Electronic device

Abstract

The embodiment of the utility model relates to the technical field of mobile communication equipment, and discloses electronic equipment, and the electronic equipment comprises a housing which is provided with a sound receiving hole; the mainboard is arranged in the shell; the sound receiving device is arranged at the position, opposite to the sound receiving hole, in the shell and electrically connected with the main board; the first sealing assembly is clamped between the sound receiving device and the inner wall, located on the periphery of the sound receiving hole, of the shell, and the first sealing assembly is configured to allow external sound to penetrate through and reach the sound receiving device; and the second sealing assembly abuts against the side, away from the sound receiving hole, of the sound receiving device and wraps the periphery of the sound receiving device, and the second sealing assembly is matched with the first sealing assembly in an abutting mode so that the space where the sound receiving device is located and the internal space of the shell can be mutually sealed. According to the electronic equipment provided by the embodiment of the invention, the sealing performance between the sound receiving device and the internal space of the shell of the electronic equipment can be improved, and the sound receiving effect of the sound receiving device is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of mobile communication devices, and in particular to an electronic device. Background Art

[0002] With the development of technology, more and more functions are integrated into electronic devices such as tablet computers, mobile phones, and electronic watches. Functions such as calling, recording, and voice interaction have been widely used in electronic devices. These functions require opening sound receiving holes on the housing of the electronic device and installing sound receiving devices such as microphones in the electronic device to collect the user's voice.

[0003] Other components inside the electronic device except the radio device, such as the power supply, speakers, etc., may make abnormal noises or buzzing sounds during operation. If these sounds are transmitted to the radio device, they will interfere with the normal operation of the radio device. Based on this, how to improve the sealing between the radio device and the internal space of the electronic device casing has become a problem that needs to be solved urgently. Utility Model Content

[0004] In view of the above problems, an embodiment of the present application provides an electronic device, which can improve the sealing between a sound receiving device and the internal space of the electronic device housing, thereby improving the sound receiving effect of the sound receiving device.

[0005] An embodiment of the present application provides an electronic device, comprising: a shell body, on which a sound receiving hole is opened; a main board, which is arranged inside the shell body; a sound receiving device, which is arranged inside the shell body at a position opposite to the sound receiving hole and is electrically connected to the main board, and is used to collect external sound through the sound receiving hole, and send it to the main board after converting it into an electrical signal; a first sealing component, which is clamped between the sound receiving device and an inner wall of the shell body located around the sound receiving hole, and the first sealing component is configured to allow external sound to pass through and reach the sound receiving device; a second sealing component, which abuts against a side of the sound receiving device away from the sound receiving hole and wraps around the outer periphery of the sound receiving device, and the second sealing component abuts against the first sealing component to seal the space where the sound receiving device is located and the internal space of the shell body.

[0006] In an optional manner, the first sealing component includes a dustproof net and a sealing buffer gasket. The dustproof net is attached to the inner wall of the shell and covers the sound receiving hole. The sealing buffer gasket is clamped between the dustproof net and the sound receiving device. The sealing buffer gasket is provided with a first through hole for external sound to pass through.

[0007] In an optional manner, the first sealing assembly also includes a rigid pressing plate, which is fixed in the shell and presses the sealing buffer gasket onto the dustproof net so that the sealing buffer gasket is deformed to form an interference fit. The sound receiving device is arranged on the side of the rigid pressing plate away from the sealing buffer gasket, and a second through hole is opened on the rigid pressing plate for external sound to pass through.

[0008] In an optional manner, the first sealing component also includes a flexible circuit board, which is attached and fixed to the side of the rigid pressing plate facing away from the sealing buffer gasket. The sound receiving device is arranged on the side of the flexible circuit board facing away from the rigid pressing plate. The sound receiving device is electrically connected to the main board through the flexible circuit board. A third through hole is opened on the flexible circuit board for external sound to pass through.

[0009] In an optional manner, the diameter of the sound receiving hole is equal to the diameter of the second through hole, the diameter of the sound receiving hole is smaller than the diameter of the first through hole, and the diameter of the sound receiving hole is larger than the diameter of the third through hole.

[0010] In an optional manner, the ratio of the diameter of the sound receiving hole to the sum of the depths of the sound receiving hole, the first through hole, the second through hole and the third through hole is any value in the range of 0.3-0.4.

