Vapor chamber radiator

Abstract

The utility model relates to the technical field of projectors, and discloses a vapor chamber radiator, which comprises a vapor chamber, a heat pipe and a radiating block. A heat conduction part is arranged in the center of the bottom end of the vapor chamber, and the heat conduction part and the vapor chamber are used for heat conduction of the DMD; the heat pipe is arranged on the vapor chamber and used for conducting heat of the vapor chamber; the heat dissipation block is arranged on one side of the vapor chamber, connected with the heat pipe and used for heat dissipation of the heat pipe. A first cavity is formed in the vapor chamber; a second cavity is formed in the heat conduction part, and the first cavity is communicated with the second cavity. Through the arrangement of the vapor chamber, the heat pipe and the heat dissipation block, heat on the DMD is transferred into the vapor chamber through the heat conduction part on the vapor chamber, the first cavity is communicated with the second cavity, so that the heat transfer path is changed from peripheral diffusion to overall upward direct transfer to the heat pipe, and then the heat is transferred to the heat dissipation block through the heat pipe; the heat transfer path is shortened, the transfer efficiency is improved, and the heat dissipation efficiency of the radiator is improved due to the fact that the internal circulation is formed, and the thermal resistance is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of projectors, in particular to a heat spreader radiator. Background Art

[0002] Digital micromirror device, or DMD for short, is an important digital optical device currently used in projectors. It reflects light through tens of thousands of tiny controllable lenses to form images. The light emitted by the light source in the projector shines on the DMD, which will increase the temperature of the DMD. At the same time, the large number of control circuits integrated on the DMD will also generate considerable heat when working, causing the temperature of the DMD to rise. Excessive temperature will reduce the service life of the DMD and may even cause damage to the DMD.

[0003] Therefore, the DMD needs to be provided with a heat dissipation structure to ensure that it works in a rated temperature working environment to ensure its performance and service life.

[0004] like Figure 1 The current heat sink generally includes a heat sink block, a solid copper substrate and a boss arranged on the solid copper substrate. The solid copper substrate serves as a heat conducting material between the heat source and the heat sink. The boss contacts the heat source and transfers the heat to the solid copper substrate. The heat is then transferred to the heat sink block through the solid copper substrate, thereby achieving heat dissipation of the DMD. However, the heat dissipation effect of the existing heat sink is poor. The heat is transferred to the copper substrate through the boss. Since the copper substrate is a solid structure, the heat will diffuse along the four sides of the copper substrate, the heat transfer path will become longer, the thermal resistance will become larger, and the heat dissipation efficiency will be reduced.

[0005] Therefore, a vapor chamber heat sink is urgently needed to solve the above problems. Utility Model Content

[0006] Based on the above, the purpose of the utility model is to provide a heat spreader radiator to solve the problem that the existing radiator has poor heat dissipation effect, the heat is transferred to the copper base plate through the boss, the heat will diffuse along the four sides of the copper base plate, the heat transfer path will become longer, the thermal resistance will become larger, and the heat dissipation efficiency will be reduced.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A vapor chamber heat sink, comprising a vapor chamber, a heat pipe and a heat sink block; a heat conducting portion is provided at the center of the bottom end of the vapor chamber, and the heat conducting portion and the vapor chamber are used for heat conduction of a DMD; the heat pipe is provided on the vapor chamber, and is used for heat conduction of the vapor chamber; the heat sink block is provided on one side of the vapor chamber, and is connected to the heat pipe, and is used for heat dissipation of the heat pipe;

[0009] A first cavity is formed in the heat spreader; a second cavity is formed in the heat conduction portion, and the first cavity is connected to the second cavity.

[0010] As a preferred solution for a vapor chamber heat sink, the upper end surface of the second cavity is an open structure; a through hole connected to the second cavity is provided in the center of the bottom end of the vapor chamber; the first cavity and the second cavity form a heat conduction channel from bottom to top.

[0011] As a preferred solution of a vapor chamber heat sink, the heat conducting portion is integrally formed with the vapor chamber.

[0012] As a preferred solution of a vapor chamber heat sink, a plurality of groups of copper pillars are provided in the first cavity; and the plurality of groups of copper pillars are equidistantly distributed in the first cavity.

[0013] As a preferred solution of a vapor chamber heat sink, multiple groups of capillary holes are formed between the multiple groups of copper pillars and the first cavity; and the multiple groups of capillary holes are equidistantly distributed in the first cavity.

[0014] As a preferred solution of a vapor chamber heat sink, the heat dissipation block includes a plurality of groups of fins arranged at equal intervals along a heat transfer direction; a plurality of groups of fins are connected end to end.

[0015] As a preferred solution of a vapor chamber heat sink, both upper and lower ends of the fin are provided with bent portions extending outward, and the bent portions are vertically arranged with the fin.

