Heat pipe conduction heat dissipation device

Abstract

The utility model belongs to the technical field of heat management, and relates to a heat pipe conduction heat dissipation device. The heat pipe conduction heat dissipation device comprises a porous heat pipe and a radiator, an inserting groove is formed in the bottom of the radiator, one end of the porous heat pipe is inserted into the inserting groove in a sealed mode, and the other end of the porous heat pipe is closed; the bottom of the radiator is further provided with a first flow guide hole and a second flow guide hole located below the first flow guide hole. The porous heat pipe is provided with a first micro-channel hole and a second micro-channel hole located below the first micro-channel hole. The first micro-channel hole, the first flow guide hole, the second flow guide hole and the second micro-channel hole are sequentially connected end to end and are communicated to form a circulating channel. According to the heat pipe conduction heat dissipation device, the heat resistance between the radiator and the porous heat pipe can be reduced to a lower level, so that the heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of thermal management, and in particular relates to a heat pipe conduction and heat dissipation device. Background Art

[0002] In the fields of electric vehicles, industrial electronics, consumer electronics, computer rooms, data servers, etc., equipment or devices will generate a lot of heat when working. If this heat cannot be dissipated in time, the temperature of the equipment or the ambient temperature will continue to rise. High temperature will seriously affect the operating stability and life of the equipment. Therefore, various thermal managements are required to make the equipment work within a suitable temperature range. Thermal management includes heat transfer and heat dissipation. One of the heat transfer devices is a porous heat pipe. A porous heat pipe is only a heat conduction device, not a heat pipe conduction and heat dissipation device. To apply heat pipes to heat dissipation, a certain heat pipe conduction and heat dissipation device, such as a heat sink, must be installed at the heat dissipation end of the heat pipe.

[0003] The main method currently used is to combine the heat pipe and the heat sink by pasting thermally conductive silicone at the heat dissipation end. This method has a large thermal resistance, which greatly reduces the heat dissipation efficiency. In order to improve the heat dissipation efficiency, it is necessary to increase the area of ​​the heat sink or increase the flow rate of the refrigerant. Utility Model Content

[0004] The technical problem to be solved by the utility model is: to provide a heat pipe conduction heat dissipation device in view of the technical problem that the heat pipe and the heat sink are combined by pasting heat-conducting silicone at the heat dissipation end, which greatly reduces the heat dissipation efficiency.

[0005] In order to solve the above technical problems, the embodiment of the utility model provides a heat pipe conduction heat dissipation device, including a porous heat pipe and a radiator, wherein a plug-in slot is provided at the bottom of the radiator, one end of the porous heat pipe is sealed and plugged into the plug-in slot, and the other end of the porous heat pipe is sealed;

[0006] The bottom of the radiator is also provided with a first guide hole and a second guide hole located below the first guide hole, and the porous heat pipe is provided with a first microchannel hole and a second microchannel hole located below the first microchannel hole;

[0007] The first microchannel hole, the first flow guide hole, the second flow guide hole and the second microchannel hole are sequentially connected end to end and communicated to form a circulation channel.

[0008] According to the heat pipe conduction heat dissipation device of the embodiment of the utility model, a first flow guide hole and a second flow guide hole arranged up and down are set at the bottom of the radiator, and a first microchannel hole and a second microchannel hole arranged up and down are set on the porous heat pipe, and the first microchannel hole, the first flow guide hole, the second flow guide hole and the second microchannel hole are connected end to end and connected in sequence to form a circulation channel. In this way, the bottom of the radiator has similar characteristics to the porous heat pipe. Compared with the gluing method of the prior art, the thermal resistance between the radiator and the porous heat pipe can be reduced to a lower level, so that the efficiency of heat dissipation is greatly improved. And under the same heat dissipation efficiency, the area of ​​the radiator can be reduced or the flow rate of the refrigerant can be reduced, which is conducive to cost reduction and is conducive to the miniaturization of the heat pipe conduction heat dissipation device.

[0009] Optionally, the first flow guide hole, the second flow guide hole, the first microchannel hole and the second microchannel hole are respectively provided in plurality;

[0010] The first flow guide hole and the second flow guide hole are connected in a one-to-one or one-to-many manner, the first microchannel hole and the second microchannel hole are connected in a one-to-one or one-to-many manner, the first flow guide hole and the first microchannel hole are connected in a one-to-one or one-to-many manner, and the second flow guide hole and the second microchannel hole are connected in a one-to-one or one-to-many manner.

