Heat dissipation back clamp

Abstract

The embodiment of the utility model provides a heat dissipation back splint, which comprises an aluminum VC bottom plate used for conducting heat generated by a mobile terminal, and the inside of the aluminum VC bottom plate is of a hollow structure, and a cooling medium is arranged in the hollow structure; the heat dissipation assembly is arranged on the side, away from the mobile terminal, of the aluminum VC bottom plate and used for transferring heat conducted by the aluminum VC bottom plate into air. According to the utility model, the problem of poor heat dissipation efficiency of the heat dissipation back splint in the prior art is solved.

Description

Technical Field

[0001] The embodiment of the utility model relates to the technical field of radiators, and in particular to a heat dissipation back clip. Background Art

[0002] The heat dissipation back clip is a key technology for heat dissipation of electronic devices. With the continuous development and performance improvement of electronic devices, the heat generated inside the devices is also increasing, such as high-power components such as processors and graphics cards. As an effective heat dissipation solution, the heat dissipation back clip has gradually attracted widespread attention.

[0003] At present, heat dissipation back clips have been widely used in the field of electronic devices, but there are still some challenges and problems. One of the main problems is that in order to improve the heat dissipation efficiency, the main method is to add components, which makes the overall weight heavier. When there is a requirement for the portability of the heat dissipation back clip, the heat dissipation efficiency of the existing heat dissipation back clip often cannot meet the requirements and has poor heat dissipation efficiency. Utility Model Content

[0004] The embodiment of the utility model provides a heat dissipation back clip, which at least solves the problem of poor heat dissipation efficiency of the heat dissipation back clip in the related art.

[0005] According to an embodiment of the utility model, a heat dissipation back clip is provided, comprising:

[0006] An aluminum VC bottom plate, used for conducting heat generated by the mobile terminal, wherein the interior of the aluminum VC bottom plate is a hollow structure, and a cooling medium is arranged in the hollow structure;

[0007] The heat dissipation component is arranged on the side of the aluminum VC bottom plate away from the mobile terminal, and is used to transfer the heat conducted by the aluminum VC bottom plate to the air.

[0008] Through the utility model, due to the use of an aluminum VC bottom plate, the thermal conductivity of the workpiece made of aluminum VC material can reach about 3000W / mk, and the thermal conductivity efficiency is high. In addition, combined with the design of a hollow structure inside, the structure is light and simple. Therefore, while combining portability, the heat dissipation efficiency is also improved, solving the problem of poor heat dissipation efficiency of the heat dissipation back clip in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a schematic structural diagram of a heat dissipation back clip according to an embodiment of the utility model at a first viewing angle;

[0010] Figure 2 is a schematic structural diagram of a heat dissipation back clip according to another embodiment of the utility model at a second viewing angle;

[0011] Figure 3It is a structural schematic diagram of a first heat sink, a second heat sink, and an aluminum VC bottom plate according to another embodiment of the utility model;

[0012] Figure 4 It is a structural schematic diagram of an aluminum VC bottom plate according to an embodiment of the utility model;

[0013] Figure 5 It is a structural schematic diagram of a heat dissipation back clip with a cover body installed according to another embodiment of the utility model.

[0014] Explanation of the reference numerals: 1. Aluminum VC bottom plate; 11. Hollow structure; 12. Positioning hole; 13. Avoidance groove; 2. Heat dissipation assembly; 21. Heat sink; 211. First heat sink; 212. Second heat sink; 22. Cooling fan; 3. Semiconductor cooling sheet; 4. Thermal pad; 5. Cover; 51. Drainage hole; 52. Drainage hole; 6. Drainage groove. DETAILED DESCRIPTION

[0015] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0016] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0017] In this embodiment, a heat dissipation back clip is provided. Figure 1 : is a schematic diagram of the structure of the heat dissipation back clip according to an embodiment of the utility model at a first viewing angle, such as Figure 1 As shown, the heat dissipation back clip includes an aluminum VC bottom plate 1 and a heat dissipation component 2; wherein,

[0018] The aluminum VC bottom plate 1 is used to conduct heat generated by the mobile terminal, wherein the interior of the aluminum VC bottom plate 1 is a hollow structure 11, and a cooling medium is arranged in the hollow structure 11;

[0019] In an exemplary embodiment, the cooling medium may be water, helium, ethylene glycol, or the like.

[0020] In one embodiment, a groove structure is formed on the side wall of the aluminum VC bottom plate 1 located in the hollow structure 11 .

