Loudspeaker and electronic equipment
By setting back leakage channels on the glue layer of the speaker and setting notches on the magnetic circuit assembly, the problem of internal and external air pressure balance of the speaker is solved, the reliability and production ease of the speaker are improved, and the damage and magnetism of the diaphragm assembly are avoided. The performance of the circuit components is degraded.
Patent Information
- Application Number
- CN202420521124.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-03-15
AI Technical Summary
The internal space of the speaker is small, and changes in external air pressure can easily destroy the internal and external air pressure balance, causing the diaphragm assembly to deform or rupture, reducing the reliability of electronic equipment, and the traditional hole opening process is difficult, affecting mass production.
Set a back discharge channel on the glue layer of the speaker to connect the inside to the outside, balance the internal and external air pressure, avoid damage caused by changes in air pressure, and set a gap on the magnetic circuit assembly to stabilize the connection and improve the firm connection sex.
Effectively prevent the diaphragm assembly from deforming or rupturing, improve the reliability of the speaker, simplify the process, reduce costs, achieve mass production, and improve the air pressure balance capability of the speaker while ensuring sound performance.
Smart Images

Figure CN222235043U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electroacoustic technology, and in particular to a speaker and an electronic device. Background Art
[0002] With the development of headphones, users are increasingly concerned about the reliability of headphone speakers. Since the internal space of the speaker is relatively small, changes in the external air pressure of the speaker can easily affect the air pressure balance inside and outside the speaker, causing irreversible damage to the speaker. In order to solve this problem, traditional speakers will open holes in the magnetic circuit assembly to connect the inside of the speaker to the outside of the speaker. However, whether it is opening holes in the magnets of the magnetic circuit assembly or in the magnetic conductive sheet of the magnetic circuit assembly, due to the high hardness of the magnets or the magnetic conductive sheet, the process of opening the holes is difficult and the possibility of mass production is low. Utility Model Content
[0003] The present application provides a speaker and an electronic device that have a relatively low difficulty in hole opening process and are easy to mass-produce.
[0004] In a first aspect, the present application provides a speaker. The speaker includes a magnetic circuit assembly, a circuit board, a glue layer, a diaphragm assembly, and a voice coil; the diaphragm assembly is fixedly connected to the magnetic circuit assembly, the diaphragm assembly and the magnetic circuit assembly surround at least part of the inner cavity of the speaker, the voice coil is located in the inner cavity of the speaker, one end of the voice coil is fixedly connected to the diaphragm assembly, and the other end is located in the magnetic circuit assembly; the circuit board is fixed to the magnetic circuit assembly through the glue layer, at least part of the circuit board and at least part of the glue layer are located between the magnetic circuit assembly and the diaphragm assembly, and the circuit board is electrically connected to the voice coil; the glue layer is provided with a first rear leakage channel, and the first rear leakage channel connects the inner cavity of the speaker to the outside of the speaker.
[0005] It is understandable that the first rear leakage channel connects the inner cavity of the speaker to the outside of the speaker. In this way, the internal air pressure of the speaker can be balanced with the external air pressure of the speaker. In one embodiment, the inside of the speaker is not connected to the outside of the speaker. In this way, when the air pressure inside the speaker and the outside of the speaker changes, the air pressure change can easily destroy the air pressure balance inside and outside the speaker, causing the diaphragm assembly to deform or even rupture, causing irreversible damage to the components inside the speaker, and reducing the reliability of the electronic device. In this embodiment, by providing the first rear leakage channel and connecting the inside of the speaker to the outside of the speaker by using the first rear leakage channel, the first rear leakage channel can balance the air pressure inside and outside the speaker, prevent the diaphragm assembly from deforming or rupturing, avoid irreversible damage to the components inside the speaker, and improve the reliability of the speaker.
[0006] It can be understood that, compared with the solution of setting the first rear leakage channel on the first magnetic part of the magnetic circuit assembly, the solution of setting the first rear leakage channel on the rubber layer can avoid reducing the size of the first magnetic part of the magnetic circuit assembly, avoid affecting the magnetic flux of the first magnetic part, and thus avoid affecting the performance of the magnetic circuit assembly due to the reduction of the magnetic flux of the first magnetic part, thereby avoiding affecting the performance of the speaker and the electronic equipment.
