Sorting machine for semiconductor testing

Abstract

The utility model discloses a sorting machine for semiconductor testing, and belongs to the technical field of semiconductor testing. The device mainly comprises a base, a display is mounted on the base, and the base is provided with a workbench; the depth adjusting mechanism is installed on the base and is used for supporting a semiconductor, the detection mechanism is installed at the upper end of the depth adjusting mechanism and is used for carrying out a pressure test on the semiconductor; and the limiting mechanism is installed on the depth adjusting mechanism, the limiting mechanism is used for clamping the semiconductor, and the limiting mechanism is provided with a bottom plate for placing the semiconductor, and a first clamping plate and a second clamping plate for clamping the semiconductor. According to the sorting machine for semiconductor testing, through cooperative use of the bottom plate, the first clamping plate, the protruding part, the second screw rod, the second rotating wheel and the second clamping plate, the position of a semiconductor can be limited while pressure detection is conducted on the semiconductor.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and specifically to a sorting machine for semiconductor testing. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of semiconductors. Semiconductor testing and sorting machines test semiconductors to determine their quality and classify them.

[0003] For example, the patent with publication number CN212540615U specifically discloses a semiconductor testing and sorting machine, including a base, a limit device, a pressure sensor, a lower electrode, an upper electrode, a rotating disk, a movable plate, a depth adjustment device and a movable plate. By rotating the rotating disk and driving the limit device to move downward, the upper electrode squeezes the semiconductor downward at the same time. When the semiconductor is damaged by the squeezing of the lower electrode and the upper electrode, the maximum value of the external pressure is displayed on the surface of the display screen, so that the maximum pressure that the semiconductor can withstand during normal operation can be known.

[0004] When the above patent is used for semiconductor testing, the semiconductor to be tested is placed on a moving plate, and the rotating disk is rotated to drive the upper electrode to squeeze the semiconductor downward. The semiconductor moves downward and contacts the lower electrode, and then the semiconductor is energized. The lower electrode is squeezed and transmits the pressure to the pressure sensor and displays the detected value on the display screen. Then, when the upper electrode is driven downward by rotating the rotating disk to squeeze the semiconductor, there is a lack of a device to fix the semiconductor. Therefore, when squeezing the semiconductor downward, it is easy to cause the semiconductor to slip or deviate, thereby affecting the normal detection of the semiconductor. Therefore, it is necessary to design a sorting machine for semiconductor testing to solve the above problems.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0006] Based on the above problems existing in the prior art, the problem to be solved by the present application is: to provide a sorting machine for semiconductor testing, so as to solve the problem that the above patent lacks a device to fix the semiconductor when the upper electrode is driven downward by rotating the rotating disk to squeeze the semiconductor. Therefore, when the semiconductor is squeezed downward, it is easy to cause the semiconductor to slip or shift, thereby affecting the normal detection of the semiconductor.

[0007] The technical solution adopted by the present application to solve its technical problems is: a sorting machine for semiconductor testing. It mainly includes: a base, a display is installed on the base, and the base has a workbench; a depth adjustment mechanism, the depth adjustment mechanism is installed on the base, and the depth adjustment mechanism is used to support the semiconductor: a detection mechanism, the detection mechanism is installed on the upper end of the depth adjustment mechanism, and the detection mechanism is used to perform pressure testing on the semiconductor; a limiting mechanism, the limiting mechanism is installed on the depth adjustment mechanism, and the limiting mechanism is used to clamp the semiconductor, and the limiting mechanism has a bottom plate for placing the semiconductor and a first clamping plate and a second clamping plate for clamping the semiconductor; wherein: the depth adjustment mechanism is suitable for supporting the limiting mechanism and moving closer to or away from the detection mechanism, the detection mechanism is suitable for performing pressure testing on the semiconductor and displaying it through the display, and the limiting mechanism is suitable for clamping the semiconductor.

[0008] Further, the depth adjustment mechanism comprises a support column mounted on the workbench, and a spring is sleeved on the support column;

[0009] A support plate is sleeved on the support column, and one end of the spring away from the workbench is connected to a side of the support plate close to the workbench;

[0010] The support column has a threaded rod on one side away from the workbench, the threaded rod is connected with a nut, and two groups of fixing rods are movably penetrated on the support plate.

[0011] Furthermore, four groups of pillars are installed on the workbench, and top plates are connected between the four groups of pillars.

[0012] Further, the detection mechanism includes a first screw rod threadedly connected to the top plate, and a first rotating wheel is mounted on the first screw rod;

[0013] A pressure sensor is installed on the workbench, a lower electrode is installed on the pressure sensor, and an upper electrode is installed on one end of the first screw rod close to the support plate.

[0014] Further, the limiting mechanism comprises a bottom plate mounted on the supporting plate, and the first clamping plate is mounted on the bottom plate;

[0015] The bottom plate has a protruding portion, a second screw rod is threadedly connected to the protruding portion, and the second clamping plate bearing is installed on the second screw rod.

