Base material gluing device for fitting flexible circuit board

Abstract

The utility model discloses a base material gluing device for fitting a flexible circuit board, which comprises a box body, supporting plates are symmetrically arranged at the top of the box body, a first moving frame is arranged at the tops of the supporting plates in a sliding manner, a square groove is formed in a cross beam of the first moving frame, cylinders are symmetrically arranged on the inner side of the square groove, N-shaped frames are arranged at the two ends of the cylinders, and the N-shaped frames are arranged on the cross beam of the first moving frame. A glue storage box is installed above the N-shaped frame, a heating ring is installed in the glue storage box, a plurality of glue spraying devices are symmetrically installed on the two sides of the N-shaped frame, and a cylinder is in sliding connection with a square groove. An adhesive plate is mounted in the square plate, a plurality of exhaust fans are arranged below the adhesive plate, the adhesive plate is used for adsorbing dust and impurities on the base material and the flexible circuit board, and the exhaust fans are used for pumping out the dust and impurities on the base material and the flexible circuit board, so that the dust or impurities are prevented from influencing the quality and conductivity of the base material and the flexible circuit board; and pollution to the base material and the circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of glue coating devices, in particular to a substrate glue coating device for laminating a flexible circuit board. Background Art

[0002] With the development of science and technology, electronic products are gradually becoming smaller and more mobile, and flexible circuit boards have become a key solution to meet this demand. However, in the manufacturing process of flexible circuit boards, how to achieve efficient and uniform glue coating has become a technical difficulty.

[0003] At present, the traditional glue coating method relies on manual operation, which is not only inefficient, but also has a low production speed. In addition, there are a lot of dust and fine impurities on the substrate and the flexible circuit board. If they are not removed in time, the dust or impurities will affect the quality and conductive properties of the substrate and the flexible circuit board. These pollutions can easily damage the flexible circuit board. To this end, we provide a substrate glue coating device for flexible circuit board lamination to improve production efficiency and glue coating quality. Utility Model Content

[0004] The purpose of the utility model is to provide a substrate glue coating device for laminating a flexible circuit board to solve the above-mentioned background problems.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A substrate gluing device for laminating a flexible circuit board comprises a box body, a support plate is symmetrically installed on the top of the box body, a movable frame is slidably arranged on the top of the support plate, a square groove is opened on the cross beam of the movable frame, cylinders are symmetrically arranged on the inner side of the square groove, N-shaped frames are installed at both ends of the cylinder, a glue storage box is installed above the N-shaped frame, a heating ring is installed inside the glue storage box, a plurality of glue spraying devices are symmetrically installed on both sides of the N-shaped frame, and the cylinder is slidably connected to the square groove.

[0007] As a further solution of the utility model: sliding frames are symmetrically installed between the support plates, and a plurality of transmission plates are slidably connected to the top of the sliding frames.

[0008] As a further solution of the utility model: a second moving frame is slidably arranged on the top of the support plate, and cylinders are symmetrically installed on the lower surfaces of the two cross beams of the second moving frame, and the telescopic ends of the cylinders are connected to square plates.

[0009] As a further solution of the utility model: a sticking plate is installed on the inner side of the square plate, and a plurality of exhaust fans are arranged below the sticking plate.

[0010] As a further solution of the utility model: a baking box is installed on a side away from the second movable frame, and a plurality of heating rods are arranged on the inner side of the baking box.

[0011] As a further solution of the utility model: the baking oven is located on the top of the support plate, and the support plate is slidably connected to the baking oven.

[0012] As a further solution of the utility model: the movable rack 1 is located between the baking box and the movable rack 2.

[0013] As a further solution of the utility model: the sticking plate is slidably connected to the square plate, and a handle is installed on one side of the sticking plate.

