Gantry line electroplating floating frame

Abstract

The utility model provides a gantry line electroplating floating frame which comprises a suspension frame body, a detection assembly and a controller, a plurality of through holes for reducing buoyancy are formed in a bottom shielding plate of the suspension frame body at intervals in the length direction, the buoyancy of electroplating liquid on the suspension frame body can be effectively reduced, upward acting force of the suspension frame body on a PCB is reduced, and the electroplating quality of the gantry line is improved. The bending deformation of the PCB is reduced; a movable shielding plate is arranged on the side face, back on to a bottom shielding plate, of a vertical shielding plate of the suspension frame body, the movable shielding plate is in sliding fit with the vertical shielding plate in the vertical direction, when a small-size PCB is produced, the downward pressing effect of the PCB on the suspension frame body is reduced, and at the moment, the descending height of the suspension frame body is reduced; the movable shielding plate can be kept in a sinking state so as to ensure the shielding area for the current; the detection assembly comprises inductors and vertical rods which are matched in a one-to-one correspondence mode, and the controller judges the state of the suspension frame body by detecting whether all the inductors are triggered or not and whether the triggering interval of the four inductors is larger than a preset value or not.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB manufacturing, in particular to a gantry line electroplating floating frame. Background Art

[0002] Electroplating is an important process in PCB production. The electroplating line generally adopts a vertical gantry electroplating line. The vertical gantry electroplating line uses a flying bar to cooperate with the fixture to move the PCB up and down, and a floating plate is configured in the electroplating tank for cooperation. During the electroplating production process of PCB boards, the vertical gantry electroplating line completely relies on the PCB board to press the floating frame. When there are fewer PCB boards on the same flying bar or the PCB boards are thin, it will lead to insufficient downward pressure. The floating frame floats up due to the buoyancy, which will cause the PCB board to deform or break.

[0003] The existing floating frame structure has a single function, and its specifications are designed and manufactured according to the size of large-surface PCB boards. When producing smaller PCB boards, the floating frame floats up as a whole due to the buoyancy, which will reduce the area of ​​current shielding, thereby increasing the thickness of the bottom plated surface of the PCB board. At the same time, if the floating frame cannot float up or is skewed, it will lead to uneven electroplating on the PCB board surface, damage to the board surface, and even the board falling into the electroplating tank. At present, there is a lack of effective monitoring of the floating frame status in production. The quality of the electroplating floating frame can only be judged by the electroplating quality of the product after electroplating. The abnormality of the floating frame cannot be detected in time, which will waste a lot of electroplating materials and time, greatly increasing production costs. Utility Model Content

[0004] In order to overcome the problems existing in the related art, the utility model provides a gantry line electroplating floating frame.

[0005] The purpose of the utility model is to provide a gantry line electroplating floating frame:

[0006] It includes a suspension frame, a detection component and a controller;

[0007] The suspension frame is arranged in the electroplating pool, and includes two symmetrically arranged vertical shielding plates, which are connected via a connecting plate, and a plurality of connecting plates are arranged at intervals along the length direction of the vertical shielding plates, a V-shaped positioning groove is arranged in the middle of the top surface of the connecting plate, and a plug-in hole penetrating the connecting plate along the length direction of the vertical shielding plate is arranged at the bottom of the V-shaped positioning groove, and a bottom shielding plate is arranged between the two vertical shielding plates, and the bottom shielding plate penetrates the plug-in holes of each connecting plate to be plugged with the connecting plate, and a plurality of through holes for reducing buoyancy are arranged at intervals along the length direction on the bottom shielding plate;

[0008] A movable shielding plate is provided on the side of the vertical shielding plate facing away from the bottom shielding plate, and the movable shielding plate is slidably matched with the vertical shielding plate in the vertical direction;

[0009] The detection component includes four sensors and four vertical rods. The sensors and the vertical rods are arranged in a one-to-one correspondence. The vertical rods are arranged at the ends of the top surfaces of the vertical shielding plates. The sensors are installed above the electroplating pool to detect the presence or absence of the vertical rods. When the suspended frame is not subjected to downward pressure, the top ends of the vertical rods block the sensors. The sensors are electrically connected to the controller.