[0007] In addition, compared with the solution of setting the first rear leakage channel and the mesh on the first magnetic part of the magnetic circuit assembly, the present embodiment sets the first rear leakage channel on the glue layer. Since the hardness of the glue layer is relatively low, the formation process of the first rear leakage channel is relatively simple and easy to achieve mass production. In addition, the present embodiment does not need to set up an additional mesh, so the present embodiment can avoid the problem of occupying the inner cavity volume of the speaker, increasing material costs, and increasing the complexity of the assembly process caused by the need to set up an additional mesh.
[0008] In one possible implementation, the magnetic circuit assembly includes a first magnetic part, a second magnetic part, a first magnetic conductive part and a second magnetic conductive part, the first magnetic part has a first through hole; the first magnetic part and the second magnetic part are fixed on the same side of the first magnetic conductive part, the second magnetic part is located in the first through hole of the first magnetic part, and is spaced apart from the first magnetic part; the second magnetic conductive part has a notch, and the notch connects the inner side of the second magnetic conductive part to the outer side of the second magnetic conductive part; the second magnetic conductive part is fixed to the surface of the first magnetic part away from the first magnetic conductive part, and the diaphragm assembly is fixed to the surface of the second magnetic conductive part away from the first magnetic part; the circuit board includes a first part, the glue layer includes a first bonding portion, the first part is fixedly connected to the first magnetic part through the first bonding portion, and the first part and the first bonding portion are located at the notch; the first rear leakage channel is located at the first bonding portion.
[0009] It can be understood that in this embodiment, the second magnetic conductive member is fixed to the surface of the first magnetic member away from the first magnetic conductive member, so that the first magnetic member with better strength is used to support the second magnetic conductive member and the diaphragm assembly thereon. In this way, the connection between the magnetic circuit assembly and the diaphragm assembly is more stable and more secure. In addition, by setting a notch on the second magnetic conductive member, a channel is provided for the electronic components (such as the voice coil) in the inner cavity of the speaker to be electrically connected to the external components of the speaker. For example, by setting the first part of the circuit board and the first bonding part of the glue layer in the notch, the circuit board can conveniently electrically connect the voice coil set in the inner cavity of the speaker to the outside of the speaker. Finally, by setting the first rear leakage channel in the first bonding part of the glue layer. It can be understood that since the second magnetic conductive member is not fixedly connected to the surface of the first magnetic member away from the first magnetic conductive member at the notch of the second magnetic conductive member, the second magnetic conductive member will not block the first rear leakage channel from connecting to the inner cavity of the speaker. In this way, the position setting of the first rear leakage channel is relatively simple and it is not easy to interfere with the second magnetic conductive member.
[0010] It is understandable that, compared with the solution of setting the first rear leakage channel on the first magnetic part of the magnetic circuit assembly, the solution of setting the first rear leakage channel on the first bonding part of the adhesive layer can avoid reducing the size of the first magnetic part of the magnetic circuit assembly, avoid affecting the magnetic flux of the first magnetic part, and thus avoid affecting the performance of the magnetic circuit assembly due to the reduction of the magnetic flux of the first magnetic part, and further avoid affecting the performance of the speaker and the electronic device. On the premise of ensuring that the sound performance of the speaker is not affected, the first rear leakage channel can balance the air pressure of the environment inside and outside the speaker, prevent irreversible damage to the internal components of the speaker, and ensure the reliability of the electronic device.
[0011] In a possible implementation, it is characterized in that the second magnetic conductive part includes a main body and a protruding part, the protruding part is protruding from the surface of the main body, the protruding part is fixed to the surface of the first magnetic part away from the first magnetic conductive part, the main body and the first magnetic part are spaced apart, the main body, the protruding part and the first magnetic part enclose an installation space, and the diaphragm assembly is fixed to the surface of the main body away from the first magnetic part; the circuit board includes a second part, the second part is connected to the first part, the glue layer includes a second adhesive part, the second adhesive part is connected to the first adhesive part, the second part is fixedly connected to the first magnetic part through the second adhesive part, and the second part and the second adhesive part are located in the installation space.
