Protection mechanism for internal chip of label

Abstract

The utility model discloses a protection mechanism for a chip in a label, and particularly relates to the field of chips, the protection mechanism comprises a placement box, the protection mechanism is arranged in the placement box, the protection mechanism comprises a buffer pad, a sliding groove, a buffer spring, a limiting plate, a sliding block, a heat dissipation hole, a filter screen and a connecting hole, the inner wall of the placement box is fixedly connected with the buffer pad, and the sliding groove is fixedly connected with the inner wall of the placement box. The chips are fixed through the limiting plates and the buffer springs, the situation that the limiting plates make direct contact with the chips, and consequently the chips are abraded is avoided through the sponge pads, the buffer springs achieve the damping purpose, meanwhile, the chips of different specifications and sizes can be fixed conveniently, the application range is widened, and the practicability is high. Heat generated when the chip works is discharged through the heat dissipation holes, the situation that the chip is damaged due to the fact that the temperature of the containing box is too high is avoided, dust and water stains are prevented from entering the interior of the containing box through a filter screen and a rubber ring on the inner side of a connecting hole, operation of the chip is guaranteed, and the service life of the chip is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of chips, and more specifically, to a protection mechanism for chips inside a sign. Background Art

[0002] Chip, also known as microcircuit, microchip, integrated circuit, refers to a silicon wafer containing an integrated circuit, which is often part of a computer or other electronic device;

[0003] Most of the existing internal chips used in signage are fixedly connected inside the signage, and most of them do not have shockproof and heat dissipation functions. When the chip is working, its temperature will rise, which will cause damage to the chip in the long run and reduce the service life of the chip. At the same time, in the case of vibration, the chip terminal and the connecting wire may fall off, further affecting the operation of the chip. At the same time, the above-cited patent documents do not propose relevant solutions to solve the problems of chip heat dissipation and shockproof.

[0004] Therefore, in order to solve the above problems, a protection mechanism for the chip inside the sign is proposed. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the utility model provides a protection mechanism for a chip inside a sign to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a protection mechanism for a chip inside a sign, comprising a placement box, a protection mechanism is arranged inside the placement box, and the protection mechanism comprises a buffer pad, a slide groove, a buffer spring, a limit plate, a slider, a heat dissipation hole, a filter screen and a connection hole;

[0007] A buffer pad is fixedly connected to the inner wall of the placement box, a slide groove is provided on the inner wall of the placement box and on the side of the buffer pad, a buffer spring is fixedly connected to the inner wall of the placement box, a side of the buffer spring away from the placement box is fixedly connected to a limiting plate, a side wall of the limiting plate is fixedly connected to a slider slidably connected to the slide groove, a heat dissipation hole is provided on the side wall of the placement box, a filter is fixedly connected to the side wall of the placement box, and connection holes are provided on the upper and lower sides of the placement box.

[0008] Furthermore, a disassembly mechanism is provided on the side wall of the placement box, and the disassembly mechanism includes a limit block, a return spring, a spring block, a connecting rod, a push block, a rear cover, a groove, a clamping block and a limit spring.

[0009] Furthermore, the inner wall of the placement box is fixedly connected to a limit block on one side of the buffer spring, the side wall of the limit block is fixedly connected to a return spring, one side of the return spring is fixedly connected to a spring block, a connecting rod passes through the interior of the placement box, one side of the connecting rod is fixedly connected to a push block, one side of the placement box is snap-connected to a back cover, a groove is provided on the side wall of the back cover, a block is slidably connected to the inner wall of the groove, and the side wall of the block is fixedly connected to a limit spring fixedly connected to the inner wall of the back cover.

[0010] Furthermore, a mounting plate is fixedly connected to the side wall of the placement box, screws penetrate the interior of the mounting plate, the mounting plate is connected to a sign housing via the screws, a display screen is fixedly connected to the side wall of the sign housing, and electronic components are fixedly connected to the interior of the sign housing and on the side of the placement box.

[0011] Furthermore, a sponge pad is fixedly connected to the side wall of the limit plate, and the limit plate forms a sliding structure between the slider and the slide groove through a buffer spring, and the buffer spring is provided in multiple groups.

[0012] Furthermore, a rubber ring is fixedly connected to the inner side of the connecting hole, and the filter is located on the side of the heat dissipation hole.

[0013] Furthermore, the block forms a sliding structure with the groove through a limit spring and a connecting rod.

