Silicon wafer transfer device

Abstract

The utility model discloses a silicon wafer transfer device which comprises a first conveying mechanism and at least one transfer mechanism, the first conveying mechanism is provided with at least one transfer station in the first direction, and the first conveying mechanism is configured to sequentially convey silicon wafers to the transfer stations in the first direction; a set of transfer mechanism is arranged above each transfer station, the transfer mechanism comprises a driving assembly and a suction cup, the suction cup is installed at the driving end of the driving assembly, and the driving assembly is configured to drive the suction cup to pick up silicon wafers from the transfer stations; the first conveying mechanism comprises a conveying assembly and at least one set of lifting assembly, the conveying assembly is configured to support and convey silicon wafers, and the at least one set of lifting assembly is configured to drive the conveying assembly to ascend and descend so as to adjust the distance between the conveying assembly and the suction cup. The conveying assembly of the silicon wafer transfer device can ascend and descend relative to the suction cup, so that an appropriate operation space is provided for an operator when the suction cup is replaced or maintained, operation is convenient, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of silicon wafer production equipment manufacturing, and in particular to a silicon wafer transfer device. Background Art

[0002] In the production process of silicon wafers, silicon wafers need to be transferred in various processes, and usually a silicon wafer transfer device is used to transfer silicon wafers from the previous process to the next process. Most existing silicon wafer transfer devices include a conveying mechanism, a transfer mechanism and a suction cup. The suction cup is installed at the driving end of the transfer mechanism. The transfer mechanism drives the suction cup to move to the top of the conveying mechanism and absorbs the silicon wafer on the conveying mechanism, and then transfers the absorbed silicon wafer to the next process.

[0003] However, in the actual production process, since the distance between the suction cup and the conveying mechanism is very small and the height of the conveying mechanism is fixed, there is no suitable operating space when replacing or repairing the suction cup, resulting in inconvenient operation and low work efficiency. Utility Model Content

[0004] The purpose of the present application is to provide a silicon wafer transfer device to solve the problems of inconvenient operation and low working efficiency when replacing or repairing suction cups of silicon wafer transfer devices in the prior art.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] The present application provides a silicon wafer transfer device, which includes a first conveying mechanism and at least one set of transfer mechanisms, wherein:

[0007] The first conveying mechanism is provided with at least one transfer station in the first direction, and the first conveying mechanism is configured to sequentially convey the silicon wafers to the transfer station along the first direction;

[0008] A transfer mechanism is arranged above each transfer station, and the transfer mechanism includes a driving assembly and a suction cup, the suction cup is installed at the driving end of the driving assembly, and the driving assembly is configured to drive the suction cup to pick up the silicon wafer from the transfer station;

[0009] The first conveying mechanism includes a conveying component and at least one lifting component. The conveying component is configured to support and convey the silicon wafer, and the at least one lifting component is configured to drive the conveying component to rise and fall, thereby adjusting the distance between the conveying component and the suction cup.

[0010] Through the cooperation of the first conveying mechanism and the transfer mechanism, automatic transportation of silicon wafers is realized; at the same time, the conveying component of the first conveying mechanism can be raised and lowered relative to the suction cup. When the suction cup needs to be replaced or repaired, the conveying component descends relative to the suction cup, thereby increasing the distance between the conveying component and the suction cup, so that the operator has suitable operating space when replacing or repairing the suction cup, which facilitates operation and improves work efficiency; at the same time, when the suction cup and the conveying component fail and the silicon wafer between the conveying component and the suction cup cannot be taken out, the conveying component descends relative to the suction cup, which also facilitates the removal of the silicon wafer.

[0011] Optionally, each lifting assembly includes a base and a lifting drive and a lifting member installed on the base. The lifting member is fixedly connected to the conveying assembly, and the lifting drive is configured to drive the lifting member to move up and down to drive the conveying assembly to move up and down.

[0012] The lifting and lowering of the conveying component is achieved through the cooperation of the lifting driving component and the lifting component, so as to adjust the distance between the conveying component and the suction cup.

