Sensor packaging connection structure
By setting up an overflow groove in the sensor package connection structure, the problem of the amount of glue in the ceramic package affecting the connection quality is solved, and a more stable packaging structure is achieved.
Patent Information
- Application Number
- CN202323657923.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2033-12-29
AI Technical Summary
Excessive or too little glue used in existing ceramic packaging will affect the stability of the packaging structure, which may lead to overflow or gaps, and affect device functions.
A sensor package connection structure is designed, including a substrate, a chip and a cover body. A connecting groove and an overflow groove are provided on the substrate. When the cover body is connected to the substrate, the overflow groove guides the glue liquid to overflow to avoid overflowing to other devices. and increase connection stability.
It effectively avoids glue overflow and gaps, improves connection stability and sealing, and ensures packaging quality.
Smart Images
Figure CN222214164U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensor packaging, in particular to a sensor packaging connection structure. Background Art
[0002] In the process of electronic packaging, the substrate mainly plays the role of mechanical support protection and electrical interconnection (insulation). There are four main types of substrate materials commonly used in electronic packaging: polymer substrate, metal substrate, composite substrate, and ceramic substrate. Ceramic substrate materials are widely used in electronic packaging substrates due to their high strength, good insulation, excellent thermal conductivity and heat resistance, small thermal expansion coefficient, and good chemical stability. The amount of glue used in existing ceramic packaging can directly affect the stability of the packaging structure. If the amount of glue is too much, it will overflow at the connection. If it overflows to other devices, it may affect their functions; if the glue is applied less, gaps are likely to appear at the connection, resulting in unstable connection. A sensor packaging connection structure is proposed to solve the problems existing in the prior art. Utility Model Content
[0003] The utility model aims to provide a sensor packaging connection structure to solve the problem in the prior art that the amount of glue affects the connection quality.
[0004] The technical solution of the utility model is: a sensor packaging connection structure, comprising a substrate, a chip and a cover body connected to the substrate, the cover body and the substrate are connected to form a cavity, and the chip is arranged in the cavity;
[0005] A connecting groove is provided on the substrate, and the connecting groove is provided on the periphery of the chip; when the cover body is connected to the substrate, the bottom of the cover body is provided in the connecting groove; a first step is provided on the inner side of the connecting groove, and a second step connected to the first step is provided at the bottom end of the cover body.
[0006] Preferably, a first overflow groove is provided on the side wall close to the first step, and the first overflow groove is connected to the bottom of the connecting groove.
[0007] Preferably, a second overflow groove is provided on the first step, and the second overflow groove is annularly arranged and arranged on the outer periphery of the chip.
[0008] Preferably, a third overflow groove is provided on the first step, two ends of the third overflow groove are respectively connected to the first overflow groove and the second overflow groove, and the depth of the third overflow groove is smaller than that of the second overflow groove.
[0009] Preferably, the first overflow trough and the third overflow trough are provided in plurality and are evenly arranged on the first step.
[0010] Preferably, when the cover body is connected to the connecting groove, the bottom of the connecting groove is filled with glue, and the outer wall of the cover body slides along the outer wall of the connecting groove to the bottom end of the cover body and connects with the bottom end of the connecting groove; at the same time, the first step is connected with the second step.
[0011] Compared with the prior art, the advantages of the utility model are:
[0012] (1) By setting the first step and multiple overflow grooves, if there is too much glue during packaging, the glue will flow along the first overflow groove to the third overflow groove and finally overflow to the second overflow groove, which guides the overflow of the glue and avoids the situation where it overflows randomly and affects the use of other devices; compared with the traditional connection method, the amount of glue is larger, avoiding the occurrence of gaps and other defects. At the same time, the glue in the overflow groove also plays a connecting role, further increasing the stability of the connection;
[0013] (2) When the outer wall of the connecting groove and the outer wall of the cover body are connected, they slide relative to each other, thereby preventing the glue from overflowing along the outer wall of the connecting groove to the outside. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments:
[0015] Figure 1 This is a structural schematic diagram of the sensor packaging connection structure of the utility model;
[0016] Figure 2 for Figure 1 A schematic diagram of the enlarged structure at A in the middle;
[0017] Figure 3 It is a structural schematic diagram of the cover body of the utility model.
