Optical module

Abstract

The embodiment of the utility model provides an optical module comprising a circuit board, one end of which is provided with a golden finger, and the golden finger is configured to transmit an electric signal; the golden fingers comprise a first row of golden fingers which are arranged on the first surface of the circuit board and are configured to be electrically connected with the first row of metal elastic sheets; the second row of golden fingers are arranged on the second surface of the circuit board, and the second row of golden fingers are configured to be electrically connected with the second row of metal elastic sheets; the second surface and the first surface are two opposite surfaces of the circuit board, and the first row of metal elastic sheets are opposite to the second row of metal elastic sheets; the surfaces of the first row of golden fingers and the second row of golden fingers have height difference, and the distance between the first row of metal elastic sheets and the second row of metal elastic sheets is smaller than the thickness of the circuit board; a first golden finger of the first row of golden fingers is provided with a first contact; a second golden finger of the second row of golden fingers is provided with a second contact; and the first contact and the second contact are arranged in a staggered manner, so that the first elastic sheet and the second elastic sheet are staggered.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals and are one of the key components in optical communication equipment.

[0003] To meet the requirements of high-speed communication, the gold fingers on the circuit board of the optical module are usually densely packed, and there are gold fingers on both sides of the circuit board. When the optical module is pulled out from the host computer, it is easy to cause the host computer's shrapnel to accidentally touch, causing a dangerous situation. Utility Model Content

[0004] The embodiment of the present application provides an optical module that can prevent accidental contact of a host computer spring and avoid dangerous situations.

[0005] According to a first aspect of an embodiment of the present application, an optical module is provided, including:

[0006] Upper shell,

[0007] The lower shell is covered with the upper shell to form a cavity, and an electrical port is formed at one end of the cavity;

[0008] A circuit board is disposed in the cavity, a gold finger is formed at one end of the circuit board, the gold finger extends out of the electrical port, and the gold finger is configured to transmit an electrical signal;

[0009] Among them, the gold fingers include:

[0010] A first row of gold fingers is provided on the first surface of the circuit board, and the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers is configured to be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals;

[0011] The second row of gold fingers is arranged on the second surface of the circuit board, and the second row of gold fingers is arranged along the width direction of the circuit board. The second row of gold fingers is configured to be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the second surface and the first surface are two opposite surfaces of the circuit board, and the first side wall and the second side wall are two opposite side walls of the host computer; wherein the surfaces of the first row of gold fingers and the second row of gold fingers have a height difference, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board;

[0012] The first gold finger of the first row of gold fingers has a first contact point, and the first contact point is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact point, and the second contact point is configured to contact the second spring sheet of the second row of metal spring sheets; the first contact point and the second contact are staggered so that the first spring sheet and the second spring sheet are staggered.

[0013] According to a second aspect of an embodiment of the present application, an optical module is provided, including:

[0014] Upper shell,

[0015] The lower shell is covered with the upper shell to form a cavity, and an electrical port is formed at one end of the cavity;

[0016] A circuit board is disposed in the cavity, a gold finger is formed at one end of the circuit board, the gold finger extends out of the electrical port, and the gold finger is configured to transmit an electrical signal;

[0017] Among them, the gold fingers include:

[0018] A first row of gold fingers is provided on the first surface of the circuit board, and the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers is configured to be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals;

[0019] The second row of gold fingers is arranged on the second surface of the circuit board, and the second row of gold fingers is arranged along the width direction of the circuit board. The second row of gold fingers is configured to be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the second surface and the first surface are two opposite surfaces of the circuit board, and the first side wall and the second side wall are two opposite side walls of the host computer; wherein the surfaces of the first row of gold fingers and the second row of gold fingers have a height difference, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board;

[0020] The first gold finger of the first row of gold fingers has a first contact point, and the first contact point is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact point, and the second contact point is configured to contact the second spring sheet of the second row of metal spring sheets; the first gold finger and the second gold finger are staggered and partially overlapped, and the first contact point and the second contact point are staggered; so that the first spring sheet and the second spring sheet are staggered; wherein,

[0021] Along the arrangement direction of the first row of gold fingers, the first contact point is located in the interval between two adjacent second contacts; or the first contact point is located outside the second contact point corresponding to the outermost second gold finger in the second row of gold fingers;

[0022] And along the extension direction of the gold finger, the first contact point is located on one side of the second contact point.

[0023] The optical module provided by the embodiment of the present application forms a gold finger at one end of the circuit board. When the circuit board is arranged in a cavity formed by the upper shell and the lower shell covering each other, the gold finger extends out of the electrical port at one end of the cavity, thereby facilitating the electrical connection between the circuit board and the host computer to transmit electrical signals; a first row of gold fingers is arranged on the first surface of the circuit board, the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers can be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals; a second row of gold fingers is arranged on the second surface of the circuit board, the second row of gold fingers is arranged along the width direction of the circuit board, and the second row of gold fingers can be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals. The two rows of gold fingers can be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the first surface and the second surface are two surfaces opposite to each other of the circuit board, the first side wall and the second side wall are two opposite side walls of the host computer, the surfaces of the first row of gold fingers and the second row of gold fingers have a height difference, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board; in this way, gold fingers can be formed on both surfaces opposite to each other of the circuit board, the number of gold fingers can be increased, the signal transmission rate can be guaranteed, and high-speed signal transmission can be achieved; in addition, in the embodiment of the present application, the first row of gold fingers The first gold finger has a first contact point, and the first contact is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact point, and the second contact is configured to contact the second spring sheet of the second metal spring sheet; in the embodiment of the present application, the first contact and the second contact are staggered so that the first spring sheet and the second spring sheet are staggered; in this way, when the optical module is inserted into the host computer, the first spring sheet of the host computer cage contacts the first gold finger at the first contact point, and the second spring sheet of the host computer contacts the second gold finger at the second contact point; in the embodiment of the present application, the first contact and the second contact are staggered. The point misalignment setting makes the first spring piece and the second spring piece of the host computer cage misaligned. In the process of pulling the circuit board out from between the first spring piece and the second spring piece, when the height difference between the surfaces of the first row of gold fingers and the second row of gold fingers pulls up the first spring piece or the second spring piece, the misaligned first spring piece and the second spring piece will not contact each other. Compared with the related art, it can avoid the situation where the first spring piece and the second spring piece of the host computer whose distance is less than the thickness of the circuit board are pulled up by the first row of gold fingers and the second row of gold fingers with a height difference on the surface and accidentally touch each other, thereby reducing the occurrence of dangerous situations and improving the safety of using optical modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0025] Figure 1 A partial structural diagram of an optical communication system provided according to an embodiment of the present application;

