Circuit board
By setting elastic conductive parts and elastic buffer bodies in the circuit board, the problem of insufficient thickness and reliability of traditional circuit boards is solved, and its elastic and thermal management capabilities are improved, which is suitable for modern electronic products.
Patent Information
- Application Number
- CN202420188467.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-01-25
AI Technical Summary
The use of polypropylene layering material containing glass fibers causes the increase in the thickness of the board, affecting compactness and weight, and at the same time, the reliability is poor. Although the ABF-RCC material is thin and reliable, it is insufficient in strength and is prone to breaking.
A circuit board is designed, including an outer substrate, an elastic conductive member and an elastic buffer body. By setting grooves on the outer substrate and filling the elastic conductive member and an elastic buffer body, mechanical stress can be absorbed and dispersed, and stability and thermal management capabilities are improved.
It enhances the elasticity and fracture resistance of the circuit board, improves reliability and thermal management capabilities, making it suitable for miniaturized and lightweight electronic products, and reduces the risk of damage caused by stress and thermal stress.
Smart Images
Figure CN222170072U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of circuit board manufacturing, and in particular to a circuit board. Background Art
[0002] In the traditional circuit board (PCB) production process, polypropylene (PP) is commonly used as a build-up material. This material contains glass fiber (fiberglass) to enhance its structural strength. However, there are some significant limitations to using PP as a build-up material for PCBs. First, due to the presence of fiberglass, the thickness of PCBs built with PP is relatively large. This not only affects the size and weight of the circuit board, but may also affect its application in compact electronic products. Secondly, although the fiberglass enhances the structural strength of the material, this build-up method has poor reliability, which may affect the performance and stability of the circuit board in long-term use.
[0003] In response to the above problems, ABF-RCC (Ajinomoto Build-up Film-Resin Coated Copper) material came into being. ABF-RCC is a glass fiber-free build-up material. Its main advantage is that it can produce thinner PCB boards, thereby improving the compactness of the circuit board and its applicability in miniaturized electronic products. Thinner PCB boards not only reduce the weight of the circuit board, but also improve its reliability, because thinner boards are easier to manage heat and reduce the risk of failure due to overheating.
[0004] However, ABF-RCC materials also have their inherent challenges. Due to the lack of glass fiber, ABF-RCC materials are weaker than PP materials, which makes PCBs using this material more prone to breakage, especially when subjected to mechanical stress or during the manufacturing process. Therefore, although ABF-RCC offers advantages in thickness and reliability, its disadvantages in strength and durability cannot be ignored. Utility Model Content
[0005] In order to solve the problems involved in the background technology, the present application provides a circuit board.
[0006] A circuit board comprises an outer substrate, an elastic conductive member and an elastic buffer. The outer substrate comprises an outer insulator and an outer connecting pad embedded in the outer insulator, a groove is provided on one side of the outer insulator, and the outer connecting pad is exposed in the groove. The elastic conductive member is provided in the groove, and the elastic conductive member comprises an elastic part and a connecting part connected to the elastic part, and one end of the elastic part away from the connecting part is connected to the outer connecting pad. The elastic buffer fills the groove, the elastic buffer covers the elastic part, and the connecting part is exposed in the elastic buffer.
[0007] In some possible implementations, an electronic component is further included, wherein the electronic component is disposed on the elastic buffer body and is electrically connected to the connecting portion.
[0008] In some possible implementations, the first insulator has a thickness direction, the elastic portion includes a first conductive portion and a second conductive portion, and an extension direction of the first conductive portion and an extension direction of the second conductive portion are both inclined to the thickness direction.
[0009] In some possible implementations, the elastic portion includes two first conductive portions and two second conductive portions, the two first conductive portions are arranged in an "eight" shape, and the two second conductive portions are arranged in an inverted "eight" shape.
[0010] In some possible implementations, the outer insulator includes a first outer insulating layer and a second outer insulating layer connected to the first outer insulating layer, the first conductive portion is disposed on the first outer insulating layer, and the second conductive portion is disposed on the second outer insulating layer.
[0011] In some possible implementations, the elastic buffer body is provided with a groove, and the connecting portion is exposed at the bottom of the groove.
