Semiconductor full-automatic jumping piece cutting and transferring mechanism

Abstract

The utility model discloses a semiconductor full-automatic skipping piece cutting and transferring mechanism which comprises a skipping piece suction device, a material belt conveying device, a material belt cutting device, a first material table and a material table support. The material belt conveying device is connected with the first material platform side by side, the first material platform is arranged on the material platform support, and the material belt conveying device is used for conveying a material belt to a first platform surface of the first material platform; the material belt cutting device is arranged in the first material platform, a punching hole is formed in the first platform surface, and the material belt cutting device can move upwards and is partially exposed out of the punching hole so as to punch a material belt on the first platform surface into a jump piece; the jump piece suction device is arranged above the first material table and used for sucking the jump pieces on the first table top. According to the technology, the material belt is conveyed to the first material table through the material belt conveying device, the material belt cutting device cuts the material belt into the skipping pieces, the skipping piece sucking device sucks the skipping pieces and transfers the skipping pieces to an operation site, full-automatic conveying, cutting, sucking and transferring of the skipping pieces can be achieved, and the operation efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor full-automatic chip skipping, cutting and transporting mechanism. Background Art

[0002] In the semiconductor packaging process, when bonding the die, a jumper is required to connect the connection points on the substrate that need to be electrically connected. The jumper shape is pre-designed, the jumper is cut, and then bonded to the substrate for leveling and fixing. Currently, most semiconductor jumpers on the market are installed in bulk. Jumpers of corresponding sizes are purchased from suppliers and transported and installed on the production line. During the transportation and installation process, not only can the fitting accuracy not be guaranteed, but it is also easy to leak and rotate the jumper angle, resulting in low operating efficiency and difficulty in scale. Therefore, the existing technology of semiconductor jumper installation in bulk has the technical defect of low operating efficiency. Utility Model Content

[0003] The utility model aims to provide a semiconductor fully automatic chip cutting and transporting mechanism, aiming to solve the technical defect of low working efficiency in the prior art of semiconductor chip mounting as a bulk mounting operation mode.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] The utility model discloses a semiconductor fully automatic jump sheet cutting and transporting mechanism, comprising: a jump sheet suction device, a material belt conveying device, a material belt cutting device, a first material platform, and a material platform bracket; the material belt conveying device is connected to the first material platform in parallel, the first material platform is arranged on the material platform bracket, and the material belt conveying device is used to convey the material belt to the first table surface of the first material platform; the material belt cutting device is arranged inside the first material platform, and a punching hole is arranged on the first table surface, and the material belt cutting device can move upward and partially expose the punching hole to punch the material belt on the first table surface; the material belt cutting device comprises a lifting drive unit, a connecting plate, and a punching die set connected in sequence, the lifting drive unit is connected to the material platform bracket through a first support plate and a second support plate arranged in parallel, the lifting drive unit drives the connecting plate to move up and down and drives the punching die set to move up and down, when the connecting plate moves upward, it drives the punching die set to move upward and partially expose the punching hole, and punches the material belt into a jump sheet of a desired shape; the jump sheet suction device is arranged above the first material platform, and when operating, the jump sheet suction device moves downward to absorb the jump sheet on the material platform.

[0006] The lifting drive unit includes: a first motor, a cam assembly, and a lifting rod. The first motor is connected to the cam assembly, and the rotation of the first motor drives the cam assembly to rotate; the lifting rod is in contact with the cam assembly and is arranged vertically to the first motor. The lifting rod passes through the second support plate and is slidably connected to the second support plate. The top of the lifting rod is connected to the connecting plate. The first motor drives the cam assembly to rotate and drives the lifting rod to move up and down, so as to drive the connecting plate and the punching module to move up and down. When the connecting plate moves upward, it drives the punching module to partially expose the punching hole and punch the material strip into a jump piece of the required shape.