[0026] Figure 2 A partial structural diagram of a host computer provided according to an embodiment of the present application;

[0027] Figure 3 A schematic diagram of the structure of an optical module provided according to an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the exploded structure of an optical module provided according to an embodiment of the present application;

[0029] Figure 5 The structure of the circuit board in the optical module provided in the embodiment of the present application is shown in FIG. Figure 1 ;

[0030] Figure 6 An enlarged view of the first row of gold fingers in the optical module provided according to an embodiment of the present application;

[0031] Figure 7 The structure of the circuit board in the optical module provided in the embodiment of the present application is shown in FIG. Figure 2 ;

[0032] Figure 8 An enlarged view of the second row of gold fingers in the optical module provided according to an embodiment of the present application;

[0033] Fig. 9 A perspective structural diagram of a gold finger in an optical module provided according to an embodiment of the present application;

[0034] Fig.10 A structural diagram of the first row of gold fingers on the first surface of an optical module provided according to an embodiment of the present application;

[0035] Fig.11 A structural diagram of the second row of gold fingers on the second surface of an optical module provided according to an embodiment of the present application;

[0036] Fig.12 A comparative structural diagram of the first row of gold fingers and the second row of gold fingers in the optical module provided in an embodiment of the present application;

[0037] Fig.13 A side view of the front end of the circuit board in the optical module provided in the embodiment of the present application Figure 1 ;

[0038] Fig.14 A side view of the front end of the circuit board in the optical module provided in the embodiment of the present application Figure 2 ;

[0039] Fig.15Another perspective structural diagram of a gold finger in an optical module provided according to an embodiment of the present application;

[0040] Fig.16 This is another perspective structural diagram of a gold finger in an optical module provided according to an embodiment of the present application. DETAILED DESCRIPTION

[0041] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0042] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0043] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0044] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0045] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0046] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0047] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0048] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0049] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote server 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0050] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0051] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0052] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0053] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0054] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0055] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0056] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0057] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0058] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0059] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0060] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0061] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0062] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting Amplifier, LIA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, and digital signal processing (Digital Signal Processing, DSP) chips.

[0063] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0064] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0065] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0066] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0067] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0068] In some examples of the embodiments of the present application, the gold fingers are arranged on the upper and lower surfaces of the circuit board 300 as an example for explanation. In some optical communications that need to transmit high-speed signals, there is usually a large demand for the number of pins. The density of the gold fingers on the circuit board can be designed to be denser. In addition, gold fingers can also be designed on both sides of the circuit board 300 to provide more pins to meet the transmission of high-speed signals.

[0069] Generally, in order to ensure the standardization and beauty of the gold finger design, it is usually chosen to be designed in the center of one end of the circuit board, and the gold fingers on the upper and lower sides are aligned; accordingly, the matching socket of the host computer cage is also designed accordingly, for example, the metal springs that electrically connect the host computer cage to the gold fingers are designed to be aligned up and down. This is conducive to the design of the gold fingers and the production and processing of the circuit board. However, in actual applications, the thickness of the circuit board is usually thin, generally around 1mm, which results in the metal springs in the host computer socket being close to each other. When the optical module is pulled out from the host computer, the metal springs may accidentally touch each other. In some examples, when the optical module is hot-plugged with power on, the electrical appliances are prone to short circuits. Figure 5 The structure of the circuit board in the optical module provided in the embodiment of the present application is shown in FIG. Figure 1 , Figure 6 This is an enlarged view of the first row of gold fingers in the optical module provided according to an embodiment of the present application. Figure 7 The structure of the circuit board in the optical module provided in the embodiment of the present application is shown in FIG. Figure 2 , Figure 8 This is an enlarged view of the second row of gold fingers in the optical module provided according to an embodiment of the present application. Figure 7 for Figure 5 The view after the middle view is flipped 180°. Figure 5-Figure 8 As shown, the circuit board 300 has a first surface 302 and a second surface 303. In some examples of the embodiments of the present application, the first surface 302 and the second surface 303 may be two opposite surfaces of the circuit board 300; for example, Figure 5 The directions shown in FIG. 3 are used as examples to illustrate that the first surface 302 may be Figure 5 The upper surface of the circuit board 300 and the second surface may be Figure 5 Of course, in some examples, Figure 7 As an example, the first surface may be Figure 7 The lower surface in the second surface 303 may be Figure 7The upper surface of .