[0016] As a preferred solution for a vapor chamber heat sink, a protrusion extending outward is provided in the center of the fin, the protrusion is in a circular structure, and the protrusion is sleeved on the outside of the heat pipe.

[0017] As a preferred solution for a vapor chamber heat sink, a plurality of groups of the protrusions are connected end to end to form a mounting hole; and the heat pipe is fixedly connected to the mounting hole.

[0018] The beneficial effects of the utility model are:

[0019] By providing a heat spreader, a heat pipe and a heat sink, the heat on the DMD is transferred to the heat spreader through the heat conducting part on the heat spreader. Since the first cavity is connected to the second cavity, the heat transfer path is changed from diffusion around to direct transfer upward to the heat pipe as a whole, and then the heat is transferred to the heat sink through the heat pipe, thereby shortening the heat transfer path and increasing the transfer efficiency. Due to the internal self-circulation, the thermal resistance is reduced, thereby improving the heat dissipation efficiency of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a heat transfer path in the prior art;

[0021] Figure 2 It is a schematic diagram of the heat transfer path of the utility model;

[0022] Figure 3 A schematic diagram of the overall structure of a vapor chamber radiator provided by the utility model;

[0023] Figure 4 A schematic diagram of the cross-sectional structure of a vapor chamber radiator provided by the utility model;

[0024] Figure 5 A schematic diagram of the overall structure of the heat dissipation block provided by the utility model;

[0025] Figure 6 for Figure 5 A is an enlarged schematic diagram;

[0026] Figure 7 for Figure 5 A magnified schematic diagram of B.

[0027] Among them, the reference numerals in the figure are:

[0028] 10. Heat spreader; 11. Heat conducting part; 12. Copper pillar; 13. Capillary; 20. Heat pipe; 30. Heat sink; 31. Fin; 32. Bending part; 33. Raised part; 34. Mounting hole; 40. Copper substrate; 41. Boss. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0030] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] In the description of this embodiment, terms such as "up", "down", "left", and "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present utility model.

[0033] In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more than two. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0034] In one embodiment of the present invention, Figure 1-7 As shown, a heat spreader radiator is provided, comprising a heat spreader 10, a heat pipe 20 and a heat sink 30. A heat conducting portion 11 is provided at the center of the bottom end of the heat spreader 10, and the heat conducting portion 11 and the heat spreader 10 are used for heat conduction of the DMD. The heat pipe 20 is provided on the heat spreader 10 for heat conduction of the heat spreader 10. The heat sink 30 is provided on one side of the heat spreader 10 and connected to the heat pipe 20 for heat dissipation of the heat pipe 20.

[0035] A first cavity is formed in the heat spreader 10 , a second cavity is formed in the heat conducting portion 11 , and the first cavity is connected to the second cavity.

[0036] In this embodiment, the heat pipe 20 includes a first section, a bending section and a second section. The first section is fixedly connected to the center of the top surface of the heat spreader 10 and the second section is fixedly connected to the center of the heat sink 30. The first section and the second section are both fixed by soldering. Under the action of the first cavity and the second cavity, the heat on the DMD is directly transferred upward to the first section of the heat pipe 20, reducing the heat transfer path and avoiding increased resistance. The heat is then transferred to the second section of the heat pipe 20 through the bending section, and the heat is dissipated through the heat sink 30, thereby achieving heat dissipation of the DMD.

[0037] By setting up a heat spreader 10, a heat pipe 20 and a heat sink 30, the heat on the DMD is transferred to the heat spreader 10 through the heat conducting part 11 on the heat spreader 10. Since the first cavity is connected to the second cavity, the heat transfer path is changed from diffusion around to direct transfer upward to the heat pipe 20 as a whole, and then the heat is transferred to the heat sink 30 through the heat pipe 20, shortening the heat transfer path and increasing the transfer efficiency. Due to the internal self-circulation, the thermal resistance is reduced, and the heat dissipation efficiency of the radiator is improved. Under the same conditions of the same structure and the same size, the performance of the radiator is greatly improved, making the radiator suitable for more products and improving the practicality of the radiator.

[0038] Preferably, the upper end surface of the second cavity is an open structure. A through hole connected to the second cavity is provided in the center of the bottom end of the heat spreader 10. The first cavity and the second cavity form a heat conduction channel from bottom to top. The heat conduction channel formed by the first cavity and the second cavity changes the heat transfer path from diffusion around to directly upward to the heat pipe 20 as a whole, and then the heat is transferred to the heat sink 30 through the heat pipe 20, shortening the heat transfer path and increasing the transfer efficiency. Because the internal self-circulation, the thermal resistance becomes smaller, and the heat dissipation efficiency of the radiator is improved.

