Tin soldering device for LED element processing

By introducing lifting clamping components and solder components into the LED substrate soldering device, the rapid lifting and soldering operations of the LED substrate are realized, which solves the problem of discontinuity of soldering operations and improves the soldering efficiency of the LED substrate.

CN222221400UActive Publication Date: 2024-12-24ANHUI LANGTONG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202420268743.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-04
Publication Date
2024-12-24
Estimated Expiration
2034-02-04

AI Technical Summary

Technical Problem

During the LED substrate processing process, the solder operation needs to keep the substrate stationary, resulting in discontinuous operation and low efficiency.

Method used

A solder device including a soldering table, conveyor groove, pillar, sealing frame and liftable solder assembly is designed to achieve rapid lifting and soldering operation of the LED substrate through the lift-up clamping assembly and the solder assembly, maintaining continuity, and through The horizontal limit frame and adjustment motor flexibly adjusts the position of the solder gun head.

Benefits of technology

It improves the continuity and efficiency of LED substrate soldering, simplifies the soldering process, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a tin soldering device for LED element processing, and relates to the technical field of electronic accessory processing, and the technical scheme is that the tin soldering device comprises a welding table, a conveying groove is formed in the surface of the welding table, a conveying belt used for conveying an LED substrate to move is installed in the conveying groove, and supporting columns located on the two sides of the conveying belt are fixed to the surface of the welding table; a top plate is fixed between the tops of the supporting columns, sealing frames distributed at equal intervals are installed on the surface of the top plate, a liftable tin soldering assembly is installed in each sealing frame, and transverse limiting frames symmetrically arranged relative to the conveying belt are installed on the surface of the tin soldering table in an attached mode. The LED substrate tin soldering device has the advantages that an LED substrate can be quickly lifted, tin soldering operation is completed after the LED substrate is lifted in place, continuity of tin soldering operation of the LED substrate is kept, flexibility is high, and tin soldering efficiency of the LED substrate can be improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electronic parts processing, and more specifically, it relates to a soldering device for LED element processing. Background Art

[0002] Light emitting diode, or LED for short, is a commonly used light-emitting device that emits light by releasing energy through the recombination of electrons and holes. It is widely used in the field of lighting. Because light emitting diodes can efficiently convert electrical energy into light energy, they have a wide range of uses in modern society, such as lighting, flat panel displays, and medical devices. When fixing the light emitting diode on a substrate, a soldering device is required to fix the pins of the light emitting diode on the substrate.

[0003] There are a large number of light-emitting diodes that need to be soldered on a single LED substrate, so the soldering workload during LED substrate processing is large.

[0004] In order to improve the soldering efficiency of LED substrates, LED substrates are often moved by conveyor belts, and specific points are welded during the movement. Since the LED substrate needs to be kept stationary during welding, the conveyor belt needs to be stopped, resulting in discontinuity in the soldering operation of the LED substrate, thus limiting the soldering efficiency.

[0005] Therefore, in order to solve the above technical problems, the present application proposes a soldering device for LED component processing. Utility Model Content

[0006] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a soldering device for LED component processing, which can quickly lift the LED substrate and complete the soldering operation after lifting it into place, thereby maintaining the continuity of the soldering operation of the LED substrate and having high flexibility, thereby improving the soldering efficiency of the LED substrate.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: including a welding table, the surface of the welding table is structured with a conveying trough, and a conveyor belt for conveying LED substrates is installed in the conveying trough, pillars located on both sides of the conveyor belt are fixed to the surface of the welding table, and a top plate is fixed between the tops of the pillars, sealing frames distributed at equal intervals are installed on the surface of the top plate, and a liftable solder component is installed in the sealing frame, a transverse limit frame symmetrically arranged with respect to the conveyor belt is installed on the surface of the soldering table, and a lifting clamping component that can move in accordance with the surface of the conveyor belt is installed inside the transverse limit frame.

[0008] Preferably, the lifting and clamping assembly includes a transverse rod slidably arranged in a transverse limit frame and a transverse screw rotatably arranged in the transverse limit frame, the transverse screw is threadedly connected to the transverse rod, a reciprocating motor for driving the transverse screw to rotate is fixed to the outer end of the transverse limit frame, and a guide block is fixed to the end of the transverse rod.

[0009] Preferably, the soldering assembly comprises an electric telescopic rod installed in a sealing frame, a bottom plate is fixed to the bottom of the electric telescopic rod, a bottom frame is fixed to the bottom of the bottom plate, an adjusting motor is installed inside the bottom frame, and an adjusting screw is rotatably installed on the inner wall of the bottom frame, the adjusting screw is transmission-connected to the output shaft of the adjusting motor via a pulley and a belt, a transverse block slidably arranged between the inner walls of the bottom frame is threadedly connected to the outer periphery of the adjusting screw, a through rod penetrating the bottom of the bottom frame is fixed to the bottom of the transverse block, and a solder gun head is installed on the bottom end of the through rod.

