Chip adsorption device

Abstract

The utility model discloses a chip adsorption device which comprises an adsorption base, an air guide pipe is installed at the top end of the adsorption base in a threaded mode, a main suction cup and an auxiliary suction cup are installed at the bottom end of a main air channel and the bottom end of an auxiliary air channel respectively, a base plate is fixedly installed at the bottom of the outer side wall of the adsorption base, and a vertical threaded rod is installed in a hole formed in the base plate in a penetrating mode. A bottom plate is fixed to the bottom end of the vertical threaded rod, a protective pad is installed on the bottom face of the bottom plate, the top end of the vertical threaded rod penetrates through a hole formed in the movable plate, a blocking plate is fixed to the middle of the vertical threaded rod, a buffer spring is fixed to the top face of the blocking plate, and the top end of the buffer spring is fixed to the bottom face of the movable plate. According to the chip adsorption device, the novel structural design is adopted, chips of different sizes can be stably adsorbed, the chips moving upwards due to air pressure can be buffered and protected, meanwhile, the resistance of the buffering structure can be conveniently and rapidly adjusted, and the chips of different specifications can be stably adsorbed and transferred conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a chip adsorption device. Background Art

[0002] Semiconductor packaging refers to the process of connecting semiconductor components and pins through leads and realizing connection and interconnection with external circuits. The main function of packaging is to protect the chip from physical and chemical damage, and at the same time enable the chip pins to be connected to the external circuit for use. In the semiconductor packaging process, a chip adsorption device is required to adsorb and transfer the chip.

[0003] An existing chip adsorption device, such as the authorized Chinese utility model patent entitled chip adsorption device with publication number CN212725266U, includes a main body, the main body includes a first side surface and a second side surface spaced apart in the thickness direction thereof, a plurality of spaced apart bosses are provided on the outer periphery of the first side surface of the main body, the boss includes a third side surface away from the main body in the thickness direction of the main body, the third side surface of the boss is provided with an air guide groove extending toward the main body and extending into the main body, the main body is provided with a gas channel, and the gas channel is connected to the gas guide groove. In this patent solution, when the adsorption device adsorbs the chip, under the action of air pressure, the chip moves up and directly contacts the bottom end of the boss, and the chip directly collides with the boss, causing damage to the chip. Therefore, it is necessary to design a chip adsorption device to address the above problems. Utility Model Content

[0004] The utility model aims to provide a chip adsorption device to solve the problem that when the existing chip adsorption device adsorbs the chip, the chip moves up and directly contacts the bottom end of the boss under the action of air pressure, and the chip directly collides with the boss, which may cause damage to the chip.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip adsorption device, comprising an adsorption seat, an air guide tube is threadedly installed on the top of the adsorption seat, an air cavity is opened in the center of the adsorption seat, a main air channel is opened in the center of the bottom surface of the air cavity, a secondary air channel is opened at the edge of the bottom surface of the air cavity, a main suction cup and a secondary suction cup are installed at the bottom of the main air channel and the secondary air channel respectively, a base plate is fixedly installed at the bottom of the outer wall of the adsorption seat, a vertical threaded rod is installed through the hole opened in the base plate, a bottom plate is fixed to the bottom end of the vertical threaded rod, a protective pad is installed on the bottom surface of the bottom plate, the top of the vertical threaded rod passes through the hole opened in the movable plate, a blocking plate is fixed to the middle of the vertical threaded rod, a buffer spring is fixed to the top surface of the blocking plate, and the top of the buffer spring is fixed to the bottom surface of the movable plate.

[0006] Preferably, the secondary airways are distributed at equal angles with respect to the center of the main airway, and the diameter of the main airway is greater than twice the diameter of the secondary airway.

[0007] Preferably, magnet sheets are embedded and fixed on the top outer walls of the main suction cup and the auxiliary suction cup, and the magnet sheets are tightly fitted with the adsorption seat, and the adsorption seat is a ferromagnetic material containing iron, cobalt or nickel.

[0008] Preferably, the vertical threaded rod is slidably connected to the holes provided on the base plate and the movable plate, and the base plate and the movable plate are distributed in parallel.

[0009] Preferably, the bottom surface of the protective pad is lower than the bottom surfaces of the main suction cup and the auxiliary suction cup, and the thickness of the protective pad is more than twice the thickness of the bottom plate.

[0010] Preferably, a side bolt is fixed to the side of the movable plate, a positioning nut is installed on the side bolt, the end of the side bolt is in contact with the top of the inner wall of the track groove, the track groove is opened at the top of the outer wall of the adsorption seat, the movable plate is distributed at equal angles with respect to the center of the adsorption seat, the side bolt is slidably connected to the track groove, and the top view shape of the track groove is a "T" shape.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: the chip adsorption device adopts a new structural design, which can not only stably adsorb chips of different sizes, but also provide buffer protection for chips that move upward due to air pressure, and at the same time, the resistance of the buffer structure can be conveniently adjusted, which is convenient for the stable adsorption and transfer of chips of different specifications;