[0021] In an exemplary embodiment, the following form may be adopted:

[0022] For example, a series of fine grooves can be provided on the side wall of the aluminum VC bottom plate 1, and these grooves can be arranged in a grid pattern to increase the surface area of ​​the liquid cooling medium. The depth and width of the grooves can be set according to actual conditions to ensure that the penetration effect can effectively guide the liquid cooling medium back into the hollow structure 11.

[0023] For example, a certain slope or pipeline can be set in the hollow structure 11 to facilitate the smooth reflux of the liquid cooling medium to the appropriate position. These slopes or pipelines can help the liquid cooling medium to reflux smoothly under the action of gravity, and can also reduce the resistance of the liquid cooling medium and improve the reflux efficiency.

[0024] For example, a certain number of guide plates or drainage grooves may be provided in the hollow structure 11 to guide the liquid cooling medium to flow back to the optimal position to ensure that the entire reflux process proceeds smoothly.

[0025] Through the above method, the liquid cooling medium can be effectively returned to the hollow structure 11 by utilizing the osmosis effect, thereby improving the cooling efficiency of the aluminum VC bottom plate 1, while also reducing energy consumption and improving the stability of the equipment.

[0026] For example, when the heat of the mobile terminal is high, the cooling medium in the hollow structure 11 may be heated to the form of hot steam, and the hot steam diffuses to the side wall of the heat sink 21 and liquefies into liquid. The liquid cooling medium flows to the side wall of the aluminum VC bottom plate 1, and through the setting of the groove structure and combined with the penetration effect, the liquid cooling medium is refluxed into the hollow structure 11 to achieve the effect of reflux of the cooling medium.

[0027] In one embodiment, the hollow structure 11 is in a vacuum state and is filled with a cooling medium.

[0028] The heat dissipation component 2 is arranged on a side of the aluminum VC bottom plate 1 facing away from the mobile terminal, and is used to transfer the heat conducted by the aluminum VC bottom plate 1 to the air.

[0029] In one embodiment, the heat dissipation assembly 2 includes:

[0030] One or more heat sinks 21, in contact with the aluminum VC bottom plate 1;

[0031] The cooling fan 22 is disposed on one side of a heat sink 21 or between a plurality of heat sinks 21 to perform heat exchange on the heat sink 21 .

[0032] In one embodiment, a guide groove 6 is formed on the side wall of the heat sink 21 .

[0033] In an exemplary embodiment, when the cooling fan 22 is working, it will cause turbulence to the air. The provision of the guide groove 6 can accelerate the air circulation, thereby achieving the effect of taking away the heat by the cooling fan 22.

[0034] Figure 2 is a schematic structural diagram of a heat dissipation back clip according to another embodiment of the utility model at a second viewing angle, Figure 3is a schematic diagram of the structure of a first heat sink, a second heat sink, and an aluminum VC bottom plate according to another embodiment of the utility model. In one implementation, Figure 2 and Figure 3 As shown, the heat sink 21 includes:

[0035] A first heat sink 211 is disposed at a side away from a handheld portion of the mobile terminal;

[0036] The second heat sink 212 is disposed on the other side away from the handheld portion of the mobile terminal.

[0037] In an exemplary embodiment, when the user fixes the heat dissipation back clip on the mobile terminal and uses the mobile terminal, most of the heat generated by the mobile terminal during operation will be conducted to the heat sink 21, and the heat of the heat sink 21 is relatively high. By adopting the above configuration, when the heat dissipation fan 22 is working, the hot air generated by the heat dissipation fan 22 on the first heat sink 211 and the second heat sink 212 mainly flows out from the vicinity of the first heat sink 211 and the second heat sink 212. Since the flow direction of the hot air avoids the hand-held part, the impact on the user's hands is reduced, thereby improving the user experience.

[0038] In one embodiment, if Figure 1 As shown, the heat dissipation back clip also includes:

[0039] The semiconductor cooling sheet 3 is arranged on the side of the aluminum VC bottom plate 1 away from the heat dissipation component 2. The hot end of the semiconductor cooling sheet 3 contacts the aluminum VC bottom plate 1, and the cold end of the semiconductor cooling sheet 3 is arranged close to the mobile terminal.

[0040] In an exemplary embodiment, since the cold end of the semiconductor cooling sheet 3 is arranged close to the mobile terminal, the hot end of the semiconductor cooling sheet 3 is in contact with the aluminum VC bottom plate 1, so that the heat generated by the mobile terminal is easily transferred from the cold end of the semiconductor cooling sheet 3 to the hot end, and then the heat is transferred to the aluminum VC bottom plate 1. Combined with the characteristics of the semiconductor cooling sheet 3, the heat will first absorb heat and then release heat in the process from the cold end to the hot end, so that the heat generated by the mobile terminal can be effectively transferred to the aluminum VC bottom plate 1.

