Automatic ultrasonic cleaning device for electronic component chip

Abstract

The utility model discloses an automatic ultrasonic cleaning device for an electronic component chip, which is characterized by comprising a rack, a piece separating mechanism, a vibration receiving channel, a water tank, an ultrasonic generator, an ultrasonic vibrator and a net basket, a strip-shaped gap capable of enabling the electronic component chips to be separated one by one and fall downwards is formed in the chip separating mechanism, the vibration bearing channel is installed on the rack and located below the strip-shaped gap, and the vibration bearing channel gradually inclines downwards from front to back; the water tank is arranged on the rear side of the vibration receiving channel, and the rear end of the vibration receiving channel extends into the water tank; the ultrasonic generator is installed on the rack, the ultrasonic vibrator is installed at the bottom of the water tank, and the ultrasonic vibrator is electrically connected with the ultrasonic generator; the net basket is located in the water tank filled with water, an opening in the upper end of the net basket corresponds to the rear end of the vibration receiving channel, and a plurality of through holes are formed in the side wall and the bottom of the net basket.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component cleaning equipment, in particular to an automatic ultrasonic cleaning device for electronic component chips. Background Art

[0002] During the production process, electronic components may be contaminated with various impurities, such as dust, oil, etc. These impurities will affect the performance and reliability of electronic component chips. Generally, impurities on electronic component chips are removed by ball milling. After the electronic component chips are separated by the rotating track of the bending machine, the separated electronic component chips are manually poured into the drum washing machine for ball milling cleaning to wash away the impurities and pollutants on the chips, thereby achieving a cleaning effect. However, this ball milling cleaning method is complicated to operate, requires manual separation, and is prone to mixing. In addition, the impact force on the chip is too large, which can easily damage the appearance of the electronic component chip and reduce the chip qualification rate. Utility Model Content

[0003] The problem to be solved by the utility model is to provide an automatic ultrasonic cleaning device for electronic component chips. The automatic ultrasonic cleaning device for electronic component chips can automatically slice and clean each chip one by one, has good cleaning effect, and improves production efficiency.

[0004] In order to solve the above technical problems, the technical solutions adopted by the utility model are as follows:

[0005] An automatic ultrasonic cleaning device for electronic component chips is characterized in that it includes a frame, a slicing mechanism, a vibration receiving channel, a water tank, an ultrasonic generator, an ultrasonic vibrator and a net basket, the slicing mechanism is installed on the frame, the slicing mechanism is provided with a strip gap that enables the electronic component chips to be sliced ​​one by one and fall downward, the vibration receiving channel is installed on the frame and is located below the strip gap, and the vibration receiving channel is gradually inclined downward from front to back; the water tank is arranged at the rear side of the vibration receiving channel, and the rear end of the vibration receiving channel extends into the water tank; the ultrasonic generator is installed on the frame, the ultrasonic vibrator is installed at the bottom of the water tank, and the ultrasonic vibrator is electrically connected to the ultrasonic generator; the net basket is in the water tank filled with water, the upper end opening of the net basket corresponds to the rear end of the vibration receiving channel, and a plurality of through holes are provided on the side wall and the bottom of the net basket.

[0006] Before cleaning, the discharge port of the external chip unloading mechanism is set above the strip gap of the slicer mechanism, and the water tank is filled with water, and the net basket is placed in the water tank, and the upper end opening of the net basket corresponds to the rear end of the vibration receiving channel.

[0007] When cleaning is required, each chip is transported to the strip gap of the slicing mechanism through the discharge port of the chip unloading mechanism, and each chip is sliced ​​one by one by using the strip gap of the slicing mechanism and dropped onto the vibration receiving channel. Then, the vibration of the vibration receiving channel drives each chip to be gradually tilted downward from front to back, and each chip is transported to the net basket of the water tank in turn; finally, the ultrasonic generator is started, and the water tank generates ultrasonic waves under the action of the ultrasonic vibrator, causing the water in the water tank to flow, and the flowing water passes through the through holes on the net basket and generates countless tiny bubbles in the net basket. The closure of these bubbles forms an instantaneous high pressure, which continuously impacts the surface of each chip, so that the surface and gaps of each chip are cleaned.

