Heat dissipation device and lighting equipment

Abstract

The utility model provides a heat dissipation device and lighting equipment, including: heat dissipation module, heat transfer module and air cooling module wherein the heat dissipation module includes a plurality of heat dissipation fins that are laminated, heat transfer module includes heat transfer substrate and a plurality of heat transfer tubes that are arranged on the heat transfer substrate, one end of heat transfer tube is connected with the heat transfer substrate, and the other end of heat transfer tube is connected with the air cooling module. The other end of the heat transfer pipe extends in the direction away from the heat transfer substrate and is provided with a plurality of heat dissipation fins in a penetrating mode, and the air supply face of the air cooling module is right opposite to the heat dissipation module. According to the heat dissipation device, due to the fact that the heat transfer pipe is arranged among the multiple heat dissipation fins in the penetrating mode and is not provided with a bent area, the internal space occupied by the heat transfer pipe can be reduced, the size of the heat dissipation device is reduced, the utilization rate of the internal space of the heat dissipation device is increased, heat dissipation is conducted through the multiple stacked heat dissipation fins, and the heat dissipation efficiency is improved. The heat dissipation area can be increased, and the heat dissipation efficiency of the heat dissipation device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photographic lighting, in particular to a heat dissipation device and lighting equipment. Background Art

[0002] LED lamps have the advantages of low energy consumption, good light efficiency and no pollution. They are far superior to traditional lighting products in all aspects. Therefore, they are gradually becoming the only choice for new and green lighting technology. In order to increase the brightness of photographic lights, multiple light-emitting chips are usually built into the photographic lights. The light-emitting chips will generate a lot of heat when working. Therefore, the light-emitting chips need to be cooled by heat dissipation devices.

[0003] Existing LED lamps usually use a heat dissipation device composed of a heat pipe, a heat spreader and heat dissipation fins. The heat pipe of the heat dissipation device usually has a certain bending curvature, and the bending area easily causes space waste, resulting in low space utilization of the existing heat dissipation device. Utility Model Content

[0004] The embodiments of the utility model provide a heat dissipation device and a lighting device, which can reduce the volume of the heat dissipation device and increase the utilization rate of the internal space of the heat dissipation device.

[0005] In a first aspect, an embodiment of the present utility model provides a heat dissipation device, comprising:

[0006] A heat dissipation module, the heat dissipation module includes a plurality of heat dissipation fins arranged in a stacked manner;

[0007] The heat transfer module includes a heat transfer substrate and a plurality of heat transfer tubes arranged on the heat transfer substrate, one end of the heat transfer tube is connected to the heat transfer substrate, and the other end of the heat transfer tube is extended in a direction away from the heat transfer substrate and penetrated with a plurality of heat dissipation fins;

[0008] The air cooling module has an air outlet surface facing the heat dissipation module.

[0009] In one embodiment, the plurality of heat transfer tubes are disposed perpendicular to the heat transfer substrate, and the plurality of heat transfer tubes are evenly arranged along the length direction and the width direction of the heat transfer substrate.

[0010] In one embodiment, the heat dissipation fin is provided with a plurality of tube holes corresponding to the plurality of heat transfer tubes respectively, and the plurality of tube holes are evenly arranged along the length direction and the width direction of the heat dissipation fin.

[0011] In one embodiment, the edge of each tube hole is raised to form a boss, and a plurality of heat transfer tubes pass through the corresponding tube holes and bosses respectively.

[0012] In one embodiment, the heat dissipation fin includes a bottom plate, a first side plate and a second side plate, the first side plate and the second side plate are arranged around the bottom plate, the first side plate and the second side plate are arranged in parallel and have the same shape.

[0013] In one embodiment, a plurality of heat dissipation fins form a plurality of heat dissipation channels through the first side plate and the second side plate, the opening directions of the plurality of heat dissipation channels are the same, and the air outlet surface is arranged opposite to the openings of the plurality of heat dissipation channels.