[0070] In some examples of the embodiments of the present application, the gold fingers 301 may include: a first row of gold fingers 3011 and a second row of gold fingers 3012. The first row of gold fingers 3011 may be arranged on the first surface 302, and the first row of gold fingers 3011 may be arranged along the width direction of the circuit board 300 (e.g. Figure 5 In some examples of the embodiments of the present application, the first row of gold fingers 3011 is configured to be electrically connected to the first row of metal shrapnel on the first side wall of the host computer. In some examples, the first side wall of the host computer may be a side wall opposite to the first surface 302 of the circuit board 300. It can be understood that in some examples of the embodiments of the present application, the second row of gold fingers 3012 may be arranged on the second surface 303, and the second row of gold fingers 3012 may also be arranged along the width direction of the circuit board 300. The second row of gold fingers 3012 is configured to be electrically connected to the second metal shrapnel on the second side wall of the host computer. In some examples, the second side wall of the host computer may be a side wall opposite to the second surface 303 of the circuit board 300; that is, in some embodiments of the present application, after the optical module is electrically connected to the host computer, the circuit board is located between the first row of metal shrapnel and the second row of metal shrapnel.

[0071] In some examples of the embodiments of the present application, the surface of the first row of gold fingers and the surface of the second row of gold fingers have a height difference. For example, when the first row of gold fingers and the second row of gold fingers are formed on the first surface and the second surface of the circuit board, due to certain processing errors in the processing technology, the surfaces of the first row of gold fingers and the second row of gold fingers may be uneven, resulting in a height difference between the surfaces of the first row of gold fingers and the second row of gold fingers. In the process of pulling the circuit board out from between the first row of metal shrapnel and the second row of metal shrapnel, there is friction between the surface of the first row of gold fingers and the first row of metal shrapnel, and there is friction between the surface of the second row of gold fingers and the second row of metal shrapnel, so that the first row of gold fingers may pull up the first row of metal shrapnel and move it in the direction of the second row of metal shrapnel, and the second row of gold fingers may pull up the second row of metal shrapnel and move it in the direction of the first row of metal shrapnel, which is easy to cause accidental contact between the first row of metal shrapnel and the second row of metal shrapnel.

[0072] In addition, to ensure the stability of the electrical connection between the circuit board and the host computer, the spacing between the first row of metal domes and the second row of metal domes is usually smaller than the thickness of the circuit board, so that after the circuit board is inserted between the first row of metal domes and the second row of metal domes, the first row of metal domes and the second row of metal domes form an interference fit on the circuit board. Generally, the thickness of the circuit board is relatively thin, usually around 1mm; thus, after the circuit board is pulled out from between the first row of metal domes and the second row of metal domes, the first row of metal domes and the second row of metal domes, which are closer, may also accidentally touch each other.

[0073] Fig. 9 This is a perspective structural diagram of a gold finger in an optical module provided according to an embodiment of the present application. Fig. 9 As shown, in some examples of the embodiments of the present application, the first gold finger of the first row of gold fingers 3011 has a first contact 3013, and the first contact 3013 is configured to contact the first spring of the first row of metal springs. In some embodiments of the present application, the first gold finger can be any gold finger in the first row of gold fingers 3011; in some examples, the first gold finger can also be a gold finger in the first row of gold fingers 3011 that is electrically connected to the first spring.

[0074] That is to say, the first row of gold fingers 3011 has multiple first gold fingers along the arrangement direction. It can be understood that in some examples, some of the multiple first gold fingers can be data signal gold fingers, for example, they can be high-speed gold fingers for transmitting high-speed data signals, or low-speed gold fingers for transmitting low-speed data signals; another part of the multiple first gold fingers can be power gold fingers, for example, to provide power for various electrical components on the circuit board. Among them, the arrangement of multiple gold fingers along the width of the circuit board can be arranged according to relevant protocols, and the embodiments of the present application do not limit this.

[0075] It can be understood that the first contact point 3013 can be a point or area where the first gold finger contacts the first spring. Fig. 9 As shown, in some embodiments of the present application, the first contact 3013 is represented by an elliptical dot. It should be noted that the shape of the first contact 3013 can also be other shapes. In the embodiments of the present application, the elliptical dot is only shown as a specific example and does not limit the shape of the first contact.

[0076] In some examples of the embodiments of the present application, the second gold finger of the second row of gold fingers 3012 has a second contact 3014, and the second contact 3014 is configured to contact the second spring of the second row of metal springs. It can be understood that the arrangement of the second contact 3014 can be the same or similar to the arrangement of the first contact 3013 in the aforementioned embodiments of the present application, and the details can be referred to the detailed description of the aforementioned embodiments of the present application, which will not be repeated in the embodiments of the present application.

[0077] In some embodiments of the present application, the first contact and the second contact are misaligned.

[0078] In some examples, the first gold finger of the first row of gold fingers 3011 may be translated relative to the second gold finger of the second row of gold fingers 3012 by a preset distance; for example, referring to Fig. 9 As shown, the first gold finger of the first row of gold fingers 3011 may be along Fig. 9The direction shown in the positive direction of the x-axis is shifted to a certain extent, so that the first contact and the second contact. It can be understood that in some examples, in order to increase the density of the gold fingers, after the first row of gold fingers 3011 are shifted, the first gold fingers and the second gold fingers can also have a partial overlapping area, so that the gap between adjacent gold fingers can be reduced and the density of gold fingers can be increased.

[0079] It is understandable that in some other examples, the second gold fingers of the second row of gold fingers 3012 may be translated by a preset distance relative to the first row of gold fingers 3011 , so that the first contact point and the second contact point are misaligned.

[0080] The first contact and the second contact are misaligned, that is, after the first gold finger of the first row of gold fingers 3011 is translated relative to the second gold finger of the second row of gold fingers 3012 by a preset distance, the first contact 3013 and the second contact 3014 do not overlap. In this way, the first spring sheet on the first side wall of the socket and the second spring sheet on the second side wall can be completely staggered, so that the first spring sheet and the second spring sheet can be prevented from accidentally touching each other after the circuit board is pulled out from between the first spring sheet and the second spring sheet, thereby improving the safety of the optical module.