[0007] The punching module includes: a punching assembly and a positioning column arranged on the upper side of the connecting plate, the punching assembly includes a plurality of punching knives arranged in a matrix, the size and layout of the punching holes are adapted to the size and layout of the punching knives; a plurality of positioning columns are evenly arranged between the punching knives, a first positioning hole matched with the positioning column is also provided on the first table surface, a second positioning hole matched with the first positioning hole is provided on the material strip, the upward movement of the connecting plate drives the positioning column to move upward and sequentially penetrates the first positioning hole and the second positioning hole to achieve the fixation of the material strip.

[0008] The material belt conveying device includes a material belt bracket, a feeding assembly, and a second material table. The material belt bracket and the second material table are arranged side by side, the material belt is set on the material belt bracket, one end of the material belt bracket is flush with the second material table, the feeding assembly is set on one side of the second material table and is connected to the second material table through the second bracket, and the feeding assembly is used to convey the material belt to the first surface of the first material table; the second surface of the second material table is flush with the first surface of the first material table. When loading, the material belt is conveyed to the first surface of the first material table through the second surface of the second material table to realize the loading of the material belt.

[0009] The feeding assembly includes: a screw motor, a first slide, a slide base, a connecting seat, a first cylinder, a sliding rod, and a pin. The screw motor is arranged below the second material table through a second bracket and is connected to the slide base. The first slide is slidably connected to the slide base. A nut is provided on the screw of the screw motor. The nut, the first slide, and the connecting seat are connected in sequence. The connecting seat is arranged perpendicular to the first slide. The screw motor drives the first slide to move along the slide base and drives the connecting seat to move; the first cylinder is arranged on the connecting seat and connected to the sliding rod, and the first cylinder drives the sliding rod to move up and down; the sliding rod is arranged parallel to the first slide and the second table surface is arranged between the sliding rod and the first slide; a pin is provided on the side of the sliding rod close to the second table surface, and a pin hole matching the pin is provided on the material belt.

[0010] The jump sheet suction device includes: a first bracket, a horizontal moving unit, a vertical moving unit, and a material suction unit. The horizontal moving unit is arranged on the first bracket and is parallel to the ground. The vertical moving unit is slidably connected to the horizontal moving unit, and the vertical moving unit slides along the horizontal moving unit; the material suction unit is arranged on the vertical moving unit, and the material suction unit rises and falls along the vertical moving unit.

[0011] The horizontal moving unit includes: a horizontal slide rail, a horizontal slider, and a second motor. The horizontal slide rail is horizontally arranged on the first bracket and parallel to the ground. The horizontal slider is connected to the vertical movement unit. The second motor drives the horizontal slider to move along the horizontal slide rail and drives the vertical movement unit to slide along the horizontal slide rail.

[0012] The vertical motion unit includes a third motor, a second connecting plate, a vertical slide rail, and a second sliding bracket; the horizontal slider is installed on one side of the second connecting plate; the vertical slide rail is installed on the side of the second connecting plate away from the horizontal slider, the second sliding bracket is slidably connected to the vertical slide rail, and the third motor drives the second sliding bracket to slide up and down along the vertical slide rail.

[0013] The suction unit includes: a suction plate and a third connecting block. The suction plate is installed on the second sliding bracket through the third connecting block. The second sliding bracket slides up and down, driving the suction plate to move up and down to get closer to or away from the jump piece. The negative pressure device is connected to the suction plate. Turning on the negative pressure device can enable the suction plate to absorb the jump piece. The suction plate includes a plurality of suction claws arranged in an array.

[0014] The cutting mechanism also includes a waste box, which is mounted on a side of the second bracket away from the operating table.

