3D uniform temperature plate heat dissipation module

Abstract

The utility model discloses a 3D temperature-uniforming plate heat dissipation module. The 3D temperature-uniforming plate heat dissipation module comprises a temperature-uniforming plate, a heat pipe set arranged on the temperature-uniforming plate, a first fin set and a second fin set, wherein the first fin set and the second fin set are composed of a plurality of heat dissipation fins. The second fin group is arranged on one side of the first fin group, and the stacking direction of the heat dissipation fins of the second fin group is perpendicular to that of the heat dissipation fins of the first fin group; and the heat pipe group is arranged among the radiating fins in a penetrating manner. A plurality of second fin groups can be arranged as required and are arranged on the corresponding side edges of the first fin group, so that the heat dissipation space at the upper part of the heating chip is fully utilized, and a better heat dissipation effect is achieved by increasing the heat dissipation area.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation of electronic devices, in particular to a 3D temperature equalizing plate heat dissipation module. Background Art

[0002] With the development of technology, computers and various electronic devices have developed rapidly and their performance has been continuously improved. However, in this process, the heat dissipation problem brought by high-performance hardware has also come along. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat, such as using traditional heat pipe heat dissipation modules, or using thermal paste or heat sinks to attach to the heat-generating chip to absorb and dissipate the heat.

[0003] In the prior art, a heat spreader or heat pipe is used to cool the heat source, and the heat pipe is inserted between multiple heat sink fins to fully dissipate the heat from each part of the heat pipe. However, in the prior art, the fin group is usually composed of multiple heat sink fins of the same shape stacked in the same direction, and the extension direction of the heat pipe is correspondingly the same as the stacking direction of the heat sink fins. If you want to get a better heat dissipation effect, the heat pipe is usually set into a U-shaped shape, and after multiple bends, the same heat pipe is inserted into the fin group multiple times to increase the heat dissipation area. However, too many bends will affect the heat dissipation capacity of the heat pipe, and the bent parts cannot be fully cooled.

[0004] At the same time, the installation area inside the equipment is limited, and the shape and stacking direction of the heat sink fins are fixed, so heat can only be dissipated in a fixed area above the heat source. The limited heat dissipation space results in a limited heat dissipation effect. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a 3D temperature equalizer heat dissipation module, which forms a T-shaped heat dissipation module by forming a common cavity between the temperature equalizer and the heat pipe group and extending the second heat pipe outward, so that the first fin group and the second fin groups on both sides thereof are fully utilized to dissipate the heat dissipation space above the heat generating chip, thereby increasing the heat dissipation area to improve the performance of the heat dissipation module.

[0006] The technical solution of the utility model is:

[0007] It includes a temperature averaging plate, a heat pipe group arranged on the temperature averaging plate, a first fin group and a second fin group composed of a plurality of heat dissipation fins, wherein the heat pipe group is arranged between the heat dissipation fins;

[0008] The second fin group is arranged on the side of the first fin group, and the heat dissipation fin stacking direction of the second fin group is perpendicular to that of the first fin group.

[0009] A further technical solution is that the penetration direction of the heat pipe group is the same as the stacking direction of the heat dissipation fins.

[0010] Its further technical solution is:

[0011] The heat dissipation fins of the first fin group are stacked in a direction perpendicular to the temperature homogenizing plate.

[0012] Its further technical solution is:

[0013] The heat pipe group includes a plurality of first heat pipes, and the first heat pipes are penetrated through each heat dissipation fin of the first fin group through vertical through holes arranged on the first fin group.

[0014] Its further technical solution is:

[0015] The heat pipe group includes a plurality of second heat pipes, wherein the second heat pipes have a vertical portion and a horizontal portion connected to each other;

[0016] Part of the heat dissipation fins of the first fin group are passed through the vertical portion, and each heat dissipation fin of the second fin group is passed through the horizontal portion.

[0017] Its further technical solution is:

[0018] The upper end surface of the second fin group and the upper end surface of the first fin group are located in the same plane.

[0019] Its further technical solution is:

[0020] A concave square space is provided at the lower end of the side surface opposite to the second fin group, a third fin group is provided in the square space, and the second heat pipe is located between the first fin group and the third fin group.

[0021] Its further technical solution is:

[0022] The second fin groups include a plurality of groups, which are correspondingly arranged on each side of the first fin group.

[0023] Its further technical solution is:

[0024] Screw grooves are arranged around the first fin group, and the temperature homogenizing plate is fixed on a base plate through a locking screw set in the screw grooves.

[0025] Its further technical solution is:

[0026] The contact surface between the temperature homogenizing plate and the heat source is coated with thermal conductive paste.

[0027] The utility model provides a 3D heat spreader heat dissipation module, wherein a plurality of first fin groups are arranged on the surface of the heat spreader that is in contact with the heat source, a plurality of second fin groups are arranged on the sides of the first fin groups, and a plurality of heat pipes are arranged between the heat dissipation fins. Since the stacking direction of the second fin group is perpendicular to that of the first fin group, even if the heat pipe is designed as a bent structure, the entire heat pipe can be sufficiently cooled.

