Universal semiconductor chip ceramic packaging device

Abstract

The utility model relates to the technical field of chip ceramic packaging, in particular to a universal semiconductor chip ceramic packaging device which comprises a packaging shell, a chip mounting plate is movably arranged in the packaging shell, a handle is arranged at the top of the packaging shell, and a rectangular groove for a lower pressing plate to move is formed in the packaging shell. A plurality of positioning rods are arranged at the bottom of the lower pressing plate, the positioning rods are matched with the positioning holes, a chip is very convenient to take, when the chip needs to be taken out, a worker only needs to press the two L-shaped positioning blocks to make the two L-shaped positioning blocks get close synchronously, at the moment, the other ends of the L-shaped positioning blocks can be naturally away from the positioning grooves in the lifting handle, and the chip can be taken out conveniently. When the chip mounting plate is in use, under the automatic action of the reset assembly, the lifting handle moves upwards to drive the lower pressing block and the positioning rod to be separated from the positioning hole, and then a worker can easily take out the chip in the chip mounting plate without the assistance of other people, so that the operation process is greatly simplified, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip ceramic packaging, in particular to a universal semiconductor chip ceramic packaging device. Background Art

[0002] Ceramic packaging is a technology that packages integrated circuits with insulating plastic or ceramic materials. When chips are installed on electronic devices, they need to be installed in a packaging shell to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. The packaged chips are also easier to install and transport.

[0003] Chinese patent publication number CN210073812U discloses a ceramic packaging device for chips, which includes a packaging shell and a chip mounting plate. The upper and lower surfaces of the packaging shell are provided with threaded grooves, the inner walls of the two threaded grooves are provided with first threads, the insides of the two threaded grooves are threadedly connected with heat dissipation covers, the surface of the heat dissipation cover is provided with multiple heat dissipation holes, and the inside of the packaging shell is provided with a packaging inner cavity. The beneficial effects achieved by the utility model are: by utilizing the flexible combination of the packaging shell and the chip mounting plate, the chip can be well sealed and installed, the heat dissipation cover threadedly connected on the surface of the packaging shell can not only facilitate the heat removal of the chip, but also facilitate the disassembly and assembly of the heat dissipation cover, and better repair and observation of the chip, the cooperation of the bayonet and the spring can ensure that the chip mounting plate is easily in and out of the packaging shell, and it does not affect the removal of the chip, the entire ceramic packaging device is easy to install, has good sealing, and is convenient for chip heat dissipation, and flexible disassembly and assembly does not affect the use of the chip.

[0004] During the process of placing and removing the chip, the device requires the clamping covers on both sides to be opened at the same time, and the two clamping covers are installed independently. Therefore, it is difficult for a single staff member to complete the chip taking and placement work, and assistance from other staff members is required. For example, if there is a shortage of staff, it is difficult for a single staff member to take out and place the chip, and even if external objects can be used, it will take a certain amount of time. Utility Model Content

[0005] In view of the above problems, a universal semiconductor chip ceramic packaging device is provided. By using the cooperation of the positioning rod and the positioning hole, it is extremely convenient to take out the chip. When the chip needs to be taken out, the staff only needs to press the two L-shaped positioning blocks to make them approach synchronously. At this time, the other end of the L-shaped positioning block will naturally move away from the positioning groove in the handle. Under the automatic action of the reset component, the handle will move upward, thereby driving the pressing block and the positioning rod to disengage from the positioning hole. After that, the staff can easily take out the chip in the chip mounting plate without the assistance of others, which greatly simplifies the operation process and improves work efficiency.

[0006] To solve the problems of the prior art, the utility model provides a universal semiconductor chip ceramic packaging device, comprising a packaging shell, a chip mounting plate movably arranged inside the packaging shell, a handle arranged on the top of the packaging shell, a rectangular groove for the movement of a lower pressure plate arranged inside the packaging shell, a plurality of positioning rods arranged at the bottom of the lower pressure plate, and a through hole matched with the positioning rods arranged at the bottom of the rectangular groove, the bottom of the handle extends to the interior of the packaging shell and is connected to the top of the lower pressure plate, reset components are arranged on the bottom of both sides of the handle, symmetrical guide blocks are arranged on the top of the packaging shell, symmetrical L-shaped positioning blocks are slidably arranged inside the guide blocks, a second spring is arranged between the two L-shaped positioning blocks, a positioning groove matched with the L-shaped positioning block is arranged inside the handle, and a symmetrical heat sink is arranged on the top of the packaging shell.

[0007] Preferably, the reset assembly includes a telescopic rod, which is arranged on the top of the packaging shell, and a first spring is sleeved on the outside of the telescopic rod, one end of the first spring is connected to the top of the packaging shell, and the other end of the first spring is connected to the bottom of the handle.

[0008] Preferably, the heat sink comprises a heat sink shell, a plurality of heat sink holes are formed on the top of the heat sink shell, and the heat sink shell is threadedly connected to the inside of the packaging shell.

