Multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology

The multi-core fiber fan-in and fan-out device using a PLC chip and array substrates addresses the challenges of complex structures and high costs in existing technologies, enabling efficient optical signal coupling and distribution for improved transmission capacity and efficiency.

CN222189513UActive Publication Date: 2024-12-17ACCELINK TECHNOLOGIES CO LTD
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Patent Information

Application Number
CN202420014466.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-03
Publication Date
2024-12-17
Estimated Expiration
2034-01-03

AI Technical Summary

Technical Problem

Existing multi-core optical fiber devices face challenges in achieving efficient optical signal coupling and distribution with complex structures, high manufacturing difficulty, and high costs, making them unsuitable for large-scale production and application.

Method used

A multi-core fiber fan-in and fan-out device utilizing a PLC chip with array substrates and optical waveguides, allowing for efficient optical signal conversion and distribution between multi-core and single-core optical fibers, featuring a simple manufacturing process and low cost.

Benefits of technology

The device achieves efficient optical signal coupling and distribution with reduced complexity and cost, enhancing transmission capacity and efficiency while being suitable for large-scale production and application.

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Abstract

The utility model relates to the technical field of optical fiber communication, in particular to a multi-core optical fiber fan-in and fan-out device based on a multi-core optical fiber and a PLC (Programmable Logic Controller) technology, which comprises a PLC chip, a first array substrate and a second array substrate, and is characterized in that the first array substrate and the second array substrate are respectively positioned on two sides of the PLC chip; a multi-core optical fiber is arranged on the first array substrate, a plurality of single-core optical fibers are arranged on the second array substrate, the multi-core optical fiber is coupled with the input end of the PLC chip, and the single-core optical fibers are coupled with the output end of the PLC chip; wherein the number of fiber cores of the multi-core optical fiber is the same as that of the single-core optical fibers; the PLC chip is provided with optical waveguides, and the number of the optical waveguides is equal to the number of fiber cores of the multi-core optical fiber and the number of the single-core optical fibers. The multi-core optical fiber fan-in and fan-out device based on the multi-core optical fiber and the PLC technology is simple in manufacturing process, low in cost and suitable for large-scale production and application.
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Description

Technical Field

[0001] The utility model relates to the technical field of optical fiber communication, in particular to a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology. Background Art

[0002] With the popularization of the Internet and the advent of the digital age, people's demand for high-speed, long-distance and large-capacity transmission systems continues to increase. At present, only improving the transmission rate of a single wavelength and developing new band resources have been limited, and these methods can no longer meet the growing needs of users. Therefore, it is becoming more and more urgent to seek a new solution to solve the problem of the bottleneck of optical communication transmission capacity. Multi-core fiber space division multiplexing technology is a technology for transmitting multiple independent signals in multi-core optical fibers. It can effectively improve the transmission capacity and transmission rate of optical communication systems. Compared with traditional single-core optical fibers, multi-core optical fibers can transmit multiple independent signals in the same optical fiber, thereby greatly improving the transmission efficiency and capacity of optical fibers. Therefore, multi-core fiber space division multiplexing technology is widely used in high-speed data transmission, cloud computing, data centers and other fields. In the multi-core fiber space division multiplexing system, the multi-core fiber fan-in fan-out device is the key to realizing the optical coupling function of multi-core optical fibers to multiple single-core optical fibers. The multi-core fiber fan-in fan-out device can couple multiple signals in the multi-core optical fiber to multiple single-core optical fibers respectively, thereby realizing the space division multiplexing of multi-core optical fibers. Multi-core fiber fan-in and fan-out devices have the advantages of high coupling efficiency, low insertion loss, low crosstalk and high reliability, and are one of the key technologies for realizing multi-core fiber space division multiplexing systems.

[0003] In order to realize the preparation of multi-core fiber fan-in and fan-out devices, a variety of preparation schemes have emerged, including fused taper scheme, coupling scheme and waveguide scheme, which are described in detail as follows.

[0004] The first solution is the fusion taper solution. First, the first taper is performed on a cylindrical tube sleeve with the same core geometry distribution and equal aperture size for the multi-core optical fiber; then multiple single-core optical fibers are inserted into the cylindrical tube sleeve after taper, and the second and third tapers are performed at the position of the first taper, so that the waist of the cone is consistent with the cladding diameter of the multi-core optical fiber, and finally the multi-core optical fiber is fused. The difficulty of making a multi-core fan-in and fan-out device using this solution lies in the control of mode field changes and core spacing during the taper process.

