Multi-bin ball supplying and mounting device capable of preventing balls from being mixed

Abstract

The utility model discloses a multi-bin ball supplying and mounting device capable of preventing balls from being mixed, which comprises a first X-axis translation mechanism, the first X-axis translation mechanism is in driving connection with a first translation plate, and the top of the first translation plate is also connected with a plurality of first support columns; the solder ball seat is installed on the first supporting column, and a plurality of first through holes are formed in the top of the solder ball seat in the length direction at intervals; a solder ball bin is mounted in each first through hole; and the ball supply seat is arranged above the solder ball seat, and a ball supply opening is further formed in the middle of the top of the ball supply seat. When solder balls with different ball diameters are planted, the solder ball bin for supplying the solder balls with the corresponding diameters can be automatically adjusted to the ball supply opening, then automatic ball supply of the solder balls with the different diameters is achieved, meanwhile, the multi-ball processing assembly is further arranged, multiple balls can be processed, and then the ball planting procedure is prevented from being affected.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip ball planting, in particular to a multi-position ball supply and ball planting device for preventing ball mixing. Background Art

[0002] With the rapid development of the electronics industry, the integration capability of electronic products is constantly improving, and the requirements for the packaging and ball planting process of BGA chips are also increasing. The diameter of the solder balls is required to be smaller and smaller, so there is a certain probability of defective products such as bridges, large and small balls, missing balls, multiple balls, cold solder joints, and misalignment in the process of mass production. These defective BGA chips need to be repaired for the defective points to remove the defective solder balls and then perform ball planting corrections. There are two main traditional conventional repair methods in the industry:

[0003] 1) Use an electric soldering iron and a soldering wire to remove all the solder balls from the entire BGA chip, and then use a ball planting table to manually plant the balls;

[0004] 2) Manually under a microscope, use tweezers to scrape off the defective solder ball, then use tweezers to place a new solder ball and then re-plant the ball.

[0005] Both methods have obvious defects. When the first method uses a traditional electric soldering iron to clean the solder balls, the surface of the solder sucking wire is very rough, which will greatly reduce the adhesion of the metal pad on the circuit board. If you are not careful, the pad will be taken away, resulting in direct product scrapping. Moreover, this method is to remove all the solder balls on the entire BGA and then re-plant the entire piece. This method will greatly waste materials such as solder balls, making it difficult to reduce the maintenance-oriented, and also increase the risk of BGA scrapping due to careless tin removal and the risk of scrapping due to low success rate of secondary ball planting. The second method requires extremely high manual proficiency, and the overall repair yield is relatively low, generally only about 60%, and employees need to work under a microscope for a long time, causing irreversible damage to the employees' eyes. In addition, as BGA chips become smaller and smaller, the diameter of the solder balls is also getting smaller, and the difficulty of maintenance is increasing exponentially. Manual labor can no longer meet the rework of BGA chips with solder ball diameters below 0.3mm.

[0006] Therefore, it is necessary to design a precise online ball replenishing equipment to solve the above-mentioned problems existing in manual ball planting and replenishing. In this equipment, solder balls need to be provided automatically to improve the ball planting efficiency. Therefore, a multi-position ball supply and planting device used in this equipment is designed. Utility Model Content

[0007] The purpose of the utility model is to provide a multi-bin ball supply and planting device for preventing balls from being mixed. When planting solder balls of different diameters, the device can automatically adjust the solder ball bin for supplying solder balls of corresponding diameters to the ball supply port, thereby realizing the automatic ball supply of solder balls of different diameters. At the same time, a multi-ball processing component is also provided, which can process multiple balls to avoid affecting the ball planting process. The overall design is reasonable, the structure is compact, and it is easy to use. At the same time, the device is not only applicable to the field of solder ball supply, but also to other fields that require ball supply or small device supply, and has strong versatility.