[0013] Optionally, the fixed end of the lifting drive member is fixed to the lifting member, and the driving end of the lifting drive member is connected to the base.

[0014] By setting the lifting drive member, the installation structure of the lifting drive member is simplified while ensuring the lifting function of the driving lift member, which facilitates the installation of the lifting drive member.

[0015] Optionally, the fixed end of the lifting drive member is fixed to the base, and the driving end of the lifting drive member is connected to the lifting member; another installation method of the lifting drive member is provided.

[0016] Optionally, the conveying assembly includes a first conveying frame, a second conveying frame, a first conveyor belt, a second conveyor belt and a first driving mechanism. The first conveying frame and the second conveying frame are arranged in parallel and spaced apart. The first conveyor belt is rotatably mounted on the first conveying frame, and the second conveyor belt is rotatably mounted on the second conveying frame. The first driving mechanism is configured to drive the first conveyor belt and the second conveyor belt to rotate synchronously, and the lifting member is fixedly connected to the first conveying frame and the second conveying frame through a connecting block.

[0017] Through the cooperation of the first driving mechanism, the first conveyor belt and the second conveyor belt, automatic conveying of silicon wafers is realized. Through the cooperation of the lifting member, the connecting block, the first conveyor frame and the second conveyor frame, a fixed connection between the lifting member and the conveying assembly is realized, providing a conveying assembly with a simple structure, easy implementation, stable and reliable operation.

[0018] Optionally, the silicon wafer transfer device further includes a second conveying mechanism, which is disposed on the side of the transfer station, and the transfer mechanism is configured to transfer the silicon wafer between the second conveying mechanism and the transfer station of the first conveying mechanism.

[0019] Through the cooperation of the second conveying mechanism, the transfer mechanism and the first conveying mechanism, the silicon wafers at the transfer station are automatically transported to the second conveying mechanism, and then the second conveying mechanism transfers the silicon wafers to the next process.

[0020] Optionally, the feed end of the second conveying mechanism is provided with an adsorption component, the adsorption surface of the adsorption component is lower than the conveying surface of the second conveying mechanism, and the adsorption component is configured to adsorb the silicon wafer non-contactly and adsorb the silicon wafer on the conveying surface of the second conveying mechanism.

[0021] By providing the adsorption component, the silicon wafer can be adsorbed on the conveying surface of the second conveying mechanism in a non-contact manner, so as to ensure the stability of the second conveying mechanism in conveying the silicon wafer.

[0022] Optionally, the driving assembly includes a mounting frame, a transverse driving member and a transverse member, the fixed end of the transverse driving member is mounted on the mounting frame, the driving end of the transverse driving member is connected to the transverse member, the suction cup is mounted on the transverse member, and the transverse driving member is configured to drive the transverse member to move back and forth to drive the suction cup to pick up silicon wafers from the transfer station.

[0023] Automatically picking up silicon wafers from a transfer station is achieved through the cooperation of a mounting frame, a transverse driving member, a transverse member and a suction cup, providing a driving component with a simple structure, low cost, and stable and reliable operation.

[0024] Optionally, the driving assembly also includes a rotating driving member, a fixed end of which is mounted on the transverse member, a driving end of which is connected to the suction cup, and the rotating driving member is configured to drive the suction cup to rotate a preset angle to adjust the orientation of the silicon wafer adsorbed by the suction cup.

[0025] Through the cooperation of the rotary drive part, the lateral moving part and the suction cup, automatic reversing is achieved after the suction cup picks up the silicon wafer to meet different silicon wafer production requirements.

[0026] Optionally, the first conveying mechanism includes at least two sets of lifting assemblies spaced apart in the first direction.

[0027] At least two sets of lifting components are used to drive the conveying component to rise and fall, thereby improving the stability and reliability of the conveying component to rise and fall. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of the three-dimensional structure of a silicon wafer transfer device provided in an embodiment of the present application;

[0029] Figure 2 It is a partially enlarged schematic diagram of the first conveying mechanism provided in an embodiment of the present application.