[0012] It can be understood that by protruding a protrusion on the surface of the main body of the second magnetic conductive member, and then using the protrusion to fix to the surface of the first magnetic member away from the first magnetic conductive member, since the protrusion is directly fixed to the surface of the first magnetic member away from the first magnetic conductive member, the first magnetic member with better strength can support the second magnetic conductive member and the diaphragm assembly thereon. The connection between the magnetic circuit assembly and the diaphragm assembly is more stable and more secure. In addition, the main body and the first magnetic member are spaced apart, and the main body, the protrusion and the first magnetic member enclose an installation space, and the second part and the second adhesive portion are located in the installation space, so that the arrangement of the circuit board and the magnetic circuit system is more compact, thereby improving the space utilization rate of the speaker.
[0013] In a possible implementation, the second magnetic conductive member is provided with a second rear leakage channel, and the second rear leakage channel connects the inner cavity of the speaker to the outside of the speaker.
[0014] It can be understood that the second rear leakage channel connects the inner cavity of the speaker to the outside of the speaker. In this way, the internal air pressure of the speaker can be balanced with the external air pressure of the speaker. Compared with the solution of only providing the first rear leakage channel, the first rear leakage channel can cooperate with the second rear leakage channel to provide a more stable and efficient rear leakage channel, thereby better balancing the internal air pressure and external air pressure of the speaker.
[0015] In a possible implementation, the second rear leakage channel is arranged opposite to the first rear leakage channel.
[0016] It is understandable that in one embodiment, the second rear leakage channel and the first rear leakage channel are not arranged relative to each other. In this case, the rigidity of the position where the second rear leakage channel and the first rear leakage channel are not arranged in the inner cavity of the speaker is relatively large, which easily leads to large vibration and swing of the speaker during the sound production process, seriously affecting the sound quality of the speaker. In this embodiment, by arranging the second rear leakage channel and the first rear leakage channel relative to each other, the problem of large vibration and swing of the speaker during the sound production process is solved, and the sound quality of the speaker is greatly improved.
[0017] In a possible implementation, the first magnetic member is provided with a third rear leakage channel, and the third rear leakage channel connects the inner cavity of the speaker to the outside of the speaker.
[0018] It can be understood that the third rear leakage channel connects the inner cavity of the speaker to the outside of the speaker. In this way, the internal air pressure of the speaker can be balanced with the external air pressure of the speaker. Compared with the solution of only setting the first rear leakage channel, the third rear leakage channel can cooperate with the first rear leakage channel to provide a more stable and efficient rear leakage channel, and the performance of balancing the internal air pressure and external air pressure of the speaker is better.
[0019] In a possible implementation, the first magnetic conductive member is provided with a fourth rear leakage channel, and the fourth rear leakage channel connects the inner cavity of the speaker to the outside of the speaker.
[0020] It is understandable that the fourth rear leakage channel connects the inner cavity of the speaker to the outside of the speaker. In this way, the internal air pressure of the speaker can be balanced with the external air pressure of the speaker. Compared with the solution of only providing the first rear leakage channel, the first rear leakage channel and the fourth rear leakage channel can cooperate to provide a more stable and efficient rear leakage channel, and the performance of balancing the internal air pressure and the external air pressure of the speaker is better.
[0021] In one possible implementation, the first rear leakage channel runs through the inner side surface, outer side surface and bottom surface of the first bonding portion, or the first rear leakage channel runs through the inner side surface, outer side surface, bottom surface and top surface of the first bonding portion, wherein the top surface of the first bonding portion is bonded to the circuit board, the top surface and the bottom surface of the first bonding portion are arranged back to back, and the inner side surface and the outer side surface of the first bonding portion are arranged back to back.
[0022] It is understandable that the structure of the first rear leakage channel is relatively simple and easy to achieve mass production.
[0023] In a possible implementation, the width of the first rear leakage channel is a, satisfying: 1mm≤a≤3mm, the length of the first rear leakage channel is, satisfying b: 0.1mm≤b≤1.5mm, and the depth of the first rear leakage channel is c, c satisfying: c<0.7mm.
[0024] It can be understood that since the length, width and depth of the first rear leakage channel are relatively small, on the one hand, the first rear leakage channel will not have a significant impact on the sealing performance of the speaker, and the first rear leakage channel will not reduce the sound performance of the speaker and the electronic equipment; on the other hand, providing the first rear leakage channel on the adhesive layer can meet the need to balance the air pressure inside and outside the speaker, and there is no need to provide the first rear leakage channel on the magnetic circuit assembly, thereby avoiding affecting the performance of the speaker.