[0014] Beneficial effects of the utility model:

[0015] (1) A sticky plate is installed inside the square plate, and a plurality of exhaust fans are arranged below the sticky plate. The sticky plate is used to absorb dust and debris on the substrate and the flexible circuit board, and the exhaust fans are used to extract dust and impurities on the substrate and the flexible circuit board, thereby preventing dust or impurities from affecting the quality and conductive properties of the substrate and the flexible circuit board, and reducing the damage caused by these pollutions to the flexible circuit board;

[0016] (2) The groove at the bottom of the movable frame is slidably connected with the top of the support plate, and the cylinder inside the N-shaped frame is slidably connected with the square groove. A glue storage box is installed above the N-shaped frame, and a heating coil is installed inside the glue storage box. The heating coil converts electrical energy into thermal energy and then transfers it to the glue. Multiple glue spraying devices are symmetrically installed on both sides of the N-shaped plate, so that the glue coating device can adjust the position and angle according to actual needs, and better glue coating operations can be performed on substrates of different sizes. The glue spraying device can be used to brush multiple substrates and circuit boards, which greatly improves production efficiency. At the same time, it ensures that the glue maintains good fluidity and viscosity, thereby improving the quality and efficiency of glue brushing;

[0017] (3) The conveyor plate transfers the glue-coated substrate and the flexible circuit board to the bottom of the oven through the sliding rack. At this time, the heating rods inside the oven begin to heat the substrate and the flexible circuit board. During the heating process, the temperature inside the oven will gradually rise. Several heating rods will evenly transfer the heat to various parts of the flexible circuit board, so that the glue on the substrate and the flexible circuit board can completely penetrate into every gap on the circuit board, thereby improving the reliability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings.

[0019] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0020] Figure 2 This is a cross-sectional view of the connection structure between the baking box and the heating rod of the utility model;

[0021] Figure 3This is a cross-sectional view of the connection structure between the cylinder and the N-shaped frame of the utility model;

[0022] Figure 4 It is a cross-sectional view of the connection structure between the sticky plate and the exhaust fan of the utility model.

[0023] In the figure: 1. box body; 2. sliding rack; 3. conveyor plate; 4. support plate; 5. baking box; 6. heating rod; 7. mobile rack 1; 9. square groove; 10. cylinder; 11. N-shaped rack; 12. glue storage box; 13. heating coil; 15. glue spraying device; 17. mobile rack 2; 19. cylinder; 20. square plate; 21. adhesive plate; 22. exhaust fan. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1

[0026] See also Figure 1 , Figure 4 As shown, the utility model is a substrate glue coating device for laminating a flexible circuit board, comprising a box body 1, a sliding frame 2 is symmetrically installed on the top of the box body 1, a plurality of conveying plates 3 are slidably connected to the top of the sliding frame 2, a supporting plate 4 is symmetrically installed on the top of the box body 1, the sliding frame 2 is located between the supporting plates 4, a moving frame 17 is arranged on the top of the two supporting plates 4, a plurality of cylinders 19 are symmetrically installed on the lower surface of the crossbeam of the moving frame 17, the telescopic end of the cylinder 19 is connected to a square plate 20, a sticking plate 21 is installed inside the square plate 20, and a plurality of exhaust fans 22 are arranged below the sticking plate 21;

[0027] Specifically, the adhesive plate 21 is used to absorb dust and debris on the substrate and the flexible circuit board.

[0028] The exhaust fan 22 is used to extract dust and impurities on the substrate and the flexible circuit board, thereby preventing the dust or impurities from affecting the quality and conductive properties of the substrate and the flexible circuit board and reducing pollution to the substrate and the circuit board.

[0029] The use process of the embodiment of the utility model is as follows: the conveying plate 3 conveys the flat substrate and the flexible circuit board to the bottom of the square plate 20 through the sliding frame 2, and the cylinder 19 pushes the square plate 20 to the top of the substrate and the flexible circuit board through the telescopic end. At this time, multiple exhaust fans 22 are turned on and rotated to draw dust and impurities on the substrate and the flexible circuit board into the lower end of the adhesive plate 21, and the adhesive plate 21 absorbs the dust and impurities on the substrate and the flexible circuit board. After the work is completed, the adhesive plate 21 is pulled out from the side of the square plate 20, cleaned with a glue remover, and then the unused glue in the glue storage box 12 is sprayed on the surface of the adhesive plate 21 through the glue spraying device 15, and it is reused.

