Automatic wafer feeding mechanism

Abstract

The utility model discloses an automatic wafer feeding mechanism which comprises a supporting plate capable of moving along the horizontal direction and a substrate arranged below the supporting plate and capable of moving along the vertical direction, and a ceramic chip is installed on the lower surface of the supporting plate. The upper surface or the lower surface of the end, away from the supporting plate, of the ceramic wafer is provided with a plurality of adsorption holes used for being matched with wafers, and the upper surface of the substrate is movably provided with a front carrying plate and a rear carrying plate through at least one set of sliding rails and sliding blocks. The upper surface of the front carrier plate and the upper surface of the rear carrier plate are each provided with an arc-shaped groove corresponding to the wafer, and the side walls of the two arc-shaped grooves are oppositely arranged. According to the utility model, the ceramic wafer can conveniently adsorb and pick up the wafer without damaging the wafer, so that bad interference on the wafer and subsequent processing caused by static electricity generated in the pick-up process can be effectively avoided, and the wafer can be conveniently moved away while connection and clamping of the wafer can be realized.

Description

Technical Field

[0001] The utility model relates to an automatic wafer feeding mechanism, belonging to the technical field of wafer testing. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. It needs to go through multiple processes to obtain the final product. Before the processing, the wafer needs to be taken out of the silo and placed on a fixture for fixation before subsequent processing. However, in this process, if the wafer is moved carelessly, the surface of the wafer may be easily damaged, affecting the subsequent processing of the wafer. When clamping the wafer, if the fixture is not convenient for the connection and removal of the wafer, it will also affect the subsequent processing of the wafer. Utility Model Content

[0003] The purpose of the utility model is to provide an automated wafer loading mechanism, which is convenient for a ceramic sheet to adsorb and pick up a wafer without damaging the wafer, effectively avoiding static electricity generated during the picking process and causing adverse interference to the wafer and subsequent processing, and can also realize the connection and clamping of the wafer while facilitating the removal of the wafer.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an automated wafer loading mechanism, comprising: a support plate movable in the horizontal direction and a substrate arranged below the support plate and movable in the vertical direction, a ceramic sheet is installed on the lower surface of the support plate, an air groove is provided on the upper surface of the end of the ceramic sheet connected to the support plate, an air hole corresponding to the air groove is provided on the support plate, the lower end of the air hole connected to the vacuum generator at the upper end is connected to the air groove on the ceramic sheet, a plurality of adsorption holes for cooperating with the wafer are provided on the upper surface or the lower surface of the end of the ceramic sheet away from the support plate, and each of the adsorption holes is connected to the air groove through an air channel provided in the ceramic sheet;

[0005] A front loading plate and a rear loading plate are movably mounted on the upper surface of the substrate through at least one set of slide rails and sliders. The front loading plate and the rear loading plate arranged opposite to each other can approach each other or move away from each other. An arc groove corresponding to the wafer is provided on the upper surface of each of the front loading plate and the rear loading plate, and the side walls of the two arc grooves are arranged opposite to each other. When the wafer is embedded in the arc groove, the lower surface of the wafer overlaps and contacts with the bottom surfaces of the two arc grooves, and when the front loading plate and the rear loading plate approach each other, the outer surface of the wafer contacts with the side walls of the two arc grooves.

[0006] The further improved scheme in the above technical scheme is as follows:

[0007] 1. The above scheme also includes: a left column and a right column arranged in parallel and at intervals, and a cross bar connected between the left column and the right column, the two ends of the front side of the cross bar are respectively rotatably provided with a left pulley and a right pulley, the left pulley and the right pulley are connected by a belt transmission, an output shaft of a motor installed on the rear side of the cross bar is connected to the left pulley or the right pulley, and the support plate is installed on the belt and can move in the horizontal direction with the belt.

[0008] 2. In the above solution, the support plate is an L-shaped support plate, the vertical portion of the support plate is installed on the belt, and the ceramic sheet is installed on the lower surface of the horizontal portion of the support plate.

[0009] 3. In the above solution, the vertical portion of the support plate and the cross bar are connected by at least one set of slide rails and sliders.

[0010] 4. In the above solution, the thickness of the ceramic sheet is 0.5mm~5mm.