[0014] In one embodiment, the heat transfer substrate includes a first substrate and a second substrate, a plurality of heat transfer tubes are connected to the second substrate, the first substrate is arranged on a side of the second substrate away from the heat transfer tubes, the area of ​​the first substrate is smaller than the area of ​​the second substrate, and the thickness of the first substrate is smaller than the thickness of the second substrate.

[0015] In one embodiment, a plurality of heat dissipation fins are arranged parallel to the heat transfer substrate, and a surface of the plurality of heat dissipation fins having the bosses faces the heat transfer substrate.

[0016] In one embodiment, the heat transfer substrate and the heat transfer tube are both hollow, the inner space of the heat transfer substrate is connected with the inner space of the heat transfer tube, and the inner spaces of the heat transfer substrate and the heat transfer tube are provided with capillary layers.

[0017] In a second aspect, an embodiment of the utility model provides a lighting device, which includes a heat-generating component and the heat dissipation device of any one of the first aspects, wherein the heat-generating component is arranged on a side of the heat-transfer substrate away from the heat-transfer tube.

[0018] Beneficial effects of the embodiments of the utility model:

[0019] In an embodiment of the utility model, one end of the heat transfer tube is connected to the heat transfer substrate, and the other end of the heat transfer tube is extended in a direction away from the heat transfer substrate and penetrated with a plurality of heat dissipation fins. Compared with the existing heat dissipation device, since the heat transfer tube is penetrated between the plurality of heat dissipation fins and the heat transfer tube has no bending area, the internal space occupied by the heat transfer tube can be reduced, thereby reducing the volume of the heat dissipation device and increasing the utilization rate of the internal space of the heat dissipation device. Heat dissipation is performed by stacking a plurality of heat dissipation fins, which can increase the heat dissipation area and improve the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1It is an exploded schematic diagram of a heat dissipation device provided in an embodiment of the utility model;

[0022] Figure 2 It is a structural schematic diagram of a heat transfer module provided in an embodiment of the utility model;

[0023] Figure 3 It is a structural schematic diagram of a heat dissipation module provided in an embodiment of the utility model;

[0024] Figure 4 It is a structural schematic diagram of a heat dissipation fin provided in an embodiment of the utility model;

[0025] Figure 5 It is a structural schematic diagram of a lighting device provided in an embodiment of the utility model.

[0026] The following are the descriptions of the reference numerals:

[0027] 10. heat dissipation device; 20. heating component; 100. heat dissipation module; 200. heat transfer module; 300. air cooling module; 110. heat dissipation fins; 120. tube holes; 130. bosses; 140. heat dissipation channels; 210. heat transfer substrate; 220. heat transfer tubes; 111. bottom plate; 112. first side plate; 113. second side plate. DETAILED DESCRIPTION

[0028] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0029] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections.

[0030] In order to simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0031] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0032] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0034] Please refer to Figures 1 to 5 As shown, an embodiment of the present application provides a heat dissipation device, which includes: a heat dissipation module 100, a heat transfer module 200 and an air cooling module 300, wherein the heat dissipation module 100 includes a plurality of heat dissipation fins 110 arranged in a stacked manner, the heat transfer module 200 includes a heat transfer substrate 210 and a plurality of heat transfer tubes 220 arranged on the heat transfer substrate 210, one end of the heat transfer tube 220 is connected to the heat transfer substrate 210, and the other end of the heat transfer tube 220 is extended in a direction away from the heat transfer substrate 210 and penetrates a plurality of heat dissipation fins 110, the air outlet surface of the air cooling module 300 is arranged opposite to the heat dissipation module 100, and the air cooling module 300 is configured to perform air cooling on the heat dissipation module 100.

[0035] The heat dissipation device provided in this embodiment can dissipate heat for the heating component 20, wherein the heating component 20 can be a COB (Chip On Board) light source, for example, a single LED (Light Emitting Diode) or a plurality of LED arrays. Of course, the heating component 20 can also be other types of light sources, such as an organic light emitting diode or a laser diode array.