[0008] In the preferred embodiment, the slicing mechanism includes two supports, two rollers and two rotation drive mechanisms capable of driving the corresponding rollers to rotate. The two supports are installed side by side on the frame, the two rotation drive mechanisms are installed on the corresponding supports respectively, the two rollers are rotatably installed on the corresponding supports respectively, the two rollers rotate towards each other and are parallel to each other, and the strip-shaped gap is formed between the two rollers. Usually, the above-mentioned rotation drive mechanism can adopt a driving motor, and the power output shaft of the driving motor is connected to the rotating shaft of the roller. The two rollers are driven to rotate towards each other by the corresponding rotation drive mechanism, so that each chip falling into the strip-shaped gap falls into the vibration receiving channel through the rotation of the two rollers towards each other, which can ensure that the chips fall smoothly from the strip-shaped gap and are transported to the vibration receiving channel, avoid the situation that the chips are blocked or retained during the slicing process, and ensure the continuity and stability of the cleaning process.

[0009] In a further preferred embodiment, the two supports can be movably mounted on the frame, and a transverse opening and closing mechanism capable of driving the two supports to move toward or away from each other is provided on the frame. The transverse opening and closing mechanism drives the two supports to move toward or away from each other, and drives the two parallel rollers to move toward or away from each other, thereby adjusting the width of the strip gap between the two rollers, so that the strip gap can be adjusted to allow electronic components and chips of different sizes to pass through.

[0010] In a further preferred embodiment, the frame is provided with at least two mutually parallel guide rods, the support is provided with first guide holes corresponding to the guide rods, each first guide hole is provided with a linear bearing, and the first guide holes are penetrated on the corresponding guide rods through the linear bearings.

[0011] In a further preferred embodiment, the lateral opening and closing mechanism includes a screw rotation drive device, a screw, a first nut and a second nut. The screw rotation drive device is installed on the frame, one end of the screw is transmission-connected to the power output end of the screw rotation drive device, and the screw is parallel to the guide rod. A forward thread segment and a reverse thread segment are provided on the screw, and the first nut and the second nut are respectively sleeved on the forward thread segment and the reverse thread segment, and the first nut and the second nut are respectively connected to the corresponding support. When the position of the support is adjusted, the screw can be driven to rotate by the screw rotation drive device, so that the first nut moves along the forward thread segment, the second nut moves along the reverse thread segment, and the corresponding support is driven to move accordingly. The screw rotation drive device can use a servo motor or a hand wheel, preferably a servo motor.

[0012] In a further preferred embodiment, the lateral opening and closing mechanism further includes an auxiliary adjustment hand wheel, and the other end of the screw rod is connected to the auxiliary adjustment hand wheel. When the screw rod rotation drive device uses a servo motor to adjust the position of the support, the support is generally moved and adjusted frequently and over a large distance. The auxiliary adjustment hand wheel can be provided to fine-tune the position of the support.

[0013] In a preferred embodiment, the frame is provided with an inclined table surface which gradually tilts downward from front to back, and the slice mechanism is installed on the inclined table surface. Through this arrangement, the strip-shaped gap on the slice mechanism can be gradually tilted downward from front to back.

[0014] In a further preferred embodiment, the automatic ultrasonic cleaning device further comprises a guide plate and a storage box, the guide plate is mounted on the frame and gradually tilted downward from front to back, the front end of the guide plate corresponds to the rear end of the strip-shaped gap, and the storage box is mounted on the frame and is below the rear end of the guide plate. If the chips transported to the slicing mechanism are bonded, the size of the two or more chips bonded together will be larger than the width of the strip-shaped gap, and the bonded chips cannot pass through the strip-shaped gap. Driven by the rolling of the two rollers, the bonded chips slide down onto the guide plate, and the guide plate guides the bonded chips downward from front to back, so that the chips fall into the storage box and are collected.

[0015] In a further preferred embodiment, the angle between the inclined table surface and the horizontal plane of the frame is in the range of 5°-45°.

[0016] In a preferred embodiment, the vibrating receiving channel includes a vibrator and a receiving guide plate, the vibrator is mounted on the frame, the receiving guide plate is mounted on the power output end of the vibrator, and the receiving guide plate gradually tilts downward from front to back, the strip-shaped gap is located above the receiving guide plate, and the rear end of the receiving guide plate extends into the water tank. When the chips fall onto the receiving guide plate, the vibrator drives the receiving guide plate to vibrate, so that each chip is vibrated and transported to the net basket of the water tank.

[0017] In a further preferred embodiment, the receiving guide plate is a screen, and the mesh diameter of the screen is smaller than the diameter of the electronic component chip. When the electronic component chip falls onto the screen, small impurities mixed in the electronic component chip can be filtered out through the screen.