[0041] In one embodiment, if Figure 1 As shown, the heat dissipation back clip also includes:

[0042] The thermal pad 4 is arranged on the side of the semiconductor cooling sheet 3 away from the aluminum VC bottom plate 1, one side of the thermal pad 4 contacts the cold end of the semiconductor cooling sheet 3, and the other side of the thermal pad 4 contacts the mobile terminal.

[0043] In an exemplary embodiment, the thermal pad 4 may be a thermally conductive silicone pad. By using the thermally conductive silicone pad, the following technical effects can be achieved:

[0044] 1. Good thermal conductivity: The thermal conductive silicone pad has excellent thermal conductivity, can effectively conduct heat, help dissipate heat, and protect electronic components from overheating.

[0045] 2. High temperature resistance: The thermally conductive silicone pad can maintain stable performance in high temperature environments and will not fail or deform due to high temperature.

[0046] 3. Corrosion resistance: The thermal conductive silicone pad has good corrosion resistance, can resist the erosion of chemical substances and extend the service life.

[0047] 4. Good insulation performance: The thermal conductive silicone pad has good insulation performance, which can effectively isolate the electrical connection between the electronic components and the radiator, and protect the electronic components from electrical influences.

[0048] 5. Wear resistance: The surface of the thermal conductive silicone pad is smooth and has good wear resistance, which can protect electronic components from external wear.

[0049] 6. Good flexibility: The thermal conductive silicone pad has good flexibility and can adapt to heat dissipation components of different shapes, making it easy to install and use.

[0050] In one embodiment, the thermal pad 4 is filled with a thermally conductive material, thereby improving the heat conduction efficiency of the thermal pad 4 .

[0051] In an exemplary embodiment, the thermal pad 4 is provided with a hollow structure 11, and the thermally conductive material filled in the hollow structure 11 may be thermally conductive glue, thermally conductive grease, thermally conductive foam (e.g., polystyrene foam (EPS), polyurethane foam (PUF)), thermally conductive fiber (e.g., glass fiber), mineral wool, diatom mud, etc. Alternatively, the thermally conductive material is coated on the thermal pad 4 to form a thermally conductive layer on the side wall of the thermal pad 4. The specific setting method may be set according to actual conditions.

[0052] Figure 4 : is a schematic diagram of the structure of an aluminum VC bottom plate according to an embodiment of the utility model. In one implementation, as Figure 4 As shown, a positioning hole 12 is opened on the side wall of the aluminum VC bottom plate 1.

[0053] In an exemplary embodiment, a plurality of positioning holes 12 are provided on the side wall of the aluminum VC bottom plate 1 facing away from the mobile terminal, and the positioning holes 12 are provided for fixing the cooling fan 22 and the heat sink 21 on the side wall of the aluminum VC bottom plate 1 facing away from the mobile terminal using fixing parts (such as screws, mortise and tenon structures, etc.).

[0054] In one embodiment, if Figure 4 As shown, a side wall of the aluminum VC bottom plate 1 is provided with an avoidance groove 13 .

[0055] In an exemplary embodiment, when it is necessary to add a cover 5 to the cooling fan 22 and the heat sink 21, the avoidance groove 13 can accommodate the components in the cover 5, so as to facilitate the installation of the cover 5. Alternatively, when there is a gap between the first heat sink 211 and the second heat sink 212, the avoidance groove 13 is adjacent to the position of the gap, and a blocking piece can be provided at a corresponding position of the cover 5 to block the position of the gap, thereby preventing the cooling fan 22 from flowing out from the position of the gap, thereby protecting the user.

[0056] In one embodiment, the side walls of the heat sink 21 and the aluminum VC bottom plate 1 are provided with a nickel-plated layer, and the side wall between the heat sink 21 and the aluminum VC bottom plate 1 is provided with a solder paste layer. When the mobile terminal generates high temperature during operation, the high temperature melts the solder paste layer, thereby tightly connecting the heat sink 21 and the aluminum VC bottom plate 1, and further forming the heat sink 21 and the aluminum VC bottom plate 1 into a heat-conducting whole with low thermal resistance.