[0036] In the specific heat dissipation process, the heating component 20 can be fixed on the side of the heat transfer substrate 210 away from the heat transfer tube 220. The heat generated by the heating component 20 is transferred to the heat transfer substrate 210, and then transferred to the multiple heat transfer tubes 220 by the heat transfer substrate 210. Then, the multiple heat transfer tubes 220 transfer the heat to the heat dissipation module 100. At the same time, the air cooling module 300 supplies air to the heat dissipation module 100, thereby bringing the heat on the heat dissipation module 100 into the atmosphere, thereby achieving heat dissipation of the heating component 20. The heat dissipation device in this embodiment is arranged by connecting one end of the heat transfer tube 220 with the heat transfer substrate 210, and the other end of the heat transfer tube 220 is extended in a direction away from the heat transfer substrate 210 and penetrated by a plurality of heat dissipation fins 110. Compared with the existing heat dissipation device, since the heat transfer tube 220 is penetrated between the plurality of heat dissipation fins 110 and the heat transfer tube 220 has no bending area, the internal space occupied by the heat transfer tube 220 can be reduced, thereby reducing the volume of the heat dissipation device and increasing the utilization rate of the internal space of the heat dissipation device. Heat dissipation can be performed by stacking a plurality of heat dissipation fins 110, which can increase the heat dissipation area and improve the heat dissipation efficiency of the heat dissipation device.

[0037] In some embodiments, the air cooling module 300 may be a fan or other device that can drive air flow. The air cooling module 300 can quickly cool down the heat dissipation module 100 to improve the heat dissipation efficiency of the heat dissipation device.

[0038] In some embodiments, the heat transfer substrate 210 and the plurality of heat transfer tubes 220 are integrally formed. Compared with the existing method of fixing the heat pipes to the vapor chamber (VC) plate by welding, it can not only reduce the manufacturing cost, but also reduce the thermal resistance caused by welding, thereby improving the overall heat dissipation efficiency of the heat dissipation device.

[0039] In some embodiments, the heat transfer tube 220 is a metal tube, and the heat transfer substrate 210 is a metal plate. The materials of the heat transfer tube 220 and the heat transfer substrate 210 can be aluminum, copper, copper alloy, aluminum alloy, etc. Aluminum, copper, copper alloy, aluminum alloy and other materials have excellent thermal conductivity, and can quickly transfer the heat of the heating component 20 to the heat dissipation module 100, thereby improving the overall heat dissipation efficiency of the heat dissipation device.

[0040] In some embodiments, the plurality of heat transfer tubes 220 are arranged perpendicular to the heat transfer substrate 210, for example, Figure 1 and Figure 2 As shown, the heat transfer substrate 210 is located in the XY plane, one end of the plurality of heat transfer tubes 220 is connected to the heat transfer substrate 210, and the other end of the plurality of heat transfer tubes 220 extends along the Z direction.

[0041] In some embodiments, the plurality of heat transfer tubes 220 are evenly arranged along the length direction and the width direction of the heat transfer substrate 210, wherein the length direction can be Figure 1The X direction in the width direction can be Figure 1 The Y direction in the figure. Of course, the length direction can also be Figure 1 The Y direction in the width direction is Figure 1 That is, the distances between adjacent heat transfer tubes 220 in the length direction of the heat transfer substrate 210 are equal, and the distances between adjacent heat transfer tubes 220 in the width direction of the heat transfer substrate 210 are equal.

[0042] In some embodiments, reference Figure 1 , Figure 3 and Figure 4 As shown, a plurality of tube holes 120 are provided on the heat dissipation fin 110, and the plurality of tube holes 120 correspond to the plurality of heat transfer tubes 220 respectively. The plurality of tube holes 120 are evenly arranged along the length direction and the width direction of the heat dissipation fin 110. The arrangement structure of the plurality of tube holes 120 on the heat dissipation fin 110 is the same as the arrangement structure of the plurality of heat transfer tubes 220 on the heat transfer substrate 210. By providing a plurality of tube holes 120 corresponding to the plurality of heat transfer tubes 220 on the heat dissipation fin 110, the plurality of heat transfer tubes 220 can pass through a plurality of heat dissipation fins 110, so that the plurality of heat transfer tubes 220 transfer heat to the plurality of heat dissipation fins 110 for heat dissipation.