[0012] In some possible implementations, the circuit board further includes a solder resist layer, the solder resist layer is disposed on the outer insulator, the solder resist layer is provided with a window, the elastic buffer body extends into the window, and the elastic buffer body is flush with the solder resist layer.
[0013] In some possible embodiments, the outer substrate also includes an outer conductive body connected to the outer connecting pads, and the circuit board also includes an inner substrate, the inner substrate includes an inner insulator, an inner conductive body and a plurality of inner connecting pads, some of the inner connection pads are arranged in the inner insulator at intervals, and some of the inner connection pads are arranged on the outside of the inner insulator, the inner conductive body connects the plurality of inner connection pads, the inner insulator is arranged on the outer insulator, and the outer conductive body connects the inner connection pads.
[0014] In some possible implementations, the material of the outer insulator includes ABF, and the material of the inner insulator includes glass fiber.
[0015] In some possible implementations, the elastic buffer body is made of silicone rubber.
[0016] The circuit board provided by the present application is provided with a slot on one side of the outer substrate, and an elastic conductive member is provided in the slot, which includes an elastic part and a connecting part. Due to the presence of the elastic part, the circuit board can absorb and disperse these forces when subjected to mechanical stress (such as bending or vibration), thereby reducing the risk of fracture caused by stress concentration. This reduces the risk of easy fracture of ABF-RCC materials to a certain extent.
[0017] In addition, the provision of the elastic buffer further improves the overall stability of the circuit board. It not only provides additional protection for the elastic conductive member, but also reduces the damage of the circuit board caused by thermal stress or mechanical stress during long-term use, thereby improving the reliability of the circuit board.
[0018] Secondly, by providing the slots and adding the elastic conductive member and the elastic buffer body therein, the manufacturing method makes the overall structure of the circuit board more compact. Such a design makes the circuit board more suitable for application in modern electronic products that require miniaturization and lightness.
[0019] Finally, the elastic conductive member and elastic buffer body in the slot can provide a better heat dissipation path, which is helpful for the thermal management of the circuit board. Especially in high-density or high-power circuit design, good thermal management is crucial to maintain the performance and life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic cross-sectional view of an inner substrate provided in one embodiment of the present application.
[0021] Figure 2 for Figure 1 The cross-sectional schematic diagram shown is after the inner substrate is provided with the substrate intermediate.
[0022] Figure 3 for Figure 2 The cross-sectional schematic diagram of the substrate intermediate body shown is after the first groove is set.
[0023] Figure 4 Based Figure 3 The cross-sectional schematic diagram shown is after the first groove is provided with the first conductive layer.
[0024] Figure 5 for Figure 4 The cross-sectional schematic diagram is shown after the first shelter is arranged in the first slot.
[0025] Figure 6 To remove Figure 5 The schematic cross-sectional view of the portion of the first conductive layer not covered by the first mask after forming a first conductive portion.
[0026] Figure 7 for Figure 6The shown schematic cross-sectional view of the substrate intermediate after the second outer insulating layer and the second conductive part are provided.
[0027] Figure 8 for Figure 7 The cross-sectional schematic diagram shown is a diagram of the second outer insulating layer after being provided with an electroplating layer.
[0028] Fig. 9 For etching Figure 8 A schematic cross-sectional view of the electroplating layer after forming a connecting portion.
[0029] Fig.10 for Fig. 9 The cross-sectional schematic diagram shown is a second outer insulating layer after the accommodation groove is provided.
[0030] Fig.11 for Fig.10 The cross-sectional schematic diagram shown is a schematic diagram of a receiving groove after an elastic buffer body is provided.
[0031] Fig.12 for Fig.11 The cross-sectional schematic diagram shown is after the second outer insulating layer is provided with a solder mask layer.
[0032] Fig.13 for Fig.12 The elastic buffer body shown is provided with electronic components to obtain a cross-sectional schematic diagram of a circuit board.