[0014] Furthermore, the screws are provided in four groups, and the specifications of the four groups of screws are the same, and the screws are provided with a cross slot.

[0015] Technical effects and advantages of the utility model:

[0016] 1. Compared with the prior art, the device adopts a protective mechanism; the chip is fixed by a limit plate and a buffer spring, and the direct contact between the limit plate and the chip causing the chip to be worn is avoided by a sponge pad. The buffer spring serves the purpose of shock absorption, and is convenient for fixing chips of different sizes, thereby improving the scope of application. The heat generated by the chip during operation is discharged through the heat dissipation holes, thereby preventing the chip from being damaged due to excessive temperature in the placement box. The filter and the rubber ring on the inner side of the connection hole prevent dust and water stains from entering the interior of the placement box, thereby ensuring the operation of the chip and improving the service life of the chip.

[0017] 2. Compared with the prior art, the device adopts a disassembly mechanism; the back cover is fixed by a limit spring and a card block. When disassembling, the card block is pushed into the groove by a push block and a connecting rod, and the back cover is ejected by a reset spring and a spring block, so as to achieve the purpose of installing and disassembling the back cover, which is convenient for the staff to inspect or replace the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the main structure of the utility model.

[0019] Figure 2 It is a schematic diagram of the cross-sectional structure of the main body of the utility model.

[0020] Figure 3 It is a schematic diagram of the protection mechanism of the utility model.

[0021] Figure 4 This is a schematic diagram of the structure of area A of the utility model.

[0022] Figure 5 This is a schematic diagram of the filter structure of the utility model.

[0023] Figure 6 It is a schematic diagram of the disassembly mechanism of the utility model.

[0024] The accompanying drawings are marked as follows: 1. placement box; 2. protection mechanism; 201. buffer pad; 202. slide groove; 203. buffer spring; 204. limit plate; 205. slider; 206. heat dissipation hole; 207. filter; 208. connecting hole; 3. disassembly mechanism; 301. limit block; 302. reset spring; 303. spring block; 304. connecting rod; 305. push block; 306. back cover; 307. groove; 308. block; 309. limit spring; 4. mounting plate; 5. screws; 6. nameplate housing; 7. display screen; 8. electronic components. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Embodiment 1

[0027] As attached Figures 1 to 5 A protection mechanism for a chip inside a sign shown in the figure comprises a placement box 1, a protection mechanism 2 is arranged inside the placement box 1, and the protection mechanism 2 comprises a buffer pad 201, a slide groove 202, a buffer spring 203, a limit plate 204, a slider 205, a heat dissipation hole 206, a filter screen 207 and a connection hole 208;

[0028] A buffer pad 201 is fixedly connected to the inner wall of the placement box 1, and a slide groove 202 is provided on the inner wall of the placement box 1 and on the side of the buffer pad 201. A buffer spring 203 is fixedly connected to the inner wall of the placement box 1. The side of the buffer spring 203 away from the placement box 1 is fixedly connected to a limiting plate 204, and the side wall of the limiting plate 204 is fixedly connected to a slider 205 slidably connected to the slide groove 202. A heat dissipation hole 206 is provided on the side wall of the placement box 1. A filter screen 207 is fixedly connected to the side wall of the placement box 1. Connection holes 208 are provided on the upper and lower sides of the placement box 1. A sponge pad is fixedly connected to the side wall of the limiting plate 204. The limiting plate 204 forms a sliding structure with the slide groove 202 through the buffer spring 203 and the slider 205. There are multiple groups of buffer springs 203. A rubber ring is fixedly connected to the inner side of the connecting hole 208, and the filter screen 207 is located on the side of the heat dissipation hole 206.

[0029] Among them: when the chip is placed in the placement box 1, the chip will squeeze the limit plate 204. At this time, the limit plate 204 will compress the buffer spring 203 and slide along the track of the slide groove 202 through the slider 205, so that the inner side of the limit plate 204 can keep in contact with the chip, fix the chip, and avoid direct contact between the limit plate 204 and the chip to cause wear of the chip through the sponge pad. When the placement box 1 shakes, the buffer spring 203 plays the role of shock absorption, thereby facilitating the fixation of chips of different sizes and improving the scope of application. Then, the wiring terminals at both ends of the chip are connected to other electronic components 8 through the connecting holes 208. The tightness of the connecting wire is ensured by the rubber ring inside the connecting hole 208. The heat generated by the chip during operation will be discharged through the heat dissipation hole 206, avoiding the damage of the chip due to the excessive temperature of the placement box 1. The filter 207 and the rubber ring inside the connection hole 208 prevent dust and water stains from entering the interior of the placement box 1, ensuring the operation of the chip and improving the service life of the chip.