[0008] In order to achieve the above purpose, the following technical solutions are adopted:

[0009] A multi-position ball supply and planting device for preventing ball mixing, comprising:

[0010] A first X-axis translation mechanism, wherein the first X-axis translation mechanism is drivingly connected to a first translation plate, and a top of the first translation plate is further connected to a plurality of first support columns;

[0011] A solder ball seat, the solder ball seat is mounted on the first support column, and a plurality of first through holes are spaced apart in the length direction of the top of the solder ball seat; a solder ball bin is mounted in each of the first through holes;

[0012] A ball supply seat, which is arranged above the tin ball seat, and a ball supply opening is provided in the middle of the top of the ball supply seat;

[0013] A multi-ball processing component is installed on one side of the ball supply seat; the other side of the ball supply seat is also connected to a first connecting seat, and a tool setting instrument is also installed on the first connecting seat.

[0014] Furthermore, the multi-ball processing assembly includes a second connecting seat connected to one side of the ball supply seat; a plurality of first suction nozzles are installed at intervals in the length direction of the top of the second connecting seat, and a first vacuum joint connected to the first suction nozzle is also installed on one side of the second connecting seat.

[0015] Furthermore, the anti-mixing ball multi-position ball supply and planting device also includes two static electricity removal components; one of the static electricity removal components is arranged on one side of the first X-axis translation mechanism, and the other static electricity removal component is arranged at one end of the first X-axis translation mechanism.

[0016] Furthermore, the static electricity removal assembly includes a first vertical plate, and a plasma wind rod installed on the first vertical plate; one end of the plasma wind rod extends to be arranged above the ball supply seat.

[0017] Furthermore, the bottom of the ball supply seat is also connected to a plurality of second support columns.

[0018] Furthermore, an observation window is installed at each of the two ends of the top of the ball supply seat.

[0019] Furthermore, the multi-position ball supply and ball planting device for preventing ball mixing also includes a ball planting mechanism, and the ball planting mechanism is arranged above one end of the first X-axis translation mechanism.

[0020] Furthermore, the ball planting mechanism includes a first Y-axis translation mechanism, a second translation plate connected to the first Y-axis translation mechanism, a first Z-axis lifting mechanism installed on one side of the second translation plate along the vertical direction, and a first lifting plate connected to the first Z-axis lifting mechanism; a plurality of ball planting modules are also installed on one side of the first lifting plate, and the plurality of ball planting modules are arranged in parallel.

[0021] Furthermore, the ball planting module includes a lifting voice coil motor installed on one side of the first lifting plate, and a ball planting nozzle connected to the lifting voice coil motor.

[0022] By adopting the above scheme, the beneficial effects of the utility model are:

[0023] When implanting solder balls of different diameters, the device can automatically adjust the solder ball bin that supplies solder balls of corresponding diameters to the ball supply port, thereby realizing the automatic ball supply of solder balls of different diameters. At the same time, a multi-ball processing component is also provided to process multiple balls, thereby avoiding affecting the ball implantation process. The overall design is reasonable, the structure is compact, it is easy to use and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of the utility model;

[0025] Figure 2 for Figure 1 A front view of

[0026] Figure 3 for Figure 1 A top view of

[0027] Figure 4 It is a structural schematic diagram of the ball planting mechanism of the utility model;

[0028] The accompanying drawings illustrate:

[0029] 1. First X-axis translation mechanism; 2. Solder ball seat; 3. Ball supply seat; 4. Multi-ball processing assembly; 5. Tool setting instrument; 6. Plasma wind rod; 7. Ball planting mechanism; 11. First translation plate; 12. First support column; 21. Solder ball bin; 31. Ball supply port; 32. Second support column; 33. Observation window; 41. Second connecting seat; 42. First suction nozzle; 43. First vacuum joint; 71. First Y-axis translation mechanism; 72. Second translation plate; 73. First Z-axis lifting mechanism; 74. First lifting plate; 75. Lifting voice coil motor; 76. Ball planting nozzle; 77. Atomizing spray flux assembly. DETAILED DESCRIPTION