[0033] Main component symbols
[0034] Circuit board 100
[0035] Inner substrate 10
[0036] Inner insulator 11
[0037] Inner conductor 12
[0038] Inner connection pad 13
[0039] Substrate intermediate 20
[0040] The first outer insulating layer 21
[0041] External conductive body 22
[0042] Outer connection pad 23
[0043] First slot 24
[0044] Raised portion 25
[0045] First conductive layer 26
[0046] The first conductive portion 27
[0047] The second outer insulating layer 40
[0048] The second conductive portion 41
[0049] Elastic portion 42
[0050] Outer substrate 50
[0051] Electroplating layer 51
[0052] Outer circuit layer 52
[0053] Connection part 523
[0054] Elastic conductive member 53
[0055] Accommodating groove 54
[0056] Elastic buffer 60
[0057] Groove 61
[0058] Solder mask 62
[0059] Window 621
[0060] Electronic components 70
[0061] Solder 71
[0062] Thickness direction A
[0063] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0064] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.
[0065] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. When an element is considered to be "set on" another element, it may be directly set on the other element or there may be a central element at the same time.
[0066] See also Figures 1 to 13 An embodiment of the present application provides a method for manufacturing a circuit board 100, comprising the steps of:
[0067] S100: See Figure 1, an inner substrate 10 is provided, the inner substrate 10 includes an inner insulator 11, an inner conductive body 12 and a plurality of inner connection pads 13. Some of the inner connection pads 13 are arranged in the inner insulator 11 at intervals, and some of the inner connection pads 13 are arranged outside the inner insulator 11. The inner conductive body 12 connects the plurality of inner connection pads 13.
[0068] In this embodiment, the inner insulator 11 has a thickness direction A, some of the inner connection pads 13 are arranged in the inner insulator 11 along the thickness direction A at intervals, and the inner conductive body 12 connects multiple inner connection pads 13 along the thickness direction A.
[0069] In this embodiment, the material of the inner insulator 11 includes a composite material of fiber material, specifically glass fiber, carbon fiber, aramid fiber or other synthetic fiber, in order to improve the structural strength and heat resistance of the entire circuit board 100. The fiber-reinforced composite material can effectively improve the mechanical stability of the inner insulator 11 while maintaining good insulation properties and thermal stability. The use of such a material can make the inner insulator 11 have better dimensional stability during processing, and can withstand higher heat loads without deformation when the circuit board 100 is in operation.
[0070] S120: See Figure 2 A substrate intermediate body 20 is provided on the inner substrate 10, and the substrate intermediate body 20 includes a first outer insulating layer 21, an outer conductive body 22, and an outer connecting pad 23. The outer connecting pad 23 is buried in the first outer insulating layer 21, and the outer conductive body 22 connects the outer connecting pad 23 and the inner connecting pad 13.
[0071] In this embodiment, the first outer insulating layer 21 is disposed on the inner insulator 11 along the thickness direction A. The outer conductive body 22 extends along the thickness direction A.
[0072] In this embodiment, the material of the first outer insulating layer 21 includes a resin that does not contain fiber materials, which can be any one of polypropylene (PP), Ajinomoto Build-up Film (ABF), polytetrafluoroethylene (PTFE), polyimide (PI) or liquid crystal polymer (LCP). Among them, the selection of these materials as insulators can reduce the overall thickness of the circuit board 100 while maintaining good insulation, which helps to achieve a lightweight design of electronic products. ABF material is particularly suitable for high-density circuit board 100 design because it can provide excellent line forming capabilities and excellent dielectric properties.
[0073] S130: See Figure 3 A first slot 24 is provided on the side of the first outer insulating layer 21 away from the inner insulator 11. The cross-sectional shape of the first slot 24 is substantially a right triangle, and the first slot 24 has a first inclined surface 241 and a first right-angled surface 242 connecting the first inclined surface 241. The first right-angled surface 242 is substantially parallel to the thickness direction A, and the first inclined surface 241 is substantially inclined to the thickness direction A, and a portion of the outer connection pad 23 is exposed on the first inclined surface 241.