[0010] In a preferred technical solution of the utility model, the bottom shielding plate includes a horizontal plate portion and inclined plate portions arranged on both long sides of the horizontal plate portion.

[0011] In the preferred technical solution of the utility model, inverted cone positioning holes are provided at both ends of the horizontal plate. In practical applications, the flybar used in the vertical gantry electroplating line is usually equipped with side strips to improve the electroplating performance when electroplating the PCB board. The inverted cone positioning holes are used to position and guide the lower end of the side strip to improve the stability of the vertical movement of the suspension frame.

[0012] In a preferred technical solution of the utility model, a plurality of vertical ridges are arranged at intervals along the length direction of the vertical shielding plate, a vertical groove is provided on the movable shielding plate to accommodate the vertical ridges, upper limit blocks are respectively arranged on both sides of the vertical ridge at the top of the vertical groove, the two limit blocks slide together with the vertical ridge, and lower limit blocks are respectively arranged on both sides of the bottom of the vertical ridge.

[0013] In a preferred technical solution of the utility model, both inclined surfaces of the V-shaped positioning groove are provided with a protective layer.

[0014] In a preferred technical solution of the utility model, the protective layer is a protective sleeve, the protective sleeve cover is provided with an inclined surface wrapping the V-shaped positioning groove, and the protective sleeve is plugged into the connecting plate.

[0015] In a preferred technical solution of the utility model, vertically arranged guide plates are provided on both sides of the end of the suspension frame, and the guide plates are installed on the side walls of the electroplating pool. A channel for the suspension frame to move up and down is formed between the guide plates on both sides. By imposing restrictions on the suspension frame by the guide plates, the stability of the movement of the suspension frame can be improved.

[0016] In a preferred technical solution of the present utility model, the bottom surface of the bottom shielding plate is higher than the bottom surface of the vertical shielding plate, and there is a gap between the bottom shielding plate and the vertical shielding plate.

[0017] The beneficial effects of the utility model are:

[0018] A plurality of through holes for reducing buoyancy are provided at intervals along the length direction on the bottom shielding plate of the suspension frame, which can effectively reduce the buoyancy of the electroplating liquid on the suspension frame, reduce the upward force of the suspension frame on the PCB board, and reduce the bending deformation of the PCB board;

[0019] A movable shielding plate is arranged on the side of the vertical shielding plate of the suspension frame facing away from the bottom shielding plate. The movable shielding plate slides vertically with the vertical shielding plate. When producing PCB boards with smaller sizes, the downward pressure of the PCB board on the suspension frame is reduced. The height of the suspension frame is reduced, and the movable shielding plate will remain in a sinking state to ensure the shielding area of ​​the current and improve the uniformity of electroplating.

[0020] The detection component includes four sensors and four vertical rods. The sensors and the vertical rods are arranged in a one-to-one correspondence. The vertical rods are arranged at the ends of the top surfaces of the vertical baffles. The sensors are installed above the electroplating pool to detect the presence or absence of the vertical rods. When the suspended frame is not subjected to downward pressure, the top ends of the vertical rods block the sensors. The sensors are electrically connected to the controller. After the electroplating is completed, the PCB is taken out and the suspended frame will float up and reset. The controller detects whether each sensor is triggered. If a sensor is not triggered, or the triggering interval of the four sensors is greater than the preset value, it indicates that the suspended frame is in an abnormal state. At this time, the controller controls the gantry electroplating equipment to stop and alarm, thereby avoiding a large waste of electroplating materials and time due to the failure to timely detect the abnormality of the floating frame, which is conducive to reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the coordination structure of the gantry line electroplating floating frame and the electroplating tank.

[0022] Figure 2 It is a structural cross-sectional view of the gantry line electroplating floating frame.

[0023] Figure 3 It is a schematic diagram of the sliding cooperation structure of the movable shielding plate and the vertical shielding plate.