[0011] 5. In the above scheme, the base plate is mounted on a movable bracket, and the movable bracket is mounted on a vertical conveying assembly. The vertical conveying assembly includes: a vertically extending shell, a screw rod rotatably mounted on the shell and a movable nut sleeved on the screw rod, an output shaft of a driving motor mounted on the lower end of the shell is connected to the lower end of the screw rod, and the movable bracket is mounted on the movable nut.

[0012] 6. In the above solution, the front loading plate and the rear loading plate are both configured as semicircular rings.

[0013] 7. In the above solution, at least two arc-shaped protrusions are provided on the side walls of each of the two arc-shaped grooves.

[0014] 8. In the above solution, a second arc-shaped groove for embedding the wafer is provided on the bottom surface of each of the two arc-shaped grooves.

[0015] 9. In the above solution, at least one of the sliders is installed on the lower surface of both ends of the front loading plate and the rear loading plate, and four slide rails corresponding to the sliders are installed on the upper surface of the base plate.

[0016] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0017] The utility model discloses an automatic wafer loading mechanism, which comprises: a support plate which can be moved in the horizontal direction and a substrate which is arranged below the support plate and can be moved in the vertical direction, a ceramic sheet is installed on the lower surface of the support plate, an air groove is arranged on the upper surface of one end of the ceramic sheet connected to the support plate, an air hole corresponding to the air groove is arranged on the support plate, the lower end of the air hole which is connected to the vacuum generator at the upper end is connected to the air groove on the ceramic sheet, a plurality of adsorption holes for cooperating with the wafer are arranged on the upper surface or the lower surface of the end of the ceramic sheet away from the support plate, each adsorption hole is connected to the air groove through an air channel arranged in the ceramic sheet, and the upper surface of the substrate can be moved by at least one set of slide rails and sliders. A front loading plate and a rear loading plate are movably installed. The front loading plate and the rear loading plate, which are arranged opposite to each other, can approach each other or move away from each other. An arc groove corresponding to the wafer is provided on the upper surface of each of the front loading plate and the rear loading plate, and the side walls of the two arc grooves are arranged opposite to each other. When the wafer is embedded in the arc groove, the lower surface of the wafer overlaps and contacts with the bottom surfaces of the two arc grooves, and when the front loading plate and the rear loading plate are approached to each other, the outer surface of the wafer contacts with the side walls of the two arc grooves, so that the ceramic sheet can absorb and pick up the wafer without damaging the wafer, effectively avoiding static electricity generated during the picking process to cause adverse interference to the wafer and subsequent processing, and can also realize the connection and clamping of the wafer while facilitating the removal of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attached Figure 1 This is a schematic diagram of the structure of the automatic wafer loading mechanism of the utility model;

[0019] Attached Figure 2 It is a schematic diagram of the state of the wafer adsorbing of the automatic wafer loading mechanism of the utility model;

[0020] Attached Figure 3 The schematic diagram of the local structure of the automatic wafer loading mechanism of the utility model Figure 1 ;

[0021] Attached Figure 4 For attachment Figure 3 Schematic diagram of the cross section along AA;

[0022] Attached Figure 5 It is a partial structural schematic diagram of a ceramic sheet of the automatic wafer loading mechanism of the utility model;

[0023] Attached Figure 6 It is a schematic diagram of the clamping state of the automatic wafer loading mechanism of the utility model;

[0024] Attached Figure 7 The schematic diagram of the local structure of the automatic wafer loading mechanism of the utility model Figure 2 ;

[0025] Attached Figure 8 For attachment Figure 7A magnified schematic diagram of point B in the middle.

[0026] In the above drawings: 100, wafer; 1, left column; 2, right column; 3, cross bar; 41, left pulley; 42, right pulley; 5, belt; 6, motor; 7, support plate; 71, vertical part; 72, horizontal part; 73, air hole; 8, ceramic plate; 81, air groove; 82, adsorption hole; 83, air channel; 84, sealing ring; 1, substrate; 12, front loading plate; 13, rear loading plate; 141, slide rail; 142, slider; 15, arc groove; 151, arc protrusion; 152, second arc groove; 16, motor; 171, first cam; 172, second cam; 173, pin; 181, first bearing; 182, second bearing; 183, mounting rod; 19, spring; 20, movable bracket; 21, housing; 22, lead screw; 23, movable nut; 24, drive motor. DETAILED DESCRIPTION