[0074] In this embodiment, each of the outer connection pads 23 is provided corresponding to two of the first slots 24, and the two ends of the outer connection pad 23 are respectively exposed from the first inclined surfaces 241 of the two first slots 24. Two adjacent first slots 24 are arranged at intervals, thereby forming a protrusion 25. The cross-sectional profile of the protrusion 25 is roughly in the shape of an isosceles trapezoid, and the bottom edge of the cross-sectional profile of the protrusion 25 covers the middle area of the outer connection pad 23. Two adjacent first inclined surfaces 241 constitute the waist of the cross-sectional profile of the protrusion 25.
[0075] In this embodiment, the first slot 24 is formed by laser ablation. It can be understood that in other embodiments of the present application, the first slot 24 can also be formed by liquid etching or mechanical drilling.
[0076] In this embodiment, step S130 further includes:
[0077] S131: The inner circumference of the first slot 24 is treated by plasma technology. The plasma treatment uses high-energy particles of plasma to bombard the inner circumference surface of the first slot 24, thereby cleaning the surface and introducing functional groups, increasing the surface roughness and chemical activity, and thus making the first conductive layer 26 (see Figure 4) can be firmly attached to the inner circumference of the first groove 24.
[0078] S140: See Figure 4 A first conductive layer 26 is disposed on the side of the first outer insulating layer 21 away from the inner insulator 11, and a portion of the first conductive layer 26 is attached to the inner periphery of the first slot 24 and electrically connected to the outer connection pad 23. That is, the first conductive layer 26 is attached to the first inclined surface 241 and the first right-angle surface 242.
[0079] In this embodiment, the first conductive layer 26 is formed by sputtering. It can be understood that in other embodiments of the present application, the first conductive layer 26 can be formed by electroplating or the like.
[0080] S150: See Figure 5 A first shield 30 is disposed in the first slot 24 , and the first shield 30 covers the first inclined surface 241 . A gap S exists between the edge of the first shield 30 and the first right-angle surface 242 .
[0081] In this embodiment, the first mask 30 is formed by exposure and development.
[0082] S160: See Figure 6 , the portion of the first conductive layer 26 not covered by the first mask 30 is removed to form a first conductive portion 27. At the same time, the side of the first outer insulating layer 21 away from the inner insulating body 11 is exposed again, and the portion of the first conductive layer 26 in the first slot 24 not covered by the first mask 30 is removed.
[0083] In this embodiment, part of the first conductive layer 26 located on one side of the first outer insulating layer 21 is removed by etching with liquid medicine. At the same time, the liquid medicine enters the gap S, so that part of the first conductive layer 26 attached to the first right-angled surface 242 is also removed.
[0084] S170: See Figure 6 , remove the first cover 30 so that the first conductive portion 27 is exposed to the first slot 24 . One end of the first conductive portion 27 is connected to one end of the outer connection pad 23 .
[0085] In this embodiment, each of the outer connection pads 23 is connected to two corresponding first conductive portions 27 , and the two first conductive portions 27 are substantially attached to two sides of the protruding portion 25 in an “eight” shape.
[0086] S180: See Figure 7A second outer insulating layer 40 is disposed on the first outer insulating layer 21 , and a portion of the second outer insulating layer 40 is filled into the first groove 24 and covers the first conductive portion 27 .
[0087] In this embodiment, the material of the second outer insulating layer 40 is substantially the same as the material of the first outer insulating layer 21. Preferably, the material of the second outer insulating layer 40 is ABF.
[0088] S190: See Figure 7 A plurality of second conductive portions 41 are disposed in the second outer insulating layer 40, and one end of each of the first conductive portions 27 is connected to an end of the first conductive portion 27 away from the outer connection pad 23. The other end of each of the second conductive portions 41 is exposed on the outer surface of the second outer insulating layer 40. Each of the second conductive portions 41 is disposed approximately obliquely to the thickness direction A.
[0089] In this embodiment, the method for setting the second conductive portion 41 is similar to the method for setting the first conductive portion 27, and specifically includes the following steps:
[0090] S191: A second groove (not shown) is set in the second outer insulating layer 40, and the second groove has a second inclined surface (not shown). The second inclined surface is inclined with respect to the thickness direction A, and part of the first conductive part 27 is exposed on the second inclined surface.