[0018] In a preferred embodiment, the bottom of the water tank is provided with a guide slope which gradually slopes downward from the front to the back, and the net basket is placed on the guide slope. Under the impact of the wire slope and the flow of water in the water tank, the chips that fall from the vibration receiving channel to the net basket after vibration can be arranged more evenly and will not accumulate in a specific area of ​​the net basket.

[0019] Compared with the prior art, the utility model has the following advantages:

[0020] The utility model can automatically slice each chip one by one and automatically transport them to a water tank for ultrasonic cleaning, thereby reducing manual intervention, improving production efficiency and automation, and having a good cleaning effect with little impact on the chip, which can reduce the risk of chip damage during the slicing process, helps to protect the integrity of the appearance of the electronic component chip and improve the chip qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of an embodiment of the utility model;

[0022] Figure 2 yes Figure 1 Top view of the middle splitting mechanism. DETAILED DESCRIPTION

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 1-2As shown, the automatic ultrasonic cleaning device for electronic component chips in this embodiment includes a frame 1, a slicing mechanism 2, a vibration receiving channel 3, a water tank 4, an ultrasonic generator 5, an ultrasonic vibrator 6 and a net basket 7. The slicing mechanism 2 is installed on the frame 1, and the slicing mechanism 2 is provided with a strip gap 23 that can make the electronic component chips sliced ​​one by one and fall downward. The vibration receiving channel 3 is installed on the frame 1 and is below the strip gap 23. The vibration receiving channel 3 is gradually inclined downward from front to back; the water tank 4 is arranged on the rear side of the vibration receiving channel 3, and the rear end of the vibration receiving channel 3 extends into the water tank 4; the ultrasonic generator 5 is installed on the frame 1, and the ultrasonic vibrator 6 is installed at the bottom of the water tank 4, and the ultrasonic vibrator 6 is electrically connected to the ultrasonic generator 5; the net basket 7 is in the water tank 4 filled with water, and the upper end opening of the net basket 7 corresponds to the rear end of the vibration receiving channel 3, and the side wall and bottom of the net basket 7 are provided with a plurality of through holes 71.

[0025] Before cleaning, the discharge port of the external chip unloading mechanism is set above the strip gap 23 of the slicing mechanism 2, and the water tank 4 is filled with water, and the net basket 7 is placed in the water tank 4, and the upper end opening of the net basket 7 corresponds to the rear end of the vibration receiving channel 3.

[0026] When cleaning is to be performed, each chip is transported to the strip gap 23 of the slicing mechanism 2 through the discharge port 02 of the chip unloading mechanism 01, and each chip is sliced ​​one by one by using the strip gap 23 of the slicing mechanism 2 and dropped downward onto the vibration receiving channel 3. The vibration of the vibration receiving channel 3 then drives each chip to be gradually tilted downward from front to back, and each chip is transported to the net basket 7 of the water tank 4 in turn; finally, the ultrasonic generator 5 is started, and the water tank 4 generates ultrasonic waves under the action of the ultrasonic vibrator 6, so that the water in the water tank 4 flows, and the flowing water passes through the through holes 71 on the net basket 7 and generates countless tiny bubbles in the net basket 7. The closure of these bubbles forms an instantaneous high pressure, which continuously impacts the surface of each chip, so that the surface and gaps of each chip are cleaned.

[0027] The slicing mechanism 2 includes two supports 21, two rollers 22 and two rotation drive mechanisms (not shown in the figure) capable of driving the corresponding rollers 22 to rotate. The two supports 21 are installed side by side on the frame 1, and the two rotation drive mechanisms are installed on the corresponding supports 21 respectively. The two rollers 22 are rotatably installed on the corresponding supports 21 respectively. The two rollers 22 rotate towards each other and are parallel to each other, and the strip gap 23 is formed between the two rollers 22. Usually, the above-mentioned rotation drive mechanism can adopt a driving motor, and the power output shaft of the driving motor is connected with the rotating shaft of the roller 22. The two rollers 22 are driven to rotate towards each other by the corresponding rotation drive mechanism, so that each chip falling into the strip gap 23 falls down into the vibration receiving channel 3 through the rotation of the two rollers 22 towards each other, which can ensure that the chip falls smoothly from the strip gap 23 and is transported to the vibration receiving channel 3, avoids the situation that the chip is blocked or retained during the slicing process, and ensures the continuity and stability of the cleaning process.

