Temperature control device for wafer polishing solution

Abstract

The utility model provides a wafer polishing solution temperature control device, and belongs to the technical field of polishing solution storage temperature control. The wafer polishing solution temperature control device comprises a polishing solution storage mechanism and a lifting self-adjusting mechanism. The polishing liquid storage mechanism comprises a storage tank, a heating assembly, a first temperature sensor and a second temperature sensor, the heating assembly is arranged outside the storage tank, the first temperature sensor is installed on the outer side of the lower section of the storage tank, a liquid adding opening is formed in the top of the storage tank, and a liquid outlet pipe is arranged on the outer side of the bottom of the storage tank; the lifting self-adjusting mechanism comprises a guide rail and a floating part. The first temperature sensor is used for monitoring the temperature of the polishing solution close to the bottom in the storage tank, and the second temperature sensor is used for monitoring the temperature of the top of the polishing solution in the storage tank; and the second temperature sensor can be automatically adjusted according to the liquid level height of the polishing liquid in the storage tank, so that the accuracy of monitoring the temperature of the polishing liquid in the storage tank is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing liquid storage temperature control, in particular to a wafer polishing liquid temperature control device. Background Art

[0002] In order to improve the quality of wafer polishing, the polishing liquid used for polishing wafers needs to be heated before use. The polishing liquid inside the storage tank can be heated by the storage tank. Generally, a single set of temperature sensors will be used on the storage tank to monitor the temperature of the internal polishing liquid to ensure that the polishing liquid is in a suitable temperature range during polishing. For example, a polishing liquid temperature control device in the public document with announcement number CN203557269U includes a liquid cooling pipeline, a solenoid valve is provided on the liquid cooling pipeline, and the polishing liquid temperature control device also includes a temperature controller and an infrared temperature sensor for detecting the temperature of the polishing liquid. The temperature controller includes a temperature data input terminal, an alarm output terminal and a control output terminal; the infrared temperature sensor is connected to the temperature data input terminal of the temperature controller. The above-mentioned polishing liquid temperature control device uses a single temperature sensor to monitor the temperature. When there is a temperature difference between the upper and lower layers of the polishing liquid inside the storage tank, the monitored temperature will be inaccurate, resulting in a deviation in the temperature of the polishing liquid used during polishing, which affects the quality of wafer polishing. Utility Model Content

[0003] In order to make up for the above shortcomings, the utility model provides a chip polishing liquid temperature control device, which aims to improve the temperature control device of the related technology. The polishing liquid temperature control device uses a single temperature sensor to monitor the temperature. When there is a temperature difference between the upper and lower layers of the polishing liquid in the storage tank, the monitored temperature will be not accurate enough, resulting in deviations in the temperature of the polishing liquid used during polishing, affecting the quality of the chip polishing process.

[0004] The utility model is achieved in this way:

[0005] The utility model provides a wafer polishing liquid temperature control device, which comprises a polishing liquid storage mechanism and a lifting self-adjusting mechanism.

[0006] The polishing liquid storage mechanism includes a storage tank, a heating component, a first temperature sensor and a second temperature sensor, wherein the heating component is arranged outside the storage tank, the first temperature sensor is installed outside the lower section of the storage tank, a liquid filling port is arranged on the top of the storage tank, and a liquid outlet pipe is arranged outside the bottom of the storage tank;

[0007] The lifting self-adjusting mechanism comprises a guide rail and a floating part, wherein the guide rail is vertically arranged on the inner wall of the storage tank, the floating part vertically slides on the guide rail, and the second temperature sensor is installed on the floating part.

[0008] In an embodiment of the present utility model, the storage tank comprises a tank body and a tank cover, and the tank cover is fixed on the top of the tank body.

[0009] In one embodiment of the utility model, the polishing liquid storage mechanism further comprises a stirring and mixing component, and the stirring and mixing component is installed on the tank cover to stir the polishing liquid in the tank body.

[0010] In one embodiment of the utility model, the stirring and mixing assembly includes a motor, a transmission shaft and a stirring blade, the motor is installed on the top of the tank cover, the transmission shaft is arranged inside the storage tank, and the top end of the transmission shaft rotates through the top wall of the tank cover and is connected to the output shaft end of the motor, and the stirring blade is arranged on the outside of the bottom end of the transmission shaft.

[0011] In one embodiment of the utility model, the heating component includes an outer shell, the outer shell is arranged outside the storage tank, and a water inlet end pipe and a water outlet end pipe are respectively arranged on the bottom and the outer side of the top of the outer shell.

[0012] In one embodiment of the present utility model, the polishing liquid storage mechanism further includes a liquid level meter, and the liquid level meter is installed on the outside of the storage tank.

[0013] In an embodiment of the utility model, the floating part includes a floating plate and a sliding block, a sliding groove is provided on the guide rail, the sliding block slides inside the sliding groove, the second temperature sensor is installed on the floating plate, and the floating plate is connected to the floating plate through a connecting rod.

[0014] In an embodiment of the present utility model, a limiting block is provided on the top of the slide groove inside the guide rail.

