Semiconductor laser packaging structure
By adopting a double-layer heat dissipation mechanism and coolant circulation system of components such as copper heat sinks, water tanks and other components in the semiconductor laser packaging structure, the problem of poor heat dissipation effect of semiconductor lasers is solved, extending its service life and saving costs.
Patent Information
- Application Number
- CN202323618639.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2033-12-29
AI Technical Summary
Existing semiconductor lasers have poor heat dissipation effects, resulting in a short service life.
A semiconductor laser packaging structure was designed, including copper heat sink, water tank, water distributor, water collector, water pump, motor, mixing rod and refrigeration plate. It can achieve rapid heat dissipation and cooling through a double-layer heat dissipation mechanism and a coolant circulation system. .
It effectively avoids overheating of semiconductor laser chips, extends its service life, and saves costs through cooling liquid recycling.
Smart Images
Figure CN222168937U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor lasers, in particular to a semiconductor laser packaging structure. Background Art
[0002] Semiconductor lasers are devices that use certain semiconductor materials as working materials to generate lasers. Their working principle is to achieve a population inversion of non-equilibrium carriers between the energy bands of semiconductor materials, or between the energy bands of semiconductor materials and impurity energy levels, through certain excitation methods. When a large number of electrons in a population inversion state recombine with holes, stimulated emission occurs. Compared with solid-state lasers, fiber lasers and other technologies, semiconductor lasers have higher electro-optical conversion efficiency.
[0003] At present, semiconductor lasers generate a lot of heat when working. When the temperature of the semiconductor laser chip is too high, the performance of the semiconductor laser will be reduced or even completely damaged. The existing semiconductor lasers have a general heat dissipation effect, which shortens the service life of the semiconductor laser. For this reason, we propose a semiconductor laser packaging structure. Utility Model Content
[0004] The utility model aims to provide a semiconductor laser packaging structure to solve the problem that the heat dissipation effect of the existing semiconductor laser is mediocre, resulting in a short service life of the semiconductor laser.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor laser packaging structure, comprising a copper heat sink and a water tank, wherein the water tank is placed on the left side wall of the copper heat sink, the left side wall of the copper heat sink is provided with a water tank, and the water tanks are arranged in sequence from front to back, the top of the copper heat sink is fixedly connected to a transition heat sink, the top of the transition heat sink is fixedly connected to a semiconductor laser chip, and the front and rear side walls of the transition heat sink are fixedly connected to heat dissipation fins.
[0006] As a further description of the above technical solution:
[0007] The left side wall of the copper heat sink is fixedly connected with a water distributor, and the water distributor is connected with the water tank through a pipeline.
[0008] As a further description of the above technical solution:
[0009] The right side wall of the copper heat sink is fixedly connected with a water collector, which is connected with the water tank through a pipeline. The right side wall of the water collector is fixedly connected with a return pipe, and the end of the return pipe is fixedly connected to the top left side of the water tank.
[0010] As a further description of the above technical solution:
[0011] A water pump is fixedly connected to the lower side of the right side wall of the water tank, and the water pump is connected to the water tank and the water distributor through a pipeline.
[0012] As a further description of the above technical solution:
[0013] A motor is fixedly connected to the middle of the top of the water tank, a rotating shaft is fixedly connected to the end of the power output shaft of the motor, the end of the rotating shaft passes through the water tank and extends to the inner cavity of the water tank, and a stirring rod is fixedly connected to the outer wall of the rotating shaft.
[0014] As a further description of the above technical solution:
[0015] The left and right side walls of the water tank are inlaid with refrigeration fins, and the top right side of the water tank is fixedly connected with a water inlet.
[0016] Compared with the prior art, the beneficial effects of the utility model are:
[0017] 1. The semiconductor laser packaging structure conducts the heat generated by the semiconductor laser chip through the transition heat sink, so that the transition heat sink disperses the heat to the heat dissipation fins and the copper heat sink, and then dissipates the heat to the outside through the heat dissipation fins, so that the heat dissipation is initially completed, and then the coolant in the water tank is transported to the water distributor through a water pump, so that the water distributor disperses the coolant into the water tank, and then the coolant absorbs the heat on the copper heat sink and takes it away, thereby further completing the heat dissipation. Through the cooperation of double-layer heat dissipation, the heat dissipation of the semiconductor laser chip is quickly completed, thereby avoiding overheating of the semiconductor laser chip and extending its service life.
