Temperature measuring device of wafer temperature measuring system

Abstract

The utility model relates to a temperature measuring device of a wafer temperature measuring system, which is used for measuring the temperature error of the wafer temperature measuring system and comprises a thermostatic bath used for providing a constant temperature field; the isothermal block comprises a first loading space and a second loading space, the first loading space is used for loading a wafer temperature measuring system, the second loading space is used for loading a standard platinum resistance thermometer, and at least part of the isothermal block is inserted into the cavity from the strip-shaped notch from the open end to the closed end; in a constant temperature field provided by the thermostatic bath, temperature data measured by the wafer temperature measuring system and the standard platinum resistance thermometer can be respectively read and compared, so that the temperature error value of the wafer temperature measuring system is obtained, the structure is simple, the operation is convenient, and the measured error value of the wafer temperature measuring system is accurate; and the isothermal block is arranged, so that the temperature error of the wafer temperature measurement system can be measured, and the wafer temperature measurement system can be prevented from being in direct contact with a fluid medium, thereby ensuring the cleanliness of the wafer temperature measurement system.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a temperature measuring device of a wafer temperature measuring system. Background Art

[0002] Wafers are the basic materials used to manufacture integrated circuits in the semiconductor manufacturing process. During the wafer manufacturing process, the wafer needs to be thermally treated multiple times to change its physical and chemical properties. In this process, temperature control is crucial, and even a small change in temperature can cause significant changes in the performance of the wafer. Therefore, in order to ensure the accuracy and stability of the semiconductor process, real-time and accurate temperature measurement of the wafer is required.

[0003] The wafer temperature measurement system is designed to meet this demand. By monitoring the temperature of the wafer surface in real time, corresponding measures can be taken to ensure the stability and reliability of the entire process.

[0004] At present, there is no temperature measurement solution for wafer temperature measurement system in China, which brings inconvenience to the product performance verification work. Utility Model Content

[0005] In view of this, the embodiments of the present application are to solve at least one problem existing in the background technology, and the purpose of providing the present application is achieved through the following technical solutions: a temperature measuring device of a wafer temperature measurement system, used to measure the temperature error of the measured wafer temperature measurement system, the wafer temperature measurement system includes a temperature measuring element connected to the wafer, a control unit connected to the temperature measuring element and a display unit connected to the control unit, the control unit includes a signal processing circuit, the signal processing circuit is connected to the temperature measuring element and the display unit, and can convert the temperature data measured by the temperature measuring element into a numerical value and display it on the display unit; the temperature measuring device includes:

[0006] A constant temperature bath, used to provide a constant temperature field, comprising a cavity and a strip-shaped notch connected to the cavity, wherein the notch is located on the upper surface of the constant temperature bath, and the cavity is used to place a fluid medium;

[0007] An isothermal block has a closed end at the bottom and an open end at the top, the isothermal block also includes a first loading space and a second loading space formed between the closed end and the open end, the first loading space is used to load the wafer temperature measurement system, the second loading space is used to load a standard platinum resistance thermometer, at least part of the isothermal block is inserted into the cavity from the strip groove from the open end to the closed end, and the isothermal block is made of heat-conducting material.

[0008] Optionally, in the temperature measuring device of the above-mentioned wafer temperature measurement system, the constant temperature bath also includes a driving member and a stirring member connected to the driving member, the stirring member is located in the cavity, and the driving member can drive the stirring member to rotate to drive the fluid medium in the cavity to flow.

[0009] Optionally, in the temperature measuring device of the above-mentioned wafer temperature measurement system, the constant temperature bath has two pairs of side walls arranged opposite to each other, and a baffle is also arranged in the constant temperature bath, the baffle is connected to one pair of side walls, and there are gaps between the baffle and the upper wall and the lower wall of the constant temperature bath.

[0010] Optionally, in the temperature measuring device of the above-mentioned wafer temperature measurement system, the isothermal block is made of copper.

[0011] Optionally, in the temperature measuring device of the above-mentioned wafer temperature measurement system, the closed end is configured to be semicircular.

[0012] Optionally, in the temperature measuring device of the above-mentioned wafer temperature measurement system, the isothermal block includes a main body and a overlapping portion connected to the main body, the first loading space and the second loading space are located on the main body, the isothermal block is inserted into the cavity, and the overlapping portion overlaps the constant temperature bath.

[0013] Optionally, the temperature measuring device of the wafer temperature measurement system further comprises a sealing member arranged between the constant temperature bath and the isothermal block.

[0014] Optionally, the temperature measuring device of the wafer temperature measurement system mentioned above further comprises a liquid level detection member disposed in the cavity.

[0015] Optionally, the temperature measuring device of the wafer temperature measurement system mentioned above further includes a heating element arranged in the cavity.