[0011] In an optional manner, the second sealing component includes a sealing buffer pad, which is wrapped around the outer circumference of the sound receiving device and attached to the surface of the first sealing component.

[0012] In an optional manner, the second sealing assembly further includes a bracket, which is fixed inside the shell and crimped onto a side of the sealing buffer pad away from the first sealing assembly, so that the sealing buffer pad is deformed to form an interference fit.

[0013] In an optional manner, the sound receiving hole is arranged at the edge of the shell, and the opening of the sound receiving hole faces the side where the front of the electronic device is located.

[0014] In an optional manner, the sound receiving hole is arranged at the upper edge of the shell.

[0015] The electronic device provided in the embodiment of the present application adopts a first sealing component to seal the assembly gap between the inner wall of the shell and the sound receiving device, and further adopts a second sealing component to seal the assembly gap that may exist between the first sealing component and the sound receiving device, thereby performing high-strength sealing between the internal space of the shell and the space where the sound receiving device is located, so that the space where the sound receiving device is located and connected to the outside world is sealed and isolated from the space where the main board is arranged inside the shell, thereby providing reliable protection for the operation of the sound receiving device and preventing the sound emitted by other components in the shell from affecting the normal operation of the sound receiving device.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 A schematic diagram of the structure of an electronic device provided by an embodiment of the utility model;

[0019] Figure 2 A schematic cross-sectional structure diagram of an electronic device provided by an embodiment of the utility model;

[0020] Figure 3 for Figure 2 A schematic diagram of the enlarged structure at A;

[0021] Figure 4 A schematic diagram of the structure inside an electronic device provided by an embodiment of the utility model;

[0022] Figure 5 for Figure 4 A schematic diagram of the enlarged structure at B;

[0023] Figure 6 A schematic diagram of the exploded structure of the electronic device at the sound receiving hole provided by an embodiment of the utility model;

[0024] Figure 7 for Figure 5 Schematic diagram of the enlarged structure at C.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 100. Electronic equipment;

[0027] 110, housing; 111, sound receiving hole; 112, soft part; 113, hard part;

[0028] 120, motherboard;

[0029] 130. Radio receiver;

[0030] 140, first sealing assembly; 141, dustproof net; 142, sealing buffer gasket; 1421, first through hole; 143, rigid pressing sheet; 1431, second through hole; 144, flexible circuit board; 1441, third through hole;

[0031] 150, second sealing assembly; 151, sealing buffer pad; 152, bracket;

[0032] 160. Front; 161. Display area. DETAILED DESCRIPTION

[0033] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0038] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0039] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0040] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0041] Generally, electronic devices collect sound by opening a sound receiving hole on the housing and arranging a sound receiving device inside the sound receiving hole. Since external sound needs to enter the sound receiving device through the sound receiving hole on the housing of the electronic device, the sealing performance of the assembly gap between the inner wall of the housing around the sound receiving hole and the sound receiving device is a key factor in determining the sealing performance between the internal space of the housing of the electronic device and the sound receiving device. It is difficult to provide a reliable seal between the internal space of the housing and the sound receiving device by using a simple sealing ring or other structure arranged between the inner wall of the housing and the sound receiving device, thereby making it difficult to reduce the interference of the sound emitted by other components inside the housing on the sound receiving device.

[0042] Based on the above problems, an embodiment of the present application provides an electronic device, which realizes reliable sealing between the interior of the electronic device and the space where the sound receiving device is located by designing multiple sealing structures on the periphery of the sound receiving device. Specifically, a first sealing component is sandwiched between the sound receiving device and the inner wall of the shell, and a second sealing component is also arranged on the periphery of the sound receiving device. While the second sealing component is wrapped around the periphery of the sound receiving device, it also abuts and cooperates with the first sealing component, thereby realizing all-round sealing protection of the assembly gap between the sound receiving device and the inner wall of the shell, improving the airtightness of the interior of the shell and the sound receiving device, and ensuring that the sound receiving device is not easily disturbed by the sound emitted by other components inside the shell.

[0043] The specific embodiments provided below are described by taking the electronic device as a tablet computer as an example, which does not constitute a limitation on the specific implementation of the electronic device.

