Adjustable positioning device for semiconductor detection

Abstract

The utility model discloses an adjustable positioning device for semiconductor detection, which relates to the technical field of semiconductor detection and comprises a base, two limiting holes are arranged on the top surface of the base, two rubber pads for placing semiconductors are fixedly mounted on the top surface of the base, and a turnover support frame is arranged on the top surface of the base. A worker places a semiconductor on the top surface of a rubber pad on a base, through mutual cooperation of a second electric push rod, mounting plates, a connecting rod, a second rotating shaft, a first rotating shaft, a movable block and a supporting frame, the two mounting plates can move inwards to drive a pressing strip to move inwards, and through mutual cooperation of the mounting plates, the pressing strip, a mounting rod and a spring, the semiconductor is placed on the top surface of the rubber pad on the base. The pressing strips can abut against the two sides of the semiconductor, the springs enable the two pressing strips to have elasticity, the semiconductor is prevented from being excessively extruded and damaged by the two pressing strips, the clamping effect on the semiconductor is achieved, and workers can conveniently detect the semiconductor in the follow-up process.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor detection, in particular to an adjustable positioning device for semiconductor detection. Background Art

[0002] Semiconductor materials are electronic materials that have semiconductor properties (conductivity between conductors and insulators, resistivity in the range of about 1mΩ·cm to 1GΩ·cm) and can be used to make semiconductor devices and integrated circuits. Semiconductor testing is a crucial link in the semiconductor production process, which runs through all stages from raw materials to final products. Effective testing technology can promptly detect problems in the production process, ensure product quality, improve production efficiency, and reduce production costs.

[0003] After massive searches, it was found that the Chinese patent with the prior art publication number CN220290778U disclosed a positioning device for semiconductor detection. The patent sets a support base body, a rotating shaft, an adjustment slot and an adjustment plate. When the detection position of the semiconductor to be detected needs to be rotated and adjusted, the positioning screw is loosened to drive the top semiconductor to be detected to rotate. When it is adjusted to a suitable position, it can be fixed by tightening the positioning screw; by setting a positioning screw, a movable plate, a first adjustment screw and a limit shaft, it is convenient to adjust the left and right positions of the semiconductor to be detected. However, in this patent, when the staff detects the semiconductor, the staff needs to manually rotate the fixed screw and use the movable clamp to clamp and position the semiconductor. The semiconductor is relatively fragile, and the rigid clamping of the movable clamp to the semiconductor may cause damage to the semiconductor, affecting the staff's positioning of the semiconductor. Therefore, based on the above search and combined with the prior art, the utility model proposes an adjustable semiconductor detection positioning device to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide an adjustable semiconductor detection positioning device to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] An adjustable semiconductor detection positioning device comprises a base, the top surface of the base is provided with two limiting holes, the top surface of the base is fixedly mounted with two rubber pads for placing semiconductors, the top surface of the base is provided with a flippable support frame, the interior of the support frame is provided with a clamping assembly for clamping the semiconductor, and the top surface of the base is provided with a flipping assembly for flipping the semiconductor.

[0007] Furthermore, the clamping assembly includes two mounting plates, a second electric push rod for moving the mounting plate located on the left side is installed on one side of the interior of the support frame, movable blocks are rotatably connected on both sides of the interior of the support frame, one side of the movable block is rotatably connected to two connecting rods, the other end of the connecting rod is rotatably connected to the mounting plate, a pressure strip is elastically connected to one side of the mounting plate, and a limiting member for limiting the movement of the mounting plate is arranged inside the support frame.

[0008] Furthermore, the flip assembly includes two racks, a first electric push rod for moving the racks is installed on one side of the racks, and gears are installed on both sides of the support frame through connecting rollers, and the gears are meshed and connected with the racks.

[0009] Furthermore, a limiting rod is fixedly installed inside the limiting hole, a limiting block is slidably connected inside the limiting hole, and the limiting block is slidably connected to the limiting rod.

[0010] Furthermore, fixing blocks are fixedly installed on both sides of the base, and fixing holes are opened on the top surfaces of the fixing blocks.

[0011] Furthermore, a rubber plate is fixedly mounted on one side of the pressure strip.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. Through the provided base, the staff places the semiconductor on the top surface of the rubber pad on the base, and through the cooperation of the provided second electric push rod, mounting plate, connecting rod, second rotating shaft, first rotating shaft, movable block, and support frame, the two mounting plates can be moved inward to drive the pressure strip to move inward, and through the cooperation of the provided mounting plate, pressure strip, mounting rod, and spring, the pressure strip can be abutted against both sides of the semiconductor, and the spring makes the two pressure strips elastic to prevent the semiconductor from being excessively squeezed and damaged by the two pressure strips, thereby quickly clamping and positioning the semiconductor, achieving the clamping effect of the semiconductor, and facilitating the staff to subsequently detect the semiconductor.