[0030] Figure 1 and Figure 2 The following reference numerals are included:

[0031] A first conveying mechanism 10, a conveying assembly 11, a first conveying frame 110, a second conveying frame 111, a first conveying belt 112, a second conveying belt 113, a first driving mechanism 114, a connecting block 115, a lifting assembly 12, a base 120, a lifting driving member 121, a lifting member 122, a sliding pair 123, a connecting seat 124, and a floating joint 125;

[0032] The transfer mechanism 20 , the suction cup 21 , the mounting frame 22 , the transverse driving member 23 , the transverse member 24 , and the rotation driving member 25 . DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0034] In the production process of silicon wafers, silicon wafers need to be transferred in various processes, and usually a silicon wafer transfer device is used to transfer silicon wafers from the previous process to the next process. Most existing silicon wafer transfer devices include a conveying mechanism, a transfer mechanism and a suction cup. The suction cup is installed at the driving end of the transfer mechanism. The transfer mechanism drives the suction cup to move to the top of the conveying mechanism and absorbs the silicon wafer on the conveying mechanism, and then transfers the absorbed silicon wafer to the next process.

[0035] However, in the actual production process, since the distance between the suction cup and the conveying mechanism is very small and the height of the conveying mechanism is fixed, there is no suitable operating space when replacing or repairing the suction cup, resulting in inconvenient operation and low work efficiency.

[0036] Therefore, this application proposes a silicon wafer transfer device, see Figure 1 As shown, the silicon wafer transfer device proposed in the embodiment of the present application includes a first conveying mechanism 10 and at least one set of transfer mechanisms 20, wherein:

[0037] The first conveying mechanism 10 is provided with at least one transfer station in the first direction, and the first conveying mechanism 10 is configured to sequentially convey the silicon wafers to the transfer station along the first direction;

[0038] A transfer mechanism 20 is arranged above each transfer station. The transfer mechanism 20 includes a driving assembly and a suction cup 21. The suction cup 21 is installed at the driving end of the driving assembly. The driving assembly is configured to drive the suction cup 21 to pick up the silicon wafer from the transfer station.

[0039] The first conveying mechanism 10 includes a conveying component 11 and at least one lifting component 12 . The conveying component 11 is configured to support and convey silicon wafers. The at least one lifting component 12 is configured to drive the conveying component 11 to rise and fall, thereby adjusting the distance between the conveying component 11 and the suction cup 21 .

[0040] Through the cooperation of the first conveying mechanism 10 and the transfer mechanism 20, automatic transportation of silicon wafers is realized; at the same time, the conveying component 11 of the first conveying mechanism 10 can be raised and lowered relative to the suction cup 21. When the suction cup 21 needs to be replaced or repaired, the lifting component 12 drives the conveying component 11 to descend, thereby increasing the distance between the conveying component 11 and the suction cup 21, so that the operator has a suitable operating space when replacing or repairing the suction cup, which is convenient for operation and improves work efficiency; and when the suction cup 21 and the conveying component 11 fail, and the silicon wafer between the conveying component 11 and the suction cup 21 cannot be taken out, the lifting component 12 drives the conveying component 11 to descend relative to the suction cup 21, which is also convenient for taking out the silicon wafer.

[0041] See also Figure 2 As shown, as an embodiment, each lifting assembly 12 includes a base 120 and a lifting drive member 121 and a lifting member 122 installed on the base 120, the lifting member 122 is fixedly connected to the conveying assembly 11, and the lifting drive member 121 is configured to drive the lifting member 122 to rise and fall, so as to drive the conveying assembly 11 to rise and fall.

[0042] Specifically, the lifting drive member 121 adopts a cylinder.

[0043] Specifically, the lifting member 122 is slidably installed on the base 120 through a sliding pair 123 composed of a guide rail and a slider. The guide rail is vertically fixed on the base 120, the slider is slidably installed on the guide rail, and the lifting member 122 is fixedly connected to the slider.

[0044] The lifting and lowering of the conveying assembly 11 is achieved through the cooperation between the lifting driving member 121 and the lifting member 122 to adjust the distance between the conveying assembly 11 and the suction cup 21 .