[0018] Among them: base plate 1, connecting groove 11, first step 12, first overflow 121, second overflow groove 122, third overflow groove 123, cover body 2, second step 21. DETAILED DESCRIPTION
[0019] The following is a further detailed description of the present invention in conjunction with specific embodiments:
[0020] like Figure 1-3 As shown, a sensor packaging connection structure includes a substrate 1, a chip and a cover 2 are connected to the substrate 1, the cover 2 and the substrate 1 are connected to form a cavity, and the chip 3 is arranged in the cavity.
[0021] A connecting groove 11 is provided on the substrate 1, and the connecting groove 11 is provided on the periphery of the chip 3; when the cover body 2 is connected to the substrate 1, the bottom of the cover body 2 is provided in the connecting groove 11; a first step 12 is provided on the inner side of the connecting groove 11, and a second step 21 connected to the first step 12 is provided at the bottom end of the cover body 2.
[0022] A first overflow groove 121 is provided on the side wall close to the first step 12, and the first overflow groove 121 is connected to the bottom of the connecting groove 11. A second overflow groove 122 is provided on the first step 12, and the second overflow groove 122 is annularly arranged and arranged on the outer periphery of the chip 3. A third overflow groove 123 is provided on the first step 12, and the two ends of the third overflow groove 123 are respectively connected to the first overflow groove 121 and the second overflow groove 122, and the depth of the third overflow groove 123 is less than that of the second overflow groove 122. There are multiple first overflow grooves 121 and third overflow grooves 123, and they are evenly arranged on the first step 12. When the cover body 2 is connected to the connecting groove 11, the bottom of the connecting groove 11 is filled with glue, and the outer side wall of the cover body 2 slides along the outer side wall of the connecting groove 11 to the bottom end of the cover body 2 and connects with the bottom end of the connecting groove 11; at the same time, the first step 12 is connected to the second step 21 in contact.
[0023] In this embodiment, the outer wall of the connecting groove 11 plays a limiting role on the cover body 2. When the cover body 2 is connected to the connecting groove 11, the outer wall of the cover body 2 is slidably connected along the outer wall of the connecting groove 11, so that the position of the cover plate can be accurately positioned; at the same time, it also plays a sealing role. When connected by glue, the cover body 2 squeezes the glue at the bottom of the connecting groove 11, and the glue overflows along the first overflow groove 121 to the third overflow groove 123, and finally overflows to the second overflow groove 122, which can prevent the glue from overflowing from the gap between the outer wall of the connecting groove 11 and the outer wall bracket of the cover body 2.
[0024] The second overflow groove 122 is deep and annular, and has enough space to accommodate excess glue. When the second step 21 is in contact with the first step 12, the second step 21 can completely cover the second overflow groove 122 or partially cover the second overflow groove 122.
[0025] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model.
Claims
1. A sensor packaging connection structure, It is characterized in that It comprises a substrate, a chip and a cover body are connected to the substrate, the cover body and the substrate are connected to form a cavity, and the chip is arranged in the cavity; A connecting groove is provided on the substrate, and the connecting groove is provided on the periphery of the chip; when the cover body is connected to the substrate, the bottom of the cover body is provided in the connecting groove; a first step is provided on the inner side of the connecting groove, and a second step connected to the first step is provided at the bottom end of the cover body.
2. A sensor packaging connection structure according to claim 1, Features: A first overflow groove is arranged on the side wall close to the first step, and the first overflow groove is connected to the bottom of the connecting groove.
3. A sensor packaging connection structure according to claim 2, Features: A second overflow groove is arranged on the first step, and the second overflow groove is arranged in an annular shape and arranged on the outer periphery of the chip.
4. A sensor packaging connection structure according to claim 3, Features: A third overflow groove is arranged on the first step, two ends of the third overflow groove are respectively connected to the first overflow groove and the second overflow groove, and the depth of the third overflow groove is smaller than that of the second overflow groove.
5. A sensor packaging connection structure according to claim 4, Features: The first overflow trough and the third overflow trough are both provided in plurality and are evenly arranged on the first step.
6. A sensor packaging connection structure according to claim 5, Features: When the cover is connected to the connecting groove, the bottom of the connecting groove is filled with glue, and the outer wall of the cover slides along the outer wall of the connecting groove to the bottom end of the cover and connects with the bottom end of the connecting groove; at the same time, the first step is connected with the second step.