[0014] 2. By cooperating with each other, the support frame, pressure bar, first electric push rod, rack, gear, connecting roller, base, rubber pad and mounting block, the support frame and the semiconductor clamped on the support frame can be turned over, so that the staff can inspect the back of the semiconductor, achieve the effect of flipping the semiconductor, and realize the inspection of the front and back sides of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the connecting roller structure of the utility model;

[0017] Figure 3 for Figure 2 Schematic diagram of the local structure of A;

[0018] Figure 4 This is a schematic diagram of the support frame structure of the utility model;

[0019] Figure 5 for Figure 4 Schematic diagram of the local structure of B;

[0020] Figure 6 This is a schematic diagram of the support rod structure of the utility model.

[0021] In the figure: 1. base; 2. rubber pad; 3. support frame; 4. clamping assembly; 5. flip assembly; 6. fixing block; 7. fixing hole; 8. support plate; 9. first electric push rod; 10. rack; 11. mounting block; 12. gear; 13. connecting roller; 14. limiting hole; 15. limiting rod; 16. limiting block; 17. support rod; 18. second electric push rod; 19. mounting plate; 20. connecting hole; 21. pressure strip; 22. rubber plate; 23. mounting rod; 24. spring; 25. connecting rod; 26. movable block; 27. first rotating shaft; 28. second rotating shaft. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example 1: Please refer to Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 An adjustable semiconductor detection positioning device comprises a base 1, the top surface of the base 1 is provided with two limiting holes 14, the top surface of the base 1 is fixedly provided with two rubber pads 2 for placing semiconductors, the top surface of the base 1 is provided with a flippable support frame 3, the support frame 3 is provided with a clamping component 4 for clamping the semiconductor, and the top surface of the base 1 is provided with a flipping component 5 for flipping the semiconductor;

[0024] The clamping assembly 4 includes two mounting plates 19, both mounting plates 19 are slidably connected to the inside of the support frame 3, a second electric push rod 18 for moving the mounting plate 19 on the left side is installed on one side of the inside of the support frame 3, one end of the telescopic shaft of the second electric push rod 18 is fixedly connected to one side of the mounting plate 19 on the left side, both sides of the inside of the support frame 3 are rotatably connected with movable blocks 26 through bearings, one side of the movable block 26 is rotatably connected with two connecting rods 25, one side of the movable block 26 is fixedly installed with two first rotating shafts 27, one end of the connecting rod 25 is rotatably connected to the movable block 26 through the first rotating shaft 27, the other end of the connecting rod 25 is rotatably connected to the mounting plate 19, second rotating shafts 28 are fixedly installed on both sides of the mounting plate 19, the other end of the connecting rod 25 is rotatably connected to one side of the mounting plate 19 through the second rotating shaft 28, and one side of the mounting plate 19 is elastically connected with a pressure strip 21, one side of the mounting plate 19 is slidably connected to two mounting rods 23, one end of the mounting rod 23 is fixedly connected to one side of the pressure strip 21, and the outer circular wall sleeve of the mounting rod 23 is provided with a spring 24, one end of the spring 24 is fixedly connected to one side of the mounting plate 19, and the other side of the spring 24 is fixedly connected to one side of the pressure strip 21. A limiting member for limiting the movement of the mounting plate 19 is provided inside the support frame 3, and the limiting member includes two support rods 17, and the two support rods 17 are fixedly installed inside the support frame 3. One side of the mounting plate 19 is provided with two connecting holes 20, and the inner circular wall surface of the connecting hole 20 is movably sleeved with the outer circular wall surface of the support rod 17. Through the provided mounting plate 19, the mounting plate 19 moves inside the support frame 3 and moves along the two support rods 17. The support rod 17 can limit the movement of the mounting plate 19, thereby achieving a limiting effect on the mounting plate 19;

[0025] Through the provided base 1, the staff places the semiconductor on the top surface of the rubber pad 2 on the right side of the base 1, and the staff starts the second electric push rod 18. The telescopic axis of the second electric push rod 18 moves forward to drive the mounting plate 19 on the left side to move inward. The mounting plate 19 on the left side moves inward so that the connecting rod 25 on the left side moves inward around the second rotating shaft 28. The connecting rod 25 on the left side moves inward through the first rotating shaft 27 so that the movable block 26 rotates clockwise on the support frame 3. The movable block 26 rotates clockwise on the support frame 3 through the first rotating shaft 27 to drive the connecting rod 25 on the right side to move inward. The connecting rod 25 on the right side moves inward through the second rotating shaft 28. The rotating shaft 28 drives the right mounting plate 19 to move inward, and the two mounting plates 19 move inward, driving the pressure strip 21 to move inward and abut against the two sides of the semiconductor on the rubber pad 2. At this time, the pressure strip 21 is squeezed by the semiconductor and moves outward. The pressure strip 21 moves outward and drives the mounting rod 23 to move outward on the mounting plate 19, while compressing the spring 24, so that the two pressure strips 21 have elasticity to prevent the semiconductor from being excessively squeezed and damaged by the two pressure strips 21, thereby quickly clamping and positioning the semiconductor without manual operation by the staff, which is more convenient and quick, and achieves the clamping effect of the semiconductor, making it convenient for the staff to conduct subsequent inspection of the semiconductor.