[0045] As an implementation manner, the fixed end of the lifting drive member 121 is fixed to the lifting member 122 , and the driving end of the lifting drive member 121 is connected to the base 120 .

[0046] Specifically, a connecting seat 124 is fixed on the base 120. The connecting seat 124 is block-shaped and is provided with an inverted T-shaped groove. The driving end of the lifting drive member 121 is connected to the inverted T-shaped groove through a floating joint 125. The driving end of the lifting drive member 121 is the piston rod end of the cylinder, and the piston rod end of the cylinder is connected to the inverted T-shaped groove through the floating joint 125; the fixed end of the lifting drive member 121 is the cylinder body of the cylinder, and the cylinder body of the cylinder is fixed on the lifting member 122.

[0047] By installing the fixed end of the lifting drive member 121 on the lifting member 122 and connecting the driving end of the lifting drive member 121 to the base 120, the installation structure of the lifting drive member 121 is simplified while ensuring the lifting function of the lifting member 122, which facilitates the installation of the lifting drive member 121.

[0048] As an implementation mode, the fixed end of the lifting drive member 121 is fixed on the base 120, and the driving end of the lifting drive member 121 is connected to the lifting member 122; another installation method of the lifting drive member 121 (i.e., the installation method with the driving end facing upward) is provided. It should be noted that: because the base 120 is fixed on the ground, this installation method of the lifting drive member 121 requires fixing the fixed end of the lifting drive member 121 to the base 120 with screws under the base 120.

[0049] See also Figure 1 and Figure 2 As shown, as an embodiment, the conveying assembly 11 includes a first conveying frame 110, a second conveying frame 111, a first conveyor belt 112, a second conveyor belt 113 and a first driving mechanism 114. The first conveying frame 110 and the second conveying frame 111 are arranged in parallel and spaced apart. The first conveyor belt 112 is rotatably mounted on the first conveying frame 110, and the second conveyor belt 113 is rotatably mounted on the second conveying frame 111. The first driving mechanism 114 is configured to drive the first conveyor belt 112 and the second conveyor belt 113 to rotate synchronously, and the lifting member 122 is fixedly connected to the first conveying frame 110 and the second conveying frame 111 through a connecting block 115.

[0050] Specifically, the first driving mechanism 114 is a first motor. Through the cooperation of the first driving mechanism 114, the first conveyor belt 112 and the second conveyor belt 113, automatic conveying of silicon wafers is realized. The lifting member 122 is a vertical strip, one side of the strip is fixed adjacent to the slider, and the upper end of the strip is fixed to the lower end of the connecting block 115. Through the cooperation of the lifting member 122, the connecting block 115, the first conveyor frame 110 and the second conveyor frame 111, the lifting member 122 is fixedly connected with the conveying assembly 11, providing a conveying assembly with a simple structure, easy implementation, stable and reliable operation.

[0051] Please refer again Figure 1 As shown, as an embodiment, the silicon wafer transfer device also includes a second conveying mechanism 30, which is arranged on the side of the transfer station, and the transfer mechanism 20 is configured to transfer silicon wafers between the second conveying mechanism 30 and the transfer station of the first conveying mechanism 10.

[0052] Specifically, the conveying direction of the second conveying mechanism 30 is arranged perpendicular to the conveying direction of the first conveying mechanism 10 .

[0053] Through the cooperation of the second conveying mechanism 30 , the transfer mechanism 20 and the first conveying mechanism 10 , the silicon wafers at the transfer station are automatically transported to the second conveying mechanism 30 , and then the second conveying mechanism 30 transfers the silicon wafers to the next process.