[0028] The two supports 21 can be movably mounted on the frame 1, and the frame 1 is provided with a transverse opening and closing mechanism 8 capable of driving the two supports 21 to move toward or away from each other. The transverse opening and closing mechanism 8 drives the two supports 21 to move toward or away from each other, driving the two parallel rollers 22 to move toward or away from each other, thereby adjusting the width of the strip gap 23 between the two rollers 22, so that the strip gap 23 can be adjusted to allow electronic components and chips of different sizes to pass through.

[0029] At least two parallel guide rods 11 are provided on the frame 1, and the support 21 is provided with first guide holes 211 corresponding to the guide rods 11. Each first guide hole 211 is provided with a linear bearing 212, and the first guide hole 211 is penetrated on the corresponding guide rod 11 through the linear bearing 212.

[0030] The horizontal opening and closing mechanism 8 comprises a screw rotation driving device 81, a screw 82, a first nut 83 and a second nut 84. The screw rotation driving device 81 is installed on the frame 1. One end of the screw 82 is connected to the power output end of the screw rotation driving device 81 by transmission, and the screw 82 is parallel to the guide rod 11. The screw 82 is provided with a forward thread segment 821 and a reverse thread segment 822. The first nut 83 and the second nut 84 are respectively sleeved on the forward thread segment 821 and the reverse thread segment 822. The first nut 83 and the second nut 84 are respectively connected to the corresponding support 21. When the position of the support 21 is adjusted, the screw rotation driving device 81 can drive the screw 82 to rotate, so that the first nut 83 moves along the forward thread segment 821, the second nut 84 moves along the reverse thread segment 822, and the corresponding support 21 is driven to move accordingly. The screw rotation driving device 81 can use a servo motor or a hand wheel, preferably a servo motor.

[0031] The lateral opening and closing mechanism 8 further includes an auxiliary adjustment hand wheel 85, and the other end of the screw rod 82 is connected to the auxiliary adjustment hand wheel 85. When the screw rod rotation driving device 81 uses a servo motor to adjust the position of the support 21, the support 21 is generally moved and adjusted frequently and over a large distance. The auxiliary adjustment hand wheel 85 is provided to fine-tune the position of the support 21.

[0032] The frame 1 is provided with an inclined table surface 12 which gradually tilts downward from front to back, and the slicer mechanism 2 is mounted on the inclined table surface 12. Through this arrangement, the strip-shaped gap 23 on the slicer mechanism 2 can be gradually tilted downward from front to back.

[0033] The automatic ultrasonic cleaning device further comprises a guide plate 9 and a storage box 10. The guide plate 9 is mounted on the frame 1 and gradually tilted downward from front to back. The front end of the guide plate 9 corresponds to the rear end of the strip-shaped gap 23. The storage box 10 is mounted on the frame 1 and is located below the rear end of the guide plate 9. If the chips transported to the slicing mechanism 2 are bonded, the size of the two or more chips bonded together will be larger than the width of the strip-shaped gap 23, and the bonded chips cannot pass through the strip-shaped gap 23. Driven by the rolling of the two rollers 22, the bonded chips slide downward onto the guide plate 9. The guide plate 9 guides the chips downward from front to back, so that the bonded chips fall into the storage box 10 for collection.

[0034] The angle between the inclined table surface 12 and the horizontal plane of the frame 1 ranges from 5° to 45°.

[0035] The vibrating receiving channel 3 includes a vibrator 31 and a receiving guide plate 32. The vibrator 31 is mounted on the frame 1, and the receiving guide plate 32 is mounted on the power output end of the vibrator 31. The receiving guide plate 32 is gradually tilted downward from front to back, and the strip-shaped gap 23 is located above the receiving guide plate 32. The rear end of the receiving guide plate 32 extends into the water tank 4. When the chip falls onto the receiving guide plate 32, the vibrator 31 drives the receiving guide plate 32 to vibrate, so that each chip is vibrated and transported to the net basket 7 of the water tank 4.

[0036] The receiving guide plate 32 is a screen, and the mesh diameter of the screen is smaller than the diameter of the electronic component chip. When the electronic component chip falls onto the screen, small particles of impurities mixed in the electronic component chip can be filtered out through the screen.

[0037] The bottom of the water tank 4 is provided with a guide slope 41 which gradually slopes downward from front to back, and the net basket 7 is placed on the guide slope 41. Under the impact of the wire slope and the flow of water in the water tank 4, the chips falling from the vibration receiving channel 3 to the net basket 7 after vibration can be arranged more evenly, and will not be accumulated in a specific area of ​​the net basket 7.

