Circuit board assembly and electronic equipment

Abstract

The utility model relates to a circuit board assembly and electronic equipment, and the circuit board assembly comprises a first circuit board which is provided with a hollow area, and the hollow area is filled with a heat conduction material; the heightening plate is attached to the surface of the first circuit board and is electrically connected with the surface of the first circuit board; and the control chip is electrically connected with the block-up plate, is arranged on the surface, facing the first circuit board, of the block-up plate and is attached to the hollow area of the first circuit board. Through the circuit board assembly, heat of the control chip can be conducted out through the pad, the working stability of the control chip can be improved, and the risk of damage can be reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of circuit board structures, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the continuous development of science and technology, people's demand for electronic devices continues to increase. The development of high-performance design and application requirements and precision small-size space requires chips to continuously increase power consumption. High performance is accompanied by high power, because chips that can provide high performance must have enough energy to drive, which will generate higher and more heat. How to better dissipate heat from chips has always been a concern. Utility Model Content

[0003] Embodiments of the present disclosure provide a circuit board assembly and an electronic device.

[0004] In a first aspect, an embodiment of the present disclosure provides a circuit board assembly, the circuit board assembly comprising:

[0005] A first circuit board is provided with a hollow area, wherein the hollow area is filled with a heat conductive material;

[0006] A pad plate, attached to and electrically connected to the surface of the first circuit board;

[0007] The control chip is electrically connected to the elevation plate, disposed on a surface of the elevation plate facing the first circuit board and fitted with the hollowed-out area of ​​the first circuit board.

[0008] In some embodiments, the pad is provided with a first solder pad, the control chip is soldered to the first solder pad, and the first solder pad covers the hollowed-out area of ​​the first circuit board.

[0009] In some embodiments, the elevated plate includes a plurality of second solder pads, and the elevated plate and the first circuit board are electrically connected via the plurality of second solder pads.

[0010] In some embodiments, the second pads are spaced apart from each other.

[0011] In some embodiments, a plurality of the second pads are distributed around the first pad.

[0012] In some embodiments, a plurality of the second pads are symmetrically distributed around the first pad.

[0013] In some embodiments, the elevated plate is a second circuit board, and a first component is disposed on a side of the elevated plate facing away from the first circuit board.

[0014] In some embodiments, a second component is disposed on a surface of the first circuit board that is bonded to the elevating plate, except for a bonding position of the elevating plate.

[0015] In some embodiments, the thermally conductive material includes thermally conductive glue.

[0016] In some embodiments, a heat insulating portion is disposed on a side of the first circuit board facing away from the elevated plate, and the heat insulating portion faces the orthographic projection of the first circuit board and covers the hollowed-out area.

[0017] In a second aspect, an embodiment of the present disclosure provides an electronic device, comprising: a housing and the circuit board assembly described in the first aspect, wherein the circuit board assembly is disposed in the housing.

[0018] In some embodiments, the electronic device includes a battery, which is arranged in the shell opposite to a side of the first circuit board facing away from the elevated plate. A non-conductive thermal insulation portion is provided on a side of the first circuit board facing away from the elevated plate, and the thermal insulation portion covers the hollow area.

[0019] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0020] In the embodiments of the present disclosure, a raised plate is provided to assist in heat dissipation of the first circuit board. At the same time, a hollow area is provided on the first circuit board, and the hollow area is filled with thermally conductive material. The control chip arranged on the surface of the raised plate is bonded to the thermally conductive material so that the heat of the control chip can be dissipated, thereby improving the working stability of the control chip and reducing the risk of damage.

[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] Figure 1 is a schematic diagram of a circuit board assembly according to an exemplary embodiment Figure 1 ;

[0024] Figure 2 This is a structural example of a circuit board assembly in an embodiment of the present disclosure. Figure 2 ;

[0025] Figure 3 This is a three-dimensional structural example diagram of a circuit board assembly in an embodiment of the present disclosure;

[0026] Figure 42 is a diagram showing an example of the internal structure of an electronic device in an embodiment of the present disclosure.