[0043] Furthermore, the heat transfer tube 220 and the tube hole 120 provided on the heat dissipation fin 110 may be interference fit, and the heat transfer tube 220 and the heat dissipation fin 110 may be relatively fixed by extrusion, and the interference fit may improve the fit and connection firmness of the heat transfer tube 220 and the heat dissipation fin 110. Of course, the heat transfer tube 220 and the tube hole 120 provided on the heat dissipation fin 110 may also be gap fit, and the gap between the heat transfer tube 220 and the tube hole 120 may be filled with heat conductive silicone or heat conductive sheet, thereby helping to improve the heat conduction efficiency between the heat transfer tube 220 and the heat dissipation fin 110, and further improve the heat dissipation efficiency of the heat dissipation device.

[0044] In some embodiments, continue to refer to Figure 3 and Figure 4 As shown, the edge of each tube hole 120 is raised to form a boss 130, and multiple heat transfer tubes 220 pass through their corresponding tube holes 120 and bosses 130 respectively. By forming the bosses 130 on the edges of the tube holes 120, not only can the contact area between the heat dissipating fins 110 and the heat transfer tubes 220 be increased, thereby improving the heat dissipation efficiency of the heat dissipation device, but also the heat transfer tubes 220 can be restricted from sliding out of the tube holes 120, thereby improving the stability of the connection between the heat transfer tubes 220 and the heat dissipating fins 110.

[0045] In some embodiments, continue to refer to Figure 4As shown, the heat dissipation fin 110 includes a bottom plate 111, a first side plate 112 and a second side plate 113, a plurality of tube holes 120 are arranged on the bottom plate 111, and the first side plate 112 and the second side plate 113 are arranged around the bottom plate 111. For example, the first side plate 112 and the second side plate 113 are respectively connected to two opposite side surfaces of the bottom plate 111, and the first side plate 112 and the second side plate 113 can keep a certain distance between two adjacent heat dissipation fins 110, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0046] In some embodiments, the first side plate 112 and the second side plate 113 are arranged in parallel, and the first side plate 112 and the second side plate 113 have the same shape and the same size, so that the stability of the stacking structure of the plurality of heat dissipating fins 110 can be improved. Figure 4 As shown, the first side plate 112 and the second side plate 113 are both rectangular structures, the length of the first side plate 112 is equal to the length of the second side plate 113 , and the width of the first side plate 112 is equal to the width of the second side plate 113 .

[0047] In some embodiments, a plurality of heat dissipation fins 110 form a plurality of heat dissipation channels 140 through a first side plate 112 and a second side plate 113, and the opening directions of the plurality of heat dissipation channels 140 are the same, for example, the opening directions of the plurality of heat dissipation channels 140 are all in the X direction, or the opening directions of the plurality of heat dissipation channels 140 are all in the Y direction.

[0048] In some embodiments, the multiple heat dissipation channels 140 include relatively arranged air inlets and air outlets, and the air outlet surface of the air cooling module 300 is arranged relatively to the air inlets and air outlets of the multiple heat dissipation channels 140. In this way, the air cooling module 300 can supply cold air to the heat dissipation channels 140 through the air inlet, and bring heat from the multiple heat dissipation channels 140 to the atmosphere through the air outlets of the multiple heat dissipation channels 140, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0049] In some embodiments, continue to refer to Figure 1 As shown, the heat transfer substrate 210 includes a first substrate 211 and a second substrate 212, a plurality of heat transfer tubes 220 are connected to the second substrate 212, the first substrate 211 is arranged on a side of the second substrate 212 away from the heat transfer tubes 220, the heating component 20 is arranged on a side of the first substrate 211 away from the second substrate 212, the area of ​​the first substrate 211 is smaller than the area of ​​the second substrate 212, the thickness of the first substrate 211 is smaller than the thickness of the second substrate 212, the area and thickness of the first substrate 211 are set smaller, the heat of the heating component can be quickly transferred to the second substrate 212, the area and thickness of the second substrate 212 are set larger, the contact area between the heat transfer module 200 and the heat dissipation module 100 can be increased, and the heat dissipation efficiency of the heat dissipation device can be improved.