[0027] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0028] Embodiment 1: An automated wafer loading mechanism, comprising: a support plate 7 movable in a horizontal direction and a substrate 11 disposed below the support plate 7 and movable in a vertical direction, a ceramic sheet 8 being mounted on the lower surface of the support plate 7, an air groove 81 being provided on the upper surface of the end of the ceramic sheet 8 connected to the support plate 7, an air hole 73 corresponding to the air groove 81 being provided on the support plate 7, the air hole 73 whose upper end is connected to a vacuum generator being connected at its lower end to the air groove 81 on the ceramic sheet 8, a plurality of adsorption holes 82 for cooperating with a wafer 100 being provided on the upper surface or the lower surface of the end of the ceramic sheet 8 away from the support plate 7, each of the adsorption holes 82 being connected to the air groove 81 via an air passage 83 provided in the ceramic sheet 8;

[0029] When the wafers are received, they are usually stacked vertically in 12 or 25 pieces in a wafer plug box. When the wafers need to be processed later, the ceramic sheet needs to be moved toward the wafer plug box and extended above or below the wafer to be picked up, and then the vacuum generator is started to generate a vacuum around the adsorption holes on the ceramic sheet to achieve adsorption and grabbing of the wafers.

[0030] The upper surface of the substrate 11 is movably mounted with a front loading plate 12 and a rear loading plate 13 through at least one set of slide rails 141 and sliders 142. The front loading plate 12 and the rear loading plate 13 arranged opposite to each other can approach each other or move away from each other. The upper surface of each of the front loading plate 12 and the rear loading plate 13 is provided with an arc groove 15 corresponding to the wafer 100, and the side walls of the two arc grooves 15 are arranged opposite to each other. When the wafer 100 is embedded in the arc groove 15, the lower surface of the wafer 100 overlaps and contacts with the bottom surfaces of the two arc grooves 15, and when the front loading plate 12 and the rear loading plate 13 approach each other, the outer surface of the wafer 100 contacts with the side walls of the two arc grooves 15.

[0031] In the initial state, the front carrier plate and the rear carrier plate are placed in a state of being away from each other, the wafer is picked up by the ceramic sheet and transported to the top of the arc grooves on the front carrier plate and the rear carrier plate, and the wafer is released so that the lower surface of the wafer contacts the bottom surface of the arc grooves on the two carrier plates;

[0032] At this time, the front loading plate and the rear loading plate are driven to move toward each other until the side walls of the two arc-shaped grooves thereon are respectively pressed and contacted with the outer wall of the wafer, thereby clamping the wafer.

[0033] The above also includes: a left column 1 and a right column 2 arranged in parallel and at intervals, and a cross bar 3 connected between the left column 1 and the right column 2, the two ends of the front side of the cross bar 3 are rotatably provided with a left pulley 41 and a right pulley 42, the left pulley 41 and the right pulley 42 are connected by a belt 5, the output shaft of a motor 6 installed on the rear side of the cross bar 3 is connected to the left pulley 41 or the right pulley 42, and the support plate 7 is installed on the belt 5 and can move in the horizontal direction with the belt 5;

[0034] The ceramic sheet is driven by a belt to approach or move away from the wafer. Before the ceramic sheet picks up the wafer, the belt drives the ceramic sheet close to the wafer. After the ceramic sheet completes picking up the wafer, the belt moves in the opposite direction to drive the ceramic sheet to move the adsorbed wafer out of the card box.

[0035] The support plate 7 is an L-shaped support plate, the vertical portion 71 of the support plate 7 is mounted on the belt 5 , and the ceramic sheet 8 is mounted on the lower surface of the horizontal portion 72 of the support plate 7 .

[0036] The vertical portion 71 of the support plate 7 is connected to the crossbar 3 via at least one set of slide rails and sliders.

[0037] The thickness of the ceramic sheet 8 is 4 mm.

[0038] The substrate 11 is mounted on a movable bracket 20, which is mounted on a vertical transmission assembly. The vertical transmission assembly includes: a vertically extending housing 21, a screw rod 22 rotatably mounted on the housing 21, and a movable nut 23 sleeved on the screw rod 22. An output shaft of a driving motor 24 mounted on the lower end of the housing 21 is connected to the lower end of the screw rod 22, and the movable bracket 20 is mounted on the movable nut 23.

