Constant-temperature box capable of rapidly adjusting temperature

Abstract

The utility model discloses a thermotank capable of rapidly adjusting temperature, which comprises a temperature guide cavity, a tank body is arranged on one side of the temperature guide cavity, the temperature guide cavity is communicated with the tank body through a through groove, a temperature control module is arranged in the temperature guide cavity, a bending plate for shielding is arranged at the communication port of the temperature guide cavity and the tank body, and a temperature control module is arranged on the bending plate. The bent plate is provided with an open hole, and the bent plate is provided with a cross-flow fan. The temperature control module is controlled to control the working state switching of the heating or refrigerating module, cold or hot air is generated to enter the temperature guide cavity, then the cross-flow fan in the temperature guide cavity works to enable the cold or hot air to quickly enter the box body through the bent plate, and the air returns to the temperature guide cavity through the through groove, so that circulating air flow is formed in the constant-temperature box, and the constant-temperature box is formed. According to the constant-temperature box, the air in the constant-temperature box can be effectively circulated, so that the temperature set by the constant-temperature box can be quickly reached. The constant-temperature box is compact in structure, simple in temperature control mode, convenient to operate and high in use efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of constant temperature control, in particular to a constant temperature box capable of quickly adjusting the temperature. Background Art

[0002] Constant temperature chamber is a commonly used equipment in measurement, home appliances, automobiles and other industrial fields. It is used to provide a test environment or determine whether the parameters and performance of equipment and materials after temperature changes meet the expected requirements.

[0003] Traditional constant temperature boxes use heating wires and other methods to directly adjust the temperature inside the box. The temperature distribution inside the box is uneven and the temperature regulation efficiency is low. Utility Model Content

[0004] In view of the above defects or shortcomings, the purpose of the utility model is to provide a constant temperature box that can heat up quickly.

[0005] In order to achieve the above purpose, the technical solution of the utility model is:

[0006] A constant temperature box capable of rapid temperature adjustment comprises: a temperature conducting cavity, a box body is arranged on one side of the temperature conducting cavity, the temperature conducting cavity and the box body are connected via a through groove, a temperature control module is installed in the temperature conducting cavity, a bent plate for shielding is installed at the connecting port between the temperature conducting cavity and the box body, an opening is opened on the bent plate, and a cross flow fan is arranged on the bent plate.

[0007] The bent plate is a "V"-shaped bent plate.

[0008] The temperature control module is installed on a side away from the box.

[0009] The temperature control module includes: a first heat sink installed on the outside of the temperature conduction cavity and a second heat sink installed on the inside of the temperature conduction cavity; at least one axial flow fan is installed on one side of the first heat sink; a temperature conduction aluminum block is installed between the first heat sink and the second heat sink, and at least one semiconductor refrigeration fin is installed between the temperature conduction aluminum block and the first heat sink; and a power module is connected to the axial flow fan.

[0010] The second heat sink matches the middle opening position of the bent plate, and the temperature emitted by the second heat sink is transferred to the box body through the cross-flow fan.

[0011] The surfaces where the first heat sink, the semiconductor cooling sheet, the temperature-conducting aluminum block and the second heat sink are connected are all coated with a thermally conductive silicone grease layer.

[0012] A positioning plate is fixed on the side of the semiconductor refrigeration plate to prevent the semiconductor refrigeration plate from shifting.

[0013] A retaining ring is installed on a side of the axial flow fan away from the first heat sink.

[0014] A temperature and humidity sensor is installed on the box.

[0015] The model of the temperature and humidity sensor is HCA-S, and the transmitter matching the HCA-S is GT0.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The utility model provides a thermostatic box with rapid temperature adjustment. By controlling the working state conversion of the heating or cooling module through the control of the temperature control module, cold or hot air is generated to enter the temperature conduction cavity, and then the cross-flow fan in the temperature conduction cavity works, so that the cold or hot air quickly enters the box through the bent plate, and the air returns to the temperature conduction cavity through the through groove, so that a circulating airflow is formed inside the thermostatic box, thereby controlling the temperature inside the box. The utility model device effectively circulates the air in the thermostatic box, so as to quickly reach the temperature set by the thermostatic box. The thermostatic box has a compact structure, a simple temperature control method, is easy to operate, and has high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the thermostatic box capable of rapid temperature adjustment of the utility model;

[0019] Figure 2 This is a diagram of the heating or cooling module of the thermostat capable of rapid temperature adjustment of the utility model;

[0020] Figure 3 It is a schematic diagram of the structure of the fixed plate of the utility model;

[0021] Figure 4 It is a schematic diagram of the "V"-shaped bent plate structure of the utility model.