[0012] 1. The air in the main airway and the auxiliary airway is sucked synchronously through the air guide tube and the air cavity to ensure that the main suction cup and the auxiliary suction cup can generate suction synchronously, stably adsorb the chip, and the main suction cup and the auxiliary suction cup can be easily disassembled and replaced;

[0013] 2. The protective pad is contacted with the top surface of the chip in advance, and the bottom plate and the vertical threaded rod are squeezed and pushed upward to compress the buffer spring. The elastic force of the buffer spring is used to weaken the acceleration of the chip caused by the suction, so as to prevent the chip from directly hitting the main suction cup and the auxiliary suction cup. At the same time, the compression degree of the buffer spring can be adjusted by the movable plate with the side bolts sliding vertically along the track groove, so as to conveniently adjust the elastic potential energy stored in the buffer spring according to the specifications of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the front view structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the front cross-sectional structure of the utility model;

[0016] Figure 3 It is a schematic diagram of the cross-sectional structure of the air cavity and the movable plate of the utility model from top view;

[0017] Figure 4 It is a schematic diagram of the structure of the utility model when viewed from above.

[0018] In the figure: 1. adsorption seat; 2. air guide tube; 3. air cavity; 4. main air channel; 5. auxiliary air channel; 6. main suction cup; 7. auxiliary suction cup; 8. magnet sheet; 9. base plate; 10. vertical threaded rod; 11. bottom plate; 12. protective pad; 13. movable plate; 14. side bolt; 15. positioning nut; 16. track groove; 17. blocking plate; 18. buffer spring. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-4 The utility model provides a technical solution: a chip adsorption device, including an adsorption seat 1, an air duct 2, an air cavity 3, a main air channel 4, an auxiliary air channel 5, a main suction cup 6, an auxiliary suction cup 7, a magnet sheet 8, a substrate 9, a vertical threaded rod 10, a bottom plate 11, a protective pad 12, a movable plate 13, a side bolt 14, a positioning nut 15, a track groove 16, a blocking plate 17 and a buffer spring 18. The top of the adsorption seat 1 is equipped with an air duct 2, the center of the adsorption seat 1 is provided with an air cavity 3, the center of the bottom surface of the air cavity 3 is provided with a main air channel 4, the edge of the bottom surface of the air cavity 3 is provided with an auxiliary air channel 5, the auxiliary air channel 5 is distributed at equal angles with respect to the center of the main air channel 4, the diameter of the main air channel 4 is greater than twice the diameter of the auxiliary air channel 5, and the above-mentioned structural design ensures that the auxiliary suction cup 7 can cooperate with the main suction cup 6 to stably adsorb and fix the chip over a large area;

[0021] When using the device, the air guide tube 2 is connected to the external air pump, and the adsorption seat 1 is installed on the robot arm or other transfer mechanism. When the robot arm or other transfer mechanism controls the adsorption seat 1 to approach the top surface of the chip, the external air pump connected to the air guide tube 2 works, and the air is quickly sucked upward through the main suction cup 6 and the auxiliary suction cup 7 through the air guide tube 2, the air cavity 3, the main air channel 4 and the auxiliary air channel 5, thereby generating negative pressure to attract and move the chip upward. During the upward movement of the chip, the top surface of the chip first contacts the bottom surface of the protective pad 12, and pushes the bottom plate 11 and the vertical threaded rod 10 to move upward. The vertical threaded rod 10 slides vertically upward with the blocking plate 17 along the holes opened on the substrate 9 and the movable plate 13, and compresses the buffer spring 18. The elastic force of the buffer spring 18 is used to slow down the upward movement speed of the chip, so that the top surface of the chip will not directly hit the main suction cup 6 and the auxiliary suction cup 7. Finally, the chip is adsorbed and transferred by the main suction cup 6 and the auxiliary suction cup 7;

[0022] A main suction cup 6 and a secondary suction cup 7 are installed at the bottom of the main airway 4 and the secondary airway 5, respectively. The top outer walls of the main suction cup 6 and the secondary suction cup 7 are inlaid with magnet sheets 8, and the magnet sheets 8 are tightly fitted with the adsorption seat 1. The adsorption seat 1 is a ferromagnetic material containing iron, cobalt or nickel. The above structural design allows the main suction cup 6 and the secondary suction cup 7 to be stably installed and used and conveniently disassembled and replaced. A base plate 9 is fixedly installed at the bottom of the outer wall of the adsorption seat 1. A vertical threaded rod 10 is installed through the hole opened on the base plate 9. The vertical thread A bottom plate 11 is fixed at the bottom end of the rod 10, and a protective pad 12 is installed on the bottom surface of the bottom plate 11. The bottom surface of the protective pad 12 is lower than the bottom surfaces of the main suction cup 6 and the auxiliary suction cup 7. The thickness of the protective pad 12 is greater than twice the thickness of the bottom plate 11. The above structural design ensures that the protective pad 12 can first contact the top surface of the chip to provide buffer protection for the chip and prevent the chip from directly hitting the bottom surfaces of the main suction cup 6 and the auxiliary suction cup 7. The top end of the vertical threaded rod 10 passes through the hole opened on the movable plate 13, and the vertical threaded rod 10 is connected to the substrate 9 and the movable plate The holes opened on 13 are all sliding connections, the base plate 9 and the movable plate 13 are distributed in parallel, and the above-mentioned structural design ensures that the vertical threaded rod 10 can stably slide vertically along the holes opened on the base plate 9 and the movable plate 13. A side bolt 14 is fixed on the side of the movable plate 13, and a positioning nut 15 is installed on the side bolt 14. The end of the side bolt 14 fits with the top of the inner wall of the track groove 16. The track groove 16 is vertically opened at the top of the outer wall of the adsorption seat 1. The movable plate 13 is distributed at equal angles with respect to the center of the adsorption seat 1. The side bolt 14 and the track groove 16 are slidingly connected, and the top view shape of the track groove 16 is a "T" shape. The above-mentioned structural design enables the movable plate 13 to slide vertically stably along the track groove 16 with the side bolt 14, adjust the distance between the movable plate 13 and the base plate 9, and compress the buffer spring 18 to different degrees, thereby changing the buffering force provided by the buffer spring 18 when the vertical threaded rod 10, the bottom plate 11 and the protective pad 12 are squeezed and moved upward by the chip;