[0030] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] Reference Figures 1 to 4 As shown, the utility model provides a multi-position ball supply and planting device for preventing ball mixing, in one embodiment, comprising

[0032] A first X-axis translation mechanism 1, wherein the first X-axis translation mechanism 1 is drivingly connected to a first translation plate 11, and a plurality of first support columns 12 are further connected to the top of the first translation plate 11;

[0033] A solder ball seat 2, wherein the solder ball seat 2 is mounted on the first support column 12, and a plurality of first through holes are provided at intervals in the length direction of the top of the solder ball seat 2; a solder ball bin 21 is installed in each of the first through holes;

[0034] A ball supply seat 3, which is arranged above the solder ball seat 2, and a ball supply opening 31 is provided in the middle of the top of the ball supply seat 3;

[0035] The multi-ball processing assembly 4 is installed on one side of the ball supply seat 3; the other side of the ball supply seat 3 is also connected to a first connecting seat, and a tool setting instrument 5 is also installed on the first connecting seat.

[0036] Continue to refer to Figures 1 to 4 As shown, in this embodiment, the first X-axis translation mechanism 1 adopts a linear motor module, and the number of solder ball bins 21 is set to four groups (the number can be adjusted accordingly according to usage requirements), each solder ball bin 21 stores solder balls of different diameters, and the first X-axis translation mechanism 1 can drive the solder ball seat 2 to translate left and right, and then automatically adjust the solder ball bin 21 supplying solder balls of corresponding diameters to the ball supply port 31, so as to realize the automatic ball supply of solder balls of different diameters, and then adapt to the needs of planting solder balls of different ball diameters, with strong versatility. At the same time, a multi-ball processing component 4 is also provided, which can process multiple balls (for example, when sucking solder balls, multiple solder balls may be sucked on a nozzle, and the multi-ball processing component can be used to process the excess solder balls sucked, leaving only one), so as to avoid affecting the normal operation of the ball planting process. In addition, a tool setting instrument 5 is also provided, which can facilitate the calibration of the nozzle for sucking solder balls.

[0037] In one embodiment, the multi-ball processing component 4 includes a second connecting seat 41 connected to one side of the ball supply seat 3; a plurality of first suction nozzles 42 are installed at intervals in the length direction of the top of the second connecting seat 41, and a first vacuum joint 43 connected to the first suction nozzle 42 is also installed on one side of the second connecting seat 41. The first vacuum joint 43 can be connected to an external vacuum negative pressure gas source, and the mixed or bonded solder balls are sucked through the first suction nozzle 42. At the same time, the multi-position ball supply and planting device for preventing mixed balls also includes two static electricity removal components; one of the static electricity removal components is arranged on one side of the first X-axis translation mechanism 1, and the other static electricity removal component is arranged at one end of the first X-axis translation mechanism 1; the static electricity removal component includes a first vertical plate, and a plasma wind rod 6 installed on the first vertical plate; one end of the plasma wind rod 6 extends to the top of the ball supply seat 3. The plasma wind rod 6 can remove static electricity from the solder balls to prevent them from sticking together due to static electricity.

[0038] In one embodiment, the bottom of the ball supply seat 3 is further connected to a plurality of second support columns 32; and an observation window 33 is installed at each end of the top of the ball supply seat 3. The ball supply seat 3 can be supported by the second support seat, and at the same time, the observation window 33 is provided to observe the number of solder balls remaining in the solder ball bin 21, so as to facilitate the replenishment of solder balls.