[0024] Reference numerals:

[0025] 100, Feiba; 110, side strip; 200, electroplating tank; 210, electroplating solution; 220, guide plate; 300, suspension frame; 310, bottom shielding plate; 311, through hole; 312, inverted cone positioning hole; 320, vertical shielding plate; 321, vertical ridge; 322, lower limit block; 330, connecting plate; 331, V-shaped positioning groove; 332, protective layer; 340, movable shielding plate; 341, vertical groove; 342, upper limit block; 400, vertical rod; 500, bracket; 600, sensor; 700, PCB board. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0027] Electroplating is an important process in PCB production. The electroplating line generally adopts a vertical gantry electroplating line. The vertical gantry electroplating line uses a flying bar to cooperate with the fixture to move the PCB boards up and down, and a floating plate is configured in the electroplating tank for cooperation. During the electroplating production process of PCB boards, the vertical gantry electroplating line completely relies on the PCB boards to press the floating frame. When there are fewer PCB boards on the same flying bar or the PCB boards are thin, it will lead to insufficient downward pressure. The floating frame floats up due to the buoyancy, which will cause the PCB boards to deform or break.

[0028] The existing floating frame structure has a single function, and its specifications are designed and manufactured according to the size of large-surface PCB boards. When producing smaller PCB boards, the floating frame floats up as a whole due to the buoyancy, which will reduce the area of ​​current shielding, thereby increasing the thickness of the bottom plated surface of the PCB board. At the same time, if the floating frame cannot float up or is skewed, it will lead to uneven electroplating on the PCB board surface, damage to the board surface, and even the board falling into the electroplating tank. At present, there is a lack of effective monitoring of the floating frame status in production. The quality of the electroplating floating frame can only be judged by the electroplating quality of the product after electroplating. The abnormality of the floating frame cannot be detected in time, which will waste a lot of electroplating materials and time, greatly increasing production costs.

[0029] Example

[0030] In view of the above problems, this embodiment provides a gantry line electroplating floating frame.

[0031] like Figure 1-3 As shown, a gantry line electroplating floating frame:

[0032] It includes a suspension frame 300, a detection component and a controller;

[0033] The suspension frame 300 is arranged in the electroplating tank 200, and includes two symmetrically arranged vertical shielding plates 320, the two vertical shielding plates 320 are connected via a connecting plate 330, and a plurality of connecting plates 330 are arranged at intervals along the length direction of the vertical shielding plates 320, and a V-shaped positioning groove 331 is arranged in the middle of the top surface of the connecting plate 330, and a plug-in hole that runs through the connecting plate 330 along the length direction of the vertical shielding plates 320 is arranged at the bottom of the groove of the V-shaped positioning groove 331. 0 is provided with a bottom shielding plate 310 in the middle, the bottom shielding plate 310 penetrates the plugging holes of each connecting plate 330 to be plugged with the connecting plate 330, and a plurality of through holes 311 for reducing buoyancy are provided on the bottom shielding plate 310 at intervals along the length direction. The design of the through holes 311 can effectively reduce the buoyancy of the electroplating solution 210 on the suspension frame 300, so that the upward force of the suspension frame 300 on the PCB board 700 is reduced, so as to reduce the bending deformation of the PCB board 700;

[0034] The vertical shielding plate 320 is provided with a movable shielding plate 340 on the side facing away from the bottom shielding plate 310. The suspension frame 300 is configured as a whole to float in the electroplating solution. The movable shielding plate 340 is configured to be suspended in the electroplating solution and can move up and down relative to the vertical shielding plate 320. For example, the movable shielding plate 340 is set to be slightly larger than the density of the electroplating solution, such as 0.1-0.5 g / cm 3 The suspension frame 300 is equipped with other parts which are set to be slightly smaller than the density of the plating solution, such as 0.1-0.5 g / cm smaller than the plating solution. 3 ;

[0035] The movable shielding plate 340 is slidably matched with the vertical shielding plate 320 in the vertical direction. When a PCB board 700 of a smaller size is produced, the downward pressure of the PCB board 700 on the suspension frame 300 is reduced due to the reduced size of the PCB board 700, and the suspension frame 300 will float up accordingly. At the same time, under the action of the sliding matching structure, the movable shielding plate 340 automatically sinks the suspension frame 300, so that the shielding area at the bottom of the suspension frame 300 will not be reduced.