[0022] In the figure, 1 is a temperature conducting chamber; 2 is a box; 3 is a temperature control module; 4 is a bent plate; 5 is a cross-flow fan; 21 is a temperature and humidity sensor; 31 is an axial flow fan; 32 is a first heat sink; 33 is a semiconductor cooling plate; 34 is a temperature conducting aluminum block; 35 is a second heat sink; 331 is a positioning plate. DETAILED DESCRIPTION

[0023] The utility model will be described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the utility model.

[0024] like Figure 1 , 2As shown, the utility model provides a thermostatic box capable of rapid temperature adjustment, comprising: a temperature conducting chamber 1, a box body 2 is arranged on one side of the temperature conducting chamber 1, the temperature conducting chamber 1 and the box body 2 are connected through a through groove, a temperature control module 3 is installed in the temperature conducting chamber 1, a curved plate 4 for shielding is installed at the communication port between the temperature conducting chamber 1 and the box body 2, an opening is opened on the curved plate 4, and a cross flow fan 5 is arranged on the curved plate 4. The second heat sink 35 matches the middle opening position of the curved plate 4, and the temperature emitted by the second heat sink 35 is transmitted to the box body 2 through the cross flow fan 5.

[0025] Preferably, if Figure 3 , 4 As shown, the bent plate 4 is a "V"-shaped bent plate, and a through groove is opened at the bottom of the panel where the temperature conduction chamber 1 and the box body 2 are connected. The through groove is covered by a "V"-shaped bent plate 4, and a cross-flow fan 5 is fixed above the "V"-shaped bent plate 4.

[0026] In addition, in the present invention, the temperature control module 3 is installed on a side away from the box body 2. Specifically, the temperature control module 3 includes: a first heat sink 32 installed on the outside of the temperature conducting cavity 1 and a second heat sink 35 installed on the inside of the temperature conducting cavity 1; at least one axial flow fan 31 is installed on one side of the first heat sink 32; a temperature conducting aluminum block 34 is installed between the first heat sink 32 and the second heat sink 35, and at least one semiconductor cooling fin 33 is installed between the temperature conducting aluminum block 34 and the first heat sink 32, wherein a through groove is provided at the bottom of the panel of the temperature conducting cavity 1, and the temperature conducting aluminum block 34 passes through the through groove and is connected to other devices; a power module is connected to the axial flow fan 31. The semiconductor cooling fin 33 is controlled by the control module to control the semiconductor cooling fin 33 to heat or cool.

[0027] Exemplarily, two cooling plates are used in this embodiment, and the control module controls the change of the current direction of the semiconductor cooling plate 33, so that the hot end of the semiconductor cooling plate 33 becomes the cold end, and the cold end becomes the hot end, thereby realizing the temperature change. The structure is compact and practical, and the temperature control method is simple.

[0028] In the present embodiment, two axial flow fans 31 are used. It should be noted that after the axial flow fan 31 is powered by the power module, the axial flow fan 31 will be turned on to prevent the selected semiconductor refrigeration plate 33 from having too high power, the first heat sink 32 and the second heat sink 35 from being unable to take away the heat, and the surface temperature of the semiconductor refrigeration plate 33 from being too high and being damaged; for selecting a high-power semiconductor refrigeration plate 33, a surface temperature resistance with a high degree can be selected; in addition, in order to take into account both the heating and cooling in the box to meet the requirements of the textile testing environment, it is necessary to select a semiconductor refrigeration plate 33 with appropriate power.

[0029] More preferably, temperature monitoring sensors are added to the two contact surfaces of the refrigeration plate to monitor the surface temperature of the refrigeration plate.

[0030] Furthermore, the axial flow fan 31 has two usage modes: sucking into the temperature conducting chamber 1 and blowing into the temperature conducting chamber 1, and the installation direction of the axial flow fan 31 is just opposite. After comparison of the application in this case, the axial flow fan 31 blowing outward can better take into account the temperature increase and temperature decrease conditions in the box.

[0031] Furthermore, the surfaces where the first heat sink 32 , the semiconductor cooling fin 33 , the temperature-conducting aluminum block 34 and the second heat sink 35 are connected are coated with a thermally conductive silicone grease layer. The use of the thermally conductive silicone grease improves the temperature transfer efficiency of the semiconductor cooling fin 33 .

