Optical device meeting working temperature condition application

Abstract

The utility model relates to an optical device satisfying working temperature condition application, comprising a VCSEL laser, a TO pedestal, a TO cap, a turning prism and a backlight monitoring assembly, the VCSEL laser and the turning prism are both arranged on the TO pedestal and are both packaged in a packaging cavity formed by the TO pedestal and the TO cap; the light inlet end of the turning prism is located on the laser emitting path of the VCSEL laser, the turning prism defines a front light emitting path and a backlight emitting path, and the backlight monitoring assembly is located on the backlight emitting path. According to the utility model, TO packaging and TO airtight packaging are carried out on the VCSEL laser, so that the high-speed optical module based on multimode optical fiber transmission can be applied to a front transmission working temperature condition, the application of the high-speed optical module in the 5G front transmission field can be realized, front light transmission and independent backlight receiving are realized by adopting the turning prism, reflection is avoided, an optical path is simple, and the optical path is compact. And the problems of difficulty in backlight receiving and the like of the TO-packaged VCSEL laser can be well solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of optical communication, and in particular relates to an optical device that meets the application of working temperature conditions. Background Art

[0002] In the 5G era, 50G optical modules will be adopted on a large scale. Currently, the 50G-SFP56-LR solution and industrial chain have matured and have begun small-batch testing. With the subsequent development and allocation of optical fiber resources, the reference 25G products will evolve into 50G-SFP56-CWDM6, 50G-SFP56-LWDM12, 50G-SFP56-MWDM12 color optical and 50G-SFP56-BIDI, 50G-SFP56-industrial temperature SR and other products. In the field of 5G fronthaul alone, the demand for 25G / 50G optical modules will reach tens of millions, and the mid-haul field is also a new growth point. The 50G optical modules based on single-mode optical fiber transmission are mainly concentrated in the fields of wireless fronthaul and Ethernet transmission, and multi-mode SR products are missing.

[0003] Therefore, in order to meet the demand for the next generation of 5G fronthaul products, it is necessary to develop 50G SR optical modules and meet the requirements of working temperature applications. Existing VCSELs are generally non-hermetic COB packages, which cannot meet the working temperature environment of fronthaul. Although TO hermetic packages can meet the working temperature conditions (-45 to 85°C), they are generally suitable for side-emitting lasers such as DFB. When used for VCSEL lasers, there will be problems such as complex optical paths and difficulty in backlight reception. Utility Model Content

[0004] The utility model relates to an optical device that meets the application conditions of working temperature and can at least solve some defects of the prior art.

[0005] The utility model relates to an optical device that meets the application of working temperature conditions, comprising a VCSEL laser, a TO base, a TO cap, a turning prism and a backlight monitoring component. The VCSEL laser and the turning prism are both arranged on the TO base and are both packaged in a packaging cavity formed by the TO base and the TO cap. The light input end of the turning prism is located on the laser emission path of the VCSEL laser, the turning prism defines a front light emission path and a backlight emission path, and the backlight monitoring component is located on the backlight emission path.

[0006] As one of the implementation modes, the VCSEL laser is connected to the TO base by gold wire bonding.

[0007] As one of the implementation modes, a refrigerator is also provided in the packaging cavity.

[0008] As one of the implementation modes, the cooler is arranged on the TO base, and the VCSEL laser is connected to the cooler via a heat conduction structure.

[0009] As one of the implementation modes, the refrigerator is a TEC refrigerator.

[0010] As one of the implementation modes, a temperature monitoring unit is further provided in the packaging cavity, and the temperature monitoring unit is interlocked with the refrigerator.

[0011] As one of the implementation modes, a transition block is provided on the TO base, and the VCSEL laser, the turning prism and the backlight monitoring component are all arranged on the transition block.

[0012] As one of the implementation modes, the transition block is a tungsten-copper transition block.

[0013] As one of the implementation modes, the optical device further includes a pin assembly, and the pin assembly is connected to the TO packaging structure through an adjustment ring.

[0014] As one of the implementation modes, the TO cap is a non-spherical tube cap.

[0015] The utility model has at least the following beneficial effects:

[0016] In the utility model, the VCSEL laser is TO-packaged. The TO hermetic packaging can be suitable for the fronthaul working temperature conditions, and can realize the application of high-speed optical modules based on multi-mode optical fiber transmission in the 5G fronthaul field. A turning prism is used to realize frontlight transmission and backlight separate reception. The optical path is simple, and the problem of difficulty in backlight reception in TO-packaged VCSEL lasers can be well solved, and the problem of signal degradation caused by light beam reflection in the TO packaging technology of VCSEL lasers in the current market can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the structure of an optical device provided in an embodiment of the utility model;

[0019] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0020] Figure 3An exploded schematic diagram of a TO packaging structure provided by an embodiment of the utility model;

[0021] Figure 4 Schematic diagram of the component layout on the TO base. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] like Figure 3 and Figure 4 The embodiment of the utility model provides an optical device that meets the application of working temperature conditions, including a VCSEL laser 103, and also includes a TO base 101, a TO cap 102, a turning prism 104 and a backlight monitoring component 105. The VCSEL laser 103 and the turning prism 104 are both arranged on the TO base 101 and are both packaged in a packaging cavity formed by the TO base 101 and the TO cap 102. The light input end of the turning prism 104 is located on the laser emission path of the VCSEL laser 103. The turning prism 104 defines a front light emission path and a backlight emission path. The backlight monitoring component 105 is located on the backlight emission path.