[0018] 2. The semiconductor laser packaging structure collects the coolant in the water tank through a water collector, and returns the coolant to the water tank through a return pipe. Then, the cooling plate is started to cool the coolant that absorbs heat. At the same time, the motor is started to drive the shaft to rotate, so that the stirring rod continuously stirs the coolant, and then the cooling plate can evenly cool the coolant, so that the coolant can be recycled and cost saved. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A three-dimensional structural schematic diagram of a semiconductor laser packaging structure proposed by the utility model;
[0020] Figure 2 This is a schematic diagram of the main structure of a semiconductor laser packaging structure proposed by the utility model;
[0021] Figure 3 This is a schematic diagram of a front cross-sectional structure of a semiconductor laser packaging structure proposed by the utility model;
[0022] Figure 4 The utility model is a schematic diagram of a left-side cross-sectional structure of a semiconductor laser packaging structure.
[0023] In the figure: 100, copper heat sink; 110, water tank; 120, transition heat sink; 130, semiconductor laser chip; 140, cooling fins; 150, water distributor; 160, water collector; 170, return pipe; 200, water tank; 210, water pump; 220, motor; 230, rotating shaft; 240, stirring rod; 250, cooling plate; 260, water inlet. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.
[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0027] The utility model provides a semiconductor laser packaging structure, which can quickly complete heat dissipation, avoid overheating of semiconductor laser chips, extend their service life, and enable the cooling liquid to be recycled, saving costs. Figure 1-4 , including a copper heat sink 100 and a water tank 200;
[0028] Please refer again Figure 1-4 A water tank 110 is provided on the left side wall of the copper heat sink 100, and the water tanks 110 are arranged in sequence from front to back, and the water tank 110 is used to flow in the coolant. A transition heat sink 120 is fixedly connected to the top of the copper heat sink 100, and the transition heat sink 120 is used to install a semiconductor laser chip 130. A semiconductor laser chip 130 is fixedly connected to the top of the transition heat sink 120, and the semiconductor laser chip 130 is used to generate laser. The front and rear side walls of the transition heat sink 120 are fixedly connected to heat dissipation fins 140, and the heat dissipation fins 140 are used to dissipate heat. The semiconductor laser is conducted through the transition heat sink 120. The heat generated by the body laser chip 130 causes the transition heat sink 120 to disperse the heat to the heat sink 140 and the copper heat sink 100, and then the heat sink 140 dissipates the heat to the outside, so that the heat dissipation is initially completed. Then, the coolant in the water tank 200 is transported to the water distributor 150 through the water pump 210, so that the water distributor 150 disperses the coolant into the water tank 110, and then the coolant absorbs the heat on the copper heat sink 100 and takes it away, thereby further completing the heat dissipation. Through the cooperation of double-layer heat dissipation, the heat dissipation of the semiconductor laser chip 130 is quickly completed;
[0029] See also Figure 1-3 , the water tank 200 is placed on the left side wall of the copper heat sink 100, and the water tank 200 is used to store the coolant;
[0030] In summary, the semiconductor laser chip 130 is prevented from overheating and its service life is extended.
[0031] See also Figure 2-3 A water distributor 150 is fixedly connected to the left side wall of the copper heat sink 100 . The water distributor 150 is connected to the water tank 110 through a pipeline. The coolant can be distributed to different water tanks 110 through the water distributor 150 .
[0032] Please refer again Figure 1-3 The right side wall of the copper heat sink 100 is fixedly connected with a water collector 160, and the water collector 160 is connected with the water tank 110 through a pipe. The right side wall of the water collector 160 is fixedly connected with a return pipe 170, and the end of the return pipe 170 is fixedly connected to the top left side of the water tank 200. The coolant in different water tanks 110 can be collected together through the water collector 160.
