PCB (Printed Circuit Board) capable of preventing bonding pad from warping
By setting the extension part of the insulating green oil layer and the ink layer QR code on the PCB board to cover the pads, the problem of pad curling is solved, the defect rate and production cost are reduced, and the product competitiveness is improved.
Patent Information
- Application Number
- CN202420330793.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-21
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-02-21
AI Technical Summary
During the welding process of traditional PCB boards, exposed pads are easily pushed by the solder pen, causing the pads to be scrapped, and the defect rate and production costs are increased.
The opening area of the insulating green oil layer is set at the pad position, and the extension covers the pad. The black ink layer and the white ink layer are laser-formed into a QR code to ensure that the extension covers the pad and prevents curling.
Effectively prevent the pad from curling during welding, reduce the defect rate, improve product competitiveness, and reduce labor costs by optimizing the ink layer thickness and laser technology.
Smart Images
Figure CN222192649U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printed circuit boards, and more specifically to a PCB board capable of preventing pads from warping. Background Art
[0002] Traditional PCB boards will have a layer of insulating green oil on the pads. The insulating green oil layer will have windows and will not cover the pads, so as to expose the pads for welding with other components. However, when welding components, the soldering pen will sometimes hit the edge of the pads, which can easily cause the pads to warp, and then cause the pads to be scrapped and unusable, which increases the defective rate of PCB boards and reduces product competitiveness. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to prevent the soldering pad of a PCB board from being lifted up by a soldering pen during soldering.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides a PCB board for preventing pads from warping, comprising a PCB body, at least one pad being arranged on the PCB body, an insulating green oil layer being arranged on the outer surface of the PCB body, the insulating green oil layer located at each of the pads retaining an opening area, the insulating green oil layer located at the opening area extending toward the pad with at least one extension portion, the extension portion covering and pressing the pad, a two-dimensional code laser area being arranged on the upper surface of the insulating green oil layer, a black ink layer and a white ink layer arranged on the black ink layer being arranged on the upper surface of the insulating green oil layer located on the two-dimensional code laser area, a two-dimensional code being formed on the white ink layer by laser.
[0006] As a preferred implementation of the PCB board for preventing the pad from warping provided by the utility model, there are two pads, and the two opening areas are connected to each other.
[0007] As a preferred implementation of the PCB board for preventing pad warping provided by the utility model, two extension parts are arranged on each of the opening areas.
[0008] As a preferred implementation of the PCB board for preventing pad warping provided by the utility model, the two extension parts are respectively arranged on both sides of the opening area.
[0009] As a preferred embodiment of the PCB board for preventing pad warping provided by the utility model, the PCB body includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.
[0010] As a preferred embodiment of the PCB board for preventing the solder pad from warping provided by the utility model, the PCB body also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a thermal conductive layer in contact with the circuit layer and the metal heat dissipation layer.
[0011] As a preferred implementation of the PCB board for preventing pad warping provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
[0012] As a preferred implementation of the PCB board for preventing pad warping provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.
[0013] As a preferred embodiment of the PCB board for preventing pad warping provided by the utility model, the thickness of the black ink layer is 30 μm. ～ 40μm.
[0014] As a preferred embodiment of the PCB board for preventing pad warping provided by the utility model, the thickness of the white ink layer is 10 μm ～ 20μm.
[0015] The utility model has the following beneficial effects:
[0016] Since the insulating green oil layer located in the opening area extends toward the pad with at least one extension portion, and the extension portion covers and presses the pad, when the soldering pen reaches the edge of the pad, the pad is covered and pressed by the extension portion of the insulating green oil layer, so that the pad will not warp, thereby preventing the pad from warping during the soldering process of the device, thereby avoiding the pad being scrapped and unusable, further improving the defective rate of the PCB board, reducing the production cost of the PCB board, and improving the competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 The utility model provides a structural schematic diagram of a PCB board for preventing pads from warping.
[0019] Figure 2 for Figure 1 Schematic diagram of the decomposition structure.
[0020] Figure 3 for Figure 1 Schematic diagram of the improved structure of the middle insulating green oil layer.