[0005] The second solution is the coupling solution. This solution uses optical elements such as lenses, capillaries, and adjustment frames to couple multi-core optical fibers with multiple single-core optical fibers to form a multi-core fan-in fan-out device. First, the single-core fiber bundle and the multi-core optical fiber are made into pins respectively; then a right-angle prism is placed between the multi-core pin and the single-core fiber bundle pin for coupling and debugging. The difficulty of using the coupling solution to make a multi-core fan-in fan-out device lies in the design of the optical path. When the number of cores increases, the optical path becomes complicated, the difficulty of debugging will increase, and the size of the device will also increase.

[0006] The third solution is the waveguide solution. First, remove part of the coating layer of the multi-core optical fiber to form a multi-core optical fiber head, so that the core distribution of the multi-core optical fiber head is the same as the waveguide arrangement shape of the input end of the three-dimensional waveguide chip; then remove part of the coating layer of multiple single-mode optical fibers to form a single-core optical fiber bundle head, so that the core distribution of the single-mode optical fiber bundle head is the same as the waveguide arrangement shape of the output end of the three-dimensional waveguide chip; finally, couple the multi-core optical fiber with the input end of the three-dimensional waveguide chip, couple the single-core optical fiber bundle with the output end of the three-dimensional waveguide chip, and encapsulate the chip and the coupling point in a metal tube. The difficulty of this solution lies in the production of the three-dimensional waveguide chip, and the cost is relatively high. Among them, the three-dimensional waveguide chip is a new type of optical waveguide integrated chip, which uses three-dimensional integration technology to realize high-integration, high-performance optical waveguide devices. Compared with traditional planar waveguide integrated chips, three-dimensional waveguide chips have greater advantages in solving many limitations such as planar waveguide integration, optical and electrical connection points, and materials. The 3D waveguide chip uses 3D integration technology to stack multiple chips with different functions, and realizes the transmission and control of light waves through the coupling structure between layers, which can achieve higher integration, smaller volume and lower power consumption. Compared with traditional planar waveguide integrated chips, the design and manufacturing of 3D waveguide chips are more difficult, requiring special manufacturing processes and precision processing equipment. At the same time, 3D waveguide chips also have higher flexibility and scalability, and can be customized according to different application requirements. Design and manufacture.

[0007] In view of this, how to overcome the defects of the prior art and solve the above-mentioned technical problems is a difficult problem to be solved in this technical field. Utility Model Content

[0008] The utility model aims to overcome the problems of the existing multi-core optical fiber fan-in and fan-out devices that are complex in structure, difficult to prepare, and unable to take into account the requirements for low cost and small volume of optical devices.

[0009] The utility model is achieved in this way:

[0010] The utility model provides a multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology, comprising: a PLC chip 1, a first array substrate 2 and a second array substrate 3, wherein the first array substrate 2 and the second array substrate 3 are respectively located on both sides of the PLC chip 1;

[0011] The first array substrate 2 is provided with a multi-core optical fiber 20, and the second array substrate 3 is provided with a plurality of single-core optical fibers 30, the multi-core optical fiber 20 is coupled with the input end of the PLC chip 1, and the single-core optical fiber 30 is coupled with the output end of the PLC chip 1; wherein the number of cores of the multi-core optical fiber 20 is the same as the number of the single-core optical fibers 30;

[0012] The PLC chip 1 is provided with optical waveguides 10 , and the number of the optical waveguides 10 is equal to the number of cores of the multi-core optical fiber 20 and the number of the single-core optical fiber 30 .

[0013] Preferably, a first V-shaped groove 21 is provided on the first array substrate 2 , and the multi-core optical fiber 20 is located in the first V-shaped groove 21 .

[0014] Preferably, the first array substrate 2 includes a first cover plate 22 , and the first cover plate 22 is used to close the first V-shaped groove 21 and fix the multi-core optical fiber 20 .

[0015] Preferably, a plurality of second V-grooves 31 are provided on the second array substrate 3 , the number of the second V-grooves 31 is equal to the number of the single-core optical fibers 30 , and the plurality of single-core optical fibers 30 are respectively located in the second V-grooves 31 .

[0016] Preferably, the second array substrate 3 includes a second cover plate 32 , and the second cover plate 32 is used to close the second V-shaped groove 31 and fix the single-core optical fiber 30 .