[0025] In a possible implementation, the speaker further includes a sealing member, which is fixedly connected to the circuit board and the diaphragm assembly, and the sealing member is located in the notch and is used to seal the notch.
[0026] It can be understood that the shape of the sealing member can be matched with the shape of the notch of the second magnetic conductive member, so that the sealing member can prevent the inner cavity of the speaker from being connected to the outside of the speaker through the notch of the second magnetic conductive member.
[0027] In a possible implementation, the adhesive layer and the circuit board are integrally formed.
[0028] It can be understood that the connection between the glue layer and the circuit board is more secure.
[0029] In a possible implementation, the magnetic circuit assembly further includes a third magnetic conductive member, the third magnetic conductive member is fixed to a side of the second magnetic member away from the first magnetic conductive member, and the third magnetic conductive member is spaced apart from the second magnetic conductive member.
[0030] It can be understood that the second magnetic conductive component and the third magnetic conductive component can cooperate with each other to constrain the magnetic lines of force, which can increase the magnetic flow intensity in the gap between the first magnetic component and the second magnetic component, thereby improving the driving strength of the diaphragm assembly and further improving the sound quality of the speaker.
[0031] In a possible implementation, the diaphragm assembly includes a diaphragm and a steel ring, the steel ring is fixed to a side of the second magnetic conductive member away from the first magnetic member, and the diaphragm is fixed to a side of the steel ring away from the second magnetic conductive member.
[0032] It can be understood that the diaphragm is fixedly connected to the second magnetic conductive member via the steel ring, so that the connection between the diaphragm and the second magnetic conductive member is more stable and reliable.
[0033] In a possible implementation, the speaker is used to emit sound in a first frequency band, and the frequency of the first frequency band is in the range of 5 kHz to 20 kHz.
[0034] It is understandable that a speaker may have a high frequency advantage, and the high frequency sound quality of the speaker is better.
[0035] In a second aspect, the present application provides an electronic device, which includes a housing and the above-mentioned speaker, wherein the speaker is mounted on the housing.
[0036] It is understandable that electronic devices can have high-frequency advantages, and the high-frequency sound quality of electronic devices is better.
[0037] In a possible implementation, the electronic device further includes a second speaker installed in the housing, and the second speaker is used to emit sound in a second frequency band, where the frequency of the second frequency band is in the range of 20 Hz to 5 kHz.
[0038] It is understandable that electronic devices can have advantages in low frequencies, medium frequencies and high frequencies, and the frequency band covered by electronic devices is wider.
[0039] In a possible implementation, the housing is provided with a sound outlet, and the second speaker is located on a side of the speaker away from the sound outlet.
[0040] It can be understood that placing the speaker near the sound outlet of the electronic device can improve the propagation of high-frequency sound, provide better sound separation and positioning effects, and at the same time reduce the interference of the low-frequency sound of the second speaker on the high-frequency sound of the speaker, which helps to improve the sound quality of the electronic device and the user's auditory experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;
[0042] Figure 2 yes Figure 1 A partially exploded schematic diagram of an electronic device in one embodiment is shown;
[0043] Figure 3 yes Figure 1 A partial cross-sectional schematic diagram of an embodiment of the electronic device shown at line AA;
[0044] Figure 4 yes Figure 2 The structure diagram of the loudspeaker in one embodiment is shown;
[0045] Figure 5 yes Figure 4 A partially exploded schematic diagram of a loudspeaker in one embodiment is shown;
[0046] Figure 6 yes Figure 5 An exploded schematic diagram of a magnetic circuit assembly in one embodiment is shown;
[0047] Figure 7 yes Figure 5 The structure schematic diagram of an implementation mode of the second magnetic conductive member of the magnetic circuit assembly shown in different angles;
[0048] Figure 8 yes Figure 5 A cross-sectional schematic diagram of an embodiment of the magnetic circuit assembly shown at line BB;
[0049] Fig. 9 yes Figure 5 The circuit board and the adhesive layer are shown in an enlarged schematic diagram of the structure in one embodiment;