[0091] S192: Dispose a second conductive layer (not shown) on the second outer insulating layer 40, and fill part of the second conductive layer into the second groove.
[0092] S193: Disposing a second shield (not shown) in the second groove, wherein the second shield covers a portion of the second conductive layer on the second inclined surface.
[0093] S194: Etching and removing the portion of the second conductive layer not covered by the second mask, and removing the second mask to form the second conductive portion 41.
[0094] In this embodiment, two adjacent second conductive parts 41 corresponding to one outer connection pad 23 are roughly in an inverted "eight" shape, and two first conductive parts 27 connect the two second conductive parts 41 to form an elastic part 42. Specifically, since both the first conductive part 27 and the second conductive part 41 are arranged obliquely with respect to the thickness direction A, when the elastic part 42 is acted upon by an external force, the shape of the elastic part 42 can be squeezed or stretched, however, the stability of the structure of the elastic part 42 itself and the stability of the connection with the outer connection pad 23 will not be destroyed.
[0095] In this embodiment, the elastic part 42 is substantially barrel-shaped, the maximum width W1 of the cross section of the elastic part 42 is 130-150 μm, the minimum width W2 is 80-100 μm, the cross-sectional thickness D of the elastic part 42 is 15-25 μm, and the height H of the elastic part 42 is 15-25 μm.
[0096] In this embodiment, the second outer insulating layer 40 , the substrate intermediate body 20 , and the elastic portion 42 together constitute an outer substrate 50 .
[0097] S200: See Figure 8 The outer substrate 50 is provided with an electroplating layer 51 , and the electroplating layer 51 covers and connects the side of the elastic portion 42 away from the outer connection pad 23 . That is, the electroplating layer 51 is electrically connected to one end of the second conductive portion 41 .
[0098] S210: See Fig. 9 , the electroplating layer 51 is etched to form an outer circuit layer 52, and the outer circuit layer 52 includes a plurality of connecting parts 523. Each of the connecting parts 523 is connected to one end of the second conductive part 41. The connecting part 523 and the elastic part 42 form an elastic conductive member 53. One end of the elastic conductive member 53 is connected to the outer connection pad 23, and the other end is used to connect an electronic component (for example, a chip).
[0099] S220: See Fig.10 A receiving groove 54 is provided on the outer substrate 50 so that the elastic conductive member 53 is exposed in the receiving groove 54 .
[0100] In this embodiment, the receiving groove 54 is formed by laser etching. It can be understood that in other embodiments of the present application, the receiving groove 54 can also be formed by mechanical drilling and liquid etching.
[0101] In this embodiment, after forming the receiving groove 54, step S12 further includes removing the glue. The residual second outer insulating layer 40 debris that may be generated in the process of setting the receiving groove 54 is removed, so as to ensure that the inner surface of the receiving groove 54 is clean and free of interference, so that the subsequent steps, such as the elastic buffer body 60 (see Fig.13 ) can be installed and connected to the circuit board under the best surface conditions. This is very important to ensure the electrical performance and long-term reliability of the circuit board 100, especially in the application of the circuit board 100 with high precision and high performance.
[0102] S230: See Fig.11An elastic buffer 60 is disposed in the receiving groove 54, and the elastic buffer 60 covers the elastic conductive member 53. The elastic buffer 60 is made of one of silicone rubber, polyurethane (PU), nitrile rubber, styrene-butadiene rubber and polyvinyl alcohol (PVA) foam. Preferably, the elastic buffer 60 is made of silicone rubber.
[0103] In this embodiment, the elastic buffer body 60 protrudes out of the receiving groove 54 .
[0104] S240: See Fig.11 , a groove 61 is set in the elastic buffer body 60 so that the connecting portion 523 is exposed at the bottom of the groove 61.
[0105] S250:See Fig.12 A solder mask 62 is disposed on the second outer insulating layer 40 . The solder mask 62 has a window 621 . The elastic buffer 60 extends into the window 621 . The elastic buffer 60 is substantially flush with the solder mask 62 .