[0044] First see Figures 1 to 3 , Figure 1 The structure of the electronic device provided by the embodiment of the present application is shown in FIG. Figure 2 The cross-sectional structure of the electronic device at the sound receiving hole is shown in FIG. Figure 3 It is shown in Figure 2 Amplified structure at A. As shown in the figure, the electronic device 100 includes: a housing 110, a mainboard 120, a sound receiving device 130, a first sealing component 140 and a second sealing component 150. A sound receiving hole 111 is provided on the housing 110. The mainboard 120 is arranged inside the housing 110. The sound receiving device 130 is arranged in a position opposite to the sound receiving hole 111 in the housing 110, and the sound receiving device 130 is electrically connected to the mainboard 120, and is used to collect external sounds through the sound receiving hole 111, and convert them into electrical signals and send them to the mainboard 120. The first sealing component 140 is sandwiched between the sound receiving device 130 and the inner wall of the housing 110 around the sound receiving hole 111, and the first sealing component 140 is configured to allow external sounds to pass through and reach the sound receiving device 130. The second sealing component 150 abuts against the side of the sound receiving device 130 away from the sound receiving hole 111 and wraps around the outer circumference of the sound receiving device 130. The second sealing component 150 abuts against the first sealing component 140 to seal the space where the sound receiving device 130 is located and the internal space of the shell 110.

[0045] like Figure 3 As shown in , the shell 110 can be made of a soft part 112 and a hard part 113 that are integrally injection molded, and the soft part 112 is wrapped around the outer periphery of the hard part 113 to ensure the structural strength of the shell 110 while improving the hand feel of the user when holding the electronic device 100. The sound receiving hole 111 is opened on the soft part 112 to ensure that the inner wall of the soft part 112 and the first sealing component 140 can be better fitted and sealed. The soft part 112 can be made of thermoplastic elastomer (TPE), and the hard part 113 can be made of a synthetic plastic material of polycarbonate (PC) and acrylonitrile-butadiene-styrene copolymer (ABS). Of course, in some other embodiments, the shell 110 can also be molded with the same material.

[0046] The sound receiving hole 111 and the sound receiving device 130 may be provided with only one, or Figure 1 , Figure 4 and Figure 5 The arrangement shown in the figure is set up multiple times to achieve better sound reception effect, among which Figure 4 shows the internal structure of the electronic device 100, Figure 5 Shows Figure 4A magnified structure at B. Figure 1 In the specific embodiment shown, there are four sound receiving holes 111 and four sound receiving devices 130, and the distance between two adjacent sound receiving holes 111 and 130 is 40 mm. Through practical tests, it is found that the four sound receiving holes 111 and the sound receiving devices 130 and the distance of 40 mm can achieve a better sound receiving effect.

[0047] The first sealing component 140 can be one or more stacked combinations of structures such as foam pads and soft rubber pads. The first sealing component 140 is used to be clamped between the sound receiving device 130 and the inner wall of the shell 110 to preliminarily seal the assembly gap between the sound receiving device 130 and the inner wall of the shell 110.

[0048] The second sealing component 150 can be a combination of one or more structures such as a foam block and a soft rubber block. The second sealing component 150 is used to wrap around the outer periphery of the sound receiving device 130 and abut against the first sealing component 140 to reliably seal the assembly gap that may exist between the first sealing component 140 and the sound receiving device 130.

[0049] The electronic device 100 provided in the embodiment of the present application adopts a first sealing component 140 to seal the assembly gap between the inner wall of the shell 110 and the sound receiving device 130, and further adopts a second sealing component 150 to seal the assembly gap that may exist between the first sealing component 140 and the sound receiving device 130, thereby performing high-strength sealing between the internal space of the shell 110 and the space where the sound receiving device 130 is located, so that the space where the sound receiving device 130 is located and connected to the outside world is sealed and isolated from the space inside the shell 110 where the main board 120 is set, so as to provide reliable protection for the operation of the sound receiving device 130 and prevent the sound emitted by other components in the shell 110 from affecting the normal operation of the sound receiving device 130.

