Glue applying device and glue applying system

Abstract

The utility model provides a sizing device and a sizing system, and belongs to the technical field of conductive foam manufacturing. The sizing device comprises a base and a sizing block. A through groove is formed in the top of the base; the glue applying block is installed at the top of the base, a boss clamped and matched with the through groove is arranged at the bottom of the glue applying block, a strip-shaped gap used for allowing the conducting layer to pass through is defined by the side, close to the groove bottom of the through groove, of the boss and the groove bottom of the through groove, and a groove sunken in the direction away from the bottom wall of the through groove is formed in the side, close to the groove bottom, of the boss; and a sizing hole in the sizing block penetrates through the bottom wall of the groove. According to the sizing device, the problem that glue overflows from the edges of the conductive layer and the foam elastomer in the coating forming process can be solved, and then high-quality conductive foam is prepared.

Description

Technical Field

[0001] The present application relates to the technical field of conductive foam manufacturing, and in particular to a gluing device and a gluing system. Background Art

[0002] In the prior art, a glue-applying device is usually used in the process of producing conductive foam to form an adhesive layer on the surface of the conductive layer, and then the formed adhesive layer is used to bond with the foam elastomer to achieve the coating of the conductive layer on the foam elastomer, thereby preparing the conductive foam. However, due to the poor structural design of the glue-applying device of the prior art, there is a problem of glue overflow in the edge area of ​​the conductive layer and the foam elastomer during the coating molding process, which in turn causes the surface of the conductive foam to be glued, so that the quality of the corresponding product is affected. Utility Model Content

[0003] The purpose of the present application is to provide a glue applying device and a glue applying system, which can improve the problem of glue overflow at the edges of the conductive layer and the foam elastomer during the overmolding process, thereby preparing high-quality conductive foam.

[0004] The embodiment of the present application is implemented as follows:

[0005] In the first aspect, the embodiment of the present application provides a glue-applying device, comprising a base and a glue-applying block. A through slot is provided on the top of the base; the glue-applying block is mounted on the top of the base, and the bottom of the glue-applying block has a boss that engages with the through slot, and the boss is close to the bottom of the through slot to form a strip-shaped gap for passing the conductive layer, and the boss is close to the bottom of the slot to form a groove that is recessed in a direction away from the bottom wall of the through slot, and the glue-applying hole on the glue-applying block passes through the bottom wall of the groove.

[0006] In the above technical solution, the boss on the glue block is provided with a groove which is concave in the direction away from the bottom wall of the through groove, and the glue hole on the glue block is arranged to penetrate the bottom wall of the groove. During the gluing process, an adhesive layer which is thick in the middle and thin on both sides can be formed. Compared with the gluing device of the existing structure (which usually forms an adhesive layer with uniform thickness), in the subsequent overmolding process, since there is less adhesive in the edge area of ​​the conductive layer, the risk of glue overflow at the edge can be effectively reduced, thereby preparing a conductive foam with relatively excellent quality.

[0007] In some optional embodiments, the groove is located in the middle of the boss in the width direction of the through groove.

[0008] In the above technical solution, the groove is set in the middle of the boss in the width direction of the through groove, that is, the groove is set in the center, which can more accurately control the thickness of the glue layer on the edge surfaces of both sides of the conductive layer, thereby more effectively solving the problem of glue overflow at the edges of the conductive layer and the foam elastomer during the overmolding process.

[0009] In some optional embodiments, in the width direction of the through groove, the ratio of the inner width of the groove to the size of the boss is 7:10 to 8:10.

[0010] In the above technical solution, in the width direction of the through groove, the ratio of the inner width of the groove to the size of the boss is limited within a specific range, so that the inner width of the groove has a more appropriate size ratio, thereby being able to more accurately control the thickness of the glue layer on the edge surfaces of both sides of the conductive layer.

[0011] In some optional embodiments, in the height direction of the glue applying device, both side walls of the through groove are provided with chamfers at the opening.

[0012] In the above technical solution, chamfers are provided on both side walls of the through groove at the opening, which can make the glue block fit more closely with the area corresponding to the through groove and not easily produce burrs during the snap-fitting process, thereby improving the overall stability of the glue application device and extending its service life to a certain extent.

[0013] In some optional embodiments, in the extension direction of the through slot, the bottom wall of the through slot is provided with chamfers at both end openings.

[0014] In the above technical solution, the bottom wall of the through slot is provided with chamfers at both end openings, which can effectively reduce the risk of scratching between the bottom wall of the through slot and the bottom of the conductive layer when the conductive layer passes in and out of the through slot, thereby better protecting the conductive layer.

