Fence sealing type dustproof lamp box structure
Through the fence sealed structure, combined with COB high-density substrate and seamless splicing of ALN substrate, the problems of dust protection and light output uniformity of COB packages in high-density and high-power environments are solved, and cost reduction and chip stability are achieved.
Patent Information
- Application Number
- CN202420928916.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-30
AI Technical Summary
The existing COB packaging technology is difficult to effectively prevent dust in high-density and high-power environments, resulting in chip pollution, reduced luminous efficiency and shortened service life. The traditional sealing method is costly and unevenly emits light.
Using a fence sealing structure, the combination of COB high-density substrate, fixing mechanism, radiator, strip and glass cover is used to use seamless splicing of ALN substrate and non-metal strips, combined with bolt fixing and glue sealing, ensuring the cleanliness of the chip area and Exhaust evenly.
Reduce costs, avoid dust entering, ensure the stability and long life of the chip, achieve uniformity of light output, and avoid the problems of dust absorption and ablation on the silicone surface.
Smart Images
Figure CN222190234U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of dustproof light box equipment, in particular to a fence-sealed dustproof light box structure. Background Art
[0002] COB, or chip on board packaging technology, is a semiconductor packaging process that adheres the chip to an interconnect substrate with conductive or non-conductive glue, and then performs wire bonding to achieve its electrical connection. In simple terms, the light-emitting chip is directly mounted on the PCB board without the need for a bracket or solder pins. Compared with the traditional SMD method, COB packaging omits the two major processes of making LED chips into lamp beads and reflow soldering. However, in workshops and factories with generally poor environments, the protection of COB chips has always been difficult because COB does not have the protection of traditional lamp beads’ brackets and bonding glass.
[0003] Conventional COB substrates use glue dams on the edge of the chip, gold plating or gold deposition to grow steps, and then cover them with small-sized flat quartz glass. Finally, they are sealed by gluing on the four sides. A single COB substrate can be used as an independent module.
[0004] Another method is to solidify the chip on the surface of the ceramic substrate, and then apply silicone on the surface of each independent chip or the entire surface of the chip for covering and sealing. There are two forms of silicone, one is a flat cover and the other is a hemispherical cover. Due to the characteristics of silicone itself, it is very easy to stick to dust, causing local overtemperature, causing yellowing or ablation of the surface.
[0005] At present, in actual production, the traditional unshielded COB light source cannot avoid the large amount of dust, rosin, flux and other pollutants in the production line, which affects the luminous efficiency and service life of the chip. In addition, the COB dust protection technology cannot protect the high-density and high-power COB light source. The glue dam method cannot ensure the consistency of the height of the four sides. Dust can easily enter the internal space and cause chip pollution. Gold plating or gold deposition has a good sealing effect, but the cost is relatively high.
[0006] For high-power density COB, the chip spacing is very small. When multiple substrates are spliced, the chip spacing between the boards must be kept constant. Conventional methods can no longer meet the requirements. Because conventional methods must reserve dams or growth steps in advance, when multiple substrates are spliced, the invalid width is doubled, which ultimately causes a large area of long shadows to form when the splicing gap emits light, which cannot meet the overall light uniformity.
[0007] The silicone sealing method on the chip surface is very easy to stick to dust. When used for a long time, the dust on the silicone surface continues to absorb heat, which can easily cause the surface to turn yellow or burn, affecting the normal light output of the chip. In severe cases, large areas of black spots and pits will be formed, causing the silicone to burn through and eventually causing the chip to break down. Therefore, this device provides a fence-sealed dust-proof light box structure. Utility Model Content
[0008] The purpose of the utility model is to provide a fence-sealed dustproof light box structure to solve the above-mentioned technical problems in view of the shortcomings of the prior art.