[0039] The movable bracket moves upward, so that the upper surfaces of the front carrier plate and the rear carrier plate installed on the movable bracket and in a state of being away from each other contact with the lower surface of the wafer, thereby achieving connection with the wafer;

[0040] At this time, the front loading plate and the rear loading plate are driven to move toward each other until the side walls of the two arc-shaped grooves thereon are respectively pressed and contacted with the outer wall of the wafer, thereby clamping the wafer.

[0041] The front loading plate 12 and the rear loading plate 13 are both configured in a semicircular ring shape.

[0042] At least two arc-shaped protrusions 151 are disposed on the side walls of the two arc-shaped grooves 15 .

[0043] A second arc groove 152 for embedding the wafer 100 is formed on the bottom surface of each of the two arc grooves 15 . The second arc groove and the arc groove can embed wafers of different sizes, thereby improving versatility.

[0044] At least one slider 142 is installed on the lower surface of both ends of the front loading plate 12 and the rear loading plate 13 , and four slide rails 141 corresponding to the slider 142 are installed on the upper surface of the base plate 11 .

[0045] Both ends of the cross bar 3 are connected to the upper ends of the left column 1 and the right column 2 respectively.

[0046] The plurality of adsorption holes 82 are distributed in a T-shape.

[0047] The above-mentioned several air passages 83 are interconnected.

[0048] The air groove 81 is a circular air groove.

[0049] A sealing ring 84 embedded in the air groove 81 is in press contact with the lower surface of the horizontal portion 72 of the support plate 7 .

[0050] The other end of the ceramic sheet 8 connected to the support plate 7 at one end extends away from the support plate 7 along the moving direction of the belt 5 .

[0051] Embodiment 2: An automated wafer loading mechanism, comprising: a support plate 7 movable in a horizontal direction and a substrate 11 disposed below the support plate 7 and movable in a vertical direction, a ceramic sheet 8 being mounted on the lower surface of the support plate 7, an air groove 81 being provided on the upper surface of the end of the ceramic sheet 8 connected to the support plate 7, an air hole 73 corresponding to the air groove 81 being provided on the support plate 7, the air hole 73 whose upper end is connected to a vacuum generator being connected at its lower end to the air groove 81 on the ceramic sheet 8, a plurality of adsorption holes 82 for cooperating with a wafer 100 being provided on the upper surface or the lower surface of the end of the ceramic sheet 8 away from the support plate 7, each of the adsorption holes 82 being connected to the air groove 81 via an air passage 83 provided in the ceramic sheet 8;

[0052] A front loading plate 12 and a rear loading plate 13 are movably mounted on the upper surface of the substrate 11 through at least one set of slide rails 141 and sliders 142. The front loading plate 12 and the rear loading plate 13 arranged opposite to each other can approach each other or move away from each other. An arc groove 15 corresponding to the wafer 100 is provided on the upper surface of each of the front loading plate 12 and the rear loading plate 13, and the side walls of the two arc grooves 15 are arranged opposite to each other. When the wafer 100 is embedded in the arc groove 15, the lower surface of the wafer 100 overlaps and contacts with the bottom surfaces of the two arc grooves 15, and when the front loading plate 12 and the rear loading plate 13 approach each other, the outer surface of the wafer 100 contacts with the side walls of the two arc grooves 15.

[0053] The thickness of the ceramic sheet 8 is 1.5 mm.

[0054] The substrate 11 is mounted on a movable bracket 20, which is mounted on a vertical conveying assembly, and the vertical conveying assembly includes: a vertically extending housing 21, a screw rod 22 rotatably mounted on the housing 21, and a movable nut 23 sleeved on the screw rod 22, an output shaft of a driving motor 24 mounted on the lower end of the housing 21 is connected to the lower end of the screw rod 22, and the movable bracket 20 is mounted on the movable nut 23. At least two arc-shaped protrusions 151 are provided on the side walls of each of the two arc-shaped grooves 15.

[0055] At least one slider 142 is installed on the lower surface of both ends of the front loading plate 12 and the rear loading plate 13 , and four slide rails 141 corresponding to the slider 142 are installed on the upper surface of the base plate 11 .