[0016] Furthermore, a first silicone pad is installed on the first clamping plate.

[0017] The beneficial effect of the present application is that the semiconductor testing sorting machine provided by the present application, through the coordinated use of the base plate, the first clamping plate, the first silicone pad, the protrusion, the second screw, the second rotating wheel, the second clamping plate and the second silicone pad, can achieve pressure testing of the semiconductor while limiting the position of the semiconductor to prevent the semiconductor from slipping or deviating when pressed down.

[0018] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 It is an overall schematic diagram of a semiconductor test sorting machine in this application;

[0021] Figure 2 for Figure 1 Explosion diagram of

[0022] Figure 3 for Figure 2 A in the enlarged view;

[0023] Among them, the reference numerals in the figure are:

[0024] 1. Base; 101. Workbench; 102. Pillar; 103. Top plate; 2. Depth adjustment mechanism; 201. Support plate; 202. Support column; 203. Spring; 204. Nut; 205. Fixing rod; 3. Detection mechanism; 301. First screw; 302. First rotating wheel; 303. Pressure sensor; 304. Lower electrode; 4. Limitation mechanism; 401. Bottom plate; 402. First clamping plate; 403. First silicone pad; 404. Protrusion; 406. Second screw; 407. Second rotating wheel; 408. Second clamping plate; 409. Second silicone pad. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0027] like Figure 1-Figure 3 As shown, the present application provides a semiconductor test sorting machine, including a base 1, the base 1 having a workbench 101, and four groups of pillars 102 are fixedly installed on the workbench 101, and a top plate 103 is connected between the four groups of pillars 102;

[0028] A depth adjustment mechanism 2 is installed on the workbench 101, and the depth adjustment mechanism 2 is used to support the semiconductor, and the depth adjustment mechanism 2 includes a support column 202 installed on the workbench 101, and a spring 203 is sleeved on the support column 202, and one end of the spring 203 close to the workbench 101 is connected to the workbench 101;

[0029] A support plate 201 is sleeved on the support column 202, and the support plate 201 is suitable for supporting the semiconductor, and one end of the spring 203 away from the workbench 101 is connected to a side of the support plate 201 close to the workbench 101, and the spring 203 is suitable for supporting the support plate 201;

[0030] At the same time, a threaded rod (not shown) is provided on the side of the support column 202 away from the workbench 101, and a nut 204 is connected to the threaded rod, and the nut 204 is suitable for fixing the support plate 201 on the support column 202, and two sets of fixing rods 205 are movably penetrated on the support plate 201, and the fixing rods 205 are suitable for keeping the support plate 201 in a horizontal state;

[0031] A detection mechanism 3 is installed on the top plate 103, and the detection mechanism 3 is suitable for performing pressure testing on the semiconductor. The detection mechanism 3 includes a first screw 301 threadedly connected to the top plate 103, and a first rotating wheel 302 is fixedly installed on one end of the first screw 301 away from the support plate 201, and the first rotating wheel 302 is suitable for rotating the first screw 301 so that the first screw 301 is suitable for approaching or moving away from the support plate 201;

[0032] Meanwhile, a pressure sensor 303 is fixedly mounted on the workbench 101, a lower electrode 304 is mounted on the pressure sensor 303, and an upper electrode (not shown in the figure) is mounted on one end of the first screw 301 close to the support plate 201, the lower electrode 304 and the upper electrode are both electrically connected to an external power supply through a circuit, and a display (not shown in the figure) is fixedly mounted on the base 1, the display is used to display the pressure value detected by the pressure sensor 303;

[0033] In order to avoid the semiconductor from running off track during semiconductor testing, Figure 2-Figure 3 As shown, a limiting mechanism 4 is installed on the support plate 201, and the limiting mechanism 4 is used to clamp the semiconductor, and the limiting mechanism 4 includes a bottom plate 401 fixedly installed on the support plate 201, and the bottom plate 401 has a first clamping plate 402, and a first silicone pad 403 is fixedly installed on the first clamping plate 402, and the first silicone pad 403 is suitable for preventing the first clamping plate 402 from directly contacting the semiconductor, causing the semiconductor surface to be clamped;

[0034] Meanwhile, the bottom plate 401 has a protrusion 404, and a second screw rod 406 is threadedly connected to the protrusion 404. A second clamping plate 408 is bearing-mounted on one end of the second screw rod 406 close to the first clamping plate 402. The second clamping plate 408 is adapted to approach or move away from the first clamping plate 402 as the second screw rod 406 rotates.

[0035] A second silicone pad 409 is installed on one side of the second clamping plate 408 close to the first clamping plate 402. The second silicone pad 409 is suitable for preventing the second clamping plate 408 from directly contacting the semiconductor and causing damage to the semiconductor surface.