[0081] Reference Fig. 9 As shown, in some examples of the embodiments of the present application, the first gold finger of the first row of gold fingers and the second gold finger of the second row of gold fingers are offset along the width direction of the circuit board, so that the first contact and the second contact are offset along the arrangement direction of the first row of gold fingers 3011.

[0082] In some embodiments of the present application, the arrangement direction of the first row of gold fingers 3011 and the arrangement direction of the second row of gold fingers 3012 can be the same, similar or consistent. For example, the arrangement direction of the first row of gold fingers 3011 and the second row of gold fingers 3012 can be along the width direction of the circuit board 300. Fig. 9 As an example, the first row of gold fingers 3011 and the second row of gold fingers 3012 can be arranged along Fig. 9 The x-axis shows the direction arrangement.

[0083] In some examples of the embodiments of the present application, the first contact is located in the interval between two adjacent second contacts. That is, the interval between two adjacent second contacts is the first contact, and correspondingly, the interval between two adjacent first contacts is the second contact.

[0084] In some examples of the embodiments of the present application, the first contact point is located outside the second contact point corresponding to the second outermost golden finger of the second row of golden fingers 3012. Fig. 9 As shown, located Fig. 9 The leftmost first contact is located on the left side of the leftmost second contact.

[0085] In other words, in some optional examples of the embodiments of the present application, reference Fig. 9 As shown, along the width direction of the circuit board (eg Fig. 9 The first contact 3013 and the second contact 3014 are offset along the length direction of the circuit board (eg, Fig. 9 There may be no misalignment between the first contact and the second contact.

[0086] Fig.10 This is a structural diagram of the first row of gold fingers on the first surface of the optical module provided according to an embodiment of the present application. Fig.10 As shown, in some examples of the embodiments of the present application, when designing the first row of gold fingers 3011 on the first surface 302, the first row of gold fingers 3011 can be translated as a preset distance along the width direction of the circuit board 300 as a whole, so that the first contact and the second contact on the second row of gold fingers are misaligned.

[0087] In some examples, along the width direction of the circuit board 300, the circuit board 300 has a first side surface 304 and a second side surface 305; along the arrangement direction of the first row of gold fingers 3011, a first distance d1 is provided between the first gold finger facing the first side surface 304 in the first row of gold fingers 3011 and the first side surface 304, and a second distance d2 is provided between the first gold finger facing the second side surface 305 in the first row of gold fingers 3011 and the second side surface 305; the first distance d1 is greater than the second distance d2. In other words, the first row of gold fingers 3011 can be moved as a whole toward the second side edge by a preset distance.

[0088] In some examples of the embodiments of the present application, the overall width of the circuit board 300 may be 16.34 mm-16.50 mm, wherein the first distance d1 may be 1.15 mm-1.31 mm, and the second distance d2 may be 0.73 mm-0.89 mm. Fig.10 As shown, the distance between the first gold finger in the first row of gold fingers 3011 facing the first side surface 304 and the central axis i of the circuit board 300 is 7.0 mm, and the distance between the first gold finger in the first row of gold fingers 3011 facing the second side surface 305 and the central axis i of the circuit board 300 can be 7.4 mm; that is, in a specific example, the first row of gold fingers 3011 can be translated toward the second side surface 305 by 0.4 mm along the width direction of the circuit board 300.

[0089] Fig.11The second row of gold fingers in the optical module according to the embodiment of the present application is a structural diagram of the second surface. In some examples of the embodiment of the present application, when designing the second row of gold fingers 3012 on the second surface 303, the second row of gold fingers 3012 can be designed to be normally symmetrical. In this way, since the first row of gold fingers is designed to be translated by a preset distance, the first contact and the second contact are misaligned. Of course, in other examples, refer to Fig.11 As shown, the second row of gold fingers 3012 may be translated as a preset distance along the width direction of the circuit board 300. The translation direction of the second row of gold fingers 3012 along the width direction of the circuit board 300 may be opposite to the translation direction of the first row of gold fingers.

[0090] In some examples, along the arrangement direction of the second row of gold fingers 3012, there is a third distance d3 between the second gold fingers in the second row of gold fingers 3012 facing the first side surface 304 and the first side surface 304, and there is a fourth distance d4 between the second gold fingers in the second row of gold fingers 3012 facing the second side surface 305 and the second side surface 305; the fourth distance d4 is greater than the third distance d3. That is, in some examples of the embodiments of the present application, the second row of gold fingers 3012 can be translated as a whole toward the first side surface 304 by a preset distance, so that the second contact point is completely misaligned with the first contact point, that is, the first contact point is located in the gap between two adjacent second contacts, and correspondingly, the second contact point is located in the gap between two adjacent first contacts.

[0091] It can be understood that in some embodiments of the present application, the distance that the second row of gold fingers 3012 translates toward the first side 304 can be the same or similar to the distance that the first row of gold fingers translates toward the second side 305. In this way, it can be ensured that the first contact and the second contact are completely misaligned, so that there will be no accidental contact between the first spring sheet and the second spring sheet, thereby improving the safety of hot-plugging the optical module.

[0092] Fig.12 This is a comparative structural diagram of the first row of gold fingers and the second row of gold fingers in the optical module provided in the embodiment of the present application. Fig.12 As shown, in some examples of the embodiments of the present application, the first distance d1 is greater than the third distance d3, and the fourth distance d4 is greater than the second distance d2. The first distance d1 and the second distance d2 have a first difference, and the fourth distance d4 and the third distance d3 have a second difference.