[0015] In some optional embodiments, in the extension direction of the through groove, the base has a first mounting portion and a second mounting portion, the glue block is installed on the first mounting portion, the through groove passes through the first mounting portion and the second mounting portion, the height of the first mounting portion is greater than the height of the second mounting portion, so that the depth of a section of the through groove corresponding to the first mounting portion is greater than the depth of a section of the through groove corresponding to the second mounting portion, and the glue applying device also includes a glue scraping unit, which is installed on the second mounting portion and is configured to be able to thin the glue layer on the two side edges of the conductive layer located in the through groove.

[0016] In the above technical solution, the base is set to the above-mentioned specific form, and an additional glue scraping unit is provided which can thin the glue layer on the two side edges of the conductive layer located in the through groove, that is, the glue applying device is given a secondary thinning function, which can more accurately control the thickness of the glue layer on the two side edges of the conductive layer, thereby more effectively solving the problem of glue overflow at the edge.

[0017] In some optional embodiments, the scraper unit includes two relatively distributed scraper blocks installed on the second mounting part, and the two scraper blocks are spaced apart on both sides of the through slot. Corresponding to each scraper block, the second mounting parts on both sides of the through slot are provided with a glue flow channel, and the end of the scraper block passes through the top of the opening of the glue flow channel and extends to the top of the through slot, which is used to thin the glue layer on the corresponding edge of the conductive layer, and the glue flow channel is used to collect glue scraps generated during the thinning process.

[0018] In the above technical solution, the glue scraping unit is configured in the form of a glue scraping block and a corresponding glue flow channel cooperating with each other, which has the advantages of convenient glue scraping and relatively simple overall structure.

[0019] In some optional embodiments, the scraper block includes a connecting plate and a scraper plate, the connecting plate is connected to the second mounting portion, the end of the scraper plate passes through the opening of the glue flow channel and extends to the top of the through slot, and is used to thin the glue layer on the corresponding edge of the conductive layer, and the size of the scraper plate gradually decreases from the end away from the through slot to the end close to the through slot.

[0020] In the above technical solution, the scraper block is set in a form in which the connecting plate and the scraper plate cooperate with each other, and the scraper plate is set in a specific form in which its size gradually decreases from the end farthest from the through groove to the end close to the through groove, which has the advantage of more convenient scraping.

[0021] In some optional embodiments, the end of the scraper plate away from the connecting plate is inclined toward the first mounting portion.

[0022] In the above technical solution, the end of the scraper plate away from the connecting plate is arranged to be inclined toward the first mounting portion, so that the scraper plate can cut into the glue layer at a specific angle and thin the glue layer in the corresponding area, which has the advantage of more convenient scraping.

[0023] In a second aspect, an embodiment of the present application provides a glue applying system, comprising a glue applying device and a traction device as provided in the embodiment of the first aspect, wherein the traction device is used to pull the conductive layer through the through groove.

[0024] In the above technical scheme, the gluing system includes a gluing device as provided in the first aspect embodiment. With the help of the gluing device with a specific structure, the gluing system can improve the problem of glue overflow at the edges of the conductive layer and the foam elastomer during the overmolding process, thereby preparing high-quality conductive foam. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic structural diagram of a first glue application device provided in an embodiment of the present application at a first viewing angle;

[0027] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0028] Figure 3 A schematic structural diagram of a second glue application device provided in an embodiment of the present application at a first viewing angle;

[0029] Figure 4 A schematic structural diagram of a second glue application device provided in an embodiment of the present application at a second viewing angle.

[0030] Icons: 10-glue applying device; 100-base; 110-through slot; 120-first mounting portion; 121-fixing hole; 130-second mounting portion; 131-screw hole; 200-glue applying block; 210-boss; 211-groove; 220-glue applying hole; 300-glue scraping unit; 310-glue scraping block; 311-connecting plate; 312-glue scraping plate; 320-glue flow channel; 400-glue supply hose; a-width direction of the through slot; b-extension direction of the through slot; c-height direction of the glue applying device. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of this application, it should be noted that the terms "upper", "lower", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0035] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] The gluing device and the gluing system provided in the present application are described in detail below.