[0009] The embodiment of the utility model adopts the following technical scheme: including a COB high-density substrate, a fixing mechanism, a heat sink, a pressure strip and a glass cover, wherein two pressure strips are provided, and the COB high-density substrate is fixed to the inside of the heat sink by means of bolts fixed by the fixing mechanism and the cooperation of the corresponding pressure strips, and the glass cover covers the heat sink so that the COB high-density substrate is located in the heat sink in a sealed manner, and the glass cover and the heat sink are fixed in a manner of surrounding with glue, and the COB high-density substrate is composed of a plurality of ALN substrates, and the plurality of ALN substrates are arranged in two groups and arranged symmetrically in sequence, and the plurality of ALN substrates are seamlessly spliced, and the length of the plurality of ALN substrates does not exceed 130 mm and the width does not exceed 20 mm, and the internal circuits of the plurality of ALN substrates are connected in series, in parallel or in series-parallel.
[0010] Furthermore, several of the ALN substrates include a chip, a spacing area and a pad terminal area, the end of the spacing area is provided with a fixing hole, the chip and the pad terminal area are separated by the spacing area, and the width of the spacing area is less than or equal to 10 mm.
[0011] Furthermore, the fixing mechanism includes a plurality of fixing bolts, and the fixing holes at the ends of the plurality of spacing areas are provided with internal threads matched with the corresponding fixing bolts. The two pressure strips are provided with connecting holes corresponding to and matched with the plurality of fixing holes, and the plurality of fixing bolts can pass through the corresponding connecting holes and be threadedly connected with the corresponding fixing holes.
[0012] Furthermore, the glass cover may be quartz glass or high infrared transmittance glass, and two groups of step grooves adapted for placement and bonding with the glass cover are arranged at both ends of the heat sink.
[0013] Furthermore, the two pressure strips are made of non-metallic material.
[0014] Furthermore, a thermal interface material layer is provided between the contact surface between the COB high-density substrate and the inside of the heat sink, and the contact surface between the inside of the heat sink and the thermal interface material layer is made of aluminum or copper.
[0015] At least one of the above technical solutions adopted in the embodiment of the utility model can achieve the following beneficial effects:
[0016] The utility model adopts the method of overall fence sealing, which is conducive to reducing costs and has obvious advantages in COB applications with high power density. It can make the chip arrangement closer to the edge, and eliminate the shadow area caused by the existence of the dam in the seam area of the traditional substrate. The overall light output is more uniform, and the good sealing effect can make the chip surface relatively clean for a long time, avoiding dust or other debris from entering and affecting the normal light output of the chip, ensuring the stability and long life of the equipment. At the same time, several ALN substrates are seamlessly spliced, and when the overall light is emitted, there is no long shadow in the seam area, ensuring the uniformity of light output;
[0017] The dust on the surface of the silica gel will not continue to absorb heat, which greatly reduces the yellowing or ablation of the surface and the impact on the normal light emission of the chip. At the same time, it will not form large areas of black spots and pits to cause the silica gel to burn through, thus avoiding the ultimate chip breakdown and ensuring the stability and service life of use.
[0018] First, several ALN substrates are seamlessly spliced. After the splicing is completed, they are placed inside the radiator, and exactly located at the place where the contact surface of the radiator is made of aluminum or purple material. Then, two non-metallic strips are matched with the corresponding fixing holes according to the corresponding connection holes. At this time, several fixing bolts are passed through the corresponding connection holes and rotated, so that the corresponding fixing bolts are threadedly connected with the corresponding fixing holes to fix the COB high-density substrate inside the radiator by bolt fixing. Then, the glass cover is placed according to the corresponding step groove to cover the COB high-density substrate, and the glass cover is evenly glued around to form a seal inside the radiator to ensure that the chip area is isolated from the outside world and prevent dust from entering. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:
[0020] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0021] Figure 2 This is a schematic diagram of the structure of the utility model in a split state;
[0022] Figure 3 The schematic diagram of the distribution structure of the COB high-density substrate in the utility model is shown in FIG. Figure 1 ;
[0023] Figure 4 The schematic diagram of the distribution structure of the COB high-density substrate in the utility model is shown in FIG. Figure 2 ;
[0024] Figure 5 It is a schematic diagram of the three-dimensional structure of the ALN substrate in the utility model.