[0050] Fig.10 yes Fig. 9 The schematic diagram of the structure of the circuit board and the adhesive layer shown in another angle;
[0051] Fig.11 yes Figure 5 A schematic diagram of the structural assembly of a portion of the loudspeaker shown in one embodiment;
[0052] Fig.12 yes Fig.11 A schematic cross-sectional view of an embodiment of a loudspeaker at line CC is shown;
[0053] Fig.13 yes Figure 5 A schematic diagram of the exploded structure of a diaphragm assembly of a loudspeaker in one embodiment is shown;
[0054] Fig.14 yes Figure 4 A schematic diagram of a partial structure of a loudspeaker in one embodiment is shown;
[0055] Fig.15 yes Figure 4 An exploded schematic diagram of a loudspeaker in one embodiment is shown;
[0056] Fig.16 yes Fig.15 A schematic cross-sectional view of an embodiment of a loudspeaker at line DD is shown;
[0057] Fig.17 yes Figure 4 A schematic cross-sectional view of an embodiment of the loudspeaker at line EE is shown;
[0058] Fig.18 for Figure 4 A partial cross-sectional schematic diagram of an embodiment of a loudspeaker at line FF is shown;
[0059] Fig.19 is a simulation schematic diagram of a loudspeaker with first rear leakage channels of different sizes;
[0060] Fig. 20 yes Figure 5 A schematic structural diagram of the second magnetic conductive member shown in another embodiment at another angle;
[0061] Fig.21 yes Figure 4 A partial structural schematic diagram of a loudspeaker in another embodiment is shown;
[0062] Fig. 22 yes Figure 4 A partial cross-sectional schematic diagram of another embodiment of the loudspeaker at line FF shown;
[0063] Fig.23 yes Fig. 22 The structure diagram of the loudspeaker in another embodiment is shown;
[0064] Fig.24 yes Fig. 22 The structure of the loudspeaker shown in another embodiment is schematically shown. DETAILED DESCRIPTION
[0065] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
[0066] In the description of the present application, it is understood that, unless otherwise specified and limited, the terms "install", "connect", "connect", and "connect" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an electrical connection or a mechanical connection. Among them, "fixed connection" means that the relative position relationship after connection is unchanged. In addition, the two components are obtained by an integrated molding process to obtain an integrated structure, which means that in the process of forming one of the two components, the component is connected to the other component, and there is no need to connect the two components together by reprocessing (such as bonding, welding, snap connection, screw connection). The relative arrangement of component A and component B can be that component A is projected along the target direction to obtain projection C, and component B is projected along the target direction to obtain projection D, and projection C and projection D can overlap at least in part. In some embodiments, the majority of overlap can be any of the following: projection C is completely located in projection D. Or, projection D is completely located in projection C. Or, projection C and projection D intersect with each other, and the intersection area of projection C and projection D accounts for more than 50% of projection C or projection D.
[0067] The directional terms mentioned in the embodiments of the present application, such as "top", "bottom", "inside", "outside", etc., are only referenced to the directions of the drawings. Therefore, the directional terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.
[0068] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable when appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated before and after are in an "or" relationship. "Multiple" refers to at least two.
[0069] Figure 1 It is a schematic diagram of the structure of the electronic device 1000 provided in an embodiment of the present application.
[0070] like Figure 1 As shown, the electronic device 1000 may be a device equipped with a speaker (also referred to as a loudspeaker) such as a headset, a mobile phone, a watch, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, an augmented reality (AR) glasses, an AR helmet, a virtual reality (VR) glasses, a VR helmet, etc. The electronic device 1000 may be used to play music or voice information, etc. Figure 1 The electronic device 1000 of the embodiment shown is described by taking a headset as an example. The headset can be wirelessly connected to an external device such as a mobile phone, a computer, a laptop, a vehicle-mounted device or a wearable device using a short-range communication technology (for example, Bluetooth, wireless LAN (WiFi, Wireless Fidelity) or short-range communication (NFC, Near Field Communication).) and other technologies. It can be understood that in order to clearly illustrate the structure of the electronic device 1000, the attached Figure 1 The electronic device 1000 shown in the figure only shows one earphone. Of course, the electronic device 1000 can also be a pair of earphones.