[0039] Furthermore, the heat conducting part 11 is integrally formed with the heat vapor chamber 10. By integrally forming the heat conducting part 11 with the heat vapor chamber 10, the production and processing of the heat conducting part 11 and the heat vapor chamber 10 are facilitated, the processing steps are simplified, and the production efficiency is improved.

[0040] Furthermore, a plurality of groups of copper pillars 12 are provided in the first cavity. The plurality of groups of copper pillars 12 are equidistantly distributed in the first cavity. The heat in the first cavity is transferred by the plurality of groups of copper pillars 12, so that the heat is better transferred upward, and the heat is prevented from diffusing around on the heat spreader 10, thereby reducing the heat transfer path, preventing the resistance from increasing, and improving the heat dissipation effect.

[0041] Furthermore, multiple groups of capillary holes 13 are formed between the multiple groups of copper pillars 12 and the first cavity. The multiple groups of capillary holes 13 are evenly distributed in the first cavity. In this embodiment, the capillary holes 13 are filled with a thermally conductive material (such as copper powder) and a working fluid, and heat transfer occurs between the two, thereby improving the heat transfer and further improving the heat dissipation effect in the first cavity.

[0042] Preferably, the heat sink 30 includes a plurality of groups of fins 31 arranged at equal intervals along the heat transfer direction. The plurality of groups of fins 31 are connected end to end. The heat on the heat pipe 20 is dissipated by the plurality of groups of fins 31 connected end to end, so as to effectively reduce the heat in the DMD and prevent the DMD from being damaged due to overheating. The number of fins 31 can be selected according to actual use requirements, so that the number of fins 31 of the heat sink 30 can meet the use requirements.

[0043] Furthermore, the upper and lower ends of the fin 31 are provided with outwardly extending bent portions 32, which are arranged vertically with the fin 31. By providing the bent portions 32, the contact area between the fin 31 and the outside is enlarged, the heat dissipation effect thereof is improved, and the heat dissipation effect of the heat sink 30 is further improved.

[0044] Furthermore, a protrusion 33 extending outward is provided in the center of the fin 31, and the protrusion 33 has a circular structure. The protrusion 33 is sleeved on the outside of the heat pipe 20. Multiple groups of protrusions 33 are connected end to end to form a mounting hole 34. The heat pipe 20 is fixedly connected to the mounting hole 34. In this embodiment, each group of protrusions 33 in the mounting hole 34 fits the outside of the heat pipe 20, and the heat on the heat pipe 20 is transferred to the corresponding fin 31 one by one through each group of protrusions 33, and the heat is dissipated through the bending portion 32 on the fin 31, thereby reducing the temperature on the heat pipe 20, thereby achieving the heat dissipation of the DMD.

[0045] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A heat sink, characterized in that: include: A heat spreader, wherein a heat conducting portion is provided at the center of the bottom end of the heat spreader, and the heat conducting portion and the heat spreader are used for heat conduction of the DMD; A heat pipe, the heat pipe is arranged on the heat spreader and is used for heat conduction of the heat spreader; A heat sink block, which is disposed on one side of the heat sink and connected to the heat pipe for heat dissipation of the heat pipe; A first cavity is formed in the heat spreader; a second cavity is formed in the heat conduction portion, and the first cavity is connected to the second cavity.

2. The vapor chamber heat sink according to claim 1, characterized in that: The upper end surface of the second cavity is an open structure; a through hole connected to the second cavity is provided in the center of the bottom end of the heat spreader; the first cavity and the second cavity form a heat conduction channel from bottom to top.

3. The vapor chamber heat sink according to claim 2, characterized in that: The heat conducting portion and the heat spreader are integrally formed.

4. The vapor chamber heat sink according to claim 3, characterized in that: A plurality of groups of copper pillars are arranged in the first cavity; and the plurality of groups of copper pillars are evenly distributed in the first cavity.

5. The vapor chamber heat sink according to claim 4, characterized in that: A plurality of groups of capillary holes are formed between the plurality of groups of copper pillars and the first cavity; the plurality of groups of capillary holes are evenly distributed in the first cavity.

6. The vapor chamber heat sink according to claim 1, characterized in that: The heat sink block comprises a plurality of groups of fins arranged at equal intervals along the heat transfer direction; a plurality of groups of fins are connected end to end.

7. The vapor chamber heat sink according to claim 6, characterized in that: The upper and lower ends of the fin are both provided with a bending portion extending outward, and the bending portion is vertically arranged with the fin.

8. The vapor chamber heat sink according to claim 7, characterized in that: A protrusion extending outward is provided in the center of the fin, the protrusion is in a circular structure, and the protrusion is sleeved on the outside of the heat pipe.

9. The vapor chamber heat sink according to claim 8, characterized in that: A plurality of groups of protrusions are connected end to end to form a mounting hole; and the heat pipe is fixedly connected to the mounting hole.

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