[0025] Reference numerals
[0026] COB high-density substrate 1, ALN substrate 11, chip 111, spacing area 112, pad terminal area 113, fixing mechanism 2, heat sink 3, step groove 31, pressure bar 4, connection hole 41. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by patients with ordinary skills in the field without making creative work are within the scope of protection of the utility model.
[0028] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.
[0029] The utility model embodiment provides a fence-sealed dustproof light box structure, including a COB high-density substrate 1, a fixing mechanism 2, a heat sink 3, a pressure strip 4 and a glass cover, wherein two pressure strips 4 are provided, and the COB high-density substrate 1 is fixed to the inside of the heat sink 3 by means of bolts fixed by the fixing mechanism 2 and the cooperation of the corresponding pressure strips 4, and the glass cover covers the heat sink 3 so that the COB high-density substrate 1 is located in the heat sink 3 in a sealed manner, and the glass cover and the heat sink 3 are fixed in a manner of surrounding with glue, and the COB high-density substrate 1 is composed of a plurality of ALN substrates 11, and the plurality of ALN substrates 11 are arranged in two groups and arranged symmetrically in sequence, and the plurality of ALN substrates 11 are seamlessly spliced, and the length of the plurality of ALN substrates 11 is not more than 130 mm and the width is not more than 20 mm, and the internal circuits of the plurality of ALN substrates 11 are connected in series, in parallel or in series-parallel.
[0030] The device adopts the method of overall fence sealing, which is conducive to reducing costs and has obvious advantages in COB applications with high power density. It can arrange the chip 111 closer to the edge, and eliminate the shadow area in the traditional substrate joint area due to the existence of the dam. The overall light output is more uniform, and the good sealing effect can make the surface of the chip 111 relatively clean for a long time, avoiding dust or other debris from entering and affecting the normal light output of the chip 111, ensuring the stability and long life of the equipment. At the same time, several ALN substrates 11 are seamlessly spliced, and when the overall light is emitted, there is no long shadow in the joint area, ensuring the uniformity of light output and low cost;
[0031] The dust on the surface of the silicone rubber of this device will not continuously absorb heat, which greatly reduces the yellowing or ablation of the surface and the impact on the normal light emission of the chip. At the same time, it will not form large areas of black spots and pits to cause the silicone rubber to burn through, thus avoiding the ultimate chip breakdown and ensuring the stability and service life of use.
[0032] In a further preferred embodiment of the utility model, several of the ALN substrates 11 include a chip 111, a spacing area 112 and a pad terminal area 113, the end of the spacing area 112 is provided with a fixing hole, the chip 111 and the pad terminal area 113 are separated by the spacing area 112 and the width of the spacing area 112 is less than or equal to 10 mm, the fixing mechanism 2 includes a plurality of fixing bolts, and the fixing holes at the ends of the plurality of spacing areas 112 are provided with internal threads adapted to the corresponding fixing bolts, and the two pressure strips 4 are provided with Connecting holes 41 corresponding to and matching with a plurality of fixing holes, a plurality of fixing bolts can pass through the corresponding connecting holes 41 and be threadedly connected with the corresponding fixing holes, the glass cover can be quartz glass or high infrared transmittance glass, two groups of step grooves 31 matching with the glass cover for placement and bonding are arranged at both ends of the radiator 3, the two pressure strips 4 are made of non-metallic material, a thermal interface material layer is provided between the contact surface of the COB high-density substrate 1 and the inside of the radiator 3, and the contact surface of the inside of the radiator 3 and the thermal interface material layer is made of aluminum or copper material,
[0033] A thermal interface material layer is provided between the contact surface of the COB high-density substrate 1 and the inside of the heat sink 3. The contact surface between the inside of the heat sink 3 and the thermal interface material layer is made of aluminum or copper material, which can facilitate heat conduction and achieve good heat dissipation effect.