[0016] Compared with the prior art, the present application has the following beneficial effects: by providing a constant temperature bath and an isothermal block, and the isothermal block has a first loading space and a second loading space, the wafer temperature measurement system that needs to be detected for error can be placed in the first loading space, the standard platinum resistance thermometer can be placed in the second loading space, and then at least part of the isothermal block can be placed in the cavity, and the temperature data measured by the wafer temperature measurement system and the standard platinum resistance thermometer can be read and compared respectively under the constant temperature field provided by the constant temperature bath, so as to obtain the temperature error of the measured wafer temperature measurement system, the structure is simple, the operation is convenient, and the measured temperature error of the wafer temperature measurement system is accurate; and by providing an isothermal block, the temperature error of the wafer temperature measurement system can be measured while preventing the wafer temperature measurement system from directly contacting the fluid medium, thereby ensuring the cleanliness of the wafer temperature measurement system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a constant temperature bath in a temperature measurement device of a wafer temperature measurement system of the present application;

[0018] Figure 2 yes Figure 1 A schematic cross-sectional view of the isothermal block is shown;

[0019] Figure 3 It is a structural schematic diagram of an isothermal block in a temperature measurement device of a wafer temperature measurement system of the present application;

[0020] Figure 4 yes Figure 3 Schematic diagram of the other orientation of the isothermal block.

[0021] Among them, 1 is a constant temperature tank, 11 is a cavity, 12 is a notch, 13 is a baffle, 14 is a gap, 2 isothermal block, 21 is a first loading space, 22 is a second loading space, 23 is a closed end, 24 is an open end, 25 is a main body, and 26 is an overlapping part. DETAILED DESCRIPTION

[0022] The exemplary embodiments disclosed in the present application will be described in more detail below. In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and known functions and structures are not described in detail.

[0023] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. And when the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has the first element, component, region, layer or part.

[0024] Spatially relative terms such as "under", "beneath", "below", "under", "over", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0025] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "a", "an" and " / the" are also intended to include plural forms, unless the context clearly indicates another way. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0026] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0027] Please refer to Figure 1-Figure 4 As shown, an embodiment of the present application provides a temperature measurement device of a wafer temperature measurement system (hereinafter referred to as the temperature measurement device), which is used to measure the temperature errors of different wafer temperature measurement systems, so that a user can determine the temperature error of a certain wafer temperature measurement system when using the temperature measurement system, thereby facilitating calibration when using the wafer temperature measurement system.

[0028] The wafer temperature measurement system includes a temperature measuring element connected to the wafer, a control unit connected to the temperature measuring element, and a display unit connected to the control unit. The temperature measuring element converts the measured data into an electrical signal. The control unit includes a signal processing circuit. The signal processing circuit connects the temperature measuring element and the display unit and can convert the temperature data (electrical signal) measured by the temperature measuring element into a numerical value and display it on the display unit for reference. In this embodiment, the temperature measuring element is a temperature sensor.

[0029] Specifically, the temperature measurement device includes a thermostatic bath 1 and an isothermal block 2. The thermostatic bath 1 is used to provide a constant temperature field, and the isothermal block 2 is used to load the wafer temperature measurement system and the standard platinum resistance thermometer, and is inserted into the thermostatic bath 1, so as to read the temperature data displayed by the measured wafer temperature measurement system and the standard platinum resistance thermometer respectively, and compare the two to obtain the error of the measured wafer temperature measurement system.

[0030] More specifically, the thermostatic bath 1 includes a cavity 11 and a strip-shaped slot 12 connected to the cavity 11, wherein the orthographic projection of the cavity 11 on the horizontal plane covers the orthographic projection of the strip-shaped slot 12 on the horizontal plane, the slot 12 is located on the upper surface of the thermostatic bath 1, and the cavity 11 is used to place the fluid medium; the isothermal block 2 is inserted into the strip-shaped slot 12 to realize the error detection of the temperature measurement system of the measured wafer at the fixed point temperature. The isothermal block 2 is a heat-conducting material, such as copper, or when the temperature in the thermostatic bath 1 is negative, the isothermal block 2 can be made of aluminum; the fluid medium can be silicone oil, water or alcohol, etc. In this embodiment, the cavity 11 is configured as a rectangular parallelepiped or a cube shape as a whole, and the isothermal block is configured as a flat structure, so that the isothermal block can be inserted into the cavity 11 through the strip-shaped slot 12.

[0031] The constant temperature bath 1 also includes a heating element, a driving element, and a stirring element connected to the driving element. The heating element is used to heat the fluid medium to reach the target temperature; the stirring element is located in the cavity 11, and the driving element can drive the stirring element to rotate to drive the fluid medium in the cavity 11 to flow, so that the temperature in the cavity 11 is uniform, and then the wafer temperature measurement system can perform temperature measurement in a uniform constant temperature environment to improve accuracy.