[0010] Preferably, the side walls of the sealing frame are sealingly mounted with side panels.

[0011] Preferably, an inclined surface is constructed between the side wall of the guide block and the end of the transverse rod, and a groove for accommodating the LED substrate is constructed at the end of the transverse rod.

[0012] Preferably, the bottom of the bottom frame is configured with a through groove adapted to the through rod.

[0013] Preferably, a connecting rod is fixed to the outer periphery of the pillar, and a guide strip located above the conveyor belt is fixed to the end of the connecting rod.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. In the utility model, by setting the lifting clamping assembly, when the LED substrate moves to the soldering station corresponding to the soldering position during the conveying process, the LED substrate can be quickly approached from both sides, thereby shoveling up the LED substrate and temporarily separating the LED substrate from the conveyor belt surface. After the LED substrate completes the soldering operation at the corresponding part, the LED substrate can be quickly put down to maintain the continuity of the LED substrate soldering operation, thereby improving the soldering efficiency of the LED substrate;

[0016] 2. In the utility model, through the arrangement of the soldering assembly, the position of the solder gun head on the corresponding workstation can be flexibly adjusted horizontally so as to be adjusted and used according to the produced LED substrate. The flexibility is high, and the soldering operation can be completed by lifting the LED substrate through the lifting clamping assembly. The soldering process is simple, which is conducive to the rapid completion of the soldering operation, thereby greatly improving the soldering efficiency of the LED substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a cross-sectional view of the transverse limit frame in the utility model;

[0020] Figure 3 It is a cross-sectional view of the sealing frame in the utility model.

[0021] In the figure: 1. welding table; 2. transverse limit frame; 3. reciprocating motor; 4. transverse screw; 5. transverse rod; 6. guide block; 7. support; 8. connecting rod; 9. guide strip; 10. top plate; 11. sealing frame; 12. side plate; 13. electric telescopic rod; 14. bottom plate; 15. bottom frame; 16. adjusting motor; 17. adjusting screw; 18. transverse block; 19. through rod; 20. solder gun head. DETAILED DESCRIPTION

[0022] like Figure 1-3 As shown, the utility model provides a soldering device for processing LED components, including a soldering table 1, the surface of the soldering table 1 is structured with a conveying trough, and a conveying belt for conveying the LED substrate is installed in the conveying trough, the surface of the soldering table 1 is fixed with pillars 7 located on both sides of the conveying belt, and a top plate 10 is fixed between the tops of the pillars 7, the surface of the top plate 10 is installed with sealing frames 11 distributed at equal intervals, the side walls of the sealing frame 11 are sealed with side plates 12, and a solder assembly that can be lifted and lowered is installed in the sealing frame 11, and the surface of the soldering table is fitted with related The conveyor belt is symmetrically arranged with a transverse limit frame 2, and a lifting clamping assembly that can move in accordance with the surface of the conveyor belt is installed inside the transverse limit frame 2. The number of the lifting clamping assemblies corresponds to the number of the solder assemblies, and the solder assemblies are located above the corresponding lifting clamping assemblies. The lifting clamping assembly is used to temporarily separate the LED substrate from the surface of the conveyor belt, and the solder assembly is used to complete the soldering operation when the lifting clamping assembly lifts the LED substrate. A connecting rod 8 is fixed to the periphery of the pillar 7, and a guide strip 9 located above the conveyor belt is fixed to the end of the connecting rod 8.

[0023] In order to quickly scoop up the LED substrate from both sides and separate it from the surface of the conveyor belt, and press it tightly and limit it above the conveyor belt, the lifting clamping assembly includes a transverse rod 5 slidably arranged in the transverse limit frame 2 and a transverse screw 4 rotatably arranged in the transverse limit frame 2, the transverse screw 4 is threadedly connected to the transverse rod 5, and a reciprocating motor 3 for driving the transverse screw 4 to rotate is fixed to the outer end of the transverse limit frame 2, and a guide block 6 is fixed to the end of the transverse rod 5, and an inclined surface is constructed between the side wall of the guide block 6 and the end of the transverse rod 5, and a groove for placing the LED substrate is constructed at the end of the transverse rod 5.