[0009] Preferably, a positioning hole cooperating with the positioning rod is provided on the top of the chip mounting plate.

[0010] Preferably, a mounting groove for mounting an adjusting screw is provided inside the chip mounting plate, one end of the adjusting screw extends to the outside of the chip mounting plate, the external thread of the adjusting screw is connected to a thread block, and a moving block is provided on the top of the thread block.

[0011] Preferably, an anti-slip pad is provided on one side outer wall of the moving block.

[0012] Preferably, a sliding block is provided on the side wall of the L-shaped positioning block, and a sliding groove for the sliding block to move is provided on the side wall of the guide block.

[0013] Preferably, one end of the L-shaped positioning block is provided with an inclined surface capable of sliding in cooperation with the positioning groove.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] By using the positioning rod and the positioning hole, it is extremely convenient to take out the chip. When the chip needs to be taken out, the staff only needs to press the two L-shaped positioning blocks to make them approach synchronously. At this time, the other end of the L-shaped positioning block will naturally move away from the positioning groove in the handle. Under the automatic action of the reset component, the handle will move up, thereby driving the pressing block and the positioning rod to disengage from the positioning hole. After that, the staff can easily take out the chip in the chip mounting plate without the assistance of others, which greatly simplifies the operation process and improves work efficiency.

[0016] By rotating the adjusting screw rod to drive the threaded block to move, the moving block is driven to move on the chip mounting plate, so as to limit the position of chips of different sizes, and prevent the chips from colliding and being damaged during moving and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The present invention is a structural schematic diagram of a packaging shell and a chip mounting plate in a general-purpose semiconductor chip ceramic packaging device.

[0018] Figure 2 The present invention is a schematic diagram of the overall structure of a general-purpose semiconductor chip ceramic packaging device.

[0019] Figure 3 The present invention is a schematic diagram of the structure of a heat sink in a general semiconductor chip ceramic packaging device.

[0020] Figure 4 The present invention is a schematic diagram of the internal structure of a packaging shell in a general-purpose semiconductor chip ceramic packaging device.

[0021] Figure 5 The present invention is a structural schematic diagram of a reset component in a general semiconductor chip ceramic packaging device.

[0022] Figure 6 The present invention is a structural schematic diagram of a threaded block in a general semiconductor chip ceramic packaging device.

[0023] The numbers in the figure are: 1. packaging shell; 2. chip mounting plate; 3. adjusting screw; 4. heat dissipation shell; 5. handle; 6. moving block; 7. first spring; 8. telescopic rod; 9. lower pressure plate; 10. positioning rod; 11. L-shaped positioning block; 12. second spring; 13. guide block; 14. positioning hole; 15. threaded block; 16. slider. DETAILED DESCRIPTION

[0024] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0025] like Figures 1 to 6 As shown, the utility model provides:

[0026] A universal semiconductor chip ceramic packaging device comprises a packaging shell 1, a chip mounting plate 2 is movably arranged inside the packaging shell 1, a handle 5 is arranged on the top of the packaging shell 1, a rectangular groove for a lower pressing plate 9 to move is provided inside the packaging shell 1, a plurality of positioning rods 10 are provided at the bottom of the lower pressing plate 9, and a through hole matched with the positioning rod 10 is provided at the bottom of the rectangular groove, the bottom of the handle 5 extends to the inside of the packaging shell 1 and is connected to the top of the lower pressing plate 9, reset components are arranged at the bottom of both sides of the handle 5, symmetrical guide blocks 13 are arranged on the top of the packaging shell 1, symmetrical L-shaped positioning blocks 11 are slidably arranged inside the guide blocks 13, a second spring 12 is arranged between the two L-shaped positioning blocks 11, a positioning groove matched with the L-shaped positioning block 11 is provided inside the handle 5, and a symmetrical heat sink is arranged on the top of the packaging shell 1.

[0027] By using the positioning rod 10 and the positioning hole 14, it is very convenient to take out the chip. When the chip needs to be taken out, the staff only needs to press the two L-shaped positioning blocks 11 to make them approach synchronously. At this time, the other end of the L-shaped positioning block 11 will naturally move away from the positioning groove in the handle 5. Under the automatic action of the reset component, the handle 5 will move up, thereby driving the pressing block and the positioning rod 10 to disengage from the positioning hole 14. After that, the staff can easily take out the chip in the chip mounting plate 2 without the assistance of others, which greatly simplifies the operation process and improves work efficiency.

[0028] Figure 5 As shown, the reset assembly includes a telescopic rod 8, which is arranged on the top of the packaging shell 1. A first spring 7 is sleeved on the outside of the telescopic rod 8. One end of the first spring 7 is connected to the top of the packaging shell 1, and the other end of the first spring 7 is connected to the bottom of the handle 5.

[0029] The handle 5 can be moved upward by the cooperation between the telescopic rod 8 and the first spring 7 , thereby driving the pressing block and the positioning rod 10 to disengage from the positioning hole 14 .