[0071] Figure 2 yes Figure 1 The electronic device 1000 is shown as a partially exploded schematic diagram in one embodiment. Figure 3 yes Figure 1 The illustrated electronic device 1000 is a partial cross-sectional schematic diagram of an embodiment of the electronic device 1000 at line AA.
[0072] See also Figure 2 and Figure 3 , and combined with Figure 1 As shown, the electronic device 1000 includes a speaker 100 and a housing 200. The speaker 100 can be installed in the housing 200. It can be understood that Figures 1 to 3 The following figures only schematically show some components of the electronic device 1000, and the actual shapes, sizes and structures of these components are not subject to Figures 1 to 3 and the accompanying drawings below.
[0073] Exemplarily, the housing 200 is provided with a sound outlet 201. The sound outlet 201 connects the interior of the housing 200 to the exterior of the housing 200. The speaker 100 may be mounted on the housing 200. The sound waves emitted by the speaker 100 may be transmitted to the exterior of the electronic device 1000 through the sound outlet 201 of the housing 200.
[0074] Exemplarily, the speaker 100 has a high frequency advantage. In this way, the electronic device 1000 can emit sound waves in the first frequency band (5kHz to 20kHz). In other embodiments, the speaker 100 may also have advantages in medium and low frequencies. This application does not specifically limit this.
[0075] Exemplarily, the electronic device 1000 may further include a second speaker 300. The second speaker 300 may be installed in the housing 200. The second speaker 300 may have an advantage in the second frequency band (20 Hz to 5 kHz). In this way, the electronic device 1000 may have advantages in low frequency, medium frequency and high frequency, and the frequency band covered by the electronic device 1000 is wider. Exemplarily, the operating frequency band of the electronic device 1000 is in the range of 20 Hz to 20 KHz. The electronic device 1000 may emit sound waves in the first frequency band and the second frequency band. The present application does not limit the specific type or structure of the second speaker 300.
[0076] Exemplarily, the second speaker 300 is located on a side of the speaker 100 away from the sound outlet 201. It is understandable that a channel (attached Figure 3 The channel is connected to the sound outlet 201 of the electronic device 1000. The sound waves emitted by the second speaker 300 can be transmitted to the outside of the electronic device 1000 through the reserved channel and the sound outlet 201. In some other embodiments, the electronic device 1000 may further include a bracket (attached Figure 3 The bracket may have a through hole (not shown). Figure 3The through hole is connected to the sound outlet hole 201 of the electronic device 1000. The sound waves emitted by the second speaker 300 can be transmitted to the outside of the electronic device 1000 through the through hole of the bracket and the sound outlet hole 201.
[0077] In other implementations, the position of the second speaker 300 is not specifically limited.
[0078] In other implementations, the electronic device 1000 may further include a third speaker, a fourth speaker, ..., an Mth speaker, where M is an integer greater than 2. It is understandable that by making full use of the advantages of the speaker 100, the second speaker 300, the third speaker, ..., the Mth speaker, the electronic device 1000 has the advantage of a wide frequency band, thereby better improving the user experience.
[0079] like Figure 3 As shown, illustratively, the housing 200 of the electronic device 1000 includes a front housing 202 and a rear housing 203. The front housing 202 is fixedly connected to the rear housing 203. Exemplarily, the front housing 202 can be fixedly connected to the rear housing 203 by snapping. In some other embodiments, the front housing 202 can be fixedly connected to the rear housing 203 by bonding methods such as glue or tape. Exemplarily, the front housing 202 and the rear housing 203 enclose the internal space of the electronic device 1000. It is understandable that the internal space of the electronic device 1000 can be used to place components such as microphones, power supplies, circuit boards, and signal processing circuits (such as filters).
[0080] For example, the front shell 202 and a portion of the rear shell 203 may form an earplug portion. Another portion of the rear shell 203 may form an ear handle portion. It is understood that when a user uses the electronic device 1000, the earplug portion may be placed more stably in the user's ear, and the ear handle portion may be placed outside the user's ear to facilitate the user to take it.
[0081] Figure 4 yes Figure 2 The structure of the loudspeaker 100 shown in one embodiment is schematically shown. Figure 5 yes Figure 4 The loudspeaker 100 is shown as a partially exploded schematic diagram in one embodiment.