[0093] In some examples of the embodiments of the present application, the first difference may be 0.4 mm, that is, the first row of gold fingers 3011 is translated 0.4 mm toward the second side 305 as a whole; it can be understood that in other examples, the second difference may also be 0.4 mm, that is, the second row of gold fingers 3012 is translated 0.4 mm toward the first side 304 as a whole. In this way, the misalignment distance between the first contact and the second contact along the arrangement direction of the first row of gold fingers 3011 is 0.8 mm, that is, the misalignment distance between the first row of gold fingers 3011 and the second row of gold fingers 3012 is the sum of the first difference and the second difference.

[0094] It should be noted here that the numerical values ​​and numerical ranges involved in the embodiments of the present invention are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors, which can be considered negligible by those skilled in the art.

[0095] In some embodiments of the present application, the first row of gold fingers 3011 and the second row of gold fingers 3012 are respectively translated so that the first contacts and the second contacts are misaligned along the arrangement direction of the first row of gold fingers 3011. In this way, the first row of gold fingers 3011 and the second row of gold fingers 3012 only need to be translated a small distance to meet the misalignment of the first contacts and the second contacts, which can reduce the space required to be occupied by the first row of gold fingers 3011 and the second row of gold fingers 3012, thereby reducing the size of the circuit board.

[0096] In some other examples of the embodiments of the present application, the width of the first gold finger of the first row of gold fingers 3011 and the width of the second gold finger of the second row of gold fingers 3012 can be the same or similar, and there is a first gap between two adjacent first gold fingers of the first row of gold fingers 3011, and there is a second gap between two adjacent second gold fingers of the second row of gold fingers 3012; wherein, the width of the first gold finger is the second gap, and the width of the second gold finger is greater than the first gap.

[0097] In some examples, the sum of the width of the first gold finger and the width of the first gap can be 0.8 mm, or, in other examples, the sum of the width of the second gold finger and the width of the second gap can be 0.8 mm. This facilitates the design of the gold finger, and the design of the first contact and the second contact on the gold finger, which can increase the density of the gold finger and improve the transmission efficiency of the high-speed signal of the optical module.

[0098] Fig.13 A side view of the front end of the circuit board in the optical module provided in the embodiment of the present application Figure 1 , Fig.14 A side view of the front end of the circuit board in the optical module provided in the embodiment of the present application Figure 2 .in, Fig.13 is a side view observed from the first side 304, Fig.14305 is a side view viewed from the second side surface 305. Fig.13 and Fig.14 As shown, the front end of the circuit board is tapered, and the circuit board also has a first bevel 307, a second bevel 308, a third bevel 309 and a fourth bevel 310. The first bevel 307 is connected between the first side surface 304 and the front end surface 306 of the circuit board, that is, the first bevel 307 can be a bevel formed at the angle between the first side surface 304 and the front end surface 306. In some examples, the angle between the first side surface 304 and the front end surface 306 can be chamfered.

[0099] The second inclined surface 308 is connected between the first surface 302 and the front end surface 306, that is, the second inclined surface 308 can be formed between the first surface 302 and the front end surface 306. In some examples, the angle between the first surface 302 and the front end surface 306 can be chamfered. In some examples of the embodiments of the present application, the first row of gold fingers can be located at the rear end of the second inclined surface, that is, the first row of gold fingers is set on the first surface 302.

[0100] The third inclined surface 309 is connected between the second side surface 305 and the front end surface 306 , wherein the formation method of the third inclined surface 309 may be the same as or similar to the formation method of the first inclined surface 307 , and this embodiment of the present application will not be described in detail.

[0101] The fourth inclined surface 310 is connected between the second surface 303 and the front end surface 306, wherein the formation method of the fourth inclined surface 310 can be the same as or similar to the formation method of the second inclined surface 308, and the present embodiment of the application will not be repeated. In some examples of the present embodiment of the application, the second row of gold fingers can be located at the rear end of the fourth inclined surface 310, that is, the second row of gold fingers is set on the second surface 303.

[0102] In some examples, the first side surface 304 and the front end surface 306 form a first notch 3041 at the first slope 307, which is the chamfering treatment of the aforementioned embodiment of the present application, wherein the dimension of the first notch 3041 along the width direction of the circuit board is 0.25mm-0.45mm, and the inclination angle of the first slope 307 relative to the first side surface 304 can be 45°.

[0103] In some other examples, the second side surface 305 and the front end surface 306 form a second notch 3051 at the third inclined surface 309 . As a specific example, the second notch 3051 may be symmetrical to the first notch 3041 .

[0104] In some other examples of the embodiments of the present application, the first surface 302 and the front end surface 306 form a third notch 3021 at the second bevel 308, and the dimension of the third notch 3021 along the length direction of the circuit board is 0.15mm-0.35mm, wherein the inclination angle of the second bevel 308 relative to the first surface 302 can also be 45°.

[0105] In some other examples, the second surface 303 and the front end surface 306 form a fourth notch 3031 at the fourth inclined surface 310 . As a specific example, the fourth notch 3031 is symmetrical to the third notch 3021 .

[0106] Fig.15 Another perspective structural diagram of the gold finger in the optical module provided according to the embodiment of the present application. Fig.15 As shown, the first contact and the second contact are staggered along the extension direction of the gold finger 301 . Along the extension direction of the gold finger, the first contact is located on one side of the second contact.

[0107] In some examples of the embodiments of the present application, the extension direction of the gold finger may be the length direction of the circuit board (eg Fig.15 That is to say, in some examples of the embodiments of the present application, the first row of gold fingers 3011 and the second row of gold fingers 3012 may be staggered along the length direction of the circuit board, or the first contact 3013 and the second contact 3014 may be staggered.