[0056] A motor 16 is installed on the lower surface of the substrate 11 and located between the front loading plate 12 and the rear loading plate 13. The upper end of the output shaft of the motor 16 passes through the substrate 11 and is sequentially installed with a first cam 171 and a second cam 172. The first cam 171 and the second cam 172 are arranged at intervals in the vertical direction and differ by 180° in the circumferential direction. A first bearing 181 matched with the first cam 171 is installed on the front loading plate 12, and a second bearing 182 matched with the second cam 172 is installed on the rear loading plate 13. At least one spring 19 is connected between the front loading plate 12 and the rear loading plate 13, so that the raised portion of the first cam 171 and the first bearing 181, and the raised portion of the second cam 172 and the second bearing 182 maintain contact, thereby ensuring the synchronization of the movement of the two loading plates. While achieving wafer clamping, the wafer can be preliminarily calibrated to facilitate subsequent processing operations.

[0057] A vertically arranged pin 173 is connected between the first cam 171 and the second cam 172 to prevent the two cams from rotating relative to each other, thereby preventing the two carriers from moving asynchronously and damaging the wafers clamped therein.

[0058] The first bearing 181 and the second bearing 182 are respectively mounted on the front loading plate 12 and the rear loading plate 13 via a mounting rod 183. The first bearing 181 and the second bearing 182 are rotatably mounted on the other end of the mounting rod 183, one end of which is connected to the lower surface of the front loading plate 12 and the rear loading plate 13.

[0059] The working principle of the utility model is as follows:

[0060] When the wafers are received, they are usually stacked vertically in 12 or 25 pieces in a wafer plug box. When the wafers need to be processed later, the ceramic sheet needs to be moved toward the wafer plug box and extended above or below the wafer to be picked up, and then the vacuum generator is started to generate a vacuum around the adsorption holes on the ceramic sheet to achieve adsorption and grabbing of the wafers.

[0061] In this process, the ceramic sheet is driven by a belt to approach or move away from the wafer. Before the ceramic sheet picks up the wafer, the belt drives the ceramic sheet close to the wafer. After the ceramic sheet finishes picking up the wafer, the belt moves in the opposite direction to drive the ceramic sheet to move the adsorbed wafer out of the card box.

[0062] The entire handling process described above has little interference with the wafer to be picked up, will not damage the wafer, will not generate static electricity to interfere with subsequent processing of the wafer; and will not interfere with other wafers stacked above or below the wafer to be picked up;

[0063] Then, the movable bracket moves upward, so that the upper surfaces of the front carrier plate and the rear carrier plate installed on the movable bracket and in a state of being away from each other contact with the lower surface of the wafer, thereby achieving the connection of the wafer;

[0064] At this time, the front loading plate and the rear loading plate are driven to move toward each other until the side walls of the two arc-shaped grooves thereon are respectively pressed and contacted with the outer wall of the wafer, thereby clamping the wafer.

[0065] At the same time, the two carrier plates always have a tendency to move towards each other under the action of the spring;

[0066] Before the wafer contacts the carrier, the protrusions of the two cams rotating with the output shaft of the motor are rotated to be pressed and contacted with the corresponding bearings. At this time, the two carriers are in a state of being away from each other. The wafer is transported to the top of the arc grooves on the front carrier and the rear carrier by an external pickup assembly, and the wafer is released so that the lower surface of the wafer contacts the bottom surfaces of the arc grooves on the two carriers.

[0067] Next, the output shaft of the motor drives the two cams to rotate so that their respective recessed parts rotate toward the corresponding bearing directions. At this time, the front loading plate and the rear loading plate move toward each other synchronously under the action of the spring until the side walls of the two arc-shaped grooves thereon are respectively squeezed into contact with the outer walls of the wafer, thereby clamping the wafer and performing preliminary position alignment calibration on the wafer.

[0068] When the above-mentioned automated wafer loading mechanism is used, it is convenient for the ceramic sheet to adsorb and pick up the wafer without damaging the wafer, effectively avoiding static electricity generated during the picking process and causing adverse interference to the wafer and subsequent processing, and can also realize the connection and clamping of the wafer while facilitating the removal of the wafer.