[0030] Embodiment 2

[0031] Based on the first embodiment, the solution in the first embodiment is further detailed in combination with the following specific working methods. Figures 1 to 6As shown, see the following description for details: a disassembly mechanism 3 is provided on the side wall of the placement box 1, and the disassembly mechanism 3 includes a limit block 301, a return spring 302, a spring block 303, a connecting rod 304, a push block 305, a back cover 306, a groove 307, a block 308 and a limit spring 309. The inner wall of the placement box 1 and one side of the buffer spring 203 are fixedly connected to the limit block 301, the side wall of the limit block 301 is fixedly connected to the return spring 302, and one side of the return spring 302 is fixedly connected to the block 303. A connecting rod 304 runs through the interior of the placement box 1, and one side of the connecting rod 304 is fixedly connected to the push block 305. One side of the placement box 1 is snap-connected to the back cover 306, and a groove 307 is provided on the side wall of the back cover 306. The inner wall of the groove 307 is slidably connected to the block 308, and the side wall of the block 308 is fixedly connected to the back cover 306. The limit spring 309 is fixedly connected to the inner wall; further, the back cover 306 is pressed toward the inside of the placement box 1, so that the spring block 303 compresses the reset spring 302 and moves it to the inside of the limit block 301, and at the same time, the inclined surface of the block 308 contacts the placement box 1, which compresses the limit spring 309 and moves it to the inside of the groove 307. When the block 308 is flush with the connecting rod 304, the limit spring 309 will restore the elastic force to restore the block 308 to its original position, thereby facilitating the fixation of the back cover 306. When disassembling, it is only necessary to press the push block 305 to push the block 308 into the inside of the groove 307 through the connecting rod 304. At the same time, the reset spring 302 will restore the elastic force to eject the back cover 306 through the spring block 303, thereby achieving the purpose of installing and disassembling the back cover 306, which is convenient for the staff to inspect or replace the chip.

[0032] As a preferred embodiment, the side wall of the placement box 1 is fixedly connected with a mounting plate 4, screws 5 pass through the inside of the mounting plate 4, the mounting plate 4 is connected with a sign housing 6 by screws, the side wall of the sign housing 6 is fixedly connected with a display screen 7, and the inside of the sign housing 6 and on the side of the placement box 1 are fixedly connected with electronic components 8; further, the placement box 1 is installed on the sign housing 6 by screws 5 and the mounting plate 4.

[0033] As a preferred embodiment, the card block 308 forms a sliding structure between the limit spring 307 and the connecting rod 304 and the groove 309; further, the push block 305 is pressed, and the card block 308 is pushed by the connecting rod 304 to move the limit spring 309 and slide into the inside of the groove 307. At the same time, the reset spring 302 will restore the elastic force to make it pop out the back cover 306 through the spring block 303, thereby facilitating the opening of the back cover 306.

[0034] As a preferred embodiment, four groups of screws 5 are provided, and the specifications of the four groups of screws 5 are the same, and the screws 5 are provided with a cross slot; further, the cross slot at the top of the screw 5 facilitates the screw 5 to be turned by a tool.

[0035] The working process of the utility model is as follows: when using this kind of protection mechanism for the chip inside the sign, first, it is necessary to install the placement box 1 on the sign housing 6 through the screws 5 and the mounting plate 4. The cross slot at the top of the screw 5 is convenient for tightening the screw 5 with a tool. Then, the chip is placed in the placement box 1. The chip will squeeze the limit plate 204. At this time, the limit plate 204 will compress the buffer spring 203 and slide along the trajectory of the slide groove 202 through the slider 205, so that the inner side of the limit plate 204 can keep in contact with the chip to fix the chip. The sponge pad avoids direct contact between the limit plate 204 and the chip, which causes the chip to wear. When the placement box 1 shakes, the buffer spring 203 plays a role in shock absorption. Then, the wiring terminals at both ends of the chip are connected to other electronic components 8 through the connecting holes 208. The tightness of the connecting wire is guaranteed by the rubber ring inside the connecting hole 208. The heat generated by the chip when it is working will be passed through The heat is discharged through the heat dissipation hole 206 to prevent the chip from being damaged by excessive temperature in the placement box 1. The rubber ring inside the filter screen 207 and the connecting hole 208 prevents dust and water stains from entering the interior of the placement box 1. Then, the back cover 306 is pressed toward the interior of the placement box 1, so that the spring block 303 compresses the return spring 302 and moves it to the interior of the limit block 301. At the same time, the inclined surface of the block 308 contacts the placement box 1, which compresses the limit spring 309 and moves it to the interior of the groove 307. When the block 308 is flush with the connecting rod 304, the limit spring 309 will restore the elastic force to restore the block 308 to its original position, thereby facilitating the fixing of the back cover 306. When disassembling, it is only necessary to press the push block 305 to push the block 308 into the interior of the groove 307 through the connecting rod 304. At the same time, the return spring 302 will restore the elastic force to eject the back cover 306 through the spring block 303. This is the working principle of the protection mechanism for the chip inside the sign.