[0026] Example 2: Please refer to Figure 1 , Figure 2 and Figure 3 , an adjustable semiconductor detection positioning device, the flip assembly 5 includes two racks 10, the two racks 10 are slidably connected to the top surface of the base 1, a first electric push rod 9 for moving the rack 10 is installed on one side of the rack 10, two support plates 8 are fixedly installed on one side of the base 1, the bottom surface of the first electric push rod 9 is fixedly connected to the top surface of the support plate 8, one end of the telescopic shaft of the first electric push rod 9 is fixedly connected to one side of the rack 10, gears 12 are installed on both sides of the support frame 3 through connecting rollers 13, the gears 12 are meshed and connected with the rack 10, connecting rollers 13 are fixedly installed on both sides of the support frame 3, the inner circumferential wall surface of the gear 12 is fixedly sleeved with the outer circumferential wall surface of the connecting roller 13, a mounting block 11 is fixedly installed on the top surface of the base 1, and the connecting roller 13 is rotatably connected to the mounting block 11 through a bearing;

[0027] Through the support frame 3, after the semiconductor is clamped by the two pressure strips 21 inside the support frame 3, the staff starts the first electric push rod 9, and the telescopic shaft of the first electric push rod 9 moves forward to drive the rack 10 to move forward. The rack 10 moves forward so that the gear 12 and the connecting roller 13 drive the support frame 3 to flip to the other side until the top surface of the support frame 3 contacts the rubber pad 2 on the left side of the base 1 and the connecting roller 13 rotates around the bearing on the mounting block 11. At this time, the support frame 3 and the semiconductor clamped on the support frame 3 are flipped, so that the staff can detect the back side of the semiconductor, achieve the flipping effect of the semiconductor, and realize the detection of the front and back sides of the semiconductor;

[0028] A limiting rod 15 is fixedly installed inside the limiting hole 14, and a limiting block 16 is slidably connected inside the limiting hole 14. The limiting block 16 is slidably connected to the limiting rod 15, and the top surface of the limiting block 16 is fixedly connected to the bottom surface of the rack 10. Through the set rack 10, the rack 10 moves forward to drive the limiting block 16 to move along the limiting rod 15 inside the limiting hole 14 on the base 1. The limiting rod 15 and the limiting block 16 can limit the movement of the rack 10, thereby achieving a limiting effect on the rack 10;

[0029] Fixed blocks 6 are fixedly installed on both sides of the base 1, and fixing holes 7 are opened on the top surface of the fixing blocks 6. Through the set fixing blocks 6, the staff puts the bolts into the fixing holes 7 on the fixing blocks 6, so as to install the base 1 in a suitable position. A rubber plate 22 is fixedly installed on one side of the pressure strip 21. The rubber plate 22 can provide a buffer for the semiconductor, further preventing the semiconductor from being damaged during clamping.

[0030] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.

Claims

1. An adjustable semiconductor detection positioning device, comprising a base (1), Features: The top surface of the base (1) is provided with two limiting holes (14); two rubber pads (2) for placing semiconductors are fixedly mounted on the top surface of the base (1); a flippable support frame (3) is provided on the top surface of the base (1); a clamping assembly (4) for clamping the semiconductor is provided inside the support frame (3); and a flipping assembly (5) for flipping the semiconductor is provided on the top surface of the base (1).

2. An adjustable semiconductor detection positioning device according to claim 1, Features: The clamping assembly (4) comprises two mounting plates (19), a second electric push rod (18) for moving the mounting plate (19) located on the left side is installed on one side of the interior of the support frame (3), movable blocks (26) are rotatably connected to the two sides of the interior of the support frame (3), one side of the movable block (26) is rotatably connected to two connecting rods (25), the other end of the connecting rod (25) is rotatably connected to the mounting plate (19), one side of the mounting plate (19) is elastically connected to a pressure strip (21), and a limiting member for limiting the movement of the mounting plate (19) is arranged inside the support frame (3).

3. The adjustable semiconductor detection positioning device according to claim 1, Features: The flip assembly (5) comprises two racks (10), one side of the racks (10) is provided with a first electric push rod (9) for moving the racks (10), and both sides of the support frame (3) are provided with gears (12) via connecting rollers (13), and the gears (12) are meshingly connected with the racks (10).

4. The adjustable semiconductor detection positioning device according to claim 3, Features: A limiting rod (15) is fixedly installed inside the limiting hole (14), a limiting block (16) is slidably connected inside the limiting hole (14), and the limiting block (16) is slidably connected to the limiting rod (15).

5. The adjustable semiconductor detection positioning device according to claim 1, Features: Fixed blocks (6) are fixedly mounted on both sides of the base (1), and a fixing hole (7) is provided on the top surface of the fixed block (6).

6. The adjustable semiconductor detection positioning device according to claim 2, Features: A rubber plate (22) is fixedly mounted on one side of the pressure strip (21).

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