[0017] Preferably, the spacing L1 of the optical waveguide 10 at the input end of the PLC chip 1 is equal to the core spacing d1 of the multi-core optical fiber 20 .

[0018] Preferably, the spacing L2 between the optical waveguides 10 at the output end of the PLC chip 1 is the same as the spacing d2 between the single-core optical fibers 30 .

[0019] Preferably, the PLC chip 1 is an isosceles trapezoid or a parallelogram;

[0020] When the PLC chip 1 is an isosceles trapezoid, the first end face 23 of the first array substrate 2 is an inclined surface, and the angle between the first end face 23 and the bottom surface of the first array substrate 2 is complementary to the bottom angle of the isosceles trapezoid; the second end face 33 of the second array substrate 3 is an inclined surface, and the angle between the second end face 33 and the bottom surface of the second array substrate 3 is complementary to the bottom angle of the isosceles trapezoid.

[0021] Preferably, the arrangement of the cores of the multi-core optical fiber 20 is the same as the arrangement of the optical waveguide 10 at the input end of the PLC chip 1 .

[0022] Preferably, the arrangement of the single-core optical fiber 30 on the second array substrate 3 is the same as the arrangement of the optical waveguide 10 at the output end of the PLC chip 1 .

[0023] Compared with the prior art, the utility model has the following beneficial effects: the utility model takes the PLC chip 1 as the core, and realizes the optical signal conversion and distribution between the multi-core optical fiber 20 and the single-core optical fiber 30 through the optical waveguide 10 arranged on the PLC chip 1. The PLC chip 1 has the advantages of small size, light weight, low power consumption, high integration, etc., which is convenient for integration and application, and meets the demand for small size of optical devices; and, compared with the existing technology for coupling the multi-core optical fiber 20 and the single-core optical fiber 30, the utility model arranges the multi-core optical fiber 20 and the single-core optical fiber 30 on the first array substrate 2 and the second array substrate 3 respectively, so that the first array substrate 2 and the second array substrate 3 are coupled with the PLC chip 1, which greatly reduces the difficulty of direct coupling between the optical fiber and the PLC chip 1, realizes efficient coupling and signal distribution between the multi-core optical fiber 20 and the single-core optical fiber 30, and effectively improves the transmission capacity and efficiency of the optical communication system. The multi-core optical fiber fan-in and fan-out device based on the multi-core optical fiber and PLC technology provided by the utility model has a simple manufacturing process and low cost, and is suitable for large-scale production and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A schematic diagram of the overall structure of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided by an embodiment of the utility model;

[0026] Figure 2A schematic diagram of a first array substrate of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided by an embodiment of the utility model;

[0027] Figure 3 A schematic diagram of a second array substrate of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided by an embodiment of the utility model;

[0028] Figure 4 A schematic diagram of an optical waveguide of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided by an embodiment of the utility model;

[0029] Figure 5 A schematic diagram of a multi-core optical fiber of a multi-core optical fiber fan-in and fan-out device based on a multi-core optical fiber and PLC technology provided in an embodiment of the utility model;

[0030] Figure 6 A schematic diagram of a single-core optical fiber of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided in an embodiment of the utility model;

[0031] Figure 7 A schematic diagram of a first end surface of a first array substrate of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided by an embodiment of the utility model;

[0032] Figure 8 A schematic diagram of a second end surface of a second array substrate of a multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology provided in an embodiment of the utility model.

[0033] Wherein, the accompanying drawings are marked as follows:

[0034] 1-PLC chip, 10-optical waveguide, 2-first array substrate, 20-multi-core optical fiber, 21-first V-groove, 22-first cover plate, 23-first end face, 3-second array substrate, 30-single-core optical fiber, 31-second V-groove, 32-second cover plate, 33-second end face. DETAILED DESCRIPTION

[0035] In the description of the present invention, the terms "inside", "outside", "longitudinal", "lateral", "upper", "lower", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0036] The terms "first", "second", etc. in this utility model are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this utility model, unless otherwise specified, "plurality" means two or more.

[0037] In the present invention, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. In addition, the term "coupling" can be a way of achieving electrical connection for signal transmission.

[0038] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0039] The utility model embodiment provides a multi-core optical fiber fan-in fan-out device based on multi-core optical fiber and PLC technology, such as Figure 1 As shown, it includes: a PLC chip 1, a first array substrate 2 and a second array substrate 3, wherein the first array substrate 2 and the second array substrate 3 are respectively located at two sides of the PLC chip 1.