[0027] The following are the descriptions of the reference numerals:

[0028] 1000, circuit board assembly; 1, first circuit board; 2, raised board; 10, hollowed-out area; 3, control chip; 4, thermal conductive material; 20, first component; 11, second component; 21, first solder pad; 22, second solder pad; 5, thermal insulation part; 6, battery. DETAILED DESCRIPTION

[0029] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0030] The present disclosure provides a circuit board assembly. Figure 1 is a schematic diagram of a circuit board assembly 1000 according to an exemplary embodiment. Figure 1 ,like Figure 1 The circuit board assembly 1000 includes:

[0031] The first circuit board 1 is provided with a hollow area 10, and the hollow area 10 is filled with a heat conductive material 4;

[0032] A pad plate 2 is attached to and electrically connected to the surface of the first circuit board 1;

[0033] The control chip 3 is electrically connected to the elevation plate 2 , is disposed on a surface of the elevation plate 2 facing the first circuit board 1 and is in contact with the hollowed-out area 10 of the first circuit board 1 .

[0034] In the embodiment of the present disclosure, the circuit board assembly 1000 can be used in any electronic device that needs to use a circuit board, such as a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The electronic device includes but is not limited to a first circuit board 1, a pad board 2 and a control chip 3.

[0035] In the disclosed embodiment, the first circuit board 1 may be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a hard-soft board, and a circuit routing structure is provided inside the first circuit board 1. The first circuit board 1 is provided with a hollow area 10, and the hollow area 10 may be located at any position of the first circuit board 1, for example, it may be located in the middle of the first circuit board 1, and the hollow area 10 is filled with a thermally conductive material 4. In some embodiments, the thermally conductive material 4 may be a ceramic material: such as alumina ceramics, silicate ceramics, etc.; in some embodiments, the thermally conductive material 4 may also be a polymer material: such as polystyrene, polystyrene-acrylonitrile, polyethylene terephthalate, etc. In other embodiments, the thermally conductive material 4 includes a thermally conductive adhesive, which is solidified in the hollow area 10 after filling. The thermally conductive adhesive has good thermal conductivity and electrical insulation.

[0036] In the disclosed embodiment, the padding plate 2 may also be a PCB board or a ceramic board. The padding plate 2 also has a circuit routing structure inside. The padding plate 2 is used to realize the layout and switching of the circuits, increase the space of the circuit board assembly 1000, to accommodate more components or improve the mechanical strength of the circuit board assembly 1000, to achieve signal isolation, and to assist in heat dissipation, etc. The shape and size of the padding plate 2 may be customized according to the design of the first circuit board 1.

[0037] Figure 2 This is a structural example of a circuit board assembly in an embodiment of the present disclosure. Figure 2 , Figure 3 is a three-dimensional structural example diagram of a circuit board assembly in an embodiment of the present disclosure, Figure 4 The following is an example diagram of the structure of the electronic device in the embodiment of the present disclosure. Figure 2-Figure 4 It should be noted that, in the embodiments of the present disclosure, the structures with the same mark in different drawings have the same functions.

[0038] In some embodiments, the elevated plate 2 is a second circuit board, and a first component 20 is disposed on a side of the elevated plate 2 facing away from the first circuit board 1 .

[0039] In some embodiments, a second component 11 is disposed on a surface of the first circuit board 1 where the raising plate 2 is affixed to the surface, except for a bonding position of the raising plate 2 .

[0040] In the embodiment of the present disclosure, the elevated board 2 is a second circuit board that can carry components, and the elevated board can also be a PCB or FPC board, etc. The first component 20 and the second component 11 can be chips, resistors or capacitors, etc., and the number of the first component 20 and the second component 11 can be one or more. In addition, in the embodiment of the present disclosure, multiple first components 20 can be arranged around the periphery of the elevated board 2, and the second component 11 of the first circuit board 2 can be electrically connected to adjacent first components 20.