[0024] In order to quickly perform soldering operation on the LED substrate during the process of lifting the LED substrate and adjust the position of the solder gun head 20 according to the corresponding work station, the soldering assembly includes an electric telescopic rod 13 installed in the sealing frame 11, a bottom plate 14 is fixed to the bottom of the electric telescopic rod 13, a bottom frame 15 is fixed to the bottom of the bottom plate 14, an adjusting motor 16 is installed inside the bottom frame 15, and an adjusting screw 17 is rotatably installed on the inner wall of the bottom frame 15, the adjusting screw 17 is connected to the output shaft of the adjusting motor 16 through a pulley and a belt, the outer periphery of the adjusting screw 17 is threadedly connected to a transverse block 18 slidably arranged between the inner walls of the bottom frame 15, a through rod 19 that passes through the bottom of the bottom frame 15 is fixed to the bottom of the transverse block 18, a solder gun head 20 is installed at the bottom end of the through rod 19, and the bottom of the bottom frame 15 is structured with a through groove adapted to the through rod 19.

[0025] It should be noted that the utility model relates to a soldering device for processing LED components. When processing LED components, the LED substrate is placed on the surface of the conveyor belt and moves with the conveyor belt. First, the LED substrate approaches the center line of the conveyor belt surface under the action of the guide bar 9, and then when the LED substrate moves to the soldering station at the corresponding position, the transverse screw 4 rotates rapidly clockwise under the action of the reciprocating motor 3, so that the transverse rod 5 moves rapidly to one side of the LED substrate under the action of the transverse screw 4, and the LED substrate is guided to the end of the transverse rod 5 under the action of the guide block 6, and clamped and limited, and then the solder gun head 20 that is pre-adjusted to the corresponding position by adjusting the motor 16, the adjusting screw 17 and the transverse block 18 is used to perform soldering operation on the corresponding position of the LED substrate. After the soldering operation is completed, the reciprocating motor 3 drives the transverse screw 4 to rotate counterclockwise to reset the transverse rod 5, and then the LED substrate moves to the soldering station at the next position, and the above operations are repeated to complete the soldering operations at the corresponding points in sequence.

[0026] The above description is only a preferred embodiment of the utility model and does not limit the utility model in any form. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. A soldering device for LED component processing, characterized in that: The invention comprises a welding platform (1), wherein the surface of the welding platform (1) is structured with a conveying trough, and a conveying belt for conveying an LED substrate is installed in the conveying trough, pillars (7) located on both sides of the conveying belt are fixed on the surface of the welding platform (1), and a top plate (10) is fixed between the tops of the pillars (7), and the surface of the top plate (10) is installed with sealing frames (11) distributed at equal intervals, and a solder assembly that can be lifted and lowered is installed in the sealing frame (11), and a transverse limiting frame (2) symmetrically arranged with respect to the conveying belt is installed on the surface of the welding platform (1), and a lifting clamping assembly that can move in accordance with the surface of the conveying belt is installed inside the transverse limiting frame (2).

2. The soldering device for LED component processing according to claim 1, characterized in that: The lifting and clamping assembly comprises a transverse rod (5) slidably arranged in a transverse limit frame (2) and a transverse screw (4) rotatably arranged in the transverse limit frame (2); the transverse screw (4) is threadedly connected to the transverse rod (5); a reciprocating motor (3) for driving the transverse screw (4) to rotate is fixed to the outer end of the transverse limit frame (2); and a guide block (6) is fixed to the end of the transverse rod (5).

3. The soldering device for LED component processing according to claim 1, characterized in that: The soldering assembly comprises an electric telescopic rod (13) installed in a sealing frame (11), a bottom plate (14) is fixed to the bottom of the electric telescopic rod (13), a bottom frame (15) is fixed to the bottom of the bottom plate (14), an adjusting motor (16) is installed inside the bottom frame (15), and an adjusting screw (17) is rotatably installed on the inner wall of the bottom frame (15), the adjusting screw (17) is connected to the output shaft of the adjusting motor (16) through a pulley and a belt, the outer periphery of the adjusting screw (17) is threadedly connected to a transverse block (18) slidably arranged between the inner walls of the bottom frame (15), a through rod (19) penetrating the bottom of the bottom frame (15) is fixed to the bottom of the transverse block (18), and a solder gun head (20) is installed at the bottom end of the through rod (19).

4. The soldering device for processing LED components according to claim 1, characterized in that: The side wall of the sealing frame (11) is sealed with a side plate (12).

5. The soldering device for LED component processing according to claim 2, characterized in that: An inclined surface is constructed between the side wall of the guide block (6) and the end of the transverse rod (5), and the end of the transverse rod (5) is constructed with a groove for accommodating an LED substrate.

6. The soldering device for LED component processing according to claim 3, characterized in that: The bottom of the bottom frame (15) is configured with a through slot adapted to the through rod (19).

7. The soldering device for LED component processing according to claim 1, characterized in that: A connecting rod (8) is fixed on the outer periphery of the support (7), and a guide strip (9) located above the conveyor belt is fixed at the end of the connecting rod (8).