[0108] As an alternative example, see Fig.15 As shown, the first row of gold fingers 3011 may be moved toward the front end face by a preset distance along the length direction of the circuit board. In other examples, the first row of gold fingers 3011 may be moved toward the front end face by a preset distance along the length direction of the circuit board, and the second row of gold fingers 3012 may be moved toward the side facing away from the front end face by a preset distance along the length direction of the circuit board, so that the first contact and the second contact are misaligned in the length direction of the circuit board. In other words, the first contact may be located on the side of the second contact facing the front end face.

[0109] It can be understood that in other examples, the first row of gold fingers 3011 may be moved along the length direction of the circuit board as a whole away from the front end surface by a preset distance, while the second row of gold fingers 3012 may be moved along the length direction of the circuit board as a whole towards the front end surface by a preset distance, so that the first contact and the second contact are misaligned. In other words, the first contact may be located on the side of the second contact away from the front end surface. In this way, the first contact and the second contact are misaligned in the extension direction of the gold fingers 301, which can reduce the space required in the arrangement direction of the gold fingers, thereby increasing the number of arranged gold fingers 301, or reducing the width of the circuit board, and improving the density of the arrangement of the gold fingers.

[0110] Fig.16 This is another perspective structural diagram of the gold finger in the optical module provided according to the embodiment of the present application. Fig.16 As shown, in some other optional examples of the embodiments of the present application, the first contact and the second contact are offset along the arrangement direction of the first row of gold fingers 3011; the first contact is located in the interval between two adjacent second contacts; or, the first contact is located on the outside of the second contact corresponding to the outermost second gold finger of the second row of gold fingers 3012; and, the first contact and the second contact are offset along the extension direction of the gold fingers; the first contact is located on one side of the second contact along the extension direction of the gold fingers.

[0111] That is to say, in some other examples of the embodiments of the present application, the first contact and the second contact can be misaligned in both directions, that is, the first contact and the second contact can be misaligned in the arrangement direction of the gold finger, such as the width direction of the circuit board; in addition, the first contact and the second contact can also be misaligned in the extension direction of the gold finger. It can be understood that the misalignment in the arrangement direction of the gold finger can refer to the detailed description of the previous embodiments of the present application, and the embodiments of the present application will not be repeated; in addition, the misalignment in the extension direction of the gold finger can also refer to the detailed description of the previous embodiments of the present application, and the embodiments of the present application will not be repeated.

[0112] The optical module provided by the embodiment of the present application forms a gold finger at one end of the circuit board. When the circuit board is arranged in a cavity formed by the upper shell and the lower shell covering each other, the gold finger extends out of the electrical port at one end of the cavity, thereby facilitating the electrical connection between the circuit board and the host computer to transmit electrical signals; a first row of gold fingers is arranged on the first surface of the circuit board, the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers can be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals; a second row of gold fingers is arranged on the second surface of the circuit board, the second row of gold fingers is arranged along the width direction of the circuit board, and the second row of gold fingers can be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals. The two rows of gold fingers can be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the first surface and the second surface are two surfaces opposite to each other of the circuit board, the first side wall and the second side wall are two opposite side walls of the host computer, the surfaces of the first row of gold fingers and the second row of gold fingers have a height difference, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board; in this way, gold fingers can be formed on both surfaces opposite to each other of the circuit board, the number of gold fingers can be increased, the signal transmission rate can be guaranteed, and high-speed signal transmission can be achieved; in addition, in the embodiment of the present application, the first row of gold fingers The first gold finger has a first contact point, and the first contact is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact point, and the second contact is configured to contact the second spring sheet of the second metal spring sheet; in the embodiment of the present application, the first contact and the second contact are staggered so that the first spring sheet and the second spring sheet are staggered; in this way, when the optical module is inserted into the host computer, the first spring sheet of the host computer cage contacts the first gold finger at the first contact point, and the second spring sheet of the host computer contacts the second gold finger at the second contact point; in the embodiment of the present application, the first contact and the second contact are staggered. The point misalignment setting makes the first spring piece and the second spring piece of the host computer cage misaligned. In the process of pulling the circuit board out from between the first spring piece and the second spring piece, when the height difference between the surfaces of the first row of gold fingers and the second row of gold fingers pulls up the first spring piece or the second spring piece, the misaligned first spring piece and the second spring piece will not contact each other. Compared with the related art, it can avoid the situation where the first spring piece and the second spring piece of the host computer whose distance is less than the thickness of the circuit board are pulled up by the first row of gold fingers and the second row of gold fingers with a height difference on the surface and accidentally touch each other, thereby reducing the occurrence of dangerous situations and improving the safety of using optical modules.

[0113] In some examples, the first contact and the second contact are misaligned along the arrangement direction of the first row of gold fingers, so that the first contact is located in the interval between two adjacent second contacts, or the first contact is located outside the second contact corresponding to the outermost second gold finger in the second row of gold fingers. In this way, the first contact and the second contact are completely misaligned, which can effectively prevent the socket's spring from accidentally touching after the optical module is pulled out, and in the case of hot-plugging the optical module, it is ensured that the socket spring will not be short-circuited.

[0114] In some examples, the first contact and the second contact are staggered along the extension direction of the gold finger, and the first contact is located on one side of the second contact along the extension direction of the gold finger; in this way, the space required to be occupied along the arrangement direction of the gold finger can be reduced. On the one hand, the arrangement density of the gold finger can be improved, and the transmission performance of the optical module for high-speed signals can be improved. On the other hand, the occupation of the width of the circuit board is reduced, and the width of the circuit board is reduced, thereby reducing the overall volume of the optical module.

[0115] In some examples of the embodiments of the present application, the first contact and the second contact can be staggered along the arrangement direction of the first gold finger, and the first contact and the second contact can be staggered along the extension direction of the gold finger. In this way, the flexibility of the gold finger staggering is improved, and the first row of gold fingers and the second row of gold fingers can be staggered according to actual needs, which is convenient for the staggered setting of the first contact and the second contact.