[0036] The detection assembly includes four sensors 600 and four vertical rods 400. The sensors 600 and the vertical rods 400 are arranged one by one. The vertical rods 400 are arranged at the ends of the top surfaces of the vertical shielding plates 320. The sensors 600 are installed above the electroplating pool 200 through the brackets 500 to detect the presence or absence of the vertical rods 400. When the suspension frame 300 is not subjected to downward pressure, the tops of the vertical rods 400 block and trigger the sensors 600. The sensors 600 are electrically connected to the controller.

[0037] The detection component includes four sensors 600 and four vertical rods 400. The sensors 600 and the vertical rods 400 are arranged in a one-to-one correspondence. The vertical rods 400 are arranged at the top ends of the vertical baffles 320. The sensors 600 are installed above the electroplating pool 200 to detect the presence or absence of the vertical rods 400. When the suspension frame 300 is not subjected to downward pressure, the top ends of the vertical rods 400 block the sensors 600. The sensors 600 are electrically connected to the controller. After the electroplating is completed, the PCB is taken out, and the suspension frame 300 floats up and resets. The controller detects whether each sensor 600 is triggered. If there is a sensor 600 that is not triggered, or the triggering interval of the four sensors 600 is greater than the preset value, it indicates that the suspension frame 300 is in an abnormal state. At this time, the controller controls the gantry electroplating equipment to stop and alarm, thereby avoiding a large waste of electroplating materials and time due to the inability to timely detect the abnormality of the floating frame, which is beneficial to reducing production costs.

[0038] In this embodiment, the bottom shielding plate 310 includes a horizontal plate portion and inclined plate portions arranged on both long sides of the horizontal plate portion, and the inclined plate portions can further shield the current.

[0039] In this embodiment, both ends of the horizontal plate portion are provided with inverted cone positioning holes 312. In practical applications, the Feiba 100 used in the vertical gantry electroplating line is usually equipped with a side strip 110 to improve the electroplating performance when electroplating the PCB board 700. The inverted cone positioning hole 312 is used to position and guide the lower end of the side strip 110. Correspondingly, the lower end of the side strip 110 is chamfered so that the side strip 110 can accurately press down the suspension frame 300 when it moves downward, thereby improving the stability of the vertical movement of the suspension frame 300.

[0040] In this embodiment, a plurality of vertical ridges 321 are arranged at intervals along the length direction of the vertical shielding plate, and a vertical groove 341 is provided on the movable shielding plate 340 for accommodating the vertical ridge 321. Upper limit blocks 342 are respectively arranged on the top of the vertical groove 341 and on both sides of the vertical ridge 321. The two limit blocks slidably cooperate with the vertical ridge 321, and lower limit blocks 322 are respectively arranged on both sides of the bottom of the vertical ridge 321. The lower limit block 322 can block and limit the upper limit block 342 to prevent the movable shielding plate 340 from moving downward and falling out.

[0041] In this embodiment, the two inclined surfaces of the V-shaped positioning groove 331 are both provided with a protective layer 332 .

[0042] In the present embodiment, the protective layer 332 is a protective cover, and the protective cover is provided with an inclined surface that wraps the V-shaped positioning groove 331, and the protective cover is plugged into the connecting plate 330. For a PCB board 700 with a large mass and sharp edges, after being inserted into the suspension frame 300 during electroplating, certain damage will be caused to the suspension frame 300. The suspension frame 300 is made of PVC or PP material. After a period of use, notches with different cutting depths will appear. If the PCB board 700 falls into the notch, it will not be able to enter the part where the bottom shielding plate 310 is located, thereby causing the electroplating uniformity of the PCB board 700 to deteriorate. By adding a protective layer 332, this design can reduce the damage to the suspension frame 300 caused by the collision between the PCB board 700 and the suspension frame 300 during the descent process, thereby increasing the service life of the suspension frame 300.