[0030] Embodiment 2

[0031] Based on Example 1, please refer to Figure 1 , Figure 3 As shown, in order to realize the simultaneous coating of multiple substrates and flexible circuits and improve production efficiency and production quality, the utility model is a substrate glue coating device for flexible circuit board bonding, which also includes a moving frame 7, the moving frame 7 is located above the box body 1, and a groove is provided at the bottom of the moving frame 7. The moving frame 7 is slidably connected to the top of the support plate 4 through the groove at the bottom;

[0032] Specifically, a square groove 9 is provided on the crossbeam of the mobile frame 7, and a cylinder 10 is symmetrically arranged on the inner side of the square groove 9, and the cylinder 10 is slidably connected to the square groove 9, and N-shaped frames 11 are installed at both ends of the cylinder 10, and a glue storage box 12 is installed above the N-shaped frame 11, and a heating ring 13 is installed inside the glue storage box 12, and a plurality of glue spraying devices 15 are symmetrically installed on both sides of the N-shaped frame 11;

[0033] More specifically, the groove at the bottom of the movable frame 7 is slidably connected to the top of the support plate 4, and the cylinder 10 on the inner side of the N-shaped frame 11 is slidably connected to the square groove 9, so that the gluing device can adjust the position and angle according to actual needs, thereby achieving better gluing operations on substrates of different sizes.

[0034] The glue storage box 12 is a container for storing glue. The heating coil 13 inside it converts electrical energy into thermal energy and then transfers it to the glue. The heating coil 13 is used to control the temperature of the glue inside the glue storage box 12, thereby ensuring that the glue maintains good fluidity and viscosity, thereby improving the quality and efficiency of glue brushing.

[0035] The top of the glue spraying device 15 is connected to the glue storage box 12 through an arc tube, so that the glue inside the glue storage box 12 can flow to the inside of the glue spraying device 15 through the arc tube, and the glue spraying device 15 then coats the substrate and the flexible circuit board. By symmetrically installing multiple glue spraying devices 15 on both sides of the N-shaped plate, the glue spraying device 15 can coat multiple substrates and circuit boards, greatly improving the production efficiency.

[0036] Specifically, the glue spraying device 15 is located between the baking oven 5 and the second movable rack 17 .

[0037] The use process of the embodiment of the utility model is as follows: the conveying plate 3 conveys the cleaned substrate and the flexible circuit board to the bottom of the glue spraying device 15 through the sliding frame 2, and the glue inside the glue storage box 12 flows into the inside of the glue spraying device 15 through the arc tube. At this time, the movable frame 7 and the N-shaped frame 11 adjust the position and angle according to actual needs. After the adjustment, the glue spraying device 15 starts to spray the substrate and the flexible circuit board.

[0038] Embodiment 3

[0039] Based on the first and second embodiments, please refer to Figure 1-Figure 2 As shown, in order to achieve rapid solidification of the glue on the substrate and the flexible circuit board, the utility model is a substrate glue coating device for bonding the flexible circuit board, which also includes a baking box 5 arranged above the sliding frame 2, and a plurality of heating rods 6 arranged inside the baking box 5;

[0040] Specifically, the baking oven 5 is used to heat the flexible circuit board on the surface of the conveying plate 3 where the glue has not dried yet. The flexible circuit board is heated by the heating rod 6 to promote the curing of the glue. As the temperature rises, the substrate will gradually soften and adhere to the flexible circuit board, thereby improving production efficiency, reducing production costs, and making the adhesion between the substrate and the flexible circuit board stronger.

[0041] The use process of the embodiment of the utility model is as follows: the conveying plate 3 conveys the substrate and the flexible circuit board coated with glue to the bottom of the baking oven 5 through the sliding frame 2. At this time, the heating rod 6 inside the baking oven 5 starts to heat the substrate and the flexible circuit board. During the heating process, the temperature inside the baking oven 5 will gradually rise, and several heating rods 6 will evenly transfer heat to various parts of the flexible circuit board, so that the glue on the substrate and the flexible circuit board can completely penetrate into every gap on the circuit board, thereby improving the reliability of the circuit board.