[0041] It should be noted that the first component 20 can be set on the elevated plate 2 by welding or plugging, and similarly, the second component 11 can also be set on the first circuit board 1 by welding or plugging, which is not limited to this embodiment of the present disclosure.

[0042] In the disclosed embodiment, the elevated plate 2 is attached to and electrically connected to the surface of the first circuit board 1. For example, both the elevated plate 2 and the first circuit board 1 are provided with solder pads, and the elevated plate 2 and the first circuit board 1 can be electrically connected by soldering the solder pads. Providing the elevated plate 2 on the first circuit board 1 can effectively increase the space of the circuit board assembly, thereby accommodating more components.

[0043] It should be noted that in the disclosed embodiment, through holes and buried holes can be reasonably set on the elevated board 2, so as to increase the heat dissipation effect of the elevated board 2 and the first component 20 thereon on the basis of realizing the connection between the circuit inside the elevated board 2 and the circuit between the elevated board 2 and the first circuit board 1. Among them, the circuit inside the elevated board 2 is the circuit of the first component 20 on the elevated board 2.

[0044] In the disclosed embodiment, the control chip 3 may be a storage chip (Universal Flash Storage, UFS), or a power control chip, a display control chip, a communication control chip, etc., which is not limited in the disclosed embodiment. The control chip 3 is electrically connected to the elevated board 2, for example, the control chip 3 may be plugged or welded to the elevated board 2.

[0045] In the disclosed embodiment, the control chip 3 is arranged on the surface facing the first circuit board 1 and is attached to the hollow area 10 of the first circuit board 1. Since the hollow area 10 of the first circuit board 1 is filled with thermal conductive material 4, the thermal conductive material 4 can dissipate the heat of the control chip 3.

[0046] It can be understood that in the embodiment of the present disclosure, the heat dissipation of the first circuit board can be assisted by providing a raised plate. At the same time, the first circuit board is provided with a hollow area, and the hollow area is filled with thermally conductive material. The control chip arranged on the surface of the raised plate is bonded with the thermally conductive material so that the heat of the control chip can be discharged, which can improve the working stability of the control chip and reduce the risk of damage.

[0047] In some embodiments, the pad 2 is provided with a first soldering pad 21 , the control chip 3 is soldered to the first soldering pad 21 , and the first soldering pad 21 covers the hollowed-out area 10 of the first circuit board 1 .

[0048] In the disclosed embodiment, the control chip 3 can be soldered to the first soldering pad 21 of the elevated plate 2, for example, by means of solder paste. Since the first soldering pad 21 covers the hollow area 10 of the first circuit board 1, the thermally conductive material 4 filled in the hollow area 10 can fully dissipate the heat of the control chip 3. Thus, in this way, the heat dissipation effect of the control chip 3 can be improved.

[0049] In some embodiments, the elevation plate 2 includes a plurality of second solder pads 22 , and the elevation plate 2 and the first circuit board 1 are electrically connected via the plurality of second solder pads 22 .

[0050] As mentioned above, the raising plate 2 and the first circuit board 1 can be welded to form an electrical connection. In the embodiment of the present disclosure, a plurality of second solder pads 22 are arranged on the raising plate 2. The plurality of second solder pads 22 can be arranged adjacent to each other or at intervals. The raising plate 2 and the first circuit board 1 are electrically connected via the plurality of second solder pads 22, which can improve the stability of the connection between the raising plate 2 and the first circuit board 1.

[0051] It should be noted that in the disclosed embodiment, a pad may be provided outside the hollowed-out area on the side of the first circuit board 1 facing the elevated board 2. For example, the first circuit board 1 includes a plurality of third pads, one third pad corresponding to one second pad. In the disclosed embodiment, the first pad 21, the second pad 22, and the third pad may all be copper foil pads. Since copper foil has good conductivity, it can improve the working stability and reliability of the first circuit board 1 and the elevated board 2.