[0040] The first array substrate 2 is provided with a multi-core optical fiber 20, and the second array substrate 3 is provided with a plurality of single-core optical fibers 30. The multi-core optical fiber 20 is coupled with the input end of the PLC chip 1, and the single-core optical fiber 30 is coupled with the output end of the PLC chip 1; wherein the number of cores of the multi-core optical fiber 20 is the same as the number of the single-core optical fiber 30. The PLC chip 1 is used to realize the conversion and distribution of optical signals between the multi-core optical fiber 20 and the single-core optical fiber 30. The multi-core optical fiber 20 is used to transmit multiple optical signals, and the single-core optical fiber 30 is used to transmit a single optical signal.

[0041] The PLC chip 1 is provided with an optical waveguide 10, and the number of the optical waveguides 10 is equal to the number of cores of the multi-core optical fiber 20 and the number of the single-core optical fiber 30. Specifically, the optical waveguide 10 is used to realize the branching and distribution function of the optical signal, and to couple the array of the multi-core optical fiber 20 and the array of the single-core optical fiber 30.

[0042] When making the device, firstly, it is necessary to remove the coating of the multi-core optical fiber 20 and the single-core optical fiber 30, and fix them on the first array substrate and the second array substrate respectively; use the photolithography process to form the optical waveguide 10 on the PLC chip 1 to realize the branching and distribution function of the optical signal; couple the multi-core optical fiber 20 with the input end of the PLC chip 1, and couple the single-core optical fiber 30 with the output end of the PLC chip 1 to realize the transmission and conversion of the optical signal. Among them, the arrangement of the cores of the multi-core optical fiber 20 is the same as the arrangement of the optical waveguide 10 at the input end of the PLC chip 1, and the arrangement of the single-core optical fiber 30 on the second array substrate 3 is the same as the arrangement of the optical waveguide 10 at the output end of the PLC chip 1, so as to realize the effective coupling and distribution of the optical signal and ensure the transmission efficiency and stability of the optical signal inside the device.

[0043] The utility model takes the PLC chip 1 as the core, and realizes the optical signal conversion and distribution between the multi-core optical fiber 20 and the single-core optical fiber 30 through the optical waveguide 10 arranged on the PLC chip 1. The PLC chip 1 has the advantages of small size, light weight, low power consumption, high integration, etc., which is easy to integrate and apply, and meets the demand for small size of optical devices; and, compared with the existing technology for coupling the multi-core optical fiber 20 and the single-core optical fiber 30, the utility model greatly reduces the difficulty of direct coupling between the optical fiber and the PLC chip 1 by arranging the multi-core optical fiber 20 and the single-core optical fiber 30 on the first array substrate 2 and the second array substrate 3 respectively, so that the first array substrate 2 and the second array substrate 3 are coupled with the PLC chip 1, and the efficient coupling and signal distribution between the multi-core optical fiber 20 and the single-core optical fiber 30 are realized, and the transmission capacity and efficiency of the optical communication system are effectively improved. In addition, the manufacturing process of the multi-core optical fiber fan-in fan-out device based on the multi-core optical fiber and PLC technology provided by the utility model is simple and low-cost, and is suitable for large-scale production and application.

[0044] In order to better fix the multi-core optical fiber 20 on the first array substrate 2, as shown in FIG. Figure 2 As shown, a first V-shaped groove 21 is provided on the first array substrate 2, and the multi-core optical fiber 20 is located in the first V-shaped groove 21; the first array substrate 2 includes a first cover plate 22, and the first cover plate 22 is used to close the first V-shaped groove 21 and fix the multi-core optical fiber 20. When the multi-core optical fiber 20 is located in the first V-shaped groove 21, the first V-shaped groove 21 and the first cover plate 22 will apply a slight extrusion force to the multi-core optical fiber 20, so that the multi-core optical fiber 20 can be more firmly fixed on the first array substrate 2.

[0045] In order to better fix the single-core optical fiber 30 on the second array substrate 3, as shown in FIG. Figure 3As shown, the second array substrate 3 is provided with a plurality of second V-grooves 31, the number of the second V-grooves 31 is equal to the number of the single-core optical fibers 30, and the plurality of the single-core optical fibers 30 are respectively located in the second V-grooves 31; the second array substrate 3 includes a second cover plate 32, and the second cover plate 32 is used to close the second V-grooves 31 and fix the single-core optical fibers 30. When the single-core optical fiber 30 is located in the second V-grooves 31, the second V-grooves 31 and the second cover plate 32 will exert a slight extrusion force on the single-core optical fiber 30, so that the single-core optical fiber 30 can be more firmly fixed on the second array substrate 3.