[0024] In this embodiment, the VCSEL laser 103 is TO-packaged. The TO hermetic packaging can be suitable for the fronthaul working temperature conditions, and can realize the application of high-speed optical modules based on multi-mode optical fiber transmission in the 5G fronthaul field. The turning prism 104 is used to realize front light transmission and backlight separate reception. The optical path is simple, which can better solve the problems such as the difficulty in backlight reception of the TO-packaged VCSEL laser 103, and avoid the degradation of the signal caused by the light beam reflection in the TO packaging technology of the VCSEL laser in the current market.

[0025] In this embodiment, the working temperature condition is generally an ambient temperature in the range of -45 to 85°C.

[0026] In one embodiment, the VCSEL laser 103 is connected to the TO base 101 by gold wire bonding. Based on this structure, the use of a ceramic substrate can be avoided, thereby improving the signal integrity of the optical device and reducing the cost.

[0027] Preferably, the light outlet of the TO cap 102 is located on the front light transmission path, and the signal light output by the turning prism 104 is output forward and enters the optical fiber through the TO cap 102 .

[0028] In one embodiment, the TO cap 102 is a non-spherical cap.

[0029] The electrical signal enters from the TO base 101 and is directly loaded into the VCSEL laser 103. The VCSEL laser 103 emits a signal light and enters from the first prism surface of the turning prism 104. The light beam passes through the turning prism 104 and is divided into two paths. One path is output from the second prism surface of the turning prism 104 and is transmitted forward into the optical fiber as a signal light. The other path is output from the third prism surface of the turning prism 104 and is received by the backlight monitoring component 105 as backlight to achieve backlight monitoring. Figure 4 In the structure shown, the front light transmission direction is perpendicular to the TO base 101 .

[0030] In one embodiment, the backlight monitoring component 105 includes an MPD chip that receives backlight and converts it into a monitoring current.

[0031] Preferably, a refrigerator is also provided in the packaging cavity, which is mainly used to control the VCSEL laser 103 to work at a suitable temperature, so as to ensure the working stability and reliability of the VCSEL laser 103 and the optical device.

[0032] In one embodiment, the refrigerator is disposed on the TO base 101, and the VCSEL laser 103 is connected to the refrigerator via a heat conduction structure.

[0033] The above-mentioned cooler includes but is not limited to the TEC cooler 106, which has the characteristics of reliable cooling and compact structure, and is suitable for cooling in a TO package. Figure 4 The TEC cooler 106 is mounted on the TO base 101 , the VCSEL laser 103 is located above the TEC cooler 106 , and the heat conduction structure is located between the VCSEL laser 103 and the TEC cooler 106 .

[0034] In one embodiment, if Figure 4 The pins of the TO base 101 are distributed around the cooler, which is convenient for the connection of signal lines and the arrangement of components such as the cooler and the VCSEL laser 103.

[0035] Further preferably, a temperature monitoring unit 108 is further provided in the packaging cavity, and the temperature monitoring unit 108 is interlocked with the refrigerator to improve the temperature control reliability and accuracy of the refrigerator. In one embodiment, the temperature monitoring unit 108 is a thermistor.

[0036] In one embodiment, if Figure 4A transition block 107 is provided on the TO base 101 , and the VCSEL laser 103 , the turning prism 104 and the backlight monitoring component 105 are all arranged on the transition block 107 .

[0037] In the above scheme with a refrigerator, the transition block 107 is optionally used as a heat conduction structure, for example, the transition block 107 is connected to the upper surface of the TEC refrigerator 106. When a temperature monitoring unit 108 is provided, the temperature monitoring unit 108 is preferably arranged on the transition block 107. The above transition block 107 includes but is not limited to a tungsten copper transition block 107.

[0038] In one embodiment, if Figure 1 and Figure 2 The optical device further includes a pin assembly 300 , and the pin assembly 300 is connected to the TO packaging structure 100 through an adjustment ring 200 .

[0039] The TO packaging structure 100 includes a packaging structure formed by connecting a TO base 101 and a TO cap 102 and various components to be packaged.

[0040] The adjustment ring 200 is used to realize the connection between the TO packaging structure 100 and the pin assembly 300, and is also used to adjust the focal length.

[0041] The above-mentioned pin assembly 300 preferably adopts a metal multi-mode pin assembly 300, wherein the pin assembly 300, the adjustment ring 200 and the TO packaging structure 100 are preferably coupled and welded. This three-piece coupling welding operation can use the existing single-mode process platform, thereby reducing the preparation cost.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An optical device that meets the application of working temperature conditions, including a VCSEL laser, Features: It also includes a TO base, a TO cap, a turning prism and a backlight monitoring component. The VCSEL laser and the turning prism are both arranged on the TO base and are both packaged in a packaging cavity formed by the TO base and the TO cap. The light input end of the turning prism is located on the laser emission path of the VCSEL laser. The turning prism defines a front light emission path and a backlight emission path. The backlight monitoring component is located on the backlight emission path.

2. The optical device according to claim 1, Features: The VCSEL laser is connected to the TO base by gold wire bonding.

3. The optical device according to claim 1, Features: A refrigerator is also arranged in the packaging cavity.

4. The optical device according to claim 3, Features: The refrigerator is arranged on the TO base, and the VCSEL laser is connected to the refrigerator via a heat conduction structure.

5. The optical device according to claim 3, Features: The refrigerator is a TEC refrigerator.

6. The optical device according to claim 3, Features: A temperature monitoring unit is also provided in the packaging cavity, and the temperature monitoring unit is interlocked with the refrigerator.

7. The optical device according to claim 1, Features: A transition block is provided on the TO base, and the VCSEL laser, the turning prism and the backlight monitoring component are all arranged on the transition block.

8. The optical device according to claim 7, Features: The transition block is a tungsten-copper transition block.

9. The optical device according to claim 1, Features: It also includes a pin assembly, which is connected to the TO packaging structure through an adjusting ring.

10. The optical device according to claim 1, Features: The TO cap is a non-spherical tube cap.

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