[0106] S260: See Fig.13 The connecting portion 523 is provided with an electronic component 70, and the electronic component 70 is electrically connected to the connecting portion 523. The electronic component 70 includes a chip, a resistor, a capacitor, an inductor, and the like.
[0107] Compared with the prior art, the method for manufacturing the circuit board 100 provided in the present application has the following advantages:
[0108] (i) Improving the elasticity and fracture resistance of the circuit board 100. By introducing the elastic portion 42 and the elastic buffer 60 into the circuit board 100, the elasticity of the circuit board 100 is enhanced, so that the circuit board 100 can maintain structural integrity when subjected to mechanical stress such as bending or stretching, thereby reducing the possibility of fracture. This enhanced elasticity not only improves the protection capability of the circuit board 100 in the event of a fall or impact, and protects the electronic components 70 as a buffer layer, but also reduces the risk of damage during the assembly process of the electronic components 70, thereby significantly improving the yield and reliability after assembly.
[0109] (ii) Optimizing the thermal management and mechanical adaptability of the circuit board 100. The design of the elastic portion 42 not only helps to disperse and transfer heat, improving the thermal stability of the circuit board 100, but also its structure also exhibits better adaptability when dealing with thermal expansion or contraction. This structural optimization makes the circuit board 100 more stable and reliable in long-term operation, especially in high temperature environments.
[0110] (III) Strengthening the durability and versatility of the circuit board 100. The addition of the elastic conductive member 53 not only makes the circuit board 100 more elastic and adaptable at the mechanical level, but also enables the circuit board 100 to provide additional protection when it falls or is mechanically impacted, and acts as a buffer layer to reduce the impact force on the electronic components 70. The versatility of this design enables the circuit board 100 to be applicable to more types of electronic devices and to maintain performance and reliability under various operating conditions.
[0111] See also Fig.13 , an embodiment of the present application further provides a circuit board 100, the circuit board 100 includes an outer substrate 50, an elastic conductive member 53 and an elastic buffer 60. The outer substrate 50 includes an outer insulator (a first outer insulating layer 21 and a second outer insulating layer 40) and an outer connecting pad 23 buried in the outer insulator, and a receiving groove 54 is provided on one side of the outer substrate 50. The outer connecting pad 23 is exposed in the receiving groove 54. The elastic conductive member 53 is provided in the receiving groove 54, and the elastic conductive member 53 includes an elastic portion 42 and a connecting portion 523 connected to the elastic portion 42, and one end of the elastic portion 42 away from the connecting portion 523 is connected to the outer connecting pad 23. The elastic buffer 60 is filled in the receiving groove 54, the elastic buffer 60 covers the elastic portion 42, and the connecting portion 523 is exposed in the elastic buffer 60.
[0112] In this embodiment, the circuit board 100 further includes an electronic component 70 , which is disposed on the elastic buffer body 60 , and is electrically connected to the connecting portion 523 . Specifically, the connecting portion 523 is soldered to the electronic component 70 by solder 71 .
[0113] In this embodiment, the first outer insulating layer 21 has a thickness direction A, the elastic conductive member 53 includes a first conductive portion 27 and a second conductive portion 41 , and the extension directions of the first conductive portion 27 and the second conductive portion 41 are both inclined to the thickness direction A.
[0114] In this embodiment, the elastic part 42 includes two first conductive parts 27 and two second conductive parts 41, the two first conductive parts 27 are arranged in an "eight" shape, and the two second conductive parts 41 are arranged in an inverted "eight" shape. In this way, the elasticity and mechanical stability of the circuit board 100 are improved, so that the circuit board 100 has better stress distribution and buffering ability when subjected to external forces.
[0115] In this embodiment, the outer insulator includes a first outer insulating layer 21 and a second outer insulating layer 40 connected to the first outer insulating layer 21, the first conductive portion 27 is disposed on the first outer insulating layer 21, and the second conductive portion 41 is disposed on the second outer insulating layer 40. In this way, better insulation and interlayer structure stability are provided, which helps to maintain the long-term reliability and performance of the circuit board 100.