[0015] The beneficial effect of the utility model is as follows: the utility model obtains a wafer polishing liquid temperature control device through the above design, the first temperature sensor is used to monitor the temperature of the polishing liquid near the bottom of the storage tank, and the second temperature sensor is used to monitor the temperature at the top of the polishing liquid in the storage tank; and the second temperature sensor can automatically adjust according to the liquid level height of the polishing liquid in the storage tank to ensure the accuracy of monitoring the temperature of the polishing liquid in the storage tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1It is a schematic structural diagram of a wafer polishing liquid temperature control device provided by an embodiment of the utility model;

[0018] Figure 2 A schematic diagram of the heating assembly structure provided by the embodiment of the utility model;

[0019] Figure 3 A schematic diagram of the structure of the tank body and the lifting self-adjusting mechanism provided in the embodiment of the utility model;

[0020] Figure 4 A schematic diagram of the structure of a stirring and mixing assembly provided in an embodiment of the utility model;

[0021] Figure 5 A schematic diagram of the structure of a stirring and mixing assembly provided in an embodiment of the utility model;

[0022] Figure 6 This is a schematic diagram of the floating part structure provided by an embodiment of the utility model.

[0023] In the figure: 10-polishing liquid storage mechanism; 110-storage tank; 111-tank body; 112-tank cover; 120-heating component; 121-outer shell; 122-water inlet end pipe; 123-water outlet end pipe; 130-first temperature sensor; 140-second temperature sensor; 150-liquid outlet pipe; 160-liquid level gauge; 170-stirring and mixing component; 171-motor; 172-drive shaft; 173-stirring blade; 20-lifting self-adjusting mechanism; 210-guide rail; 220-floating part; 221-floating plate; 222-slider; 223-connecting rod; 230-slide; 240-limiting block. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example

[0026] See also Figure 1-Figure 6 The utility model provides a wafer polishing liquid temperature control device, including a polishing liquid storage mechanism 10 and a lifting self-adjusting mechanism 20.

[0027] Among them, the polishing liquid storage mechanism 10 is used to store heated polishing liquid, and cooperates with the lifting and self-adjusting mechanism 20 to use two groups of temperature sensors to monitor the temperature of the lower and upper solutions inside the storage tank 110 respectively, to ensure the accuracy of temperature monitoring and improve the quality of polishing liquid output.

[0028] See also Figure 1 , Figure 3 and Figure 5 The polishing liquid storage mechanism 10 includes a storage tank 110, a heating assembly 120, a first temperature sensor 130 and a second temperature sensor 140. The heating assembly 120 is arranged outside the storage tank 110, the first temperature sensor 130 is installed on the outside of the lower section of the storage tank 110, a liquid filling port is arranged on the top of the storage tank 110, and a liquid outlet pipe 150 is arranged on the outside of the bottom of the storage tank 110. The lifting self-adjusting mechanism 20 includes a guide rail 210 and a floating part 220. The guide rail 210 is vertically arranged on the inner wall of the storage tank 110, the floating part 220 slides vertically on the guide rail 210, and the second temperature sensor 140 is installed on the floating part 220.

[0029] The heating component 120 heats the polishing liquid stored in the storage tank 110. The first temperature sensor 130 is used to monitor the temperature of the polishing liquid near the bottom of the storage tank 110. The second temperature sensor 140 is used to monitor the temperature at the top of the polishing liquid in the storage tank 110. The second temperature sensor 140 can automatically adjust according to the liquid level of the polishing liquid in the storage tank 110 to ensure the accuracy of monitoring the temperature of the polishing liquid in the storage tank 110, that is, to improve the accuracy of the temperature of the polishing liquid when it is discharged.

[0030] For specific settings, see Figure 1 The storage tank 110 includes a tank body 111 and a tank cover 112. The tank cover 112 is fixed to the top of the tank body 111 by bolts. The polishing liquid storage mechanism 10 also includes a stirring and mixing component 170, which is installed on the tank cover 112 to stir the polishing liquid inside the tank body 111. That is, the stirring and mixing component 170 can mix the polishing liquid stored in the tank body 111, so that the temperature of the stored polishing liquid is more uniform.

[0031] For further information, see Figure 4 The stirring and mixing assembly 170 includes a motor 171, a transmission shaft 172 and a stirring blade 173. The motor 171 is mounted on the top of the tank cover 112, the transmission shaft 172 is arranged inside the storage tank 110, and the top end of the transmission shaft 172 rotates and penetrates the top wall of the tank cover 112 to connect with the output shaft end of the motor 171, and the stirring blade 173 is arranged outside the bottom end of the transmission shaft 172. That is, the motor 171 in the stirring and mixing assembly 170 drives the transmission shaft 172 to rotate, and the rotating transmission shaft 172 drives the stirring blade 173 to rotate and stir the polishing liquid inside the tank body 111.

[0032] Specifically, see Figure 2 The heating assembly 120 includes an outer shell 121. The outer shell 121 is disposed outside the storage tank 110, and a water inlet pipe 122 and a water outlet pipe 123 are disposed on the bottom and outside of the top of the outer shell 121, respectively. External heat medium enters through the water inlet pipe 122 and is discharged from the water outlet pipe 123. The heat medium inside the outer shell 121 heats the polishing liquid stored inside the storage tank 110.