[0054] As an embodiment, the feeding end of the second conveying mechanism 30 is provided with an adsorption component 300, the adsorption surface of the adsorption component 300 is lower than the conveying surface of the second conveying mechanism 30, and the adsorption component 300 is configured to non-contactly adsorb the silicon wafer and adsorb the silicon wafer on the conveying surface of the second conveying mechanism 30. The adsorption component 300 can be a Bernoulli suction cup, which is arranged between the first conveyor belt 112 and the second conveyor belt 113, and the adsorption surface of the Bernoulli suction cup is lower than the conveying surfaces of the first conveyor belt 112 and the second conveyor belt 113; or the adsorption component 300 is a bar adsorption block based on the Bernoulli principle, and the bar adsorption block is provided with an air cavity that can form a Bernoulli negative pressure, and the adsorption surface of the bar adsorption block is lower than the conveying surfaces of the first conveyor belt 112 and the second conveyor belt 113, and the air cavity of the bar adsorption block or the Bernoulli suction cup is connected to the air source through a pipeline.

[0055] By providing the adsorption assembly 300 , the silicon wafers are adsorbed on the conveying surface of the second conveying mechanism 30 , so as to ensure the stability of the second conveying mechanism 30 in conveying the silicon wafers.

[0056] As an embodiment, the driving assembly includes a mounting frame 22, a transverse driving member 23 and a transverse member 24, the fixed end of the transverse driving member 23 is mounted on the mounting frame 22, the driving end of the transverse driving member 23 is connected to the transverse member 24, the suction cup 21 is mounted on the transverse member 24, and the transverse driving member 23 is configured to drive the transverse member 24 to move back and forth to drive the suction cup 21 to pick up the silicon wafer from the transfer station.

[0057] Specifically, the mounting frame 22 is a gantry frame, the first conveying mechanism 10 is arranged through the mounting frame 22 along the first direction, the transverse driving member 23 is a linear driving module horizontally installed on the crossbeam of the mounting frame 22, and the transverse driving member 24 is a seat body for installing the suction cup 21, and the seat body is installed on the slide of the linear driving module.

[0058] Through the cooperation of the mounting frame 22, the transverse driving member 23, the transverse member 24 and the suction cup 21, the silicon wafer is automatically picked up from the transfer station and laterally transported to the specified position, providing a driving component with simple structure, low cost, stable and reliable operation.

[0059] As an embodiment, the driving assembly further includes a rotating driving member 25, the fixed end of which is mounted on the traverse member 24, the driving end of which is connected to the suction cup 21, and the rotating driving member 25 is configured to drive the suction cup 21 to rotate a preset angle to adjust the orientation of the silicon wafer adsorbed by the suction cup 21. The rotating driving member 25 is a second motor, the driving end of the second motor, i.e., the output shaft end, is connected to the suction cup 21, and the fixed end of the second motor, i.e., the base of the second motor, is mounted on the traverse member 24.

[0060] Through the cooperation of the rotary drive member 25, the lateral member 24 and the suction cup 21, the suction cup 21 can automatically change direction after picking up the silicon wafer and then transport it to a designated position to meet different silicon wafer production requirements.

[0061] As an embodiment, the first conveying mechanism 10 includes at least two sets of lifting assemblies 12 spaced apart in the first direction.

[0062] Specifically, the first conveying mechanism 10 includes two sets of lifting components 12 arranged at intervals, wherein one set of lifting components 12 is arranged at a first end of the conveying component 11 , and the other set of lifting components 12 is arranged at a second end of the conveying component 11 .

[0063] At least two sets of lifting components 12 are used to drive the conveying component 11 to rise and fall, thereby improving the stability and reliability of the conveying component 11 to rise and fall.

[0064] Compared with the prior art, the silicon wafer transfer device proposed in this embodiment has the following advantages:

[0065] 1) The conveying assembly of the first conveying mechanism can be raised and lowered relative to the suction cup. When the suction cup needs to be replaced or repaired, the conveying assembly descends to increase the distance between the conveying assembly and the suction cup, so that the operator has a suitable operating space when replacing or repairing the suction cup, which is convenient for operation and improves work efficiency.

[0066] 2) When the suction cup and the conveying assembly fail, the suction cup stagnates directly above the conveying assembly, and the silicon wafer between the conveying assembly and the suction cup cannot be removed, controlling the conveying assembly to descend relative to the suction cup also facilitates the removal of the silicon wafer.