[0032] In this embodiment, the thermostatic bath has two pairs of side walls arranged opposite to each other, and a baffle 13 is also arranged in the thermostatic bath. The baffle 13 connects one pair of side walls, and there are gaps between the baffle 13 and the upper wall and the lower wall of the thermostatic bath. The purpose of setting the baffle 13 is that the driving member drives the stirring member to rotate to drive the fluid medium to flow, and the existence of the baffle 13 can make the fluid medium flow irregularly in the cavity, and even make the fluid medium form a turbulent flow direction, thereby further improving the temperature uniformity. In addition, it can be understood that the baffle 13 divides the space into a first cavity and a second cavity that are interconnected through upper and lower gaps 14. The first cavity is arranged below the strip notch, the isothermal block is inserted in the first cavity, and the heating member, the driving member and the stirring member are all arranged in the second cavity to prevent collision and wear with the isothermal block 2.

[0033] It is worth noting that in this embodiment, the temperature measurement device also includes a liquid level detection member disposed in the cavity 11. The liquid level detection member can detect the liquid level height of the fluid medium in the cavity 11 in real time, thereby ensuring that the liquid level of the fluid medium can reach the liquid level height required when the wafer temperature measurement system measures the temperature error, further improving the accuracy of the error.

[0034] The isothermal block 2 has a first loading space 21 and a second loading space 22. The first loading space 21 is used to load the wafer temperature measurement system, and the second loading space 22 is used to load the standard platinum resistance thermometer. In this embodiment, the isothermal block 2 has a closed end 23 located at the bottom and an open end 24 located at the top, and the first loading space 21 and the second loading space 22 are located between the closed end 23 and the open end 24. When the temperature error detection of the wafer temperature measurement system is performed, the wafer temperature measurement system and the standard platinum resistance thermometer are loaded into the first loading space 21 and the second loading space 22 from the open end 24, respectively, and the entire isothermal block 2 is at least partially inserted from the open end 24 to the closed end 23 from the strip notch 12 into the cavity 11. At this time, at least part of the isothermal block 2 is immersed in the fluid medium.

[0035] The isothermal block 2 also includes a main body 25 and an overlapping portion 26 connected to the main body 25. The first loading space 21 and the second loading space 22 are located on the main body 25. When the isothermal block 2 is inserted into the cavity 11, the overlapping portion 26 overlaps the constant temperature bath 1 to relatively fix the isothermal block 2 and the constant temperature bath 1.

[0036] It is worth noting that the temperature measuring device also includes a seal arranged between the constant temperature bath 1 and the isothermal block 2, which is used to ensure the temperature inside the isothermal block 2 when it is loaded in the cavity 11 to prevent the heat flow in the cavity 11 from overflowing.

[0037] In this embodiment, the closed end 23 is set to be semicircular. The purpose of this setting is to make the circular wafer temperature measurement system fit closely with the semicircular closed end 23, so as to avoid the problem of poor error detection accuracy caused by the isothermal block 2 and the wafer temperature measurement system not being in contact.

[0038] The above is only a specific implementation of the present application, and any other improvements made based on the concept of the present application are deemed to be within the protection scope of the present application.

Claims

1. A temperature measuring device for a wafer temperature measuring system, characterized in that: Used to measure the temperature error of the temperature measurement system of the measured wafer, the wafer temperature measurement system includes a temperature measuring element connected to the wafer, a control unit connected to the temperature measuring element and a display unit connected to the control unit, the control unit includes a signal processing circuit, the signal processing circuit is connected to the temperature measuring element and the display unit, and can convert the temperature data measured by the temperature measuring element into a numerical value and display it on the display unit; The temperature measuring device comprises: A constant temperature bath, used to provide a constant temperature field, comprising a cavity and a strip-shaped notch communicating with the cavity, wherein the notch is located on the upper surface of the constant temperature bath, and the cavity is used to place a fluid medium; An isothermal block has a closed end at the bottom and an open end at the top, the isothermal block also includes a first loading space and a second loading space formed between the closed end and the open end, the first loading space is used to load the wafer temperature measurement system, the second loading space is used to load a standard platinum resistance thermometer, at least part of the isothermal block is inserted into the cavity from the strip groove from the open end to the closed end, and the isothermal block is made of heat-conducting material.

2. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The constant temperature bath further comprises a driving member and a stirring member connected to the driving member, wherein the stirring member is located in the cavity, and the driving member can drive the stirring member to rotate so as to drive the fluid medium in the cavity to flow.

3. The temperature measuring device of the wafer temperature measuring system according to claim 2, characterized in that: The thermostatic bath has two pairs of side walls arranged opposite to each other. A baffle is also arranged in the thermostatic bath. The baffle connects one pair of side walls, and there are gaps between the baffle and the upper wall and the lower wall of the thermostatic bath.

4. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The material of the isothermal block is copper.

5. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The closed end is configured in a semicircular shape.

6. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The isothermal block includes a main body and an overlapping portion connected to the main body, the first loading space and the second loading space are located on the main body, the isothermal block is inserted into the cavity, and the overlapping portion overlaps the thermostatic bath.

7. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The temperature measuring device further includes a sealing member disposed between the constant temperature bath and the isothermal block.

8. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The temperature measuring device further comprises a liquid level detecting member arranged in the cavity.

9. The temperature measuring device of the wafer temperature measuring system according to claim 1, characterized in that: The temperature measuring device further comprises a heating element disposed in the cavity.

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