[0030] like Figure 4 and Figure 5 As shown, the heat sink includes a heat sink shell 4 , a plurality of heat sink holes are formed on the top of the heat sink shell 4 , and the heat sink shell 4 is threadedly connected to the inside of the packaging shell 1 .

[0031] The heat dissipation shell 4 and the heat dissipation holes can be used to conveniently remove heat from the chip.

[0032] like Figure 5 As shown, a positioning hole 14 is provided on the top of the chip mounting plate 2 to cooperate with the positioning rod 10 .

[0033] Through the cooperation between the positioning rod 10 and the positioning hole 14 , the chip mounting board 2 can be limited to prevent it from shaking randomly inside the packaging shell 1 .

[0034] like Figure 1 and Figure 2 As shown, a mounting groove for mounting an adjusting screw 3 is provided inside the chip mounting plate 2, one end of the adjusting screw 3 extends to the outside of the chip mounting plate 2, the external thread of the adjusting screw 3 is connected to a thread block 15, and a moving block 6 is provided on the top of the thread block 15.

[0035] By rotating the adjusting screw rod 3 to drive the threaded block 15 to move, the moving block 6 is driven to move on the chip mounting plate 2, so as to limit the position of chips of different sizes and prevent the chips from colliding and being damaged during transportation.

[0036] like Figure 1 As shown, an anti-slip pad is provided on one side outer wall of the moving block 6.

[0037] The anti-skid pad makes the moving block 6 more secure when limiting the chip.

[0038] like Figure 6 As shown, a slide block 16 is disposed on the side wall of the L-shaped positioning block 11 , and a sliding groove for the slide block 16 to move is provided on the side wall of the guide block 13 .

[0039] The slider 16 slides in the slide groove to prevent the L-shaped positioning block 11 from shifting during movement.

[0040] One end of the L-shaped positioning block 11 is provided with an inclined surface that can slide in cooperation with the positioning groove.

[0041] The inclined surface facilitates the downward movement of the handle 5.

[0042] The above embodiments only express a general semiconductor chip ceramic packaging device or several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the attached claims.

Claims

1. A general-purpose semiconductor chip ceramic packaging device, It is characterized in that The invention comprises a packaging shell (1), wherein a chip mounting plate (2) is movably arranged inside the packaging shell (1), a handle (5) is arranged on the top of the packaging shell (1), a rectangular groove for a lower pressing plate (9) to move is provided inside the packaging shell (1), a plurality of positioning rods (10) are provided at the bottom of the lower pressing plate (9), and a through hole matched with the positioning rods (10) is provided at the bottom of the rectangular groove, the bottom of the handle (5) extends to the inside of the packaging shell (1) and is connected to the top of the lower pressing plate (9), reset components are arranged at the bottom of both sides of the handle (5), symmetrical guide blocks (13) are arranged on the top of the packaging shell (1), symmetrical L-shaped positioning blocks (11) are slidably arranged inside the guide blocks (13), a second spring (12) is arranged between the two L-shaped positioning blocks (11), a positioning groove matched with the L-shaped positioning blocks (11) is provided inside the handle (5), and a symmetrical heat sink is arranged on the top of the packaging shell (1).

2. A general-purpose semiconductor chip ceramic packaging device according to claim 1, It is characterized in that The reset assembly comprises a telescopic rod (8), wherein the telescopic rod (8) is arranged at the top of the encapsulation shell (1), and a first spring (7) is sleeved on the outside of the telescopic rod (8), one end of the first spring (7) is connected to the top of the encapsulation shell (1), and the other end of the first spring (7) is connected to the bottom of the handle (5).

3. A general-purpose semiconductor chip ceramic packaging device according to claim 1, It is characterized in that The heat sink comprises a heat sink shell (4), a plurality of heat sink holes are provided on the top of the heat sink shell (4), and the heat sink shell (4) is threadedly connected to the inside of the packaging shell (1).

4. A general-purpose semiconductor chip ceramic packaging device according to claim 1, It is characterized in that A positioning hole (14) is provided on the top of the chip mounting plate (2) and works in coordination with the positioning rod (10).

5. A general-purpose semiconductor chip ceramic packaging device according to claim 1, It is characterized in that The chip mounting plate (2) is provided with a mounting groove for mounting an adjusting screw (3), one end of the adjusting screw (3) extends to the outside of the chip mounting plate (2), the external thread of the adjusting screw (3) is connected to a thread block (15), and a moving block (6) is arranged on the top of the thread block (15).

6. A general-purpose semiconductor chip ceramic packaging device according to claim 5, It is characterized in that An anti-slip pad is provided on one side outer wall of the moving block (6).

7. A general-purpose semiconductor chip ceramic packaging device according to claim 1, It is characterized in that The side wall of the L-shaped positioning block (11) is provided with a sliding block (16), and the side wall of the guide block (13) is provided with a sliding groove for the sliding block (16) to move.

8. A general-purpose semiconductor chip ceramic packaging device according to claim 1, It is characterized in that One end of the L-shaped positioning block (11) is provided with an inclined surface capable of sliding in cooperation with the positioning groove.

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