[0067] 3) The lifting drive member is installed with the driving end facing upward, which simplifies the installation structure of the lifting drive member and facilitates the installation of the lifting drive member.

[0068] 4) After picking up the silicon wafer at the transfer station, the silicon wafer can be changed in direction and then transported to the second conveying mechanism to meet different silicon wafer production requirements.

[0069] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A silicon wafer transport device, It is characterized in that The silicon wafer transfer device comprises a first conveying mechanism and at least one set of transfer mechanisms, wherein: The first conveying mechanism is provided with at least one transfer station in the first direction, and the first conveying mechanism is configured to sequentially convey the silicon wafers to the transfer station along the first direction; A set of the transfer mechanism is arranged above each transfer station, the transfer mechanism comprises a driving assembly and a suction cup, the suction cup is installed at the driving end of the driving assembly, and the driving assembly is configured to drive the suction cup to pick up the silicon wafer from the transfer station; The first conveying mechanism includes a conveying component and at least one lifting component, the conveying component is configured to support and convey the silicon wafer, and the at least one lifting component is configured to drive the conveying component to rise and fall, thereby adjusting the distance between the conveying component and the suction cup.

2. The silicon wafer transfer device according to claim 1, It is characterized in that Each set of the lifting components includes a base and a lifting drive and a lifting component installed on the base. The lifting component is fixedly connected to the conveying component. The lifting drive is configured to drive the lifting component to move up and down, so as to drive the conveying component to move up and down.

3. The silicon wafer transfer device according to claim 2, It is characterized in that The fixed end of the lifting drive member is fixed on the lifting member, and the driving end of the lifting drive member is connected to the base.

4. The silicon wafer transfer device according to claim 2, It is characterized in that The fixed end of the lifting drive member is fixed on the base, and the driving end of the lifting drive member is connected to the lifting member.

5. The silicon wafer transfer device according to claim 2, It is characterized in that The conveying assembly includes a first conveying frame, a second conveying frame, a first conveyor belt, a second conveyor belt and a first driving mechanism. The first conveying frame and the second conveying frame are arranged in parallel and spaced apart. The first conveying belt is rotatably mounted on the first conveying frame, and the second conveying belt is rotatably mounted on the second conveying frame. The first driving mechanism is configured to drive the first conveying belt and the second conveying belt to rotate synchronously. The lifting member is fixedly connected to the first conveying frame and the second conveying frame through a connecting block.

6. The silicon wafer transporting device according to claim 1, It is characterized in that The silicon wafer transfer device also includes a second conveying mechanism, which is arranged on the side of the transfer station, and the transfer mechanism is configured to transfer silicon wafers between the second conveying mechanism and the transfer station of the first conveying mechanism.

7. The silicon wafer transporting device according to claim 6, It is characterized in that The feed end of the second conveying mechanism is provided with an adsorption component, the adsorption surface of the adsorption component is lower than the conveying surface of the second conveying mechanism, and the adsorption component is configured to adsorb the silicon wafer non-contactly and adsorb the silicon wafer onto the conveying surface of the second conveying mechanism.

8. The silicon wafer transporting device according to claim 1, It is characterized in that The driving assembly includes a mounting frame, a transverse driving member and a transverse member, the fixed end of the transverse driving member is mounted on the mounting frame, the driving end of the transverse driving member is connected to the transverse member, the suction cup is mounted on the transverse member, and the transverse driving member is configured to drive the transverse member to move back and forth to drive the suction cup to pick up the silicon wafer from the transfer station.

9. The silicon wafer transporting device according to claim 8, It is characterized in that The driving assembly also includes a rotating driving member, a fixed end of which is mounted on the transverse member, a driving end of which is connected to the suction cup, and the rotating driving member is configured to drive the suction cup to rotate a preset angle to adjust the orientation of the silicon wafer adsorbed by the suction cup.

10. The silicon wafer transporting device according to claim 1, It is characterized in that The first conveying mechanism includes at least two sets of lifting assemblies spaced apart in the first direction.

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