[0021] Figure 4 This is a schematic diagram of the structure of Example 2.
[0022] Description of Figure Numbers:
[0023] PCB body 1; pad 2; insulating green ink layer 3; opening area 31; extension portion 32; black ink layer 301; white ink layer 302;
[0024] Base material layer 11; circuit layer 12; metal heat dissipation layer 13; through hole 14. DETAILED DESCRIPTION
[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0027] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0028] The utility model provides a PCB board for preventing pads from warping, comprising a PCB body, at least one pad being arranged on the PCB body, an insulating green oil layer being arranged on the outer surface of the PCB body, the insulating green oil layer located at each pad retaining an opening area, the insulating green oil layer located at the opening area extending toward the pad with at least one extension portion, the extension portion covering and pressing the pad, a two-dimensional code laser area being arranged on the upper surface of the insulating green oil layer, a black ink layer and a white ink layer arranged on the black ink layer being arranged on the upper surface of the insulating green oil layer located on the two-dimensional code laser area, and a two-dimensional code being formed on the white ink layer by laser.
[0029] Since the insulating green oil layer located in the opening area extends toward the pad with at least one extension portion, and the extension portion covers and presses the pad, when the soldering pen reaches the edge of the pad, the pad is covered and pressed by the extension portion of the insulating green oil layer, so that the pad will not warp, thereby preventing the pad from warping during the soldering process of the device, thereby avoiding the pad being scrapped and unusable, further improving the defective rate of the PCB board, reducing the production cost of the PCB board, and improving the competitiveness of the product.
[0030] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0031] Example 1
[0032] See also Figures 1 to 3, a PCB board for preventing pads from warping provided by the utility model, comprising a PCB body 1, at least one pad 2 is arranged on the PCB body 1, an insulating green oil layer 3 is arranged on the outer surface of the PCB body 1, the insulating green oil layer 3 located at each pad 2 retains an opening area 31, the opening area 31 does not brush the insulating green oil layer 3, that is, the insulating green oil layer 3 will open a window and not cover the pad 2, so that the pad 2 is exposed, the insulating green oil layer 3 located in the opening area 31 extends toward the pad 2 with at least one extension 32, the extension 32 covers and presses the pad 2, in this embodiment, each opening area 31 is provided with two extensions 32, the pad 2 has two, and the two opening areas 31 are connected to each other. A two-dimensional code laser area is arranged on the upper surface of the insulating green oil layer 3, and a black ink layer 301 and a white ink layer 302 arranged on the black ink layer 301 are arranged on the upper surface of the insulating green oil layer 3 located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer 302 by laser. Since the insulating green oil layer 3 located in the opening area 31 extends toward the pad 2 with at least one extension 32, and the extension 32 covers and presses the pad 2, when the soldering pen reaches the edge of the pad 2, the pad 2 is covered and pressed by the extension 32 of the insulating green oil layer 3, so that the pad 2 will not be lifted, thereby preventing the pad 2 from lifting during the soldering process, thereby avoiding the pad 2 from being scrapped and unusable, so that the defective rate of the PCB board is further improved, the production cost of the PCB board is reduced, and the competitiveness of the product is improved. Since two layers of ink are set, the surface white ink layer 302 is lasered off by laser, exposing the bottom black ink layer 301, and the area where the laser is lasered is displayed in black. The two-dimensional code generated in this way has a good contrast effect and is easy to scan. At the same time, the two-dimensional code will not fall off and be damaged, preventing the two-dimensional code from being invalid, and greatly reducing the labor cost.
[0033] Furthermore, two extension portions 32 are respectively arranged on both sides of the opening area 31 so that the extension portions 32 can press the two ends of the pad 2. In other embodiments, more extension portions 32 can also be arranged to ensure that the pad 2 does not warp.
