noted that, in some of the above embodiments, the elastic member 600 is a disc spring, and the semiconductor cooling sheet 300 is a semiconductor cooling sheet.

[0069] In this embodiment, the disc spring has a large deformation capacity per unit volume, has a good deformation range in a relatively small space, and can provide continuous and reliable pressure for the semiconductor cooling plate 300 to press against the chip stage 200.

[0070] According to an embodiment of the present invention, on the other hand, a sequencing device is provided, including: the above-mentioned chip carrying device.

[0071] In this embodiment, the semiconductor cooling sheet 300 and the heat dissipation assembly 400 are arranged between the chip stage 200 and the base plate 500, and the chip stage 200 and the base are fastened and connected, and at the same time, the chip stage 200 and the cooling sheet are pressed and heat transferred in cooperation with the elastic member 600, so as to avoid the situation where the cooling sheet or the heat dissipation assembly 400 is directly installed on the chip stage 200 by bolts, resulting in heat transfer affecting the sequencing results, thereby avoiding the two technical effects of heat conduction and absorption of deformation, which are the effects of the overall structural design. At the same time, when deformation occurs due to temperature changes, the deformation is transferred to the elastic member 600 through the slight displacement of the semiconductor cooling sheet 300 and the heat dissipation assembly 400, and the deformation is absorbed by the elastic member 600, further avoiding the possibility that the chip stage 200 and the chip deformation affect the sequencing results.

[0072] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A chip carrier device, characterized in that: include: A pedestal (100) having a mounting groove (101) on its lower side, wherein the bottom of the mounting groove (101) has a connecting groove (102) penetrating the pedestal (100); A chip stage (200) detachably connected to the upper side of the stage (100); A semiconductor cooling sheet (300) is located in the connecting groove (102) and is attached to the bottom wall of the chip stage (200); A heat dissipation component (400) is located at the lower side of the semiconductor cooling sheet (300); A bottom plate (500), located at the lower side of the heat dissipation assembly (400) and fixedly connected to the bottom wall of the pedestal (100); The elastic member (600) is arranged between the heat dissipation component (400) and the bottom plate (500) at intervals, and is suitable for pressing the semiconductor cooling sheet (300) toward the chip stage (200).

2. The chip carrier device according to claim 1, characterized in that: It also includes a plurality of limit rods (401), which are located on a side of the heat dissipation component (400) away from the semiconductor cooling plate (300), and the elastic member (600) includes a plurality of elastic members, which are sleeved on the plurality of limit rods (401) in a one-to-one correspondence. One of the base plate (500) and the heat dissipation component (400) is connected to the limit rod (401), and the other is provided with a mounting hole (501) for the limit rod (401) to pass through.

3. The chip carrier device according to claim 2, characterized in that: The limiting rod (401) is fixedly mounted on the heat dissipation assembly (400), and the mounting hole (501) is disposed on the bottom plate (500).

4. The chip carrier device according to claim 1, characterized in that: The upper side of the base (100) has a receiving groove (104), the receiving groove (104) is arranged opposite to the installation groove (101) and is connected to the connecting groove (102), and the chip stage (200) is located in the receiving groove (104) and is detachably connected to the bottom of the receiving groove (104).

5. The chip carrier device according to claim 1, characterized in that: The heat dissipation assembly (400) comprises a heat dissipation block (402) and a water cooling block (403); the water cooling block (403) is mounted on the heat dissipation block (402); and the semiconductor cooling sheet (300) is in abutment with the heat dissipation block (402).

6. The chip carrier device according to claim 5, characterized in that: The heat dissipation block (402) has a plurality of heat dissipation fins (4022) on a side away from the semiconductor refrigeration fin (300), the heat dissipation block (402) has a receiving cavity suitable for receiving the heat dissipation fins (4022), the water cooling block (403) closes the receiving cavity, and the water cooling block (403) is provided with a water inlet (405) and a water outlet (404) connected to the receiving cavity.

7. The chip carrier device according to claim 6, characterized in that: The water cooling block (403) is provided with a drainage block (4031), and the drainage block (4031) passes through and extends out of the bottom plate (500). The water inlet (405) and the water outlet (404) are both located on the drainage block (4031) and on the side where the drainage block (4031) extends out of the bottom plate (500).

8. The chip carrier device according to claim 5, characterized in that: Two limit bars (4021) are provided on one side of the heat dissipation block (402) facing the semiconductor cooling plate (300); the semiconductor cooling plate (300) is located between the two limit bars (4021) and respectively abuts against the two limit bars (4021).

9. The chip carrier device according to any one of claims 1 to 8, characterized in that: The elastic member (600) is a disc spring.

10. A sequencing device, characterized in that: include: The chip carrier device according to any one of claims 1 to 9.

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