[0116] In some other examples of the embodiments of the present application, along the width direction of the circuit board, the circuit board has a first side surface and a second side surface, and along the arrangement direction of the first row of gold fingers, the first row of gold fingers can be moved as a whole to the second side surface by a preset distance, so that the first distance between the first row of gold fingers and the first side surface is greater than the second distance between the second gold fingers and the second side surface; along the arrangement direction of the second row of gold fingers, the second row of gold fingers can be moved as a whole to the first side surface by a preset distance, so that the fourth distance between the second row of gold fingers and the second side surface is greater than the third distance between the second row of gold fingers and the first side surface. That is, when the first contact and the second contact are staggered, the first row of gold fingers can be moved by a preset distance, and the second row of gold fingers can be moved by a preset distance at the same time, and the translation direction of the first row of gold fingers is opposite to that of the second row of gold fingers. In this way, the translation distances of the first row of gold fingers and the second row of gold fingers are both small, which can reduce the space requirement in the width direction of the circuit board, which is conducive to reducing the size of the circuit board and the size of the optical module.

[0117] In some other examples of the embodiments of the present application, the front end of the circuit board is set to be conical, and the circuit board has a first bevel, a second bevel, a third bevel and a fourth bevel, the first bevel is connected between the first side surface and the front end surface of the circuit board, and the second bevel is connected between the first surface and the front end surface; the third bevel is symmetrically arranged with the first bevel, and the fourth bevel is symmetrically arranged with the second bevel. In this way, when the optical module is inserted into the upper computer, the front end of the circuit board is inserted into the socket, and the inclined first bevel, second bevel, third bevel and fourth bevel are conducive to being inserted between the upper and lower spring sheets, which can protect the spring sheets of the socket of the upper computer.

[0118] Some embodiments of the present application further provide an optical module, including:

[0119] Upper shell,

[0120] The lower shell is covered with the upper shell to form a cavity, and an electrical port is formed at one end of the cavity;

[0121] A circuit board is disposed in the cavity, a gold finger is formed at one end of the circuit board, the gold finger extends out of the electrical port, and the gold finger is configured to transmit an electrical signal;

[0122] Among them, the gold fingers include:

[0123] A first row of gold fingers is provided on the first surface of the circuit board, and the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers is configured to be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit electrical signals;

[0124] The second row of gold fingers is arranged on the second surface of the circuit board, and the second row of gold fingers is arranged along the width direction of the circuit board. The second row of gold fingers is configured to be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the second surface and the first surface are two opposite surfaces of the circuit board, and the first side wall and the second side wall are two opposite side walls of the host computer; wherein the surfaces of the first row of gold fingers and the second row of gold fingers have a height difference, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board;

[0125] The first gold finger of the first row of gold fingers has a first contact point, and the first contact point is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact point, and the second contact point is configured to contact the second spring sheet of the second row of metal spring sheets; the first gold finger and the second gold finger are staggered and partially overlapped, and the first contact point and the second contact point are staggered; so that the first spring sheet and the second spring sheet are staggered; wherein,

[0126] Along the arrangement direction of the first row of gold fingers, the first contact point is located in the interval between two adjacent second contacts; or the first contact point is located outside the second contact point corresponding to the outermost second gold finger in the second row of gold fingers;

[0127] And along the extension direction of the gold finger, the first contact point is located on one side of the second contact point.

[0128] It can be understood that the optical module provided in the embodiment of the present application can have the same or corresponding technical effects as the optical module in the aforementioned embodiment of the present application. For details, please refer to the detailed description of the aforementioned embodiment of the present application, and the embodiment of the present application will not be repeated here.

[0129] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: Upper shell, A lower shell, which is covered with the upper shell to form a cavity, and an electrical port is formed at one end of the cavity; A circuit board is disposed in the cavity, a gold finger is formed at one end of the circuit board, the gold finger extends out of the electrical port, and the gold finger is configured to transmit an electrical signal; Wherein, the golden finger includes: A first row of gold fingers is provided on the first surface of the circuit board, and the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers is configured to be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit the electrical signal; A second row of gold fingers is provided on the second surface of the circuit board, and the second row of gold fingers is arranged along the width direction of the circuit board, and the second row of gold fingers is configured to be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the second surface and the first surface are two opposite surfaces of the circuit board, and the first side wall and the second side wall are two opposite side walls of the host computer; wherein there is a height difference between the surfaces of the first row of gold fingers and the second row of gold fingers, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board; The first gold finger of the first row of gold fingers has a first contact, and the first contact is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact, and the second contact is configured to contact the second spring sheet of the second row of metal spring sheets; the first contact and the second contact are staggered so that the first spring sheet and the second spring sheet are staggered.

2. The optical module according to claim 1, characterized in that: The first gold finger and the second gold finger are staggered along the width direction of the circuit board, so that the first contact and the second contact are staggered along the arrangement direction of the first row of gold fingers; Along the arrangement direction of the first row of gold fingers, the first contact is located in the interval between two adjacent second contacts; or, the first contact is located on the outside of the second contact corresponding to the outermost second gold finger in the second row of gold fingers; when the circuit board is pulled out from between the first spring sheet and the second spring sheet, along the arrangement direction of the first row of gold fingers, the first spring sheet is located between two adjacent second spring sheets, or the first spring sheet is located on the outside of the outermost second spring sheet in the second row of metal spring sheets.