[0033] For further information, see Figure 1 The polishing liquid storage mechanism 10 also includes a liquid level meter 160 , which is installed on the outside of the storage tank 110 . The liquid level meter 160 is used to monitor the real-time liquid level of the polishing liquid inside the storage tank 110 .

[0034] In the above specific implementation, please refer to Figure 5 and Figure 6 The floating part 220 includes a floating plate 221 and a slider 222. A slide groove 230 is provided on the guide rail 210, and the slider 222 slides inside the slide groove 230. The second temperature sensor 140 is installed on the floating plate 221, and the floating plate 221 is connected to the floating plate 221 through a connecting rod 223. The floating plate 221 can be a corrosion-resistant and floatable plastic plate. The floating plate 221 drives the second temperature sensor 140 to float on the surface of the polishing liquid by buoyancy, which is used to monitor the liquid level temperature of the upper layer of the polishing liquid. A limit block 240 is provided at the top of the slide groove 230 inside the guide rail 210, and the limit slider 222 slides out from the top of the slide groove 230.

[0035] It should be noted that the specific model specifications of the first temperature sensor 130, the second temperature sensor 140, and the motor 171 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in the field, so it will not be described in detail. The power supply and principle of the first temperature sensor 130, the second temperature sensor 140, and the motor 171 are clear to those skilled in the art and will not be described in detail here.

[0036] The working principle of the wafer polishing liquid temperature control device is as follows: when in use, the heating component 120 heats the polishing liquid stored in the storage tank 110, the first temperature sensor 130 is used to monitor the temperature of the polishing liquid near the bottom of the storage tank 110, and the second temperature sensor 140 is used to monitor the temperature at the top of the polishing liquid in the storage tank 110; and the second temperature sensor 140 can automatically adjust according to the liquid level height of the polishing liquid in the storage tank 110, to ensure the accuracy of monitoring the temperature of the polishing liquid in the storage tank 110, that is, to improve the accuracy of the temperature when the polishing liquid is discharged.

[0037] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wafer polishing liquid temperature control device, characterized in that: include A polishing liquid storage mechanism (10), the polishing liquid storage mechanism (10) comprising a storage tank (110), a heating component (120), a first temperature sensor (130) and a second temperature sensor (140), the heating component (120) being arranged outside the storage tank (110), the first temperature sensor (130) being installed on the outer side of the lower section of the storage tank (110), the top of the storage tank (110) being provided with a liquid filling port, and the outer side of the bottom of the storage tank (110) being provided with a liquid outlet pipe (150); A lifting self-adjusting mechanism (20), the lifting self-adjusting mechanism (20) comprising a guide rail (210) and a floating part (220), the guide rail (210) being vertically arranged on the inner wall of the storage tank (110), the floating part (220) being vertically slidable on the guide rail (210), and the second temperature sensor (140) being mounted on the floating part (220).

2. A wafer polishing liquid temperature control device according to claim 1, characterized in that: The storage tank (110) comprises a tank body (111) and a tank cover (112), wherein the tank cover (112) is fixed on the top of the tank body (111).

3. A wafer polishing liquid temperature control device according to claim 2, characterized in that: The polishing liquid storage mechanism (10) further comprises a stirring and mixing component (170), wherein the stirring and mixing component (170) is installed on the tank cover (112) to stir the polishing liquid inside the tank body (111).

4. A wafer polishing liquid temperature control device according to claim 3, characterized in that: The stirring and mixing assembly (170) comprises a motor (171), a transmission shaft (172) and a stirring blade (173); the motor (171) is mounted on the top of the tank cover (112); the transmission shaft (172) is arranged inside the storage tank (110); and the top end of the transmission shaft (172) rotates through the top wall of the tank cover (112) and is connected to the output shaft end of the motor (171); and the stirring blade (173) is arranged on the outside of the bottom end of the transmission shaft (172).

5. A wafer polishing liquid temperature control device according to claim 1, characterized in that: The heating component (120) comprises an outer shell (121), the outer shell (121) is arranged outside the storage tank (110), and a water inlet end pipe (122) and a water outlet end pipe (123) are respectively arranged on the bottom and the outer side of the top of the outer shell (121).

6. A wafer polishing liquid temperature control device according to claim 1, characterized in that: The polishing liquid storage mechanism (10) further comprises a liquid level meter (160), and the liquid level meter (160) is installed outside the storage tank (110).

7. A wafer polishing liquid temperature control device according to claim 1, characterized in that: The floating part (220) comprises a floating plate (221) and a sliding block (222); a sliding groove (230) is provided on the guide rail (210); the sliding block (222) slides inside the sliding groove (230); the second temperature sensor (140) is mounted on the floating plate (221), and the floating plate (221) is connected to the floating plate (221) via a connecting rod (223).

8. A wafer polishing liquid temperature control device according to claim 7, characterized in that: A limiting block (240) is provided at the top of the slide groove (230) inside the guide rail (210).

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