[0023] A blocking plate 17 is fixedly installed in the middle of the vertical threaded rod 10, a buffer spring 18 is fixedly installed on the top surface of the blocking plate 17, and the top end of the buffer spring 18 is connected and fixed to the bottom surface of the movable plate 13;

[0024] When the chip specifications and weights are different, or the suction power of the external air pump connected to the air duct 2 is different, in order to ensure the buffering effect of the bottom plate 11 and the protective pad 12, and to ensure that the main suction cup 6 and the auxiliary suction cup 7 can stably adsorb the chip, the positioning nut 15 can be rotated away from the outer side of the adsorption seat 1, and the movable plate 13 with the side bolts 14 can be pushed to slide vertically along the track groove 16 to change the compression degree of the buffer spring 18. Since the blocking plate 17 is in contact with the top surface of the substrate 9, the vertical threaded rod 10 cannot move downward until the compression degree of the buffer spring 18 is appropriate. The positioning nut 15 is rotated to reset and squeeze the outer side of the adsorption seat 1, and the position of the movable plate 13 is fixed. The resistance of the vertical threaded rod 10, the bottom plate 11 and the protective pad 12 during the upward movement when they contact the chip can be changed to ensure the buffering effect.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip adsorption device, comprising an adsorption seat (1), characterized in that: The top of the adsorption seat (1) is threadedly mounted with an air guide tube (2); an air cavity (3) is provided at the center of the adsorption seat (1); a main air channel (4) is provided at the center of the bottom surface of the air cavity (3); an auxiliary air channel (5) is provided at the edge of the bottom surface of the air cavity (3); a main suction cup (6) and an auxiliary suction cup (7) are respectively mounted at the bottom ends of the main air channel (4) and the auxiliary air channel (5); a base plate (9) is fixedly mounted at the bottom of the outer wall of the adsorption seat (1); a hole formed on the base plate (9) is provided through the hole. A vertical threaded rod (10) is installed through the vertical threaded rod (10), a bottom plate (11) is fixed to the bottom end of the vertical threaded rod (10), a protective pad (12) is installed on the bottom surface of the bottom plate (11), the top end of the vertical threaded rod (10) passes through a hole opened on the movable plate (13), a blocking plate (17) is fixed to the middle of the vertical threaded rod (10), a buffer spring (18) is fixed to the top surface of the blocking plate (17), and the top end of the buffer spring (18) is fixed to the bottom surface of the movable plate (13).

2. A chip adsorption device according to claim 1, characterized in that: The secondary airways (5) are distributed at equal angles with respect to the center of the main airway (4), and the diameter of the main airway (4) is greater than twice the diameter of the secondary airway (5).

3. The chip adsorption device according to claim 1, characterized in that: The top outer walls of the main suction cup (6) and the auxiliary suction cup (7) are both inlaid with magnet sheets (8) fixed thereto. The magnet sheets (8) are tightly fitted with the adsorption seat (1). The adsorption seat (1) is made of ferromagnetic material containing iron, cobalt or nickel.

4. The chip adsorption device according to claim 1, characterized in that: The vertical threaded rod (10) is slidably connected to the holes provided on the base plate (9) and the movable plate (13); the base plate (9) and the movable plate (13) are arranged in parallel.

5. The chip adsorption device according to claim 1, characterized in that: The bottom surface of the protective pad (12) is lower than the bottom surfaces of the main suction cup (6) and the auxiliary suction cup (7), and the thickness of the protective pad (12) is greater than twice the thickness of the bottom plate (11).

6. The chip adsorption device according to claim 1, characterized in that: A side bolt (14) is fixed to the side of the movable plate (13), and a positioning nut (15) is installed on the side bolt (14). The end of the side bolt (14) is in contact with the top of the inner wall of the track groove (16). The track groove (16) is opened at the top of the outer wall of the adsorption seat (1). The movable plate (13) is distributed at equal angles with respect to the center of the adsorption seat (1). The side bolt (14) and the track groove (16) are slidably connected, and the top view shape of the track groove (16) is "T"-shaped.

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