[0032] Preferably, a retaining ring is installed on the side of the axial flow fan 31 away from the first heat sink 32. The retaining ring is used to shield the blades of the axial flow fan 31 to prevent accidents when people observe the instrument. In addition, a positioning plate 331 is fixed to the side of the semiconductor cooling sheet 33. The positioning plate 331 is used to prevent the position of the semiconductor cooling sheet 33 from changing after the instrument vibrates for a long time, thereby damaging the semiconductor cooling sheet 33. Figure 3 It is a structure of a positioning plate 331 for two semiconductor cooling plates 33 .

[0033] During installation, the temperature-conducting aluminum block 34 is inserted into the panel of the conduction cavity 1 , and sealing strips can be attached around the temperature-conducting aluminum block 34 to wrap the positioning plate 331 and the semiconductor cooling sheet 33 to ensure that the temperature of the temperature-conducting cavity 1 cannot be dissipated.

[0034] The sides of the box 2 are all pasted with heating aluminum plates, and the surfaces of the heating aluminum plates are pasted with heating silicon chips. The heating silicon chips are controlled by the control module. When the semiconductor refrigeration chip 33 heats up, the heating silicon chips assist in heating and heat preservation to prevent temperature loss. The sides of the box 2 are all installed with insulation foam to prevent temperature loss in the box 2.

[0035] The box 2 is equipped with a temperature and humidity sensor 21, the model of which is HC2A-S. The transmitter matching HC2A-S is GT20, which is controlled by the control module. The protective shell of the temperature and humidity sensor end is a carbon sintered filter element. The above sensor has high precision and plays a good role in accurately reflecting the temperature in the box 2. The carbon sintered filter element can well protect the temperature sensing device inside the temperature and humidity sensor.

[0036] It is obvious to those skilled in the art that the above-mentioned specific examples are only preferred schemes of the present invention. Therefore, the improvements and changes that may be made by those skilled in the art to certain parts of the present invention still reflect the principles of the present invention and achieve the purpose of the present invention, and all belong to the scope of protection of the present invention.

Claims

1. A thermostatic box capable of rapid temperature adjustment, characterized in that: include: A temperature conducting cavity (1), a box body (2) is arranged on one side of the temperature conducting cavity (1), the temperature conducting cavity (1) and the box body (2) are connected via a through groove, a temperature control module (3) is installed in the temperature conducting cavity (1), a curved plate (4) for shielding is installed at the communication port between the temperature conducting cavity (1) and the box body (2), an opening is opened on the curved plate (4), and a cross-flow fan (5) is arranged on the curved plate (4).

2. The thermostatic box capable of rapid temperature adjustment according to claim 1, characterized in that: The bent plate (4) is a "V"-shaped bent plate.

3. The thermostatic box capable of rapid temperature adjustment according to claim 1 or 2, characterized in that: The temperature control module (3) is installed on a side away from the box body (2).

4. The thermostatic box capable of rapid temperature adjustment according to claim 3, characterized in that: The temperature control module (3) comprises: a first heat sink (32) installed on the outside of the temperature conducting cavity (1) and a second heat sink (35) installed on the inside of the temperature conducting cavity (1); at least one axial flow fan (31) is installed on one side of the first heat sink (32); a temperature conducting aluminum block (34) is installed between the first heat sink (32) and the second heat sink (35), and at least one semiconductor cooling fin (33) is installed between the temperature conducting aluminum block (34) and the first heat sink (32); and a power module is connected to the axial flow fan (31).

5. The thermostatic box capable of rapid temperature adjustment according to claim 4, characterized in that: The second heat sink (35) matches the middle opening position of the bent plate (4), and the temperature emitted by the second heat sink (35) is transferred to the box body (2) through the cross-flow fan (5).

6. The thermostatic box capable of rapid temperature adjustment according to claim 4, characterized in that: The surfaces where the first heat sink (32), the semiconductor cooling sheet (33), the temperature-conducting aluminum block (34), and the second heat sink (35) are connected are all coated with a thermally conductive silicone grease layer.

7. The thermostatic box capable of rapid temperature adjustment according to claim 4, characterized in that: A positioning plate (331) is fixed to the side of the semiconductor refrigeration plate (33) to prevent the semiconductor refrigeration plate (33) from shifting.

8. The thermostatic box capable of rapid temperature adjustment according to claim 4, characterized in that: A retaining ring is installed on a side of the axial flow fan (31) away from the first heat sink (32).

9. The thermostatic box capable of rapid temperature adjustment according to claim 1, characterized in that: A temperature and humidity sensor (21) is installed on the box body (2).

10. The thermostatic box capable of rapid temperature adjustment according to claim 9, characterized in that: The model of the temperature and humidity sensor (21) is HC2A-S, and the transmitter matching the HC2A-S is GT20.

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