[0015] The present technical solution discloses a semiconductor fully automatic jump-chip cutting and transporting mechanism, which transports the material tape to the first material table by setting up a material tape conveying device, cuts the material tape into jump-chips by a material tape cutting device, and absorbs the jump-chips by a jump-chip suction device and transports them to the operation site. This can realize fully automatic conveying, cutting, suction and transportation of jump-chips, and effectively improve the operation efficiency to a great extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A structural diagram of a semiconductor fully automatic chip skipping and cutting mechanism disclosed in an embodiment of the utility model;

[0018] Figure 2 It is a partial structural diagram of the feeding assembly disclosed in the embodiment of the utility model;

[0019] Figure 3 It is a cross-sectional view of the lifting drive unit disclosed in the embodiment of the utility model;

[0020] Figure 4 The utility model disclosed in the embodiment Figure 3 A magnified view of the structure of part A;

[0021] Figure 5 It is a structural diagram of the sheet skipping and sucking device disclosed in the embodiment of the utility model;

[0022] Figure 6 This is a connection structure diagram of the vertical motion unit and the material suction unit disclosed in the embodiment of the utility model;

[0023] Wherein: 1. Skip film suction device; 11. First bracket; 12. Horizontal moving unit; 121. Horizontal slide rail; 122. Horizontal slider; 13. Vertical moving unit; 131. Third motor; 132. Second connecting plate; 133. Vertical slide rail; 134. Second sliding bracket; 14. Suction unit; 141. Suction plate; 1411. Suction claw; 142. Third connecting block; 2. Material belt conveying device; 21. Material belt bracket; 22. Second material table; 221. Second table top; 2211. First groove; 23. Feeding assembly; 231. Screw motor; 2311. Screw; 231 2. Nut; 232. First slide; 237. Slide base; 233. Connecting seat; 236. First cylinder; 234. Sliding rod; 235. Pin; 24. Second bracket; 3. Material strip cutting device; 31. Lifting drive unit; 311. First motor; 312. Cam assembly; 313. Lifting rod; 314. First support plate; 315. Second support plate; 32. Connecting plate; 33. Punching module; 331. Punching assembly; 3311. Punching knife; 332. Positioning column; 4. First material table; 41. First table top; 411. Punching hole; 5. Material table bracket; 6. Waste box; DETAILED DESCRIPTION

[0024] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] The utility model discloses a semiconductor fully automatic chip cutting and transporting mechanism. Figure 1-6 As shown, it includes: a skipping film suction device 1, a material belt conveying device 2, a material belt cutting device 3, a first material table 4, and a material table bracket 5; the material belt conveying device 2 is connected to the first material table 4 in parallel, the first material table 4 is arranged on the material table bracket 5, and the material belt conveying device 2 is used to convey the material belt to the first table 41 of the first material table 4; the material belt cutting device 3 is arranged inside the first material table 4, and the first table 41 is provided with a punching hole 411, and the material belt cutting device 3 can move upward and partially expose the punching hole 411 to punch the material belt on the first table 41; the material belt cutting device 3 includes a lifting drive unit 31, a connecting plate 32, a punching plate 33, which are connected in sequence Module 33, the lifting drive unit 31 is connected to the material table bracket through the first support plate 314 and the second support plate 315, the second support plate 315 is arranged parallel to the first support plate 314, the lifting drive unit 31 drives the connecting plate 32 to move up and down and drives the punching module 33 to move up and down. When the connecting plate 32 moves upward, it drives the punching module 33 to move upward and partially exposes the punching hole 411, and punches the material strip into a jump piece of the required shape; the jump piece suction device 1 is arranged above the first material table 4, and is used for one-time suction of the jump piece punched out by the material strip cutting device 3. During operation, the jump piece suction device 1 moves downward to suck the jump piece on the first material table 4.