[0011] Optionally, the central axes of the plurality of first flow guide holes are all located in a first plane, and the central axes of the plurality of second flow guide holes are all located in a second plane;

[0012] The central axes of the plurality of first microchannel holes are all located in a third plane, and the central axes of the plurality of second microchannel holes are all located in a fourth plane;

[0013] Optionally, the first plane is parallel to the second plane; the third plane is parallel to the fourth plane.

[0014] Optionally, a tooth-like structure is disposed on the inner side wall of the first microchannel hole and / or the second microchannel hole.

[0015] Optionally, a tooth-shaped structure is disposed on the inner side wall of the first guide hole and / or the second guide hole.

[0016] Optionally, the porous heat pipe is sealed and connected to the inner wall of the plug-in slot by welding or gluing.

[0017] Optionally, the cross-sectional shape of the plug-in slot is consistent with the cross-sectional shape of the porous heat pipe, and the cross-sectional dimension of the plug-in slot is slightly larger than the cross-sectional dimension of the porous heat pipe.

[0018] Optionally, the porous heat pipe is flat.

[0019] Optionally, the radiator is a fin, a liquid-cooled heat exchanger, a water-cooled plate, a copper plate or an aluminum plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of a heat pipe conduction and heat dissipation device provided by an embodiment of the utility model;

[0021] Figure 2 yes Figure 1 A cross-sectional view along a direction perpendicular to the axis of the porous heat pipe;

[0022] Figure 3 yes Figure 1 A cross-sectional view along the axial direction of the porous heat pipe;

[0023] Figure 4 yes Figure 3 The enlarged schematic diagram of point A in the middle;

[0024] Figure 5 yes Figure 3 A magnified schematic diagram of point B in the middle.

[0025] The reference numerals in the specification are as follows:

[0026] 1. porous heat pipe; 11. first microchannel hole; 12. second microchannel hole;

[0027] 2. Radiator; 21. Plug slot; 22. First air guide hole; 23. Second air guide hole. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0029] like Figure 1 and Figure 2 As shown, the heat pipe conduction and heat dissipation device provided by the embodiment of the utility model includes a porous heat pipe 1 and a radiator 2. The bottom of the radiator 2 is provided with a plug-in groove 21. One end of the porous heat pipe 1 is sealed and plugged into the plug-in groove 21, and the other end of the porous heat pipe 1 is closed.

[0030] The bottom of the heat sink 2 is further provided with a first guide hole 22 and a second guide hole 23 located below the first guide hole 22 , and the porous heat pipe 1 is provided with a first microchannel hole 11 and a second microchannel hole 12 located below the first microchannel hole 11 .

[0031] The first microchannel hole 11, the first flow guide hole 22, the second flow guide hole 23 and the second microchannel hole 12 are sequentially connected end to end and communicated to form a circulation channel.

[0032] Specifically, the first end of the first flow guide hole 22 is connected to the first end of the second flow guide hole 23, the second end of the first flow guide hole 22 is connected to the first end of the first microchannel hole 11, the second end of the second flow guide hole 23 is connected to the first end of the second microchannel hole 12, and the second end of the first microchannel hole 11 is connected to the second end of the second microchannel hole 12, thereby achieving end-to-end connection and communication between the first microchannel hole 11, the first flow guide hole 22, the second flow guide hole 23 and the second microchannel hole 12.

[0033] The heat pipe conduction heat dissipation device provided by the embodiment of the utility model is provided with a first flow guide hole 22 and a second flow guide hole 23 arranged vertically at the bottom of the radiator 2, and a first microchannel hole 11 and a second microchannel hole 12 arranged vertically are provided on the porous heat pipe 1, and the first microchannel hole 11, the first flow guide hole 22, the second flow guide hole 23 and the second microchannel hole 12 are connected end to end and connected in sequence to form a circulation channel. In this way, the bottom of the radiator 2 has similar characteristics to the porous heat pipe 1. Compared with the gluing method of the prior art, the thermal resistance between the radiator 2 and the porous heat pipe 1 can be reduced to a lower level, so that the efficiency of heat dissipation is greatly improved. And under the same heat dissipation efficiency, the area of ​​the radiator 2 can be reduced or the flow rate of the refrigerant can be reduced, which is conducive to reducing costs and is conducive to miniaturization of the heat pipe conduction heat dissipation device.

