Silver-copper alloy bonding wire not easy to break
By designing the spiral oil groove and recess structure on the silver-copper alloy bonding wire, the fracture problems caused by uneven distribution of lubricating oil and temperature changes are solved, and the stability of the bonding wire and the resistance to thermal expansion and contraction are improved.
Patent Information
- Application Number
- CN202420798392.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-16
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-04-16
AI Technical Summary
The lubricating oil distribution of existing bonded wires is unevenly after drying, resulting in fracture of the dry area, and the expansion or contraction pulling force during temperature changes leads to fracture of the solder joints, affecting the use of semiconductor products.
A silver-copper alloy bonded wire is designed, and its arc surface is spiraled to arrange the spiral oil groove to evenly distribute the lubricating oil, and a notch is set at the connection between the second wire section and the pin to buffer the pulling caused by temperature changes. Force, indium is used to improve the surface tension and plastic toughness of the alloy.
The uniform distribution of lubricating oil is achieved, breakage is avoided, and the welding joint is reduced through the recess buffering, improving the stability of the bonding wire and the resistance to thermal expansion and contraction.
Smart Images
Figure CN222233635U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of bonding wires, in particular to a silver-copper alloy bonding wire which is not prone to breaking. Background Art
[0002] Wire bonding refers to the process technology of using thin metal wires to connect the electrode pads of a semiconductor chip with the leads of a housing or the wiring pads on a substrate. In the prior art, the bonding wire is usually vertically led out of the first solder joint on the chip for a certain length, then bent and directly led to the second solder joint on the housing or substrate for fixation, and finally glue is used to package the entire periphery.
[0003] In the production process, after the annealing of the bonding wire is completed, in order to quickly cool the bonding wire, water cooling is usually adopted, and then the bonding wire is dried by drying. After the bonding wire is dried, its outer wall is relatively dry. After drying, a layer of lubricating oil needs to be coated on the bonding wire. However, when the lubricating oil is coated, it is often impossible to achieve full-scale coating of the lubricating oil. As a result, the bonding wire may be broken due to the drying of some areas. During use, when the external temperature changes greatly, the thermal expansion and contraction of the colloid will apply an expansion or contraction pulling force to the bonding wire. After the bonding wire is subjected to the pulling force, it is easy to cause the bonding wire solder joint to break, affecting the use of semiconductor products.
[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a silver-copper alloy bonding wire that is not easy to break is proposed. Utility Model Content
[0005] The utility model aims to provide a silver-copper alloy bonding wire which is not easy to break, so as to solve the problems raised in the above-mentioned background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silver-copper alloy bonding wire that is not easy to break, comprising a packaging substrate and a bonding wire body, a chip is arranged in the middle of the packaging substrate, and pins are arranged around the chip, the bonding wire body is welded and connected between the chip and the pins, and a spiral oil groove is arranged in a spiral structure on the arc surface of the bonding wire body, a first wire segment welded and fixed to the chip is arranged at one end of the bonding wire body, and a second wire segment welded and fixed to the pin is arranged at the other end of the bonding wire body, and a third wire segment is connected between the first wire segment and the second wire segment.
[0007] Furthermore, solder balls are arranged at the bottom of the packaging substrate, and a packaging shell sealed with polymer epoxy is arranged outside the chip.
[0008] Furthermore, the packaging substrate uses polyphenylene ether resin as the substrate material, and the pins use copper-based materials.
[0009] Furthermore, one end of the bonding wire body is connected to the electrode pad of the chip, and the other end of the bonding wire body is connected to the wiring pad of the pin.
[0010] Furthermore, the first wire segment is arranged perpendicular to the chip surface, and the first wire segment is connected to the third wire segment after being bent ninety degrees.