[0046] In order to ensure the effective coupling and distribution of optical signals and the transmission efficiency and stability of optical signals within the device, such as Figure 4 and Figure 5 As shown, the spacing L1 of the optical waveguide 10 at the input end of the PLC chip 1 is equal to the core spacing d1 of the multi-core optical fiber 20; Figure 4 and Figure 6 As shown, the spacing L2 between the optical waveguides 10 at the output end of the PLC chip 1 is the same as the spacing d2 between the single-core optical fibers 30. In one embodiment, when the number of cores of the multi-core optical fiber 20, the number of single-core optical fibers 30, and the number of optical waveguides 10 are 4, the core spacing d1 of the multi-core optical fiber 20 is 43 μm, and the spacing L1 of the optical waveguides 10 at the input end of the PLC chip 1 is 43 μm; the spacing d2 between the single-core optical fibers 30 is 250 μm, and the spacing L2 of the optical waveguides 10 at the output end of the PLC chip 1 is 250 μm. And the cores of the multi-core optical fiber 20 and the single-core optical fibers 30 are arranged in a "one" shape, which is the same as the arrangement of the optical waveguides 10 at the input and output ends of the PLC chip 1. The number of cores of the multi-core optical fiber 20, the number of single-core optical fibers 30, and the number of optical waveguides 10 can be customized according to demand, and no excessive restrictions are made here.

[0047] When the multi-core optical fiber 20 and the single-core optical fiber 30 are coupled with the PLC chip 1, it is difficult to directly couple the optical fiber with the optical waveguide 10. If the operation is improper during the coupling process, the coupling effect will be poor, and it will be difficult to ensure the stable transmission of the optical signal. Therefore, in the solution provided by the present invention, the method of directly coupling the optical fiber with the optical waveguide 10 is replaced by docking the array substrate where the optical fiber is located with the PLC chip 1, so that the optical fiber is coupled with the PLC chip 1. In order to reduce the impact of the up and down movement of the PLC chip 1 and the first array substrate 2 and the second array substrate 3 during the coupling process, and to increase the coupling area between the optical fiber and the optical waveguide 10, the PLC chip 1 is an isosceles trapezoid or a parallelogram; when the PLC chip 1 is an isosceles trapezoid (see Figure 1 As shown), Figure 7As shown, the first end surface 23 of the first array substrate 2 is an inclined surface, and the angle between the first end surface 23 and the bottom surface of the first array substrate 2 is complementary to the bottom angle of the isosceles trapezoid; Figure 8 As shown, the second end face 33 of the second array substrate 3 is an inclined face, and the angle between the second end face 33 and the bottom face of the second array substrate 3 is complementary to the bottom angle of the isosceles trapezoid. Similarly, when the PLC chip 1 is a parallelogram, the angle between the first end face 23 and the bottom face of the first array substrate 2 is complementary to the bottom angle of the input end of the PLC chip 1, and the angle between the second end face 33 and the bottom face of the second array substrate 3 is complementary to the bottom angle of the output end of the PLC chip 1. Among them, the first end face is a face coupled to the coupling face of the input end of the PLC chip, and the second end face is a face coupled to the coupling face of the output end of the PLC.

[0048] In summary, in one embodiment, the manufacturing steps of a multi-core fan-in and fan-out device based on a multi-core optical fiber 20 and a PLC provided by the embodiment of the utility model are as follows:

[0049] 1. Use photolithography to form an optical waveguide 10 on the PLC chip 1, so that the spacing of the optical waveguide 10 at the input end of the PLC chip 1 is equal to the core spacing of the multi-core optical fiber 20, and the spacing of the optical waveguide 10 at the output end of the PLC chip 1 is equal to the core spacing between the single-core optical fibers 30.