[0034] In the heat pipe conduction and heat dissipation device, the heat absorbing end (closed end) of the porous heat pipe 1 is connected to a heating element, and the heat of the heating element is conducted to the porous heat pipe 1, so that the refrigerant in the heat absorbing end of the porous heat pipe 1 is heated and vaporized to form a gas, which absorbs a large amount of heat during the vaporization process. The gas enters the heat dissipation end (the end plugged into the radiator 2) of the porous heat pipe 1 from the heat absorbing end of the porous heat pipe 1 through the first microchannel hole 11, and contacts the bottom of the radiator 2 through the first guide hole 22, and the gas is cooled and liquefied and releases heat. The heat is dissipated by the radiator 2. Then, the cooled liquid refrigerant flows back to the heat absorbing end of the porous heat pipe 1 through the second guide hole 23 and the second microchannel hole 12. This cycle is repeated to conduct the heat of the heating element through the porous heat pipe 1 and then dissipate it through the radiator 2.

[0035] In one embodiment, if Figures 2 to 5 As shown, the first flow guide hole 22, the second flow guide hole 23, the first micro-channel hole 11 and the second micro-channel hole 12 can be provided in plurality.

[0036] At this time, the first guide hole 22 and the second guide hole 23 are connected in a one-to-one or one-to-many manner, the first microchannel hole 11 and the second microchannel hole 12 are connected in a one-to-one or one-to-many manner, the first guide hole 22 and the first microchannel hole 11 are connected in a one-to-one or one-to-many manner, and the second guide hole 23 and the second microchannel hole 12 are connected in a one-to-one or one-to-many manner.

[0037] The two connected holes can be connected in a one-to-one manner or a one-to-many manner, as long as a circulation channel can be formed between the porous heat pipe 1 and the radiator 2 .

[0038] In one embodiment, if Figures 2 to 5 As shown, the central axes of the plurality of first air guide holes 22 are all located in the first plane, and the central axes of the plurality of second air guide holes 23 are all located in the second plane, so that the first air guide holes 22 and the second air guide holes 23 are arranged on the radiator 2 .

[0039] The central axes of the first microchannel holes 11 are all located in the third plane, and the central axes of the second microchannel holes 12 are all located in the fourth plane, so that the first microchannel holes 11 and the second microchannel holes 12 are arranged on the porous heat pipe 1.

[0040] In one embodiment, if Figures 2 to 5 As shown, the first plane is parallel to the second plane. The third plane is parallel to the fourth plane, so as to realize the arrangement of each guide hole (the first guide hole 22 and the second guide hole 23) and each microchannel hole (the first microchannel hole 11 and the second microchannel hole 12), and realize the formation of the circulation channel at the same time.

[0041] In one embodiment, if Figures 2 to 5 As shown, a tooth-like structure is disposed on the inner side wall of the first micro-channel hole 11 and / or the second micro-channel hole 12 .

[0042] A tooth-shaped structure is disposed on the inner side wall of the first guide hole 22 and / or the second guide hole 23 .

[0043] When no tooth-like structure is provided on the inner side wall of a certain hole (the first micro-channel hole 11 , the second micro-channel hole 12 , the first flow-guiding hole 22 and / or the second flow-guiding hole 23 ), the inner side wall of the hole is smooth.

[0044] On the one hand, the tooth-like structure can increase the contact area between the refrigerant and each microchannel hole and / or each guide hole without increasing the aperture of each microchannel hole and / or each guide hole, thereby further improving the heat conduction efficiency. On the other hand, the tooth-like structure of the inner wall of each microchannel hole and / or each guide hole is similar to a capillary structure, so that each microchannel hole and / or each guide hole forms a similar capillary hole, which is conducive to the liquefied refrigerant to flow back from the heat dissipation end to the heat absorption end to form a cycle.

[0045] In one embodiment, if Figures 2 to 5 As shown, a single tooth of the tooth-like structure is in an arc shape, and the entire tooth-like structure is in a wavy groove shape.

[0046] In other embodiments not shown in the figures, a single tooth of the tooth-like structure may also be in other shapes, such as a triangle or a trapezoid.