[0029] Among them, the lifting drive unit 31 includes: a first motor 311, a cam assembly 312, and a lifting rod 313. The first motor 311 is connected to the cam assembly 312, and the cam assembly 312 is installed on the motor rod of the first motor 311. The rotation of the first motor 311 drives the cam assembly 312 to rotate; the lifting rod 313 is in contact with the cam assembly 312 and the lifting rod 313 is vertically arranged with the first motor 311. The lifting rod 313 passes through the second support plate 315 and is slidably connected with the second support plate 315. The top of the lifting rod 313 is connected to the connecting plate 32. The first motor 311 drives the cam assembly 312 to rotate and drives the lifting rod 313 to move up and down, so as to drive the connecting plate 32 and the punching die 33 to move up and down. When the connecting plate 32 moves upward, it drives the punching die 33 to partially expose the punching hole 411 and punch the material strip into a jump piece of the required shape.

[0030] Specifically, the punching module 33 includes: a punching component 331 and a positioning column 332 arranged on the upper side of the connecting plate 32, the punching component 331 includes a plurality of punching knives 3311 arranged in a matrix, the size and layout of the punching hole 411 are adapted to the size and layout of the punching knife 3311, the punching knife 3311 moves upward and punches out the punching hole 411 to cut the material strip, and punching can be achieved once to obtain a plurality of jump pieces in a rectangular array, and the shape of the punching knife 3311 is set according to the required jump piece shape; a plurality of positioning columns 332 are evenly arranged between the punching knives 3311, a first positioning hole matched with the positioning column 332 is also provided on the first table 41, and a second positioning hole matched with the first positioning hole is provided on the material strip, the upward movement of the connecting plate 32 drives the positioning column 332 to move upward and successively penetrates the first positioning hole and the second positioning hole to fix the material strip and prevent the material strip from being displaced during the punching process.

[0031] Among them, the material belt conveying device 2 includes a material belt bracket 21, a feeding component 23, and a second material table 22. The material belt bracket 21 and the second material table 22 are arranged side by side, the material belt is set on the material belt bracket 21, one end of the material belt bracket 21 is flush with the second material table 22, the feeding component 23 is set on one side of the second material table 22 and is connected to the second material table 22 through the second bracket 24. The feeding component 23 is used to convey the material belt to the first table surface 41 of the first material table 4; the second table surface 221 of the second material table 22 is flush with the first table surface 41 of the first material table 4. When loading, the material belt is conveyed to the first table surface 41 of the first material table 4 via the second table surface 221 of the second material table 22 to realize the loading of the material belt.

[0032] Specifically, the feeding assembly 23 includes: a screw motor 231, a first slide 232, a slide base 237, a connecting seat 233, a first cylinder 236, a sliding rod 234, and a pin 235. The screw motor 231 is arranged below the second material table 22 through the second bracket 24 and is connected to the slide base 237. The slide base 237 is arranged parallel to the second table 221. The first slide 232 is slidably connected to the slide base 237. A nut 2312 is provided on the screw 2311 of the screw motor 231. The nut 2312, the first slide 232, and the connecting seat 233 are connected in sequence. The connecting seat 233 is arranged vertically to the first slide 232. The screw motor 231 rotates, driving the nut 2312 and the first slide 232 to move along the slide base 237 and driving the connecting seat 233 to move; the first cylinder 236 is arranged on the connecting seat 233 and is connected to the sliding rod 234. A cylinder 236 drives the sliding rod 234 to move up and down; the sliding rod 234 is arranged parallel to the first slide 232 and the second table 221 is arranged between the sliding rod 234 and the first slide 232; a pin 235 is provided on the side of the sliding rod 234 close to the second table 221, and a pin hole compatible with the pin 235 is provided on the material belt, and a first groove 2211 is also provided on the second table at a position corresponding to the movement trajectory of the pin 235; during operation, the first cylinder 236 drives the sliding rod 234 to move downward to the pin hole on the material belt through which the pin 235 passes, the screw motor 231 drives the connecting seat 233 to move along the slide base 237 and drives the first cylinder 236 and the sliding rod 234 to move in turn, the pin 235 slides along the first groove 2211 and moves in the direction close to the first material table 4, so as to drive the material belt to move to the first table 41 of the first material table 4, thereby completing the loading of the material belt.