[0050] 2. Prepare the multi-core optical fiber 20, remove the coating layer of the multi-core optical fiber 20, place the multi-core optical fiber 20 in the first V-groove 21, and fix it with the first cover plate 22; grind and polish the first end face 23 of the front end of the multi-core optical fiber 20 of the first array substrate 2. Since the two coupling surfaces of the PLC chip 1 are inclined surfaces, the first end face 23 after grinding and polishing is an inclined surface that matches the coupling surface of the input end of the PLC chip 1. The first end face 23 of the first array substrate 2 is connected to the coupling surface of the input end of the PLC chip 1 to complete the coupling of the multi-core optical fiber 20 and the optical waveguide 10 at the input end of the PLC chip 1. 3. Prepare a single-core optical fiber 30, remove the coating layer of the single-core optical fiber 30, place the single-core optical fiber 30 in the second V-groove 31, and fix it with a second cover plate 32; grind and polish the second end face 33 at the front end of the single-core optical fiber 30 of the second array substrate 3, so that the second end face 33 after grinding and polishing is an inclined surface matching the coupling surface of the output end of the PLC chip 1, and connect the second end face 33 of the second array substrate 3 with the coupling surface of the output end of the PLC chip 1 to complete the coupling of the single-core optical fiber 30 and the optical waveguide 10 at the output end of the PLC chip 1.

[0051] After the above three steps, the production of a multi-core fan-in fan-out device is completed.

[0052] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology, characterized in that: include: A PLC chip (1), a first array substrate (2) and a second array substrate (3), wherein the first array substrate (2) and the second array substrate (3) are respectively located on two sides of the PLC chip (1); A multi-core optical fiber (20) is arranged on the first array substrate (2), and a plurality of single-core optical fibers (30) are arranged on the second array substrate (3); the multi-core optical fiber (20) is coupled to the input end of the PLC chip (1), and the single-core optical fiber (30) is coupled to the output end of the PLC chip (1); wherein the number of cores of the multi-core optical fiber (20) is the same as the number of the single-core optical fibers (30); The PLC chip (1) is provided with an optical waveguide (10), and the number of the optical waveguides (10) is equal to the number of fiber cores of the multi-core optical fiber (20) and the number of the single-core optical fiber (30).

2. The multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology according to claim 1, characterized in that: A first V-shaped groove (21) is provided on the first array substrate (2), and the multi-core optical fiber (20) is located in the first V-shaped groove (21).

3. The multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology according to claim 2, characterized in that: The first array substrate (2) comprises a first cover plate (22), wherein the first cover plate (22) is used to close the first V-shaped groove (21) and fix the multi-core optical fiber (20).

4. The multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology according to claim 1, characterized in that: The second array substrate (3) is provided with a plurality of second V-shaped grooves (31), the number of the second V-shaped grooves (31) being equal to the number of the single-core optical fibers (30), and the plurality of single-core optical fibers (30) are respectively located in the second V-shaped grooves (31).

5. The multi-core optical fiber fan-in and fan-out device based on multi-core optical fiber and PLC technology according to claim 4, characterized in that: The second array substrate (3) comprises a second cover plate (32), wherein the second cover plate (32) is used to close the second V-shaped groove (31) and fix the single-core optical fiber (30).

6. The multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology according to any one of claims 1 to 5, characterized in that: The spacing L1 of the optical waveguide (10) at the input end of the PLC chip (1) is equal to the core spacing d1 of the multi-core optical fiber (20).

7. The multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology according to any one of claims 1 to 5, characterized in that: The spacing L2 of the optical waveguide (10) at the output end of the PLC chip (1) is the same as the spacing d2 between the single-core optical fibers (30).

8. The multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology according to any one of claims 1 to 5, characterized in that: The PLC chip (1) is an isosceles trapezoid or a parallelogram; When the PLC chip (1) is an isosceles trapezoid, the first end face (23) of the first array substrate (2) is an inclined face, and the angle between the first end face (23) and the bottom face of the first array substrate (2) is complementary to the bottom angle of the isosceles trapezoid; the second end face (33) of the second array substrate (3) is an inclined face, and the angle between the second end face (33) and the bottom face of the second array substrate (3) is complementary to the bottom angle of the isosceles trapezoid.

9. The multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology according to any one of claims 1 to 5, characterized in that: The arrangement of the fiber cores of the multi-core optical fiber (20) is the same as the arrangement of the optical waveguide (10) at the input end of the PLC chip (1).

10. The multi-core fiber fan-in and fan-out device based on multi-core fiber and PLC technology according to any one of claims 1 to 5, characterized in that: The arrangement mode of the single-core optical fiber (30) on the second array substrate (3) is the same as the arrangement mode of the optical waveguide (10) at the output end of the PLC chip (1).

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