[0034] The overall design concept of this device is that the edge of the chip 111 in the corresponding ALN substrate 11 is separated from the pad terminal area 113 by the spacing area 112 and the width of the spacing area 112 is less than or equal to 10mm. Holes are reserved within this spacing to facilitate the fixation of the pressure strip 4. The pressure strip 4 is made of non-metallic materials to prevent the metal from contacting the circuit layer on the surface of the substrate and causing a short circuit. After all substrates are seamlessly spliced on the heat sink 3, the non-metal pressure strips 4 with special structural design are used on both sides to press the whole. At the same time, consider avoiding the welding wire pad or the surface-mount terminal, and fix it to the heat sink 3 by screws, and finally cover it with quartz glass or high-transmittance infrared glass. At this time, the two sides of the glass are placed in the step groove 31 of the pressure strip 4, and the other two sides are placed in the step groove 31 of the heat sink 3 itself. Then, the four sides of the glass are bonded and sealed with glue to ensure that the chip 111 area is isolated from the outside world and prevent dust from entering.
[0035] The device first seamlessly splices several ALN substrates 11. After the splicing is completed, it is placed inside the radiator 3 and is located exactly at the place where the contact surface of the radiator 3 is made of aluminum or purple material. Then, the two non-metallic pressure strips 4 are aligned with the corresponding fixing holes according to the corresponding connection holes 41. At this time, several fixing bolts are passed through the corresponding connection holes 41 and rotated, so that the corresponding fixing bolts are threadedly connected with the corresponding fixing holes, so as to fix the COB high-density substrate 1 inside the radiator 3 by bolt fixing. Then, the glass cover is placed according to the corresponding step groove 31 to cover the COB high-density substrate 1, and the glass cover is evenly glued around to form a seal inside the radiator 3 to ensure that the chip 111 area is isolated from the outside world and prevent dust from entering.
[0036] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.
Claims
1. A fence-sealed dustproof light box structure, Features: It comprises a COB high-density substrate (1), a fixing mechanism (2), a heat sink (3), a pressure strip (4) and a glass cover; The pressure strips (4) are provided with two, and the COB high-density substrate (1) is fixed inside the heat sink (3) by means of bolts through the fixing mechanism (2) and the corresponding pressure strips (4). The glass cover covers the heat sink (3) so that the COB high-density substrate (1) is located inside the heat sink (3) in a sealed manner, and the glass cover and the heat sink (3) are fixed by glue all around. The COB high-density substrate (1) is composed of a plurality of ALN substrates (11); the plurality of ALN substrates (11) are arranged in two groups and are arranged in sequence and symmetrically; the plurality of ALN substrates (11) are seamlessly spliced; the length of the plurality of ALN substrates (11) is no more than 130 mm and the width is no more than 20 mm; and the internal circuits of the plurality of ALN substrates (11) are connected in series, in parallel or in series-parallel.
2. A fence-sealed dustproof light box structure as claimed in claim 1, Features: A plurality of the ALN substrates (11) each comprise a chip (111), a spacing region (112) and a pad terminal region (113); a fixing hole is provided at the end of the spacing region (112); the chip (111) and the pad terminal region (113) are separated by the spacing region (112); and the width of the spacing region (112) is less than or equal to 10 mm.
3. A fence-sealed dustproof light box structure as claimed in claim 2, Features: The fixing mechanism (2) comprises a plurality of fixing bolts, and the fixing holes at the ends of the plurality of spacing regions (112) are provided with internal threads matched with the corresponding fixing bolts. The two pressure strips (4) are provided with connecting holes (41) corresponding to and matched with the plurality of fixing holes, and the plurality of fixing bolts can pass through the corresponding connecting holes (41) and be threadedly connected with the corresponding fixing holes.
4. A fence-sealed dustproof light box structure as claimed in claim 1, Features: The glass cover can be quartz glass or high infrared transmittance glass. Two groups of step grooves (31) adapted for placement and bonding with the glass cover are arranged at both ends of the heat sink (3).
5. The fence-sealed dustproof light box structure as claimed in claim 1, Features: The two pressure strips (4) are made of non-metallic material.
6. A fence-sealed dustproof light box structure as claimed in claim 1, Features: A thermal interface material layer is provided between the contact surface between the COB high-density substrate (1) and the inside of the heat sink (3); the contact surface between the inside of the heat sink (3) and the thermal interface material layer is made of aluminum or copper.