[0052] In some embodiments, the second pads 22 are arranged at intervals.

[0053] In the disclosed embodiment, the second soldering pads 22 are arranged at intervals to reduce the internal stress between the soldering pads. By arranging the second soldering pads 22 at intervals, the soldering coverage area between the raised plate 2 and the first circuit board 1 is enlarged, thereby improving the stability of the soldering.

[0054] In some embodiments, a plurality of the second pads 22 are distributed around the first pad 21 .

[0055] In the embodiment of the present disclosure, as mentioned above, the elevated plate 2 and the first circuit board 1 are electrically connected via a plurality of second solder pads 22, and the first circuit board 1 has no solder pad in the hollow area 10, while the first solder pad 21 is arranged opposite to the hollow area 10. Then, the plurality of second solder pads 22 are distributed in the circumference of the first solder pad 21. Compared with the method of only arranging the second solder pad 22 on one side of the first solder pad 21, the stability of the connection between the first circuit board 1 and the elevated plate 2 can be improved.

[0056] In some embodiments, a plurality of the second pads 22 are symmetrically distributed around the first pad 21 .

[0057] In the disclosed embodiment, by symmetrically arranging the second solder pads 22, the tension on the solder surface can be balanced, and soldering defects such as cold soldering and false soldering can be reduced, thereby improving the stability of the circuit board assembly.

[0058] In some embodiments, a heat insulating portion 5 is disposed on a side of the first circuit board 1 facing away from the elevated plate 2 , and the heat insulating portion 5 covers the hollowed-out area 10 .

[0059] In the disclosed example, the thermal insulation part 5 can be formed of a thermal insulation material with conductive properties, or can be formed of a thermal insulation material with non-conductive properties, such as graphene or copper foil, etc. However, it should be noted that if electronic components are attached to the side of the first circuit board 1 facing away from the raised plate 2, the thermal insulation part 5 is configured to be formed of a non-conductive thermal insulation material.

[0060] It can be understood that in the embodiment of the present disclosure, by providing an insulating portion 5 covered with a thermally conductive material 4 on the side facing away from the raised plate 2, the heat dissipated by the control chip 3 can be reduced from being transferred to other modules in the electronic device and affecting the operation of other modules. In this way, the stability of the operation of the electronic device can be improved.

[0061] In the embodiment of the present disclosure, the circuit board assembly 1000 can be manufactured by the following process steps: S1: putting the elevated board 2 (such as a PCB board) into a printer; S2: the printer realizes solder paste printing on the elevated board 2; S3: using a solder paste detection device to detect the printed form of the solder paste; S4: using a placement machine to accurately mount components (including the control chip 3) on the predetermined position of the tinned components on the PAD through position picking; S5: using AOI automatic optical detection (Automated Optical Inspection) Optical Inspection (AOI) is used to inspect the component patches; S6: reflow soldering is performed to form the soldering of components and realize the mechanical and electrical connection between the soldering end of the surface mounted components and the soldering pad; S7: the soldering of components is inspected again through AOI automatic optical inspection; S8: X-ray inspection and appearance inspection; S9: the attached raised plate 2 is placed on a plate and sent to the placement machine as a material for patching; S9: the S1-S8 process is repeated to solder the raised plate 2 with the device soldered to the first circuit board 1; S10: the first circuit board 1 is filled with thermal conductive glue and solidified; S11: the labeling machine equipment is used to automatically attach the thermal insulation adhesive material; S12: repeat the S8 inspection. Through the above steps, the aforementioned Figure 1-Figure 3 circuit board components.

[0062] In an embodiment of the present disclosure, an electronic device is also provided. For example, the electronic device is the aforementioned mobile phone, tablet computer, laptop computer, wearable device (such as a smart watch, smart bracelet, smart ring, smart glasses, etc.), vehicle-mounted terminal, etc. The electronic device includes the aforementioned circuit board assembly 1000 in the shell, and the circuit board assembly 1000 is arranged in the shell.