[0034] Furthermore, the thickness of the black ink layer 301 is 30 μm. ～ 40 μm. The thickness of the white ink layer 302 is 10 μm ～ 20μm. This thickness is the thickness that the commonly used ultraviolet laser can just penetrate, and there is no dust around after the laser irradiation, which has the advantages of high rhythm and efficiency. The reason why the thickness of the lower black ink layer 301 is thicker than the thickness of the upper white ink layer 302 is to avoid laser power energy fluctuations and prevent the black ink layer 301 from being penetrated by the laser and causing damage to the internal layer of the PCB body 1.
[0035] Example 2
[0036] See also Figure 4 As a further optimization scheme of Example 1, in this embodiment, the PCB body 1 includes a substrate layer 11, a circuit layer 12 arranged on the upper surface of the substrate layer 11, and a metal heat dissipation layer 13 arranged on the lower surface of the substrate layer 11. The arrangement method can be that the circuit layer 12 and the metal heat dissipation layer 13 are respectively attached to the substrate layer 11 by double-sided adhesive. Since the thickness of the substrate layer 11 is relatively thin, the heat on the PCB body 1 can be diffused to the metal heat dissipation layer 13 through the substrate layer 11. The metal heat dissipation layer 13 can effectively increase the heat dissipation area of the PCB body 1 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the PCB body 1. The substrate layer 11 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 13 can be a copper foil layer.
[0037] Furthermore, the PCB body 1 further includes at least one through-hole 14 penetrating the substrate layer 11, the circuit layer 12 and the metal heat dissipation layer 13, and the inner wall of the through-hole 14 is provided with a heat-conducting layer in contact with the circuit layer 12 and the metal heat dissipation layer 13. By utilizing the good thermal conductivity of the through-hole 14, the circuit layer 12 and the metal heat dissipation layer 13 on both sides of the substrate layer 11 can be electrically connected to play a good thermal conductivity function, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.
[0038] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 14. The heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 12 and is also in contact with the heat-conducting layer in the through hole 14, so that the circuit layer 12 and the metal heat dissipation layer 13 can be connected to the external heat-conducting structure through the through hole 14, so that the heat in the PCB body 1 is diffused to the external heat-conducting structure through the heat conductor in the through hole 14, so as to further improve the heat dissipation efficiency of the PCB body 1. Preferably, in order to enable the through hole 14 to be connected to the external heat-conducting structure, the through hole 14 is disposed at the edge of the PCB body 1.
[0039] Furthermore, the metal heat dissipation layer 13 is a uniform heat dissipation structure, and its structure can be any one of a mesh structure, a strip structure, a wavy structure or a honeycomb structure. Through the uniform heat dissipation structure, the heat dissipation effect can be better improved.
[0040] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0041] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A PCB board for preventing pad warping, characterized in that: It includes a PCB body, at least one soldering pad is arranged on the PCB body, an insulating green oil layer is arranged on the outer surface of the PCB body, the insulating green oil layer located at each soldering pad retains an opening area, the insulating green oil layer located at the opening area extends toward the soldering pad with at least one extension part, the extension part covers and presses the soldering pad, a two-dimensional code laser area is arranged on the upper surface of the insulating green oil layer, a black ink layer and a white ink layer arranged on the black ink layer are arranged on the upper surface of the insulating green oil layer located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer by laser.
2. The PCB board for preventing pad warping according to claim 1, characterized in that: There are two pads, and the two opening areas are connected to each other.
3. The PCB board for preventing pad warping according to claim 1, characterized in that: Two extension parts are arranged on each of the opening areas.
4. The PCB board for preventing pad warping according to claim 3, characterized in that: The two extension portions are respectively arranged on two sides of the opening area.
5. The PCB board for preventing pad warping according to claim 1, characterized in that: The PCB body comprises a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.
6. The PCB board for preventing pad warping according to claim 5, characterized in that: The PCB body further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.
7. The PCB board for preventing pad warping according to claim 6, characterized in that: A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
8. The PCB board for preventing pad warping according to claim 5, characterized in that: The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.
9. The PCB board for preventing pad warping according to claim 1, characterized in that: The thickness of the black ink layer is 30 μm ～ 40μm.
10. The PCB board for preventing pad warping according to claim 1, characterized in that: The thickness of the white ink layer is 10 μm ～ 20μm.