[0050] In some embodiments, reference Figure 1 and Figure 5 As shown, a plurality of heat dissipation fins 110 are arranged parallel to the heat transfer substrate 210, and a plurality of heat dissipation fins 110 are stacked and arranged on a side of the heat transfer substrate 210 close to the plurality of heating tubes, and a side of the plurality of heat dissipation fins 110 having the boss 130 faces the heat transfer substrate 210. Among them, a heat dissipation fin 110 close to the heat transfer substrate 210 among the plurality of heat dissipation fins 110 is thermally connected to the heat transfer substrate 210, and the heat dissipation fin 110 and the heat transfer substrate 210 can be bonded by thermally conductive silicone, connected by a thermally conductive sheet, or connected by welding.

[0051] In some embodiments, the heat transfer substrate 210 and the heat transfer tube 220 are both hollow, the internal space of the heat transfer substrate 210 is connected to the internal space of the heat transfer tube 220, and the internal spaces of the heat transfer substrate 210 and the heat transfer tube 220 are provided with a capillary layer, which can be made of porous ceramic material or metal powder (such as copper powder, aluminum powder, etc.). The heat transfer substrate 210 is filled with a coolant, which is a liquid with a low boiling point and easily absorbs heat and evaporates to become a gas. The coolant includes but is not limited to methanol, ethanol, acetone, water, etc.

[0052] In the specific heat dissipation process, the coolant is converted into gas after being heated, and the gaseous coolant moves from the heat transfer substrate 210 to the heat transfer tube 220. During the movement, the coolant is cooled by the heat transfer tube 220 and the heat dissipation fins 110 with a lower temperature, so that the gaseous coolant is converted into liquid. The liquid coolant flows back to the heat transfer substrate 210 along the capillary layer by the action of capillary force, thereby realizing a heat dissipation process. By filling the heat transfer substrate 210 with coolant and allowing the coolant to flow back to the heat transfer substrate 210 by the action of capillary force, the heat dissipation efficiency of the heat dissipation device can be improved.

[0053] Reference Figure 5 As shown, the embodiment of the present application further provides a lighting device, which includes: a heating component 20 and the heat dissipation device 10 described in the above embodiment, wherein the heating component 20 is arranged on a side of the heat transfer substrate 210 away from the heat transfer tube 220. The lighting device in the embodiment of the present application is arranged by connecting one end of the heat transfer tube 220 with the heat transfer substrate 210, and the other end of the heat transfer tube 220 is extended in a direction away from the heat transfer substrate 210 and penetrated with a plurality of heat dissipation fins 110. Compared with the existing lighting device, since the heat transfer tube 220 is penetrated between the plurality of heat dissipation fins 110 and the heat transfer tube 220 has no bending area, the internal space occupied by the heat transfer tube 220 can be reduced, thereby reducing the volume of the lighting device and increasing the utilization rate of the internal space of the lighting device. The heat dissipation area can be increased by dissipating the heat through the stacked plurality of heat dissipation fins 110, thereby improving the heat dissipation efficiency of the lighting device.

[0054] In some embodiments, the heating component 20 can be a COB (Chip On Board) light source, for example, a single LED (Light Emitting Diode) or a plurality of LED arrays. Of course, the heating component 20 can also be other types of light sources, such as an organic light emitting diode or a laser diode array.