[0069] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. An automated wafer loading mechanism, characterized in that: include: A support plate (7) movable in a horizontal direction and a substrate (11) arranged below the support plate (7) and movable in a vertical direction, wherein a ceramic sheet (8) is mounted on the lower surface of the support plate (7), an air groove (81) is provided on the upper surface of the ceramic sheet (8) at one end connected to the support plate (7), an air hole (73) corresponding to the air groove (81) is provided on the support plate (7), the air hole (73) whose upper end is connected to a vacuum generator is connected to the air groove (81) on the ceramic sheet (8) at its lower end, a plurality of adsorption holes (82) for cooperating with a wafer (100) are provided on the upper surface or the lower surface of the end of the ceramic sheet (8) away from the support plate (7), and each of the adsorption holes (82) is connected to the air groove (81) via an air channel (83) provided in the ceramic sheet (8); A front loading plate (12) and a rear loading plate (13) are movably mounted on the upper surface of the substrate (11) via at least one set of slide rails (141) and sliders (142); the front loading plate (12) and the rear loading plate (13) arranged opposite to each other can move towards each other or move away from each other; an arc groove (15) corresponding to the wafer (100) is provided on the upper surface of each of the front loading plate (12) and the rear loading plate (13); and the side walls of the two arc grooves (15) are arranged opposite to each other; when the wafer (100) is embedded in the arc groove (15), the lower surface of the wafer (100) overlaps and contacts the bottom surfaces of the two arc grooves (15); and when the front loading plate (12) and the rear loading plate (13) move towards each other, the outer surface of the wafer (100) contacts the side walls of the two arc grooves (15).

2. The automatic wafer loading mechanism according to claim 1, characterized in that: Also includes: A left column (1) and a right column (2) are arranged in parallel and at intervals, and a cross bar (3) connected between the left column (1) and the right column (2); a left belt pulley (41) and a right belt pulley (42) are rotatably arranged at both ends of the front side of the cross bar (3); the left belt pulley (41) and the right belt pulley (42) are connected to each other through a belt (5); an output shaft of a motor (6) installed on the rear side of the cross bar (3) is connected to the left belt pulley (41) or the right belt pulley (42); and the support plate (7) is installed on the belt (5) and can move in the horizontal direction along with the belt (5).

3. The automatic wafer loading mechanism according to claim 2, characterized in that: The support plate (7) is an L-shaped support plate, the vertical portion (71) of the support plate (7) is mounted on the belt (5), and the ceramic sheet (8) is mounted on the lower surface of the horizontal portion (72) of the support plate (7).

4. The automatic wafer loading mechanism according to claim 3, characterized in that: The vertical portion (71) of the support plate (7) and the crossbar (3) are connected in cooperation with each other via at least one set of slide rails and slide blocks.

5. The automatic wafer loading mechanism according to claim 1, characterized in that: The thickness of the ceramic sheet (8) is 0.5 mm to 5 mm.

6. The automatic wafer loading mechanism according to claim 1, characterized in that: The base plate (11) is mounted on a movable bracket (20), and the movable bracket (20) is mounted on a vertical conveying assembly. The vertical conveying assembly comprises: a vertically extending shell (21), a screw rod (22) rotatably mounted on the shell (21), and a movable nut (23) sleeved on the screw rod (22); an output shaft of a driving motor (24) mounted on the lower end of the shell (21) is connected to the lower end of the screw rod (22), and the movable bracket (20) is mounted on the movable nut (23).

7. The automated wafer loading mechanism according to claim 1, characterized in that: The front loading plate (12) and the rear loading plate (13) are both arranged in a semicircular ring shape.

8. The automated wafer loading mechanism according to claim 1, characterized in that: At least two arc-shaped protrusions (151) are arranged on the side walls of each of the two arc-shaped grooves (15).

9. The automatic wafer loading mechanism according to claim 1, characterized in that: A second arc-shaped groove (152) for the wafer (100) to be embedded is provided on the bottom surface of each of the two arc-shaped grooves (15).

10. The automatic wafer loading mechanism according to claim 1, characterized in that: At least one slider (142) is installed on the lower surface of each of the two ends of the front loading plate (12) and the rear loading plate (13), and four slide rails (141) corresponding to the sliders (142) are installed on the upper surface of the base plate (11).

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