[0011] Furthermore, a notch facing the chip is provided at the connection between the second wire segment and the pin, and an angle between the notch at the connection between the second wire segment and the pin is less than ninety degrees.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] 1. When the utility model is in use, a spiral oil groove is arranged in a spiral structure on the arc surface of the bonding wire body, so that the lubricating oil applied during the production process can be evenly diffused along the spiral oil groove on the surface of the bonding wire body, ensuring that the lubricating oil is evenly distributed on the surface of the bonding wire body and is not easy to dry, avoiding the breakage of the bonding wire body due to drying caused by the fact that some areas of the bonding wire are not covered with lubricating oil after drying.
[0014] 2. When the utility model is in use, the bonding wire body of the present application adds indium to the original silver-copper alloy to improve the surface tension of the alloy liquid. The bonding wire body with added indium optimizes the plastic toughness and its ball-forming performance during bonding, and can avoid the breakage of the bonding wire body. In addition, during use, the first wire segment is vertically led out through the first welding point of the bonding wire body on the chip, and then bent into the third wire segment and directly led to the second welding point on the pin for fixation. The connection between the second wire segment and the pin of the present application is provided with a notch facing the chip. When the external temperature changes greatly and the thermal expansion and contraction of the colloid applies an expansion or contraction pulling force to the bonding wire body, the notch at the connection between the second wire segment and the pin can play a role of buffering extension, reducing the force on the connection point between the second wire segment and the pin, and avoiding breakage. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the overall external structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the overall internal structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the bonding wire body structure of the utility model.
[0018] In the figure: 1. packaging substrate; 2. solder ball; 3. chip; 4. packaging shell; 5. pin; 6. bonding wire body; 7. spiral wire oil groove; 8. first wire segment; 9. second wire segment; 10. third wire segment. DETAILED DESCRIPTION
[0019] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.
[0020] like Figures 1 to 3 As shown, a silver-copper alloy bonding wire that is not easy to break includes a packaging substrate 1 and a bonding wire body 6. The packaging substrate 1 uses polyphenylene ether resin as a substrate material, and the pins 5 use a copper-based material. A chip 3 is arranged in the middle of the packaging substrate 1, and pins 5 are arranged around the chip 3. A solder ball 2 is arranged at the bottom of the packaging substrate 1. A packaging shell 4 sealed with polymer epoxy is arranged outside the chip 3. The bonding wire body 6 is welded and connected between the chip 3 and the pins 5, and a spiral oil groove is arranged on the arc surface of the bonding wire body 6 in a spiral structure. 7. In the present application, a spiral oil groove 7 is arranged in a spiral structure on the arc surface of the bonding wire body 6. In this way, the lubricating oil applied during the production process can be evenly diffused along the spiral oil groove 7 on the surface of the bonding wire body 6, ensuring that the lubricating oil is evenly distributed on the surface of the bonding wire body 6 and is not easy to dry, thereby avoiding the breakage of the bonding wire body 6 due to drying caused by the fact that some areas of the bonding wire are not covered with lubricating oil after drying. One end of the bonding wire body 6 is connected to the electrode welding area of the chip 3, and the other end of the bonding wire body 6 is connected to the wiring welding area of the pin 5. The bonding wire body 6 is connected to the chip 3, one end of the bonding wire body 6 is provided with a first wire segment 8 welded and fixed to the chip 3, and the other end of the bonding wire body 6 is provided with a second wire segment 9 welded and fixed to the pin 5, and a third wire segment 10 is connected between the first wire segment 8 and the second wire segment 9, the first wire segment 8 is arranged perpendicular to the surface of the chip 3, and the first wire segment 8 is connected to the third wire segment 10 after being bent ninety degrees, and a notch facing the chip 3 is arranged at the connection between the second wire segment 9 and the pin 5, and the angle of the notch at the connection between the second wire segment 9 and the pin 5 is less than ninety degrees, The first wire segment 8 is vertically led out from the first welding point on the chip 3 by using the bonding wire body 6, and then bent into the third wire segment 10 and directly led to the second welding point on the pin 5 for fixation. In the present application, a notch facing the chip 3 is provided at the connection between the second wire segment 9 and the pin 5. When the external temperature changes greatly and the thermal expansion and contraction of the colloid applies an expansion or contraction pulling force to the bonding wire body 6, the notch at the connection between the second wire segment 9 and the pin 5 can play a role in buffering the extension, thereby reducing the force on the connection point between the second wire segment 9 and the pin 5 and avoiding breakage.