[0036] A second rotating wheel 407 is fixedly mounted on one end of the second screw rod 406 away from the second clamping plate 408, and the second rotating wheel 407 is suitable for rotating the second screw rod 406;

[0037] When in use, first place the semiconductor to be tested on the bottom plate 401, then rotate the second rotating wheel 407 to drive the second screw 406 to rotate, so as to drive the second clamping plate 408 to move closer to the first clamping plate 402, until the first silicone pad 403 and the second silicone pad 409 are in contact with the semiconductor;

[0038] Then, the lower electrode 304 and the upper electrode are electrically connected to an external power source, and the first rotating wheel 302 is rotated. The first rotating wheel 302 drives the first screw 301 to move downward relative to the top plate 103 through the threads on the surface. The first rotating wheel 302 also drives the upper electrode to move downward, so that the upper electrode contacts the semiconductor. Then, the first rotating wheel 302 is continuously rotated, so that the upper electrode squeezes the semiconductor downward, and the semiconductor also drives the support plate 201 to move downward. When the support plate 201 moves downward to squeeze the spring 203, the position of the support plate 201 on the surface of the fixed rod 205 changes, and the spring 203 is deformed, so that the semiconductor moves downward and contacts the lower electrode 304, and the semiconductor is energized. The squeezing force on the lower electrode 304 is transmitted to the pressure sensor 303, and the pressure sensor 303 displays the pressure value on the display screen.

[0039] If the first rotating wheel 302 continues to rotate, the semiconductor is squeezed by the lower electrode 304 and the upper electrode and damaged. The maximum value of the external pressure is displayed on the display screen, and the maximum pressure that the semiconductor can withstand during normal operation can be known.

[0040] In summary: by using the base plate 401, the first clamping plate 402, the first silicone pad 403, the protrusion 404, the second screw 406, the second rotating wheel 407, the second clamping plate 408 and the second silicone pad 409 in combination, the semiconductor can be positionally restricted while pressure testing is being performed on the semiconductor to prevent the semiconductor from slipping or deviating when pressure is applied.

[0041] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A sorting machine for semiconductor testing, characterized in that: include: A base (1), a display being mounted on the base (1), the base (1) having a workbench (101); A depth adjustment mechanism (2), the depth adjustment mechanism (2) being mounted on the base (1), and the depth adjustment mechanism (2) being used to support the semiconductor: A detection mechanism (3), the detection mechanism (3) being mounted on the upper end of the depth adjustment mechanism (2), the detection mechanism (3) being used for pressure testing of semiconductors; A limiting mechanism (4), the limiting mechanism (4) being mounted on the depth adjustment mechanism (2), the limiting mechanism (4) being used to clamp the semiconductor, the limiting mechanism (4) comprising a base plate (401) for placing the semiconductor, and a first clamping plate (402) and a second clamping plate (408) for clamping the semiconductor; Wherein: the depth adjustment mechanism (2) is suitable for supporting the limiting mechanism (4) and moving closer to or farther away from the detection mechanism (3), the detection mechanism (3) is suitable for performing a pressure test on the semiconductor and displaying it through the display, and the limiting mechanism (4) is suitable for clamping the semiconductor.

2. The semiconductor test sorting machine according to claim 1, characterized in that: The depth adjustment mechanism (2) comprises a support column (202) mounted on the workbench (101), and a spring (203) is sleeved on the support column (202); A support plate (201) is sleeved on the support column (202), and an end of the spring (203) away from the workbench (101) is connected to a surface of the support plate (201) close to the workbench (101); A threaded rod is provided on a side of the support column (202) away from the workbench (101), a nut (204) is connected to the threaded rod, and two groups of fixing rods (205) are movably penetrated through the support plate (201).

3. The semiconductor test sorting machine according to claim 2, characterized in that: Four groups of pillars (102) are installed on the workbench (101), and top plates (103) are connected between the four groups of pillars (102).

4. The semiconductor test sorting machine according to claim 3, characterized in that: The detection mechanism (3) comprises a first screw rod (301) threadedly connected to the top plate (103), and a first rotating wheel (302) is mounted on the first screw rod (301); A pressure sensor (303) is installed on the workbench (101), a lower electrode (304) is installed on the pressure sensor (303), and an upper electrode is installed on one end of the first screw rod (301) close to the support plate (201).

5. The semiconductor test sorting machine according to claim 3, characterized in that: The limiting mechanism (4) comprises a bottom plate (401) mounted on the supporting plate (201), and the first clamping plate (402) is mounted on the bottom plate (401); The bottom plate (401) has a protruding portion (404), a second screw rod (406) is threadedly connected to the protruding portion (404), and the second clamping plate (408) is bearing-mounted on the second screw rod (406).

6. The semiconductor test sorting machine according to claim 5, characterized in that: A first silicone pad (403) is installed on the first clamping plate (402).

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