[0039] In one embodiment, the multi-position ball supply and ball planting device for preventing mixed balls further includes a ball planting mechanism 7, which is arranged above one end of the first X-axis translation mechanism 1, and includes a first Y-axis translation mechanism 71, a second translation plate 72 connected to the first Y-axis translation mechanism 71, a first Z-axis lifting mechanism 73 installed on one side of the second translation plate 72 in the vertical direction, and a first lifting plate 74 connected to the first Z-axis lifting mechanism 73; a plurality of ball planting modules are also installed on one side of the first lifting plate 74, and the plurality of ball planting modules are arranged in parallel. In this embodiment, the first Y-axis translation mechanism 71 and the first Z-axis lifting mechanism 73 both use linear motor modules, and with the mutual cooperation of the two, the ball planting modules can be driven to perform translation and lifting movements, thereby facilitating the ball planting of the ball planting modules. At the same time, the number of ball planting modules is set to be multiple, which can improve the ball planting efficiency. The ball planting module includes a lifting voice coil motor 75 installed on one side of the first lifting plate 74, and a ball planting nozzle 76 connected to the lifting voice coil motor 75. The ball planting nozzle 76 can be driven to rise and fall by the lifting voice coil motor 75, thereby performing the ball planting operation. In addition, an atomizing flux spraying assembly 77 is installed on one side of the first lifting plate 74. Before the ball planting process, the flux can be evenly coated on the corresponding pads of the BGA chip, which can effectively deal with the problem of misalignment by only applying flux without the need for ball planting.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-position ball supply and ball planting device for preventing ball mixing, characterized in that: include A first X-axis translation mechanism, wherein the first X-axis translation mechanism is drivingly connected to a first translation plate, and a top of the first translation plate is further connected to a plurality of first support columns; A solder ball seat, the solder ball seat is mounted on the first support column, and a plurality of first through holes are spaced apart in the length direction of the top of the solder ball seat; a solder ball bin is mounted in each of the first through holes; A ball supply seat, which is arranged above the tin ball seat, and a ball supply opening is provided in the middle of the top of the ball supply seat; A multi-ball processing component is installed on one side of the ball supply seat; the other side of the ball supply seat is also connected to a first connecting seat, and a tool setting instrument is also installed on the first connecting seat.

2. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 1 is characterized in that: The multi-ball processing assembly includes a second connecting seat connected to one side of the ball supply seat; a plurality of first suction nozzles are installed at intervals in the length direction of the top of the second connecting seat, and a first vacuum joint connected to the first suction nozzle is also installed on one side of the second connecting seat.

3. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 1 is characterized in that: The anti-mixing ball multi-position ball supply and planting device also includes two static electricity removal components; one of the static electricity removal components is arranged on one side of the first X-axis translation mechanism, and the other static electricity removal component is arranged at one end of the first X-axis translation mechanism.

4. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 3 is characterized in that: The static electricity removal assembly comprises a first vertical plate and a plasma wind rod installed on the first vertical plate; one end of the plasma wind rod extends to be arranged above the ball supply seat.

5. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 1 is characterized in that: The bottom of the ball supply seat is also connected to a plurality of second supporting columns.

6. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 1, characterized in that: An observation window is respectively installed at two ends of the top of the ball supply seat.

7. The multi-position ball supply and ball planting device for preventing mixing balls according to any one of claims 1 to 6, characterized in that: The multi-bin ball supply and planting device for preventing mixing of balls also includes a ball planting mechanism, which is arranged above one end of the first X-axis translation mechanism.

8. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 7 is characterized in that: The ball planting mechanism includes a first Y-axis translation mechanism, a second translation plate connected to the first Y-axis translation mechanism, a first Z-axis lifting mechanism installed on one side of the second translation plate along the vertical direction, and a first lifting plate connected to the first Z-axis lifting mechanism; a plurality of ball planting modules are also installed on one side of the first lifting plate, and the plurality of ball planting modules are arranged in parallel.

9. The multi-position ball supply and ball planting device for preventing mixing balls according to claim 8, characterized in that: The ball planting module comprises a lifting voice coil motor installed on one side of the first lifting plate, and a ball planting nozzle connected to the lifting voice coil motor.

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