[0050] Regarding the structure of the first sealing assembly 140, this application proposes an implementation method. Figure 3 , and further combined with Figure 6 and Figure 7 , Figure 6 The explosion structure at the radio receiver is shown. Figure 7 Shows Figure 5 The enlarged structure at C. As shown in the figure, the first sealing component 140 includes a dustproof net 141 and a sealing buffer gasket 142, the dustproof net 141 is attached to the inner wall of the housing 110 and covers the sound receiving hole 111, the sealing buffer gasket 142 is sandwiched between the dustproof net 141 and the sound receiving device 130, and the sealing buffer gasket 142 is provided with a first through hole 1421 for external sound to pass through.

[0051] Specifically, the dustproof net 141 can be made of non-woven fabric, and the sealing buffer gasket 142 can be made of instant noodle material. During assembly, the dustproof net 141 can be first glued to the sealing buffer gasket 142 by glue, and then the sealing buffer gasket 142 and the dustproof net 141 can be glued together and attached to the inner wall of the shell 110 by glue.

[0052] By sandwiching a dustproof net 141 and a sealing buffer gasket 142 between the sound receiving device 130 and the inner wall of the shell 110, not only can the sound receiving hole 111 be dust-proof and the shell 110 and the sound receiving device 130 be sealed, but the sound receiving device 130 can also be shock-absorbing through the deformation of the sealing buffer gasket 142, thereby improving the structural stability of the sound receiving device 130.

[0053] In order to improve the sealing effect of the sealing buffer gasket 142, the present application further proposes an implementation method. Figure 3 , Figure 6 and Figure 7 As shown in the figure, the first sealing assembly 140 also includes a rigid pressing sheet 143, which is fixed in the housing 110 and presses the sealing buffer gasket 142 onto the dustproof net 141, so that the sealing buffer gasket 142 is deformed to form an interference fit. The sound receiving device 130 is arranged on the side of the rigid pressing sheet 143 away from the sealing buffer gasket 142, and a second through hole 1431 is opened on the rigid pressing sheet 143 for external sound to pass through.

[0054] Specifically, the rigid pressing sheet 143 can be made of stainless steel or other materials with high rigidity to ensure structural strength and stability of the compression joint with the sealing buffer gasket 142. Figure 7 As shown in the figure, the rigid pressing piece 143 is connected to the stud on the inner wall of the shell 110 by threaded fasteners to achieve assembly and fixation with the shell 110. In addition, the rigid pressing piece 143 can also be assembled and fixed with the shell 110 by means of clamping, riveting, etc., which is not limited here.

[0055] By using the rigid pressing sheet 143 to reliably press the sealing buffer gasket 142 onto the dustproof net 141 to form an interference fit, it can be ensured that the sealing buffer gasket 142 can provide better sealing performance.

[0056] Regarding the electrical connection structure of the sound receiving device 130, this application further proposes an implementation method. Figure 3 , Figure 6 and Figure 7As shown in the figure, the first sealing component 140 also includes a flexible circuit board 144, which is attached and fixed to the side of the rigid pressing plate 143 away from the sealing buffer gasket 142, and the sound receiving device 130 is arranged on the side of the flexible circuit board 144 away from the rigid pressing plate 143. The sound receiving device 130 is electrically connected to the main board 120 through the flexible circuit board 144, and a third through hole 1441 is opened on the flexible circuit board 144 for external sound to pass through.

[0057] On the basis of using a flexible circuit board 144 to electrically connect the sound receiving device 130 and the main board 120, by attaching and fixing the flexible circuit board 144 to the rigid pressing plate 143, and by the support of the flexible circuit board 144 by the rigid pressing plate 143, the strength of the flexible circuit board 144 can be effectively improved, thereby ensuring the stability of the circuit between the sound receiving device 130 and the main board 120.

[0058] For Figure 5 and Figure 7 As for the embodiment shown in the figure, a plurality of sound receiving holes 111 and sound receiving devices 130 are used, and the first sealing component 140 is composed of a dustproof net 141, a sealing buffer gasket 142, a rigid pressing plate 143 and a flexible circuit board 144. Both the rigid pressing plate 143 and the flexible circuit board 144 can adopt a strip structure and be arranged corresponding to all the sound receiving devices 130, so that the multiple sound receiving devices 130 are electrically connected to each other through the flexible circuit board 144 and work together to realize sound collection. At the same time, the integrated rigid pressing plate 143 can provide better pre-tightening pressure for the sealing buffer gasket 142.