[0055] Furthermore, the heating component 20 and the heat transfer substrate 210 can be reinforced by heat conductive adhesive or the like, or can be reinforced by bolts. The heat transfer substrate 210 includes a first substrate 211 and a second substrate 212, and a plurality of heat transfer tubes 220 are connected to the second substrate 212. The first substrate 211 is arranged on a side of the second substrate 212 away from the heat transfer tubes 220, and the heating component 20 is arranged on a side of the first substrate 211 away from the second substrate 212. The area of ​​the first substrate 211 is smaller than the area of ​​the second substrate 212, and the thickness of the first substrate 211 is smaller than the thickness of the second substrate 212. The first substrate 211 has a smaller area and thickness, which can quickly transfer the heat of the heating component 20 to the second substrate 212. The second substrate 212 has a larger area and thickness, which can increase the contact area between the heat transfer module 200 and the heat dissipation module 100, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0056] The above is a detailed introduction to the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A heat dissipation module (100), the heat dissipation module (100) comprising a plurality of heat dissipation fins (110) arranged in a stacked manner; A heat transfer module (200), the heat transfer module (200) comprising a heat transfer substrate (210) and a plurality of heat transfer tubes (220) arranged on the heat transfer substrate (210), one end of the heat transfer tube (220) being connected to the heat transfer substrate (210), and the other end of the heat transfer tube (220) being extended in a direction away from the heat transfer substrate (210) and passing through a plurality of the heat dissipation fins (110); An air cooling module (300), wherein an air outlet surface of the air cooling module (300) is arranged facing the heat dissipation module (100).

2. The heat dissipation device according to claim 1, characterized in that: The plurality of heat transfer tubes (220) are disposed perpendicular to the heat transfer substrate (210), and the plurality of heat transfer tubes (220) are evenly arranged along the length direction and the width direction of the heat transfer substrate (210).

3. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fin (110) is provided with a plurality of tube holes (120) respectively corresponding to the plurality of heat transfer tubes (220), and the plurality of tube holes (120) are evenly arranged along the length direction and the width direction of the heat dissipation fin (110).

4. The heat dissipation device according to claim 3, characterized in that: The edge of each tube hole (120) is raised to form a boss (130), and a plurality of heat transfer tubes (220) pass through the corresponding tube holes (120) and the boss (130) respectively.

5. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fin (110) comprises a base plate (111), a first side plate (112) and a second side plate (113); the first side plate (112) and the second side plate (113) are arranged around the base plate (111); the first side plate (112) and the second side plate (113) are arranged in parallel and have the same shape as the second side plate (113).

6. The heat dissipation device according to claim 5, characterized in that: A plurality of the heat dissipation fins (110) form a plurality of heat dissipation channels (140) through the first side plate (112) and the second side plate (113); the opening directions of the plurality of heat dissipation channels (140) are the same, and the air outlet surface is arranged opposite to the openings of the plurality of heat dissipation channels (140).

7. The heat dissipation device according to claim 1, characterized in that: The heat transfer substrate (210) comprises a first substrate (211) and a second substrate (212); a plurality of heat transfer tubes (220) are connected to the second substrate (212); the first substrate (211) is arranged on a side of the second substrate (212) away from the heat transfer tubes (220); the area of ​​the first substrate (211) is smaller than the area of ​​the second substrate (212); and the thickness of the first substrate (211) is smaller than the thickness of the second substrate (212).

8. The heat dissipation device according to claim 4, characterized in that: A plurality of the heat dissipation fins (110) are arranged parallel to the heat transfer substrate (210), and a surface of a plurality of the heat dissipation fins (110) having a boss (130) faces the heat transfer substrate (210).

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that: The heat transfer substrate (210) and the heat transfer tube (220) are both hollow, the internal space of the heat transfer substrate (210) is connected to the internal space of the heat transfer tube (220), and the internal spaces of the heat transfer substrate (210) and the heat transfer tube (220) are provided with capillary layers.

10. A lighting device, characterized in that: It comprises a heat-generating component and the heat-dissipating device according to any one of claims 1 to 9, wherein the heat-generating component (20) is arranged on a side of the heat-transfer substrate (210) away from the heat-transfer tube (220).

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