[0047] In one embodiment, the cross-sectional shape of the plug-in slot 21 is consistent with the cross-sectional shape of the porous heat pipe 1, and the cross-sectional size of the plug-in slot 21 is slightly larger than the cross-sectional size of the porous heat pipe 1, so that the porous heat pipe 1 can be inserted into the plug-in slot 21 with clearance. After one end of the porous heat pipe 1 is inserted into the plug-in slot 21, the porous heat pipe 1 and the inner wall of the plug-in slot 21 are sealed and connected by welding or gluing.

[0048] The cross section of the porous heat pipe 11 refers to the cross section perpendicular to the extension direction of the porous heat pipe 11, and the extension direction of each microchannel hole (the first microchannel hole 11 and the second microchannel hole 12) and each guide hole (the first guide hole 22 and the second guide hole 23) is consistent with the extension direction of the porous heat pipe 11, or is relatively inclined, or relatively curved.

[0049] In one embodiment, if Figures 1 to 5 As shown, the porous heat pipe 1 is flat, that is, the porous heat pipe 1 is a microchannel porous flat tube, and a certain amount of refrigerant is filled in the porous heat pipe 1 as a working medium. The refrigerant has a low boiling point so that it can vaporize when absorbing heat from the heating element.

[0050] In one embodiment, if Figures 1 to 5 As shown, the radiator 2 is a fin. In other embodiments not shown in the figure, the radiator can also be a liquid-cooled heat exchanger, a water-cooled plate, a copper plate or an aluminum plate or other elements capable of dissipating heat.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat pipe conduction heat dissipation device, characterized in that: It includes a porous heat pipe and a radiator, wherein a plug-in slot is provided at the bottom of the radiator, one end of the porous heat pipe is sealed and plugged into the plug-in slot, and the other end of the porous heat pipe is sealed; The bottom of the radiator is also provided with a first guide hole and a second guide hole located below the first guide hole, and the porous heat pipe is provided with a first microchannel hole and a second microchannel hole located below the first microchannel hole; The first microchannel hole, the first flow guide hole, the second flow guide hole and the second microchannel hole are sequentially connected end to end and communicated to form a circulation channel.

2. The heat pipe conduction and heat dissipation device according to claim 1, characterized in that: The first flow guide hole, the second flow guide hole, the first microchannel hole and the second microchannel hole are respectively provided in plurality; The first flow guide hole and the second flow guide hole are connected in a one-to-one or one-to-many manner, the first microchannel hole and the second microchannel hole are connected in a one-to-one or one-to-many manner, the first flow guide hole and the first microchannel hole are connected in a one-to-one or one-to-many manner, and the second flow guide hole and the second microchannel hole are connected in a one-to-one or one-to-many manner.

3. The heat pipe conduction and heat dissipation device according to claim 2, characterized in that: The central axes of the plurality of first flow guide holes are all located in a first plane, and the central axes of the plurality of second flow guide holes are all located in a second plane; The central axes of the plurality of first microchannel holes are all located in the third plane, and the central axes of the plurality of second microchannel holes are all located in the fourth plane.

4. The heat pipe conduction and heat dissipation device according to claim 3, characterized in that: The first plane is parallel to the second plane; the third plane is parallel to the fourth plane.

5. The heat pipe heat dissipation device according to claim 1, characterized in that: A tooth-like structure is disposed on the inner side wall of the first micro-channel hole and / or the second micro-channel hole.

6. The heat pipe heat dissipation device according to claim 1, characterized in that: A tooth-shaped structure is disposed on the inner side wall of the first guide hole and / or the second guide hole.

7. The heat pipe conduction and heat dissipation device according to claim 1, characterized in that: The porous heat pipe is sealed and connected to the inner wall of the plug-in slot by welding or gluing.

8. The heat pipe conduction and heat dissipation device according to claim 1, characterized in that: The cross-sectional shape of the plug-in slot is consistent with the cross-sectional shape of the porous heat pipe, and the cross-sectional dimension of the plug-in slot is slightly larger than the cross-sectional dimension of the porous heat pipe.

9. The heat pipe heat dissipation device according to claim 1, characterized in that: The porous heat pipe is flat.

10. The heat pipe conduction and heat dissipation device according to claim 1, characterized in that: The radiator is a fin, a liquid-cooled heat exchanger, a water-cooled plate, a copper plate or an aluminum plate.

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