3. The optical module according to claim 1, characterized in that: The first gold finger and the second gold finger are arranged along the length direction of the circuit board, so that the first contact point and the second contact point are staggered along the extension direction of the gold finger; Along the extension direction of the gold finger, the first contact is located on one side of the second contact; when the circuit board is pulled out from between the first spring sheet and the second spring sheet, along the extension direction of the gold finger, the first spring sheet is located on one side of the second spring sheet.

4. The optical module according to claim 1, characterized in that: The first gold finger and the second gold finger are staggered along the width direction of the circuit board, so that the first contact and the second contact are staggered along the arrangement direction of the first row of gold fingers; Along the arrangement direction of the first row of gold fingers, the first contact is located in the interval between two adjacent second contacts; or, the first contact is located on the outside of the second contact corresponding to the outermost second gold finger in the second row of gold fingers; in a state where the circuit board is pulled out from between the first spring sheet and the second spring sheet, along the arrangement direction of the first row of gold fingers, the first spring sheet is located between two adjacent second spring sheets, or the first spring sheet is located on the outside of the outermost second spring sheet in the second row of metal spring sheets; Furthermore, the first gold finger and the second gold finger are arranged along the length direction of the circuit board, so that the first contact point and the second contact point are staggered along the extension direction of the gold finger; Along the extension direction of the gold finger, the first contact is located on one side of the second contact; when the circuit board is extended from between the first spring sheet and the second spring sheet, along the extension direction of the gold finger, the first spring sheet is located on one side of the second spring sheet.

5. The optical module according to any one of claims 1 to 4, characterized in that: Along the width direction of the circuit board, the circuit board has a first side surface and a second side surface; Along the arrangement direction of the first row of gold fingers, a first distance exists between a first gold finger in the first row of gold fingers facing the first side surface and the first side surface, and a second distance exists between a first gold finger in the first row of gold fingers facing the second side surface and the second side surface; the first distance is greater than the second distance; Along the arrangement direction of the second row of gold fingers, a second gold finger in the second row of gold fingers facing the first side surface has a third distance from the first side surface, and a second gold finger in the second row of gold fingers facing the second side surface has a fourth distance from the second side surface; the fourth distance is greater than the third distance; The first distance is greater than the third distance, and the fourth distance is greater than the second distance.

6. The optical module according to claim 5, characterized in that: The first distance has a first difference with the second distance, and the fourth distance has a second difference with the third distance; The first contact point and the second contact point are offset along the arrangement direction of the first row of gold fingers, and the offset distance between the first contact point and the second contact point is the sum of the first difference and the second difference.

7. The optical module according to claim 5, characterized in that: The front end of the circuit board is conical, and the circuit board also has a first inclined surface, a second inclined surface, a third inclined surface and a fourth inclined surface; The first slope is connected between the first side surface and the front end surface of the circuit board, the second slope is connected between the first surface and the front end surface, the third slope is connected between the second side surface and the front end surface, and the fourth slope is connected between the second surface and the front end surface; the first row of gold fingers is located at the rear end of the second slope, and the second row of gold fingers is located at the rear end of the fourth slope.

8. The optical module according to claim 7, characterized in that: The first side surface and the front end surface form a first notch at the first inclined surface, and the dimension of the first notch along the width direction of the circuit board is 0.25 mm-0.45 mm; The second side surface and the front end surface form a second notch at the third inclined surface, and the second notch is symmetrical to the first notch; The first surface and the front end surface form a third notch at the second inclined surface, and the dimension of the third notch along the length direction of the circuit board is 0.15 mm-0.35 mm; The second surface and the front end surface form a fourth notch at the fourth inclined surface, and the fourth notch is symmetrical to the third notch.

9. The optical module according to any one of claims 1 to 4, characterized in that: The width of the first golden finger is the same as the width of the second golden finger, and there is a first gap between two adjacent first golden fingers, and there is a second gap between two adjacent second golden fingers; The width of the first golden finger is greater than the second gap, and the width of the second golden finger is greater than the first gap.

10. An optical module, characterized in that: include: Upper shell, A lower shell, which is covered with the upper shell to form a cavity, and an electrical port is formed at one end of the cavity; A circuit board is disposed in the cavity, a gold finger is formed at one end of the circuit board, the gold finger extends out of the electrical port, and the gold finger is configured to transmit an electrical signal; Wherein, the golden finger includes: A first row of gold fingers is provided on the first surface of the circuit board, and the first row of gold fingers is arranged along the width direction of the circuit board, and the first row of gold fingers is configured to be electrically connected to the first row of metal springs on the first side wall of the host computer to transmit the electrical signal; A second row of gold fingers is provided on the second surface of the circuit board, and the second row of gold fingers is arranged along the width direction of the circuit board, and the second row of gold fingers is configured to be electrically connected to the second row of metal springs on the second side wall of the host computer to transmit electrical signals; the second surface and the first surface are two opposite surfaces of the circuit board, and the first side wall and the second side wall are two opposite side walls of the host computer; wherein there is a height difference between the surfaces of the first row of gold fingers and the second row of gold fingers, and the spacing between the first row of metal springs and the second row of metal springs is less than the thickness of the circuit board; The first gold finger of the first row of gold fingers has a first contact point, and the first contact point is configured to contact the first spring sheet of the first row of metal spring sheets; the second gold finger of the second row of gold fingers has a second contact point, and the second contact point is configured to contact the second spring sheet of the second row of metal spring sheets; the first gold finger and the second gold finger are staggered and partially overlapped, and the first contact point and the second contact point are staggered; so that the first spring sheet and the second spring sheet are staggered; wherein, Along the arrangement direction of the first row of gold fingers, the first contact is located in the interval between two adjacent second contacts; or, the first contact is located outside the second contact corresponding to the outermost second gold finger in the second row of gold fingers; And along the extension direction of the gold finger, the first contact is located on one side of the second contact.

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