[0033] Please refer again Figure 1-3 A water pump 210 is fixedly connected to the lower side of the right side wall of the water tank 200. The water pump 210 is connected to the water tank 200 and the water distributor 150 through a pipeline, and the coolant can be transported through the water pump 210.
[0034] Please refer again Figure 1-3A motor 220 is fixedly connected to the middle of the top of the water tank 200, and a rotating shaft 230 is fixedly connected to the end of the power output shaft of the motor 220. The end of the rotating shaft 230 passes through the water tank 200 and extends to the inner cavity of the water tank 200. A stirring rod 240 is fixedly connected to the outer wall of the rotating shaft 230. The rotating shaft 230 is driven to rotate by the motor 220, so that the stirring rod 240 continuously stirs the coolant.
[0035] Please refer again Figure 1-3 The left and right side walls of the water tank 200 are inlaid with cooling fins 250 , and the top right side of the water tank 200 is fixedly connected with a water inlet 260 , and the cooling fins 250 can cool the cooling liquid that absorbs heat.
[0036] In summary, the coolant can be recycled and costs can be saved.
[0037] During specific use, the technical personnel in this field first turn on the semiconductor laser to make the semiconductor laser chip 130 work. When the semiconductor laser chip 130 works, a large amount of heat will be generated. At this time, the transition heat sink 120 will disperse the heat to the heat sink 140 and the copper heat sink 100. The heat sink 140 will dissipate the heat to the outside, so as to complete the initial heat dissipation. Then, the coolant in the water tank 200 is transported to the water distributor 150 through the water pump 210, so that the water distributor 150 disperses the coolant into the water tank 110, and then the coolant absorbs the heat on the copper heat sink 100 and takes it away, thereby further completing the heat dissipation. After absorbing the heat, the coolant enters the water collector 160, and then flows back to the water tank 200 through the return pipe 170. At this time, the refrigeration plate 250 is started to cool the coolant that absorbs the heat. At the same time, the motor 220 is started to drive the rotating shaft 230 to rotate, so that the stirring rod 240 continuously stirs the coolant, and then the refrigeration plate 250 can evenly cool the coolant.
[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0039] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A semiconductor laser packaging structure, Features: The invention comprises a copper heat sink (100) and a water tank (200), wherein the water tank (200) is placed on the left side wall of the copper heat sink (100), a water tank (110) is provided on the left side wall of the copper heat sink (100), and the water tanks (110) are arranged in sequence from front to back, a transition heat sink (120) is fixedly connected to the top of the copper heat sink (100), a semiconductor laser chip (130) is fixedly connected to the top of the transition heat sink (120), and heat dissipation fins (140) are fixedly connected to the front and rear side walls of the transition heat sink (120).
2. A semiconductor laser packaging structure according to claim 1, Features: A water distributor (150) is fixedly connected to the left side wall of the copper heat sink (100), and the water distributor (150) is connected to the water tank (110) through a pipeline.
3. The semiconductor laser packaging structure according to claim 1, Features: A water collector (160) is fixedly connected to the right side wall of the copper heat sink (100), the water collector (160) is connected to the water tank (110) via a pipe, a water return pipe (170) is fixedly connected to the right side wall of the water collector (160), and the end of the water return pipe (170) is fixedly connected to the top left side of the water tank (200).
4. The semiconductor laser packaging structure according to claim 1, Features: A water pump (210) is fixedly connected to the lower side of the right side wall of the water tank (200), and the water pump (210) is connected to the water tank (200) and the water distributor (150) through a pipeline.
5. The semiconductor laser packaging structure according to claim 1, Features: A motor (220) is fixedly connected to the middle of the top of the water tank (200), a rotating shaft (230) is fixedly connected to the end of the power output shaft of the motor (220), the end of the rotating shaft (230) passes through the water tank (200) and extends to the inner cavity of the water tank (200), and a stirring rod (240) is fixedly connected to the outer wall of the rotating shaft (230).
6. The semiconductor laser packaging structure according to claim 1, Features: Refrigeration fins (250) are inlaid on the left and right side walls of the water tank (200), and a water inlet (260) is fixedly connected to the right side of the top of the water tank (200).