[0028] In the embodiment, the temperature equalizing plate and the heat pipe group share a cavity, and the second fin group is arranged on the upper end of the first fin group, so that the first fin group and the second fin groups on both sides thereof form a T-shaped structure. The T-shaped heat dissipation module can maximize the use of the system space above the heat generating chip, that is, the two groups of second fin groups increase the heat dissipation area, which can greatly improve the performance of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0030] Figure 2 It is an explosion schematic diagram of the utility model;

[0031] Figure 3 It is a schematic diagram of the square space position of the utility model;

[0032] Figure 4 This is a schematic diagram of the structure of the temperature averaging plate and heat pipe group of the utility model.

[0033] Among them: 1. Temperature averaging plate; 11. Upper surface; 2. Heat pipe group; 21. First heat pipe; 22. Second heat pipe; 221. Vertical portion; 222. Horizontal portion; 3. First fin group; 4. Second fin group; 5. Vertical through hole; 6. Vertical through groove; 7. Horizontal through hole; 8. Third fin group; 9. Locking screw kit; 10. Base plate. DETAILED DESCRIPTION

[0034] In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the specific implementation methods of the utility model are further described in detail below in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model.

[0035] like Figures 1 to 4 As shown, the utility model 3D temperature averaging board heat dissipation module includes a temperature averaging board 1 and a heat pipe group 2 connected to the temperature averaging board 1, and also includes a first fin group 3 and a second fin group 4 arranged on the side of the first fin group 3, and the first fin group 3 and the second fin group 4 are both composed of a plurality of heat dissipation fins. Specifically, the heat dissipation fins of the first fin group 3 are stacked on the surface of the temperature averaging board 1 in a direction perpendicular to the temperature averaging board 1, and the second fin group 4 is perpendicular to the stacking direction of the heat dissipation fins of the first fin group 3.

[0036] In this embodiment, the heat pipe group 2 includes a plurality of first heat pipes 21 and a plurality of second heat pipes 22 evenly arranged on the upper surface 11, and the plurality of first heat pipes 21 and the plurality of second heat pipes 22 are all thin-walled hollow cylindrical structures, and the ends vertically connected to the temperature averaging plate 1 are all open ends, and the ends away from the temperature averaging plate 1 are all closed ends, and the plurality of second heat pipes 22 are arranged on the periphery of the heat pipe group 2, and the plurality of second heat pipes 22 are L-shaped, and the vertical portion 221 of the second heat pipe 22 is bent and extended outward to form a horizontal portion 222 parallel to the temperature averaging plate 1, and the heat dissipation fins of the second fin group 4 are arranged along the extension direction of the horizontal portion 222. Further, the horizontal portion 222 is lower than the upper end surface of the first fin group 3.

[0037] The first fin group 3 has a plurality of vertical through holes 5 that pass through from top to bottom. The plurality of first heat pipes 21 correspond one-to-one to the vertical through holes 5 and are sleeved in the vertical through holes 5, and the closed end of the first heat pipe 21 is flush with the upper end surface of the first fin group 3; vertical through grooves 6 that pass through from top to bottom are provided at positions corresponding to the second heat pipes 22 on both sides of the first fin group 3, and the cross-section of the vertical through grooves 6 is U-shaped. When the first fin group 3 is installed, the vertical portion 221 of the second heat pipe 22 is located in the vertical through groove 6, and the horizontal portion 222 of the second heat pipe 22 extends outward along the opening side of the vertical through groove 6.

[0038] The second fin group 4 has a plurality of horizontal through holes 7 extending left and right. The second fin group 4 is sleeved on the horizontal portion 222 of the second heat pipe 22 through the horizontal through holes 7. The upper end surface of the second fin group 4 and the upper end surface of the first fin group 3 are located in the same plane. The outermost fins of the second fin group 4 are flush with the closed end of the second heat pipe 22.

[0039] In this embodiment, there are two groups of second fin groups 4, which are symmetrically arranged on both sides of the first fin group 3, and more groups can be arranged as needed; the thickness of the first fin group 3 stacked on the upper surface 11 of the temperature homogenizing plate 1 is greater than the height of the second fin group 4 in the vertical direction, so that the first fin group 3 and the second fin groups 4 on both sides form a T-shaped heat dissipation structure. By arranging the second fin group 4 on the horizontal part 222 of the second heat pipe 22, the system space is maximized and the heat dissipation area is increased.

[0040] Furthermore, since the second fin group 4 is located at the upper part of both sides of the first fin group 3, the second heat pipe 22 has an exposed portion located at the lower part of the second fin group 4 in the U-shaped vertical through groove 6. In this embodiment, a concave square space is provided at the lower end of the side opposite to the second fin group 4 of the first fin group 3, and the third fin group 8 is provided in the square space. The second heat pipe 22 is located between the first fin group 3 and the third fin group 8, and the square space extends longitudinally from the side to the vertical portion 221 of the second heat pipe 22, and the square space is horizontally connected to all the vertical through grooves 6 on one side of the first fin group 3; the third fin group 8 is square and cooperates with the square space gap, so that the exposed portion of the second heat pipe 22 is effectively covered.