[0037] See also Figure 1 and Figure 2 In the first aspect, the embodiment of the present application provides a glue-applying device 10, comprising a base 100 and a glue-applying block 200. A through slot 110 is provided on the top of the base 100; the glue-applying block 200 is installed on the top of the base 100, and the bottom of the glue-applying block 200 has a boss 210 that is snap-fitted with the through slot 110, and the boss 210 is close to the bottom of the through slot 110 to form a strip-shaped gap for passing the conductive layer, and the boss 210 is close to the bottom of the groove to form a groove 211 that is recessed in a direction away from the bottom wall of the through slot 110, and the glue-applying hole 220 on the glue-applying block 200 passes through the bottom wall of the groove 211.

[0038] In the present application, the boss 210 on the glue block 200 is provided with a groove 211 which is recessed in the direction away from the bottom wall of the through groove 110, and the glue hole 220 on the glue block 200 is arranged to penetrate the bottom wall of the groove 211. During the gluing process, an adhesive layer which is thick in the middle and thin on both sides can be formed. Compared with the gluing device 10 of the existing structure (which usually forms an adhesive layer with uniform thickness), in the subsequent overmolding process, since there is less adhesive in the edge area of ​​the conductive layer, the risk of glue overflow at the edge can be effectively reduced, thereby preparing a conductive foam with relatively excellent quality.

[0039] It should be noted that, considering the convenience of gluing, the structure of the gluing device 10 can be optimized.

[0040] See also Figure 2 As an example, in the width direction a of the through groove, the groove 211 is located in the middle of the boss 210 .

[0041] In this embodiment, the groove 211 is arranged in the middle of the boss 210 in the width direction a of the through groove, that is, the groove 211 is arranged in the center, which can more accurately control the thickness of the glue layer on the edge surfaces of both sides of the conductive layer, thereby more effectively solving the problem of glue overflow at the edges of the conductive layer and the foam elastomer during the overmolding process.

[0042] In other possible implementations, in the width direction a of the through slot, the groove 211 may also be arranged to be biased toward any side edge thereof, for example, the groove 211 is arranged to be biased toward the left or right.

[0043] As an example, in the width direction a of the through groove, the ratio of the inner width of the groove 211 to the size of the boss 210 is 7:10 to 8:10, for example but not limited to the size ratio of any one of 7:10, 7.2:10, 7.4:10, 7.6:10, 7.8:10 and 8:10 or a range value between any two of them.

[0044] In this embodiment, in the width direction a of the through groove, the ratio of the inner width of the groove 211 to the size of the boss 210 is limited within a specific range so that the inner width of the groove 211 has a more suitable size ratio, thereby being able to more accurately control the thickness of the glue layer on the edge surfaces of both sides of the conductive layer.

[0045] It should be noted that the depth of the groove 211 is not limited and can be adjusted according to actual gluing needs.

[0046] See also Figure 2 As an example, in the height direction c of the glue application device, both side walls of the through groove 110 are provided with chamfers at the opening.

[0047] In this embodiment, both side walls of the through groove 110 are provided with chamfers at the opening, which can make the glue block 200 fit more closely with the area corresponding to the through groove 110 and is not easy to produce burrs during the snap-fitting process, thereby improving the overall stability of the glue application device 10 and extending its service life to a certain extent.

[0048] See also Figure 3 As an example, the glue applying device 10 further includes a glue supply pipe 400 , which extends along a height direction c of the glue applying device, and an outlet of the glue supply pipe 400 is connected to the glue applying hole 220 .

[0049] In this embodiment, the glue applying device 10 is additionally provided with a glue supply pipe 400 extending along the height direction c of the glue applying device, which can provide a certain power for glue applying by means of the gravity of the glue itself, thereby facilitating glue applying.

[0050] See also Figure 4 As an example, in the extension direction b of the through slot, the bottom wall of the through slot 110 is provided with chamfers at both end openings.

[0051] In this embodiment, the bottom wall of the through slot 110 is provided with chamfers at both end openings, which can effectively reduce the risk of scratching the bottom wall of the through slot 110 and the bottom of the conductive layer when the conductive layer passes in and out of the through slot 110, thereby better protecting the conductive layer.

[0052] See also Figure 4 As an example, in the extension direction b of the through groove, the base 100 has a first mounting portion 120 and a second mounting portion 130, the glue block 200 is installed on the first mounting portion 120, the through groove 110 passes through the first mounting portion 120 and the second mounting portion 130, the height of the first mounting portion 120 is greater than the height of the second mounting portion 130, so that the depth of a section corresponding to the through groove 110 and the first mounting portion 120 is greater than the depth of a section corresponding to the through groove 110 and the second mounting portion 130, and the glue applying device 10 also includes a glue scraping unit 300, which is installed on the second mounting portion 130 and is configured to be able to thin the glue layer on the two side edges of the conductive layer located in the through groove 110.