[0059] In order to improve the sound receiving effect of the sound receiving device 130, the present application further proposes an implementation method. Figure 3 As shown in the figure, the diameter D1 of the sound receiving hole 111 is equal to the diameter D3 of the second through hole 1431 , the diameter D1 of the sound receiving hole 111 is smaller than the diameter D2 of the first through hole 1421 , and the diameter D1 of the sound receiving hole 111 is larger than the diameter D4 of the third through hole 1441 .

[0060] After practical testing and verification, it is found that after setting D2>D1=D3>D4, the sound receiving device 130 can achieve a better sound receiving effect. Preferably, D1=D3=1.5mm, D2=1.8mm, D4=0.8mm, and this setting can achieve the best sound receiving effect.

[0061] Furthermore, if Figure 3 As shown in , in some embodiments, the ratio of the diameter D1 of the sound receiving hole 111 to the sum H of the depths of the sound receiving hole 111 , the first through hole 1421 , the second through hole 1431 and the third through hole 1441 is any value in the range of 0.3-0.4.

[0062] The ratio between D1 and H is called the diameter-to-depth ratio. Similarly, after testing the sound receiving effect of the sound receiving device 130, setting the diameter-to-depth ratio (D1 / H) within the range of 0.3-0.4 can achieve better sound receiving effect. The diameter-to-depth ratio is preferably set to 0.35 to achieve the best sound receiving effect.

[0063] Regarding the specific structure of the second sealing assembly 150, this application proposes an implementation method. Figure 3 and Figure 6 As shown in the figure, the second sealing component 150 includes a sealing buffer pad 151 , which is wrapped around the outer periphery of the sound receiving device 130 and attached to the surface of the first sealing component 140 .

[0064] Specifically, the sealing buffer pad 151 can be made of materials such as silicone and foam. During assembly, after the sealing buffer pad 151 is wrapped around the periphery of the sound receiving device 130, it can be glued to the first sealing component 140 to achieve assembly and fixation of the sealing buffer pad 151.

[0065] In this embodiment, the sealing buffer pad 151 is wrapped around the periphery of the sound receiving device 130 and attached to the surface of the first sealing component 140, so as to achieve all-round sealing protection for the periphery of the sound receiving device 130, ensuring that the sound inside the shell 110 will basically not interfere with the sound receiving device 130.

[0066] In order to give full play to the sealing performance of the sealing buffer pad 151, the present application further proposes an implementation method. Figure 3 , Figure 6 and Figure 7 As shown in the figure, the second sealing assembly 150 also includes a bracket 152, which is fixed inside the housing 110 and crimped on the side of the sealing buffer pad 151 away from the first sealing assembly 140, so that the sealing buffer pad 151 is deformed to form an interference fit.

[0067] Specifically, the bracket 152 can be made of hard plastic material or metal material to ensure structural strength and provide reliable pre-tightening pressure for the sealing buffer pad 151 .

[0068] By using the bracket 152 to press the sealing buffer pad 151 onto the first sealing assembly 140 to form an interference fit, the sealing buffer pad 151 can achieve a more reliable sealing effect.

[0069] Currently, the sound receiving holes on conventional electronic devices are generally located on the side of the shell, and the axis of the sound receiving hole is parallel to the plane where the display area of ​​the electronic device is located. When the usage scenario is that the user faces the front where the display area is located for voice interaction, the user's voice will be blocked by the electronic device shell, which may cause the sound receiving device to fail to pick up enough sound, affecting the sensitivity of the sound receiving device, and further affecting the success rate and accuracy of the voice interaction, affecting the user experience.

[0070] In this regard, this application proposes an implementation method, please refer to Figure 1 As shown in the figure, the sound receiving hole 111 is arranged at the edge of the housing 110, and the opening of the sound receiving hole 111 faces the side where the front side 160 of the electronic device is located.

[0071] Specifically, “the opening of the sound receiving hole 111 faces the side where the front face 160 of the electronic device is located” includes the opening of the sound receiving hole 111 tilting toward the side where the front face 160 of the electronic device is located, or the opening of the sound receiving hole 111 vertically faces the side where the front face 160 of the electronic device is located.