[0082] like Figure 4 and Figure 5 As shown, the loudspeaker 100 includes a magnetic circuit assembly 10, a circuit board 20, a glue layer 30, a diaphragm assembly 40, a voice coil 50 and a sealing member 60. It is understood that Figure 4 , Figure 5 The following figures and the related drawings only schematically show some components of the speaker 100, and the actual shapes, sizes, positions and structures of these components are not limited to the following. Figure 4, Figure 5 In other embodiments, the speaker 100 may have more or fewer components. For example, the speaker 100 may not include the sealing member 60.
[0083] Figure 6 yes Figure 5 The magnetic circuit assembly 10 is shown in an exploded schematic diagram in one embodiment. Figure 7 yes Figure 5 The structure diagram of an implementation mode of the second magnetic conductive member 14 of the magnetic circuit assembly 10 at different angles is shown.
[0084] like Figure 6 and Figure 7 As shown, the magnetic circuit assembly 10 may include a first magnetic member 11, a second magnetic member 12, a first magnetic conductive member 13, a second magnetic conductive member 14 (also referred to as a washer), and a third magnetic conductive member 15. In some embodiments, the magnetic circuit assembly 10 may also not include the second magnetic conductive member 14 and / or the third magnetic conductive member 15.
[0085] Exemplarily, the first magnetic member 11 and the second magnetic member 12 can be made of hard magnetic material, also known as permanent magnetic material (permanent magnet) or permanent magnetic material (permanent magnet). It is understandable that hard magnetic material is a permanent magnetic material that can retain magnetism for a long time. For example, magnets, etc. The materials of the first magnetic conductive member 13, the second magnetic conductive member 14 and the third magnetic conductive member 15 can be made of ferrite material, nickel-zinc ferrite material, iron oxide material and other magnetic conductive materials.
[0086] Exemplarily, the first magnetic member 11 may surround a first through hole 111. At this time, the shape of the first magnetic member 11 may be substantially annular.
[0087] Exemplarily, the second magnetic member 12 may be substantially cylindrical in shape.
[0088] Exemplarily, the first magnetic conductive member 13 may be roughly disc-shaped.
[0089] Exemplarily, the second magnetic conductive member 14 may be roughly in a “C” shape.
[0090] Exemplarily, the third magnetic conductive member 15 may be roughly in the shape of a circular ring.
[0091] In other embodiments, the first magnetic member 11 , the second magnetic member 12 , the first magnetic conductive member 13 , the second magnetic conductive member 14 and the third magnetic conductive member 15 may also be in other shapes.
[0092] Figure 8 yes Figure 5 The shown figure is a cross-sectional schematic diagram of an embodiment of the magnetic circuit assembly 10 at line BB.
[0093] like Figure 5 and Figure 8 As shown, the first magnetic member 11 and the second magnetic member 12 can be located on the same side of the first magnetic conductive member 13 and fixedly connected to the first magnetic conductive member 13. Exemplarily, the first magnetic member 11 can be located at the periphery of the first magnetic conductive member 13. The second magnetic member 12 can be located in the middle of the first magnetic conductive member 13.
[0094] like Figure 5 and Figure 8 As shown, the second magnetic member 12 may be located in the first through hole 111 of the first magnetic member 11. The second magnetic member 12 is spaced apart from the first magnetic member 11, and there is a space between the inner peripheral side wall of the first magnetic member 11 and the outer peripheral side wall of the second magnetic member 12.
[0095] like Figure 6 and Figure 7 As shown, the second magnetic conductive member 14 can enclose a second through hole 14a. In addition, the second magnetic conductive member 14 has a notch 14b. The notch 14b connects the inner side of the second magnetic conductive member 14 (i.e., the second through hole 14a) to the outer side of the second magnetic conductive member 14. In other words, the second magnetic conductive member 14 can be partially disconnected to form the notch 14b. At this time, the second magnetic conductive member 14 can be roughly in a "C" shape.
[0096] like Figure 6 and Figure 7 As shown, illustratively, the second magnetic conductive member 14 includes a main body 141 and a protruding portion 142. It can be understood that Figure 6 and attached Figure 7 The dotted lines are used to schematically distinguish the main body 141 and the protrusion 142 of the second magnetic conductive member 14. It can be understood that although the second magnetic conductive member 14 is divided into two parts for introduction in this embodiment, it does not affect that the second magnetic conductive member 14 can be an integrally formed structure, that is, the main body 141 and the protrusion 142 of the second magnetic conductive member 14 can be an integrally formed structure. In other embodiments, the main body 141 of the second magnetic conductive member 14 can be fixedly connected to the protrusion 142 by gluing, welding, etc.