[0043] In this embodiment, vertically arranged guide plates 220 are provided on both sides of the end of the suspension frame 300, and the guide plates 220 are installed on the side walls of the electroplating tank 200. A channel for the suspension frame 300 to move up and down is formed between the guide plates 220 on both sides, and the suspension frame 300 is restricted by the guide plates 220, so that the stability of the movement of the suspension frame 300 can be improved.

[0044] In this embodiment, the bottom surface of the bottom shielding plate 310 is higher than the bottom surface of the vertical shielding plate 320 , and there is a gap between the bottom shielding plate 310 and the vertical shielding plate 320 .

[0045] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the subsequent accompanying drawings.

[0046] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0047] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0048] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A gantry line electroplating floating frame, characterized in that: It includes a suspension frame, a detection component and a controller; The suspension frame is arranged in the electroplating pool, and includes two symmetrically arranged vertical shielding plates, which are connected via a connecting plate, and a plurality of connecting plates are arranged at intervals along the length direction of the vertical shielding plates, a V-shaped positioning groove is arranged in the middle of the top surface of the connecting plate, and a plug-in hole penetrating the connecting plate along the length direction of the vertical shielding plate is arranged at the bottom of the V-shaped positioning groove, and a bottom shielding plate is arranged between the two vertical shielding plates, and the bottom shielding plate penetrates the plug-in holes of each connecting plate to be plugged with the connecting plate, and a plurality of through holes for reducing buoyancy are arranged at intervals along the length direction on the bottom shielding plate; A movable shielding plate is provided on the side of the vertical shielding plate facing away from the bottom shielding plate, and the movable shielding plate is slidably matched with the vertical shielding plate in the vertical direction; The detection component includes four sensors and four vertical rods. The sensors and the vertical rods are arranged in a one-to-one correspondence. The vertical rods are arranged at the ends of the top surfaces of the vertical shielding plates. The sensors are installed above the electroplating pool to detect the presence or absence of the vertical rods. When the suspended frame is not subjected to downward pressure, the top ends of the vertical rods block the sensors. The sensors are electrically connected to the controller.

2. The gantry line electroplating floating frame according to claim 1, characterized in that: The bottom shielding plate includes a horizontal plate portion and inclined plate portions arranged on both long sides of the horizontal plate portion.

3. The gantry line electroplating floating frame according to claim 2 is characterized in that: Inverted cone-shaped positioning holes are arranged at both ends of the horizontal plate portion.

4. The gantry line electroplating floating frame according to claim 1, characterized in that: The vertical shielding plate is provided with a plurality of vertical ridges at intervals in the length direction, the movable shielding plate is provided with a vertical groove for accommodating the vertical ridges, upper limit blocks are respectively provided on both sides of the vertical ridges at the top of the vertical groove, the two limit blocks are slidably cooperated with the vertical ridges, and lower limit blocks are respectively provided on both sides of the bottom of the vertical ridges.

5. The gantry line electroplating floating frame according to claim 1, characterized in that: Both inclined surfaces of the V-shaped positioning groove are provided with a protective layer.

6. The gantry line electroplating floating frame according to claim 5, characterized in that: The protective layer is a protective sleeve, the protective sleeve cover is provided with an inclined surface wrapping the V-shaped positioning groove, and the protective sleeve is plugged into the connecting plate.

7. The gantry line electroplating floating frame according to claim 1, characterized in that: Vertically arranged guide plates are arranged on both sides of the end of the suspension frame, and the guide plates are installed on the side walls of the electroplating pool.

8. The gantry line electroplating floating frame according to claim 1, characterized in that: The bottom surface of the bottom shielding plate is higher than the bottom surface of the vertical shielding plate, and there is a gap between the bottom shielding plate and the vertical shielding plate.

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