[0057] Figure 5 is a schematic diagram of the structure of a heat dissipation back clip with a cover installed according to another embodiment of the utility model. In one implementation, as Figure 5 As shown, the heat dissipation back clip also includes:

[0058] A cover 5, used to guide the heat of the heat sink 21;

[0059] The side wall of the cover 5 close to the cooling fan 22 is provided with a drainage hole 51, and the side wall of the cover 5 close to the heat sink 21 is provided with a guide hole 52, and the extension direction of the guide hole 52 is not colinear with the line connecting the handheld part of the mobile terminal.

[0060] In an exemplary embodiment, when the cooling fan 22 is working, air with relatively low external temperature flows to the inside of the cover body 5 through the guide holes 51, and air heated by the heat sink 21 flows from the guide holes 52 to the outside of the cover body 5, thereby achieving air circulation to improve heat dissipation efficiency.

[0061] In an exemplary embodiment, the mobile terminal may be a handheld device such as a mobile phone, a tablet, or a game console.

[0062] The implementation principle of the embodiment of the present application is:

[0063] When the heat dissipation back clip is fixed on the mobile terminal, the heat generated by the mobile terminal during operation is conducted to the thermal pad 4, the thermal pad 4 conducts the heat to the semiconductor cooling plate 3, the semiconductor cooling plate 3 conducts the heat from the cold end to the hot end, and then conducts it to the aluminum VC bottom plate 1, the aluminum VC bottom plate 1 conducts the heat to the heat sink 21, and through the turbulence effect of the heat dissipation fan 22, the air with relatively low external temperature flows to the inside of the cover body 5 through the guide hole 51, and the air heated by the heat sink 21 flows from the guide hole 52 to the outside of the cover body 5, thereby realizing air circulation to improve the heat dissipation efficiency.

[0064] Secondly, when the heat of the mobile terminal is high, the cooling medium in the hollow structure 11 may be heated to the form of hot steam, and the hot steam diffuses to the side wall of the heat sink 21 and liquefies into liquid. The liquid cooling medium flows to the side wall of the aluminum VC bottom plate 1, and through the setting of the groove structure and combined with the penetration effect, the liquid cooling medium is refluxed into the hollow structure 11 to achieve the effect of reflux of the cooling medium.

[0065] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A heat dissipation back clip, characterized in that: include: An aluminum VC bottom plate, used for conducting heat generated by the mobile terminal, wherein the interior of the aluminum VC bottom plate is a hollow structure, and a cooling medium is arranged in the hollow structure; The heat dissipation component is arranged on the side of the aluminum VC bottom plate away from the mobile terminal, and is used to transfer the heat conducted by the aluminum VC bottom plate to the air.

2. The heat dissipation back clip according to claim 1, characterized in that: Also includes: The semiconductor cooling sheet is arranged on the side of the aluminum VC bottom plate away from the heat dissipation component, the hot end of the semiconductor cooling sheet contacts the aluminum VC bottom plate, and the cold end of the semiconductor cooling sheet is arranged close to the mobile terminal.

3. The heat dissipation back clip according to claim 2, characterized in that: Also includes: The thermal pad is arranged on the side of the semiconductor cooling sheet away from the aluminum VC bottom plate, one side of the thermal pad contacts the cold end of the semiconductor cooling sheet, and the other side of the thermal pad contacts the mobile terminal.

4. The heat dissipation back clip according to claim 1, characterized in that: The side wall of the aluminum VC bottom plate located in the hollow structure is provided with a groove structure.

5. The heat dissipation back clip according to claim 1, characterized in that: The heat dissipation component comprises: One or more heat sinks in contact with the aluminum VC bottom plate; A heat dissipation fan is arranged on one side of the heat dissipation fin or between the plurality of heat dissipation fins to exchange heat for the heat dissipation fins.

6. The heat dissipation back clip according to claim 5, characterized in that: The heat sink comprises: A first heat sink is arranged at a side away from a handheld portion of the mobile terminal; The second heat sink is arranged on the other side away from the handheld part of the mobile terminal.

7. The heat dissipation back clip according to claim 5, characterized in that: Also includes: A cover body, used to guide the heat of the heat sink; The side wall of the cover body close to the cooling fan is provided with a drainage hole, the side wall of the cover body close to the heat sink is provided with a guide hole, and the extension direction of the guide hole is not colinear with the line connecting the handheld part of the mobile terminal.

8. The heat dissipation back clip according to claim 5, characterized in that: The side wall of the heat sink is provided with a guide groove.

9. The heat dissipation back clip according to claim 1, characterized in that: The side wall of the aluminum VC bottom plate is provided with positioning holes.

10. The heat dissipation back clip according to claim 1, characterized in that: The side wall of the aluminum VC bottom plate is provided with an avoidance groove.

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