[0036] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A protection mechanism for a chip inside a sign, comprising a placement box (1), characterized in that; A protective mechanism (2) is arranged inside the placement box (1), and the protective mechanism (2) comprises a buffer pad (201), a slide groove (202), a buffer spring (203), a limit plate (204), a slider (205), a heat dissipation hole (206), a filter (207) and a connection hole (208); The inner wall of the placement box (1) is fixedly connected to a buffer pad (201), the inner wall of the placement box (1) is provided with a slide groove (202) located on the side of the buffer pad (201), the inner wall of the placement box (1) is fixedly connected to a buffer spring (203), the side of the buffer spring (203) away from the placement box (1) is fixedly connected to a limit plate (204), the side wall of the limit plate (204) is fixedly connected to a slider (205) slidably connected to the slide groove (202), the side wall of the placement box (1) is provided with a heat dissipation hole (206), the side wall of the placement box (1) is fixedly connected to a filter screen (207), and the upper and lower sides of the placement box (1) are provided with connection holes (208).

2. A protection mechanism for a chip inside a sign according to claim 1, characterized in that: The side wall of the placement box (1) is provided with a disassembly mechanism (3), and the disassembly mechanism (3) comprises a limit block (301), a return spring (302), a spring block (303), a connecting rod (304), a push block (305), a rear cover (306), a groove (307), a clamping block (308) and a limit spring (309).

3. A protection mechanism for a chip inside a sign according to claim 2, characterized in that: A limiting block (301) is fixedly connected to the inner wall of the placement box (1) and located on one side of the buffer spring (203); a return spring (302) is fixedly connected to the side wall of the limiting block (301); a spring block (303) is fixedly connected to one side of the return spring (302); a connecting rod (304) runs through the interior of the placement box (1); a push block (305) is fixedly connected to one side of the connecting rod (304); a rear cover (306) is snap-connected to one side of the placement box (1); a groove (307) is provided on the side wall of the rear cover (306); a clamping block (308) is slidably connected to the inner wall of the groove (307); and a limiting spring (309) is fixedly connected to the side wall of the clamping block (308) and is fixedly connected to the inner wall of the rear cover (306).

4. The protection mechanism for the chip inside the sign according to claim 1 is characterized in that: The side wall of the placement box (1) is fixedly connected to a mounting plate (4), the interior of the mounting plate (4) is penetrated by screws (5), the mounting plate (4) is connected to a sign housing (6) via the screws, the side wall of the sign housing (6) is fixedly connected to a display screen (7), and the interior of the sign housing (6) and located on the side of the placement box (1) is fixedly connected to an electronic component (8).

5. The protection mechanism for the chip inside the sign according to claim 1, characterized in that: A sponge pad is fixedly connected to the side wall of the limit plate (204); the limit plate (204) forms a sliding structure with the slide groove (202) via a buffer spring (203) and a slider (205); and a plurality of groups of buffer springs (203) are provided.

6. The protection mechanism for the chip inside the sign according to claim 1, characterized in that: A rubber ring is fixedly connected to the inner side of the connection hole (208), and the filter screen (207) is located on the side of the heat dissipation hole (206).

7. The protection mechanism for the chip inside the sign according to claim 3 is characterized by: The clamping block (308) forms a sliding structure with the groove (307) through the limit spring (309) and the connecting rod (304).

8. The protection mechanism for the chip inside the sign according to claim 4, characterized in that: The screws (5) are provided in four groups, and the specifications of the four groups of screws (5) are the same. The screws (5) are provided with a cross slot.

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