[0038] In addition, it should be noted that the names of the various parts of the specific embodiments described in this specification may be different, and any equivalent or simple changes made based on the structure, features and principles described in the utility model patent concept are included in the protection scope of the utility model patent. The technical personnel of the technical field to which the utility model belongs can make various modifications or supplements to the specific embodiments described or replace them in a similar manner, as long as they do not deviate from the structure of the utility model or exceed the scope defined by the claims, they should all fall within the protection scope of the utility model.

Claims

1. An automatic ultrasonic cleaning device for electronic component chips, characterized in that: The invention comprises a frame, a slicing mechanism, a vibration receiving channel, a water tank, an ultrasonic generator, an ultrasonic vibrator and a net basket. The slicing mechanism is installed on the frame. The slicing mechanism is provided with a strip-shaped gap that enables the electronic component chips to be sliced ​​one by one and fall downward. The vibration receiving channel is installed on the frame and is located below the strip-shaped gap. The vibration receiving channel is gradually inclined downward from front to back. The water tank is arranged at the rear side of the vibration receiving channel, and the rear end of the vibration receiving channel extends into the water tank. The ultrasonic generator is installed on the frame, and the ultrasonic vibrator is installed at the bottom of the water tank. The ultrasonic vibrator is electrically connected to the ultrasonic generator. The net basket is in the water tank filled with water. The upper end opening of the net basket corresponds to the rear end of the vibration receiving channel. A plurality of through holes are arranged on the side wall and the bottom of the net basket.

2. The automatic ultrasonic cleaning device for electronic component chips according to claim 1, characterized in that: The slicing mechanism includes two supports, two rollers and two rotating drive mechanisms that can drive the corresponding rollers to rotate. The two supports are installed side by side on the frame, the two rotating drive mechanisms are installed on the corresponding supports respectively, the two rollers are rotatably installed on the corresponding supports respectively, the two rollers rotate towards each other and are parallel to each other, and the strip-shaped gap is formed between the two rollers.

3. The automatic ultrasonic cleaning device for electronic component chips according to claim 2, characterized in that: The two supports can be movably mounted on the frame, and the frame is provided with a transverse opening and closing mechanism capable of driving the two supports to move toward or away from each other.

4. The automatic ultrasonic cleaning device for electronic component chips according to claim 3, characterized in that: The frame is provided with at least two mutually parallel guide rods, the support is provided with first guide holes corresponding to the guide rods, each first guide hole is provided with a linear bearing, and the first guide holes are penetrated on the corresponding guide rods through the linear bearings.

5. The automatic ultrasonic cleaning device for electronic component chips according to claim 4, characterized in that: The lateral opening and closing mechanism includes a screw rotation driving device, a screw, a first nut and a second nut. The screw rotation driving device is installed on the frame. One end of the screw is transmission-connected to the power output end of the screw rotation driving device, and the screw is parallel to the guide rod. A forward thread segment and a reverse thread segment are provided on the screw. The first nut and the second nut are respectively sleeved on the forward thread segment and the reverse thread segment. The first nut and the second nut are respectively connected to the corresponding supports.

6. The automatic ultrasonic cleaning device for electronic component chips according to claim 5, characterized in that: The lateral opening and closing mechanism also includes an auxiliary adjustment hand wheel, and the other end of the screw rod is connected to the auxiliary adjustment hand wheel.

7. The automatic ultrasonic cleaning device for electronic component chips according to claim 1, characterized in that: The frame is provided with an inclined table surface which gradually slopes downward from the front to the back, and the slice separating mechanism is installed on the inclined table surface.

8. The automatic ultrasonic cleaning device for electronic component chips according to claim 7, characterized in that: It also includes a material guide plate and a material storage box. The material guide plate is installed on the frame and gradually tilts downward from front to back. The front end of the material guide plate corresponds to the rear end of the strip-shaped gap. The material storage box is installed on the frame and is located below the rear end of the material guide plate.

9. The automatic ultrasonic cleaning device for electronic component chips according to claim 1, characterized in that: The vibration receiving channel includes a vibrator and a receiving guide plate. The vibrator is installed on the frame, and the receiving guide plate is installed on the power output end of the vibrator. The receiving guide plate gradually tilts downward from front to back. The strip gap is located above the receiving guide plate, and the rear end of the receiving guide plate extends into the water tank.

10. The automatic ultrasonic cleaning device for electronic component chips according to claim 9, characterized in that: The receiving guide plate is a screen, and the mesh diameter of the screen is smaller than the diameter of the electronic component chip.

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