[0033] Among them, the jump film suction device 1 includes: a first bracket 11, a horizontal moving unit 12, a vertical moving unit 13, and a material suction unit 14. The horizontal moving unit 12 is arranged on the first bracket 11 and is parallel to the ground. The vertical moving unit 13 is slidably connected to the horizontal moving unit 12, and the vertical moving unit slides along the horizontal moving unit; the material suction unit is arranged on the vertical moving unit, and the material suction unit rises and falls along the vertical moving unit.

[0034] Specifically, the horizontal moving unit 12 includes: a horizontal slide rail 121, a horizontal slider 122, and a second motor (not shown in the figure). The horizontal slide rail 121 is horizontally arranged on the first bracket 11 and parallel to the ground. The horizontal slider 122 is connected to the vertical movement unit 13. The second motor drives the horizontal slider 122 to move along the horizontal slide rail 121 and drives the vertical movement unit 13 to slide along the horizontal slide rail 121. Specifically, the second motor is a linear motor, which drives the horizontal slider 122 to slide along the horizontal slide rail 121.

[0035] Specifically, the vertical motion unit 13 includes a third motor 131, a second connecting plate 132, a vertical slide rail 133, and a second sliding bracket 134; the horizontal slider 122 is installed on one side of the second connecting plate 132; the vertical slide rail 133 is installed on the side of the second connecting plate 132 away from the horizontal slider 122, the second sliding bracket 134 is slidably connected to the vertical slide rail 133, and the third motor 131 drives the second sliding bracket 134 to slide up and down along the vertical slide rail 133. Specifically, the third motor 131 is a screw motor, and a nut is provided on the screw of the screw motor, and the nut is connected to the second sliding bracket 134. The rotation of the screw motor drives the nut to move in turn and drives the second sliding bracket 134 to slide up and down along the vertical slide rail 133.

[0036] Specifically, the suction unit 14 includes: a suction disc 141 and a third connecting block 142. The suction disc 141 is installed on the second sliding bracket 134 through the third connecting block 142. The second sliding bracket 134 slides up and down, driving the suction disc 141 to move up and down to get closer to or away from the jump piece. The negative pressure device is connected to the suction disc 141. Turning on the negative pressure device can enable the suction disc 141 to absorb the jump piece; the suction disc 141 includes a plurality of suction claws 1411 arranged in an array, and the arrangement of the suction claws 1411 is the same as that of the punching knife 3311, so that the suction claws 1411 can grab multiple jump pieces at one time.

[0037] The cutting mechanism further includes a waste box 6 , which is mounted on a side of the second bracket 24 away from the first material table 4 , and the waste generated during the cutting process is stored in the waste box 6 .

[0038] In a specific embodiment, the material belt comes to the second table 221 of the second material table 22 via the material belt bracket 21, the first cylinder 236 is shortened to drive the sliding rod 234 to move downward, the pin 235 is clamped in the pin hole of the material belt to fix the material belt, and the screw motor 231 drives the first slide 232 to slide along the slide base 237, driving the connecting seat 233, the first cylinder 236, and the sliding rod 234 to move in the direction of the first material table 4, thereby driving the material belt to move to the first table 41 of the first material table 4, and the lifting drive unit 31 drives the connecting plate 32 to move upward, driving the punch The cutting die group 33 moves upward and partially exposes the punching hole 411, punching out the material strip into jump pieces of the desired shape. In the present technology, multiple punching knives 3311 are arranged in a matrix, and punching can be achieved once to obtain multiple jump pieces in a rectangular array; the vertical movement unit 13 moves along the horizontal slide rail 121 to the top of the first material table 4, and the suction unit 14 moves downward along the vertical slide rail 133 to the upper side of the first table surface 41, and multiple suction claws 1411 are arranged in an array and the arrangement of the suction claws 1411 is the same as that of the punching knife 3311, so that the suction plate 141 can grab multiple jump pieces at one time.