[0053] In this embodiment, the base 100 is set to the above-mentioned specific form, and a scraper unit 300 is added to thin the glue layer on the two side edges of the conductive layer located in the through groove 110, that is, the glue application device 10 is given a secondary thinning function, which can more accurately control the thickness of the glue layer on the two side edges of the conductive layer, thereby more effectively solving the problem of edge glue overflow.

[0054] It is understandable that the first mounting portion 120 is further provided with a fixing hole 121 penetrating the first mounting portion 120 , for fixing the base 100 at a preset mounting position.

[0055] See also Figure 4 As an example, in the width direction a of the through slot, the first mounting portions 120 on both sides of the through slot 110 are provided with fixing holes 121 , and the two fixing holes 121 are relatively distributed and are both U-shaped holes with their openings facing away from the through slot 110 .

[0056] In this embodiment, the fixing hole 121 is set as a U-shaped hole, which has the advantage that the installation position can be adjusted.

[0057] It should be noted that the relative height of the first mounting portion 120 and the height of the second mounting portion 130 is not limited and can be adjusted according to actual glue application needs.

[0058] See also Figure 4 As an example, the scraper unit 300 includes two relatively distributed scraper blocks 310 installed on the second mounting portion 130, and the two scraper blocks 310 are spaced apart on both sides of the through slot 110. Corresponding to each scraper block 310, the second mounting portion 130 on both sides of the through slot 110 is provided with a glue flow channel 320, and the end of the scraper block 310 passes through the top of the opening of the glue flow channel 320 and extends to the top of the through slot 110, which is used to thin the glue layer on the corresponding edge of the conductive layer, and the glue flow channel 320 is used to collect glue scraps generated during the thinning process.

[0059] In this embodiment, the glue scraping unit 300 is configured in the form of a glue scraping block 310 and a corresponding glue flow channel 320 cooperating with each other, which has the advantages of convenient glue scraping and a relatively simple overall structure.

[0060] It should be noted that in order to more efficiently collect glue scraps generated by the glue scraping block 310 during the glue scraping process, the structure of the glue scraping unit 300 may be optimized.

[0061] As an example, the glue scraping unit 300 further includes a vacuum device, which is connected to the outlet of the glue flow channel 320 .

[0062] In this embodiment, the glue scraping unit 300 is additionally provided with a vacuum device, and with the help of the negative pressure provided by the vacuum device, the glue scraps can be collected more efficiently.

[0063] See also Figure 4 As an example, the glue flow channel 320 is a waist hole extending along the extension direction b of the through groove and passing through the second mounting portion 130 .

[0064] In this embodiment, the glue flow channel 320 is set to the above-mentioned specific form, which has the advantage of a wider glue collection area.

[0065] It should be noted that the form of the scraper block 310 is not limited, as long as it can achieve the function of thinning the glue layer on the corresponding edge of the conductive layer.

[0066] See also Figure 4 As an example, the scraper block 310 includes a connecting plate 311 and a scraper plate 312, the connecting plate 311 is connected to the second mounting portion 130, the end of the scraper plate 312 passes through the opening of the glue flow channel 320 and extends to the top of the through groove 110, and is used to thin the glue layer on the corresponding edge of the conductive layer, and the size of the scraper plate 312 gradually decreases from the end away from the through groove 110 to the end close to the through groove 110.

[0067] In this embodiment, the scraper block 310 is configured in a form in which the connecting plate 311 and the scraper plate 312 cooperate with each other, and the scraper plate 312 is configured in a specific form in which its size gradually decreases from the end away from the through groove 110 to the end close to the through groove 110, which has the advantage of more convenient scraping.

[0068] It should be noted that the connection method between the connecting plate 311 and the second mounting portion 130 is not limited, and may be, for example, a snap-on connection or a bolt connection.

[0069] See also Figure 4 As an example, both the connecting plate 311 and the second mounting portion 130 are provided with screw holes 131 , and the connecting plate 311 and the second mounting portion 130 are bolted together via the two screw holes 131 .

[0070] In this embodiment, the connecting plate 311 and the second mounting portion 130 are connected by bolts (ie, the connecting plate 311 can rotate around the bolts on the top end surface of the second mounting portion 130), and the position of the scraper plate 312 can be adjusted according to actual scraping requirements to improve scraping flexibility.

[0071] See also Figure 4 As an example, the screw hole 131 located on the connecting plate 311 is a waist-shaped screw hole 131.