[0021] Working principle: When using the silver-copper alloy bonding wire that is not easy to break, the present application arranges a spiral oil groove 7 in a spiral structure on the arc surface of the bonding wire body 6, so that the lubricating oil applied during the production process can be evenly diffused along the spiral oil groove 7 on the surface of the bonding wire body 6, ensuring that the lubricating oil is evenly distributed on the surface of the bonding wire body 6 and is not easy to dry, avoiding the breakage of the bonding wire body 6 due to drying caused by the fact that some areas of the bonding wire are not covered with lubricating oil after drying. The bonding wire body 6 of the present application adds indium to improve the surface tension of the alloy liquid on the basis of the original silver-copper alloy, and the bonding wire body 6 with added indium optimizes the plasticity and toughness. and its balling performance during bonding, which can avoid the breakage of the bonding wire body 6. In addition, during use, the first wire segment 8 is vertically led out from the first welding point of the bonding wire body 6 on the chip 3, and then bent into the third wire segment 10 and directly led to the second welding point on the pin 5 for fixation. In the present application, a notch facing the chip 3 is provided at the connection between the second wire segment 9 and the pin 5. When the external temperature changes greatly and the thermal expansion and contraction of the colloid applies an expansion or contraction pulling force to the bonding wire body 6, the notch at the connection between the second wire segment 9 and the pin 5 can play a role of buffering extension, reducing the force on the connection point between the second wire segment 9 and the pin 5, and avoiding breakage.
[0022] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.
Claims
1. A silver-copper alloy bonding wire that is not easy to break, characterized in that: The invention comprises a packaging substrate (1) and a bonding wire body (6), wherein a chip (3) is arranged in the middle of the packaging substrate (1), and pins (5) are arranged around the chip (3), the bonding wire body (6) is welded and connected between the chip (3) and the pins (5), and a spiral oil groove (7) is arranged in a spiral structure on the arc surface of the bonding wire body (6), a first wire segment (8) welded and fixed to the chip (3) is arranged at one end of the bonding wire body (6), and a second wire segment (9) welded and fixed to the pin (5) is arranged at the other end of the bonding wire body (6), and a third wire segment (10) is connected between the first wire segment (8) and the second wire segment (9).
2. The silver-copper alloy bonding wire that is not prone to wire breakage according to claim 1, characterized in that: A solder ball (2) is arranged at the bottom of the packaging substrate (1), and a packaging shell (4) sealed with polymer epoxy is arranged outside the chip (3).
3. The silver-copper alloy bonding wire that is not prone to wire breakage according to claim 1, characterized in that: The packaging substrate (1) uses polyphenylene ether resin as substrate material, and the pins (5) use copper-based materials.
4. The silver-copper alloy bonding wire that is not prone to wire breakage according to claim 1, characterized in that: One end of the bonding wire body (6) is connected to the electrode welding area of the chip (3), and the other end of the bonding wire body (6) is connected to the wiring welding area of the pin (5).
5. The silver-copper alloy bonding wire that is not prone to wire breakage according to claim 1, characterized in that: The first wire segment (8) is arranged perpendicular to the surface of the chip (3), and the first wire segment (8) is connected to the third wire segment (10) after being bent ninety degrees.
6. The silver-copper alloy bonding wire that is not prone to wire breakage according to claim 1, characterized in that: A notch facing the chip (3) is provided at the connection between the second wire segment (9) and the lead (5), and the angle of the notch at the connection between the second wire segment (9) and the lead (5) is less than ninety degrees.