[0039] The technical solution discloses a semiconductor fully automatic chip skipping cutting and transporting mechanism, comprising: a chip skipping suction device, a material belt conveying device, a material belt cutting device, a first material table, and a material table bracket; the material belt conveying device is connected side by side with the first material table, the first material table is arranged on the material table bracket, and the material belt conveying device is used to convey the material belt to the first table surface of the first material table; the material belt cutting device is arranged inside the first material table, and the first table surface is provided with a punching hole, and the material belt cutting device can move upward and partially expose the punching hole to punch the material belt on the first table surface; the material belt cutting device includes It includes a lifting drive unit, a connecting plate, and a punching module that are connected in sequence. The lifting drive unit is connected to the material platform bracket through a first support plate and a second support plate that are arranged in parallel. The lifting drive unit drives the connecting plate to move up and down and drives the punching module to move up and down. When the connecting plate moves upward, it drives the punching module to move upward and partially exposes the punching hole, so that the material strip is punched into a jump piece of the required shape; the jump piece suction device is arranged above the first material platform, and is used to suck the jump piece punched out by the material strip cutting device at one time. During operation, the jump piece suction device moves downward to suck the jump piece on the material platform. This technology conveys the material strip to the first material platform by setting a material strip conveying device, and the material strip cutting device cuts the material strip into jump pieces. The jump piece suction device sucks the jump piece and transports it to the operation site. It can realize fully automated conveying, cutting, suction, and transportation of jump pieces, effectively improving the operation efficiency and reducing costs.

[0040] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A semiconductor fully automatic chip skipping, cutting and transporting mechanism, characterized in that: include: A sheet skipping suction device, a material belt conveying device, a material belt cutting device, a first material table, and a material table bracket; The material belt conveyor is connected in parallel with the first material platform, the first material platform is arranged on the material platform bracket, and the material belt conveyor is used to convey the material belt to the first table surface of the first material platform; The material strip cutting device is arranged inside the first material table, and a punching hole is arranged on the first table. The material strip cutting device can move upward and partially expose the punching hole to punch the material strip on the first table; The material strip cutting device includes a lifting drive unit, a connecting plate, and a punching die set which are connected in sequence. The lifting drive unit is connected to the material table bracket through a first supporting plate and a second supporting plate which are arranged in parallel. The lifting drive unit drives the connecting plate to move up and down and drives the punching die set to move up and down. When the connecting plate moves upward, it drives the punching die set to move upward and partially expose the punching hole, so as to punch the material strip into a jump piece of a desired shape. The skipping sheet suction device is arranged above the first material table. During operation, the skipping sheet suction device moves downward to suck the skipping sheet on the material table.

2. According to claim 1, a semiconductor fully automatic chip skipping, cutting and transporting mechanism is characterized in that: The lifting drive unit includes: a first motor, a cam assembly, and a lifting rod. The first motor is connected to the cam assembly, and the rotation of the first motor drives the cam assembly to rotate; the lifting rod is in contact with the cam assembly and is arranged vertically to the first motor. The lifting rod passes through the second support plate and is slidably connected to the second support plate. The top of the lifting rod is connected to the connecting plate. The first motor drives the cam assembly to rotate and drives the lifting rod to move up and down, so as to drive the connecting plate and the punching module to move up and down. When the connecting plate moves upward, it drives the punching module to partially expose the punching hole and punch the material strip into a jump piece of the required shape.

3. According to claim 2, a semiconductor fully automatic chip skipping, cutting and transporting mechanism is characterized in that: The punching module includes: a punching assembly and a positioning column arranged on the upper side of the connecting plate, the punching assembly includes a plurality of punching knives arranged in a matrix, the size and layout of the punching holes are adapted to the size and layout of the punching knives; a plurality of positioning columns are evenly arranged between the punching knives, a first positioning hole matched with the positioning column is also provided on the first table surface, a second positioning hole matched with the first positioning hole is provided on the material strip, the upward movement of the connecting plate drives the positioning column to move upward and sequentially penetrates the first positioning hole and the second positioning hole to achieve the fixation of the material strip.