[0116] In this embodiment, the elastic buffer body 60 is provided with a groove 61, and the connecting portion 523 is exposed at the bottom of the groove 61. In this way, the connecting portion 523 is easy to access, while the elastic portion 42 is protected, thereby improving assembly efficiency and the overall functionality of the circuit board 100.
[0117] In this embodiment, the circuit board 100 also includes a solder mask 62, which is arranged on the outer insulator. The solder mask 62 is provided with a window 621, and the elastic buffer body 60 extends into the window 621. The elastic buffer body 60 is flush with the solder mask 62, thereby reducing the thermal damage that may be caused to the circuit board 100 during the welding process, and at the same time provides a smooth and neat surface, which is beneficial to the final assembly and appearance of the circuit board 100.
[0118] In this embodiment, the outer substrate 50 further includes an outer conductive body 22 connected to the outer connection pad 23, and the circuit board further includes an inner substrate 10, the inner substrate 10 includes an inner insulator 11, an inner conductive body 12 and a plurality of inner connection pads 13, some of the inner connection pads 13 are arranged in intervals in the inner insulator 11, and some of the inner connection pads 13 are arranged outside the inner insulator 11, the inner conductive body 12 connects the plurality of inner connection pads 13, and the inner insulator 11 is arranged on the outer insulator. In this way, the multi-layer structure optimizes the electrical connection and signal transmission capabilities of the circuit board 100, while maintaining good insulation and physical strength, and meets the needs of high-performance electronic devices.
[0119] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in the actual application process. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.
Claims
1. A circuit board, It is characterized in that include: An outer substrate, the outer substrate comprising an outer insulator and an outer connection pad buried in the outer insulator, a groove is provided on one side of the outer insulator, and the outer connection pad is exposed in the groove; An elastic conductive member, the elastic conductive member is disposed in the slot, the elastic conductive member comprises an elastic portion and a connecting portion connected to the elastic portion, and an end of the elastic portion facing away from the connecting portion is connected to the outer connecting pad; An elastic buffer body is filled in the slot, the elastic buffer body covers the elastic part, and the connecting part is exposed from the elastic buffer body.
2. The circuit board according to claim 1, It is characterized in that It also includes an electronic component, which is arranged on the elastic buffer body and is electrically connected to the connecting part.
3. The circuit board according to claim 1, It is characterized in that The outer insulator has a thickness direction, the elastic portion includes a first conductive portion and a second conductive portion, and the extension direction of the first conductive portion and the extension direction of the second conductive portion are both arranged to be inclined with respect to the thickness direction.
4. The circuit board as claimed in claim 3, It is characterized in that The elastic portion includes two first conductive portions and two second conductive portions, the two first conductive portions are arranged in an "eight" shape, and the two second conductive portions are arranged in an inverted "eight" shape.
5. The circuit board as claimed in claim 4, It is characterized in that The outer insulator includes a first outer insulating layer and a second outer insulating layer connected to the first outer insulating layer. The first conductive portion is disposed on the first outer insulating layer, and the second conductive portion is disposed on the second outer insulating layer.
6. The circuit board according to claim 1, It is characterized in that The elastic buffer body is provided with a groove, and the connecting portion is exposed at the bottom of the groove.
7. The circuit board as claimed in claim 3, It is characterized in that The circuit board also includes a solder mask layer, which is arranged on the outer insulator. The solder mask layer is provided with a window, and the elastic buffer body extends into the window. The elastic buffer body is flush with the solder mask layer.
8. The circuit board according to claim 1, It is characterized in that The outer substrate also includes an outer conductive body connected to the outer connection pads, and the circuit board also includes an inner substrate, the inner substrate includes an inner insulator, an inner conductive body and a plurality of inner connection pads, some of the inner connection pads are arranged in the inner insulator at intervals, and some of the inner connection pads are arranged on the outside of the inner insulator, the inner conductive body connects the plurality of inner connection pads, the inner insulator is arranged on the outer insulator, and the outer conductive body connects the inner connection pads.
9. The circuit board as claimed in claim 8, It is characterized in that The material of the outer insulator includes ABF, and the material of the inner insulator includes glass fiber.
10. The circuit board according to claim 1, It is characterized in that The elastic buffer body is made of silicone rubber.