[0042] The working principle of the utility model is as follows: the conveying plate 3 conveys the flat substrate and the flexible circuit board to the bottom of the square plate 20 through the sliding frame 2, and the cylinder 19 pushes the square plate 20 to the top of the substrate and the flexible circuit board through the telescopic end. At this time, multiple exhaust fans 22 are turned on and rotated to draw dust and impurities on the substrate and the flexible circuit board into the lower end of the adhesive plate 21, and the adhesive plate 21 absorbs dust and debris on the substrate and the flexible circuit board. After the impurities and dust are completely sucked away, the exhaust fan 22 stops working, and the cylinder 19 lifts the square plate 20 through the telescopic end. The conveying plate 3 conveys the cleaned substrate and the flexible circuit board to the bottom of the glue spraying device 15 through the sliding frame 2, and the glue inside the glue storage box 12 flows to the inside of the glue spraying device 15 through the arc tube. At this time, the movable frame 7 and the N-shaped frame 11 adjust their positions according to actual needs. and angle, after adjustment, the glue spraying device 15 starts to spray the substrate and the flexible circuit board. After spraying, the conveying plate 3 conveys the substrate and the flexible circuit board coated with glue to the bottom of the baking oven 5 through the sliding frame 2. At this time, the heating rod 6 inside the baking oven 5 starts to heat the substrate and the flexible circuit board. During the heating process, the temperature in the baking oven 5 will gradually rise, and several heating rods 6 will evenly transfer heat to various parts of the flexible circuit board, so that the glue on the substrate and the flexible circuit board can completely penetrate into every gap on the circuit board, thereby improving the reliability of the circuit board. After the work is completed, the adhesive plate 21 is pulled out from the side of the square plate 20, cleaned with a glue remover, and then the unused glue in the glue storage box 12 is sprayed on the surface of the adhesive plate 21 through the glue spraying device 15 for reuse.

[0043] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A substrate glue coating device for bonding a flexible circuit board, characterized in that: The invention comprises a box body (1), a support plate (4) is symmetrically installed on the top of the box body (1), a movable frame (7) is slidably installed on the top of the support plate (4), a square groove (9) is opened on the crossbeam of the movable frame (7), a cylinder (10) is symmetrically installed on the inner side of the square groove (9), an N-shaped frame (11) is installed at both ends of the cylinder (10), a glue storage box (12) is installed above the N-shaped frame (11), a heating ring (13) is installed inside the glue storage box (12), a plurality of glue spraying devices (15) are symmetrically installed on both sides of the N-shaped frame (11), and the cylinder (10) is slidably connected to the square groove (9).

2. A substrate glue coating device for bonding a flexible circuit board according to claim 1, characterized in that: A sliding frame (2) is symmetrically installed between the support plates (4), and a plurality of conveying plates (3) are slidably connected to the top of the sliding frame (2).

3. A substrate glue coating device for bonding a flexible circuit board according to claim 2, characterized in that: A second moving frame (17) is slidably arranged on the top of the support plate (4), and cylinders (19) are symmetrically mounted on the lower surfaces of two cross beams of the second moving frame (17), and the telescopic ends of the cylinders (19) are connected to square plates (20).

4. A substrate glue coating device for bonding a flexible circuit board according to claim 3, characterized in that: A sticking plate (21) is installed on the inner side of the square plate (20), and a plurality of exhaust fans (22) are arranged below the sticking plate (21).

5. The device for applying glue to a substrate for laminating a flexible circuit board according to claim 3, characterized in that: A baking oven (5) is installed on a side away from the second movable frame (17), and a plurality of heating rods (6) are arranged on the inner side of the baking oven (5).

6. A substrate glue coating device for bonding a flexible circuit board according to claim 5, characterized in that: The baking oven (5) is located on the top of the support plate (4), and the support plate (4) is slidably connected to the baking oven (5).

7. The device for applying glue to a substrate for laminating a flexible circuit board according to claim 1, characterized in that: The movable rack 1 (7) is located between the baking box (5) and the movable rack 2 (17).

8. The device for applying glue to a substrate for laminating a flexible circuit board according to claim 4, characterized in that: The sticking plate (21) is slidably connected to the square plate (20), and a handle is installed on one side of the sticking plate (21).

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