4. According to claim 1, a semiconductor fully automatic chip skipping, cutting and transporting mechanism is characterized in that: The material belt conveying device includes a material belt bracket, a feeding assembly, and a second material table. The material belt bracket and the second material table are arranged side by side, the material belt is set on the material belt bracket, one end of the material belt bracket is flush with the second material table, the feeding assembly is set on one side of the second material table and is connected to the second material table through the second bracket, and the feeding assembly is used to convey the material belt to the first surface of the first material table; the second surface of the second material table is flush with the first surface of the first material table. When loading, the material belt is conveyed to the first surface of the first material table through the second surface of the second material table to realize the loading of the material belt.

5. A semiconductor fully automatic chip skipping, cutting and transporting mechanism according to claim 4, characterized in that: The feeding assembly includes: a screw motor, a first slide, a slide base, a connecting seat, a first cylinder, a sliding rod, and a pin. The screw motor is arranged below the second material table through a second bracket and is connected to the slide base. The first slide is slidably connected to the slide base. A nut is provided on the screw of the screw motor. The nut, the first slide, and the connecting seat are connected in sequence. The connecting seat is arranged perpendicular to the first slide. The screw motor drives the first slide to move along the slide base and drives the connecting seat to move; the first cylinder is arranged on the connecting seat and connected to the sliding rod, and the first cylinder drives the sliding rod to move up and down; the sliding rod is arranged parallel to the first slide and the second table surface is arranged between the sliding rod and the first slide; a pin is provided on the side of the sliding rod close to the second table surface, and a pin hole matching the pin is provided on the material belt.

6. A semiconductor fully automatic chip skipping, cutting and transporting mechanism according to claim 1, characterized in that: The jump sheet suction device includes: a first bracket, a horizontal moving unit, a vertical moving unit, and a material suction unit. The horizontal moving unit is arranged on the first bracket and is parallel to the ground. The vertical moving unit is slidably connected to the horizontal moving unit, and the vertical moving unit slides along the horizontal moving unit; the material suction unit is arranged on the vertical moving unit, and the material suction unit rises and falls along the vertical moving unit.

7. A semiconductor fully automatic chip skipping, cutting and transporting mechanism according to claim 6, characterized in that: The horizontal moving unit includes: a horizontal slide rail, a horizontal slider, and a second motor. The horizontal slide rail is horizontally arranged on the first bracket and parallel to the ground. The horizontal slider is connected to the vertical movement unit. The second motor drives the horizontal slider to move along the horizontal slide rail and drives the vertical movement unit to slide along the horizontal slide rail.

8. A semiconductor fully automatic chip skipping, cutting and transporting mechanism according to claim 6, characterized in that: The vertical motion unit includes a third motor, a second connecting plate, a vertical slide rail, and a second sliding bracket; the horizontal slider is installed on one side of the second connecting plate; the vertical slide rail is installed on the side of the second connecting plate away from the horizontal slider, the second sliding bracket is slidably connected to the vertical slide rail, and the third motor drives the second sliding bracket to slide up and down along the vertical slide rail.

9. A semiconductor fully automatic chip skipping, cutting and transporting mechanism according to claim 6, characterized in that: The suction unit includes: a suction plate and a third connecting block. The suction plate is installed on the second sliding bracket through the third connecting block. The second sliding bracket slides up and down, driving the suction plate to move up and down to get close to or away from the jump piece. The negative pressure device is connected to the suction plate. The negative pressure device is turned on to enable the suction plate to absorb the jump piece. The suction plate includes a plurality of suction claws arranged in an array.

10. A semiconductor fully automatic wafer skipping, cutting and transporting mechanism according to claim 1, characterized in that: Also included is a waste box, which is mounted on a side of the second bracket away from the operating table.

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