[0041] In this embodiment, the overall appearance of the first fin group 3 may be similar to the upper surface 11 of the temperature vapor chamber 1 , that is, the first fin group 3 may completely cover the upper surface 11 of the temperature vapor chamber 1 .

[0042] In this embodiment, the temperature equalizing plate 1 is fixed to the base plate 10 by a locking screw kit 9. Specifically, screw grooves are opened around the first fin group 3, and the bottom of the locking screw kit 9 ​​extends to the bottom of the base plate 10 through the screw grooves. The locking screw kit 9 ​​includes a screw and a spring mounted on the screw.

[0043] In this embodiment, the temperature averaging plate 1 and the heat pipe group 2 are integrally formed, so that the temperature averaging plate 1 and the heat pipe group 2 share a cavity, which effectively reduces thermal resistance and improves the performance of the heat dissipation module.

[0044] The installation process of the structure is as follows: after the vertical through holes 5 and the vertical through grooves 6 of the first fin group 3 are respectively matched with the first heat pipe 21 and the second heat pipe 22, the first fin group 3 is installed on the temperature equalizing plate 1, and then the two groups of third fin groups 8 are respectively embedded in the square spaces on both sides of the first fin group 3, and then the second fin groups 4 on both sides are sleeved on the horizontal part 222 of the second heat pipe 22 through the horizontal through holes 7. After furnace welding, the temperature equalizing plate 1 is fixed to the substrate 10 by the locking screw kit 9 ​​to complete the installation.

[0045] When in use, the heating chip is located in the lower center of the temperature equalizing plate 1. In order to obtain better heat conduction of the heating chip, thermal paste is arranged between the heating chip and the temperature equalizing plate 1. When the heat emitted by the heating chip is conducted to the bottom center area of ​​the temperature equalizing plate 1, it will be quickly dispersed to the entire upper surface 11 of the temperature equalizing plate 1. Part of the heat is evenly conducted to the first fin group 3 and the third fin group 8 through the first heat pipe 21 and the second heat pipe 22; the other part of the heat can quickly and efficiently assist in heat dissipation and be conducted to the second fin group 4 through the heat conduction effect of the second heat pipe 22; through the T-shaped structure, the heat dissipation space above the heating chip can be fully utilized to achieve better heat dissipation effect.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. 3D temperature plate heat dissipation module, characterized by: It comprises a temperature equalizing plate (1), a heat pipe group (2) arranged on the temperature equalizing plate (1), a first fin group (3) and a second fin group (4) composed of a plurality of heat dissipation fins, wherein the heat pipe group (2) is arranged between the heat dissipation fins; The second fin group (4) is arranged on the side of the first fin group (3), and the heat dissipation fin stacking direction of the second fin group (4) is perpendicular to that of the first fin group (3).

2. The 3D vapor chamber heat dissipation module according to claim 1, characterized in that: The penetration direction of the heat pipe group (2) is the same as the stacking direction of the heat dissipation fins.

3. The 3D vapor chamber heat dissipation module according to claim 1, characterized in that: The heat dissipation fins of the first fin group (3) are stacked in a direction perpendicular to the temperature homogenizing plate (1).

4. The 3D vapor chamber heat dissipation module according to claim 3, characterized in that: The heat pipe group (2) comprises a plurality of first heat pipes (21), wherein the first heat pipes (21) pass through each heat dissipation fin of the first fin group (3) via a vertical through hole (5) provided on the first fin group (3).

5. The 3D vapor chamber heat dissipation module according to claim 3, characterized in that: The heat pipe group (2) comprises a plurality of second heat pipes (22), wherein the second heat pipes (22) have a vertical portion (221) and a horizontal portion (222) connected to each other; The vertical portion (221) is provided with a plurality of heat dissipation fins of the first fin group (3), and the horizontal portion (222) is provided with a plurality of heat dissipation fins of the second fin group (4).

6. The 3D vapor chamber heat dissipation module according to claim 3, characterized in that: The upper end surface of the second fin group (4) and the upper end surface of the first fin group (3) are located in the same plane.

7. The 3D vapor chamber heat dissipation module according to claim 5, characterized in that: A concave square space is provided at the lower end of the side opposite to the first fin group (3) and the second fin group (4), a third fin group (8) is provided in the square space, and the second heat pipe (22) is located between the first fin group (3) and the third fin group (8).

8. The 3D vapor chamber heat dissipation module according to claim 1, characterized in that: The second fin group (4) comprises a plurality of groups, which are correspondingly arranged on each side of the first fin group (3).

9. The 3D vapor chamber heat dissipation module according to claim 1, characterized in that: Screw grooves are provided around the first fin group (3), and the temperature equalizing plate (1) is fixed on a base plate (10) via a locking screw set (9) in the screw grooves.

10. The 3D vapor chamber heat dissipation module according to claim 1, characterized in that: The contact surface of the temperature homogenizing plate (1) with the heat source is coated with thermal conductive paste.

Images