[0072] In this embodiment, the screw hole 131 on the connecting plate 311 is set as a waist-shaped screw hole 131, so that the installation position of the connecting plate 311 on the second installation portion 130 has higher adjustment flexibility, thereby further improving the flexibility of scraping glue.

[0073] See also Figure 4 As an example, the end of the scraper plate 312 away from the connecting plate 311 is inclined toward the first mounting portion 120 .

[0074] In this embodiment, the end of the scraper plate 312 away from the connecting plate 311 is arranged to be inclined toward the first mounting portion 120, so that the scraper plate 312 can cut into the glue layer at a specific angle and thin the glue layer in the corresponding area, which has the advantage of more convenient scraping.

[0075] See also Figure 4 As an example, the scraper plate 312 protrudes from a side away from the through slot 110 toward a side close to the through slot 110 .

[0076] In this embodiment, the scraper plate 312 is set to the above-mentioned specific form, so that during the scraping process, the generated glue scraps can fall into the glue flow channel 320 faster and more easily.

[0077] It should be noted that the structures or units in the glue application device 10 that are not particularly described or limited are not limited and can be set according to conventional selections in the art.

[0078] In a second aspect, an embodiment of the present application provides a glue applying system, including a glue applying device 10 as provided in the embodiment of the first aspect and a traction device, the traction device being used to pull the conductive layer through the through groove 110 .

[0079] In the present application, the gluing system includes a gluing device 10 as provided in the first aspect embodiment. With the help of the gluing device 10 with a specific structure, the gluing system can improve the problem of glue overflow at the edges of the conductive layer and the foam elastomer during the overmolding process, thereby preparing high-quality conductive foam.

[0080] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A glue application device, characterized in that: include: A base, wherein a through groove is formed on the top of the base; A glue applying block, wherein the glue applying block is installed on the top of the base, and the bottom of the glue applying block has a boss that is snap-fitted with the through slot, and the boss is close to the bottom of the through slot on one side and the bottom of the through slot to form a strip-shaped gap for passing the conductive layer, and the boss is close to the bottom of the slot on one side and is provided with a groove that is concave away from the bottom wall of the through slot, and the glue applying hole on the glue applying block passes through the bottom wall of the groove.

2. The glue application device according to claim 1, characterized in that: In the width direction of the through slot, the groove is located in the middle of the boss.

3. The glue applying device according to claim 2, characterized in that: In the width direction of the through groove, the ratio of the inner width of the groove to the size of the boss is 7:10 to 8:

10.

4. The glue applying device according to any one of claims 1 to 3, characterized in that: In the height direction of the glue applying device, both side walls of the through groove are provided with chamfers at the openings.

5. The glue applying device according to any one of claims 1 to 3, characterized in that: In the extending direction of the through slot, the bottom wall of the through slot is provided with chamfers at both end openings.

6. The glue applying device according to any one of claims 1 to 3, characterized in that: In the extension direction of the through groove, the base has a first mounting part and a second mounting part, the glue block is installed on the first mounting part, the through groove passes through the first mounting part and the second mounting part, the height of the first mounting part is greater than the height of the second mounting part, so that the depth of a section of the through groove corresponding to the first mounting part is greater than the depth of a section of the through groove corresponding to the second mounting part, and the glue applying device also includes a glue scraping unit, which is installed on the second mounting part and is configured to be able to thin the glue layer on the two side edges of the conductive layer located in the through groove.

7. The glue applying device according to claim 6, characterized in that: The scraper unit includes two relatively distributed scraper blocks installed on the second mounting portion, the two scraper blocks are spaced apart on both sides of the through slot, and corresponding to each scraper block, the second mounting portions on both sides of the through slot are provided with glue flow channels, the ends of the scraper blocks pass through the top of the openings of the glue flow channels and extend to the top of the through slot, and are used to thin the glue layer on the corresponding edge of the conductive layer, and the glue flow channels are used to collect glue scraps generated during the thinning process.

8. The glue application device according to claim 7, characterized in that: The scraper block includes a connecting plate and a scraper plate, the connecting plate is connected to the second mounting portion, the end of the scraper plate passes through the opening of the glue flow channel and extends to the top of the through slot, and is used to thin the glue layer on the corresponding edge of the conductive layer, and the size of the scraper plate gradually decreases from the end away from the through slot to the end close to the through slot.

9. The glue applying device according to claim 8, characterized in that: The end of the scraper plate away from the connecting plate is inclined toward the first mounting portion.

10. A glue application system, characterized in that: It comprises a glue applying device and a pulling device as claimed in any one of claims 1 to 9, wherein the pulling device is used for pulling the conductive layer through the through groove.

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