[0072] exist Figure 1 In a specific embodiment of an electronic device 100 with curved side edges shown in , in order to maximize the design of the display area 161, the sound receiving hole 111 is arranged on the curved side edge, and its opening is inclined toward the side where the front 160 of the electronic device is located. Of course, for the electronic device 100 with curved side edges, the sound receiving hole 111 can also be directly arranged on the front 160 of the electronic device 100, and the opening of the sound receiving hole 111 is arranged vertically toward the side where the front 160 of the electronic device is located.

[0073] Considering that when a user performs voice interaction with the handheld electronic device 100, the height of the electronic device 100 is generally lower than the user's head, on this basis, in order to enable the sound receiving device 130 to achieve a better sound receiving effect, in some embodiments, such as Figure 1 As shown in , the sound receiving hole 111 is arranged at the upper edge of the housing 110 .

[0074] The sound receiving hole 111 is arranged at the upper edge of the housing 110 , so that when the user performs voice interaction with the handheld electronic device 100 , the distance between the sound receiving hole 111 and the user's head and mouth is closer, and the sound receiving effect is better.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way.

Claims

1. An electronic device, characterized in that: include: A shell body, wherein a sound receiving hole is provided on the shell body; A mainboard, arranged inside the housing; A sound receiving device, arranged in a position opposite to the sound receiving hole in the housing, electrically connected to the mainboard, and used for collecting external sound through the sound receiving hole, converting it into an electrical signal and sending it to the mainboard; a first sealing component, sandwiched between the sound receiving device and an inner wall of the housing around the sound receiving hole, the first sealing component being configured to allow external sound to pass through and reach the sound receiving device; The second sealing component abuts against the side of the sound receiving device away from the sound receiving hole and wraps around the outer circumference of the sound receiving device. The second sealing component abuts against and cooperates with the first sealing component to seal the space where the sound receiving device is located and the internal space of the shell.

2. The electronic device according to claim 1, characterized in that: The first sealing component includes a dustproof net and a sealing buffer gasket. The dustproof net is attached to the inner wall of the shell and covers the sound receiving hole. The sealing buffer gasket is clamped between the dustproof net and the sound receiving device. The sealing buffer gasket is provided with a first through hole for external sound to pass through.

3. The electronic device according to claim 2, characterized in that: The first sealing assembly also includes a rigid pressing plate, which is fixed in the shell and presses the sealing buffer gasket onto the dustproof net so that the sealing buffer gasket is deformed to form an interference fit. The sound receiving device is arranged on the side of the rigid pressing plate away from the sealing buffer gasket, and a second through hole is opened on the rigid pressing plate for external sound to pass through.

4. The electronic device according to claim 3, characterized in that: The first sealing component also includes a flexible circuit board, which is attached and fixed to the side of the rigid pressing plate away from the sealing buffer gasket. The sound receiving device is arranged on the side of the flexible circuit board away from the rigid pressing plate. The sound receiving device is electrically connected to the main board through the flexible circuit board. The flexible circuit board is provided with a third through hole for external sound to pass through.

5. The electronic device according to claim 4, characterized in that: The diameter of the sound receiving hole is equal to the diameter of the second through hole, the diameter of the sound receiving hole is smaller than the diameter of the first through hole, and the diameter of the sound receiving hole is larger than the diameter of the third through hole.

6. The electronic device according to claim 4, characterized in that: The ratio of the diameter of the sound receiving hole to the sum of the depths of the sound receiving hole, the first through hole, the second through hole and the third through hole is any value within the range of 0.3-0.

4.

7. The electronic device according to claim 1, characterized in that: The second sealing component includes a sealing buffer pad, which is wrapped around the outer periphery of the sound receiving device and attached to the surface of the first sealing component.

8. The electronic device according to claim 7, characterized in that: The second sealing assembly further comprises a bracket, which is fixed inside the housing and pressed against a side of the sealing buffer pad away from the first sealing assembly so as to deform the sealing buffer pad to form an interference fit.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The sound receiving hole is arranged at the edge of the shell, and the opening of the sound receiving hole faces the side where the front of the electronic device is located.

10. The electronic device according to claim 9, characterized in that: The sound receiving hole is arranged at the upper edge of the shell.

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