[0063] Optionally, in the embodiment of the present disclosure, the electronic device may further include a display screen module, the display screen module cooperates with the housing to form a housing space, and the circuit board assembly 1000 is disposed in the housing space. In the embodiment of the present disclosure, the circuit board assembly 1000 may be connected to the display screen module and used to control the working state of each electronic component of the electronic device including the display screen module. Optionally, in the embodiment of the present disclosure, the circuit board assembly 1000 in the electronic device may also be used to control other functional modules, such as a speaker module or a camera module, etc.

[0064] It is understandable that by disposing the circuit assembly 1000 of the embodiment of the present disclosure in an electronic device, better heat dissipation can be achieved within a limited space size, thereby improving the working stability of the electronic device.

[0065] In some embodiments, the electronic device includes a battery 6, which is arranged in the shell opposite to the side of the first circuit board 1 facing away from the elevated plate 2. The side of the first circuit board 1 facing away from the elevated plate 2 is provided with a non-conductive thermal insulation part 5, and the thermal insulation part 5 covers the hollow area.

[0066] As mentioned above, if electronic components are attached to the side of the first circuit board 1 facing away from the elevated plate 2, the thermal insulation portion 5 is configured to be formed of a non-conductive thermal insulation material. In this embodiment, the side of the first circuit board 1 away from the elevated plate 2 is a battery 6. By providing a non-conductive thermal insulation portion 5, heat transfer to the battery 6 can be reduced, thereby improving the stability of the operation of the electronic device.

[0067] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the utility model disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The description and examples are to be regarded as exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0068] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A circuit board assembly, characterized in that: include: A first circuit board is provided with a hollow area, wherein the hollow area is filled with a heat conductive material; A pad plate, attached to and electrically connected to the surface of the first circuit board; The control chip is electrically connected to the elevation plate, disposed on a surface of the elevation plate facing the first circuit board and fitted with the hollowed-out area of ​​the first circuit board.

2. The circuit board assembly according to claim 1, characterized in that: The pad is provided with a first pad, the control chip is soldered to the first pad, and the first pad covers the hollowed-out area of ​​the first circuit board.

3. The circuit board assembly according to claim 2, characterized in that: The elevation plate includes a plurality of second solder pads, and the elevation plate and the first circuit board are electrically connected via the plurality of second solder pads.

4. The circuit board assembly according to claim 3, characterized in that: The second pads are arranged at intervals.

5. The circuit board assembly according to claim 3, characterized in that: A plurality of the second pads are distributed in a circumferential direction of the first pad.

6. The circuit board assembly according to claim 5, characterized in that: The plurality of second pads are symmetrically distributed around the first pad.

7. The circuit board assembly according to claim 1, characterized in that: The elevated plate is a second circuit board, and a first component is disposed on a side of the elevated plate facing away from the first circuit board.

8. The circuit board assembly according to claim 1, wherein: A second component is disposed on a surface of the first circuit board that is bonded to the elevating plate, except for a bonding position of the elevating plate.

9. The circuit board assembly according to claim 1, characterized in that: The thermally conductive material includes thermally conductive glue.

10. The circuit board assembly according to claim 1, characterized in that: A heat insulating portion is provided on a side of the first circuit board facing away from the raising plate, and the heat insulating portion faces the orthographic projection of the first circuit board and covers the hollowed-out area.

11. An electronic device, characterized in that: The electronic device comprises a housing and a circuit board assembly according to any one of claims 1 to 10, wherein the circuit board assembly is arranged in the housing.

12. The electronic device according to claim 11, characterized in that: The electronic device includes a battery, which is arranged in the shell opposite to a side of the first circuit board facing away from the elevated plate. A non-conductive heat insulating portion is provided on a side of the first circuit board facing away from the elevated plate, and the heat insulating portion covers the hollowed-out area.

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