[0097] Exemplarily, the main body 141 includes a first top surface 1411 and a first bottom surface 1412 disposed opposite to each other, and a first inner side surface 1413 and a first outer side surface 1414 disposed opposite to each other. The first top surface 1411 and the first bottom surface 1412 of the main body 141 connect the first inner side surface 1413 and the first outer side surface 1414 of the main body 141.
[0098] Exemplarily, the protrusion 142 includes a second top surface 1421 and a second bottom surface 1422 disposed opposite to each other, and a second inner side surface 1423 and a second outer side surface 1424 disposed opposite to each other. The second top surface 1421 and the second bottom surface 1422 of the protrusion 142 connect the second inner side surface 1423 and the second outer side surface 1424 of the protrusion 142.
[0099] Among them, the protrusion 142 can be protruded from the first bottom surface 1412 of the main body 141. The second top surface 1421 of the protrusion 142 is fixedly connected to the first bottom surface 1412 of the main body 141. At this time, the main body 141 and the protrusion 142 are roughly in a "step" shape. In addition, relative to the first outer side surface 1414, the protrusion 142 is arranged close to the first inner side surface 1413. Exemplarily, the protrusion 142 can be connected to the first inner side surface 1413 and spaced from the first outer side surface 1414. The first bottom surface 1412 of the main body 141 and the protrusion 142 can form an avoidance groove 143. Exemplarily, the avoidance groove 143 can also be roughly in a "C" shape.
[0100] like Figure 5 and Figure 8 As shown, the third magnetic conductive member 15 can be fixedly connected to a side of the second magnetic member 12 away from the first magnetic conductive member 13. The third magnetic conductive member 15 can be spaced apart from the second magnetic conductive member 14.
[0101] like Figure 5 and Figure 8 As shown, the second magnetic conductive member 14 can be fixed to a side of the first magnetic member 11 away from the first magnetic conductive member 13. The second magnetic conductive member 14 can be fixedly connected to the first magnetic member 11.
[0102] Exemplarily, the protrusion 142 of the second magnetic conductive member 14 can be fixedly connected to the first magnetic member 11, and at this time, the first bottom surface 1412 of the main body 141 of the second magnetic conductive member 14 can be spaced apart from the first magnetic member 11. The main body 141 and the protrusion 142 of the second magnetic conductive member 14 can enclose an installation space 16 with the first magnetic member 11.
[0103] Fig. 9 yes Figure 5 The circuit board 20 and the adhesive layer 30 are shown as an enlarged schematic diagram of the structure in one embodiment. Fig.10 yes Fig. 9 The circuit board 20 and the adhesive layer 30 are shown in another structural schematic diagram at another angle.
[0104] like Fig. 9 and Fig.10 As shown, exemplarily, the circuit board 20 may surround a third through hole 20a. At this time, the circuit board 20 may be substantially in a circular ring shape.
[0105] Exemplarily, the circuit board 20 includes a first portion 21 and a second portion 22. The first portion 21 may be fixedly connected to the second portion 22. Exemplarily, the second portion 22 may be substantially in a "C" shape.
[0106] It is understandable that, although the circuit board 20 is divided into two parts in this embodiment, it does not affect that the circuit board 20 can be an integrally formed structure, that is, the first part 21 and the second part 22 can be integrally formed. In other embodiments, the first part 21 of the circuit board 20 can be fixedly connected to the second part 22 by gluing, welding, etc.
[0107] Exemplarily, the circuit board 20 may be provided with an electrical connection terminal 20b. The electrical connection terminal 20b may be located at the first portion 21 of the circuit board 20. The number of the electrical connection terminals 20b may not be limited to the four shown in the drawings, and the number of the electrical connection terminals 20b may also be two or other numbers.
[0108] It is understandable that part of the electrical connection end 20b of the circuit board 20 can be used to electrically connect with the components inside the speaker 100, and part of the electrical connection end 20b of the circuit board 20 can be used to electrically connect with the components inside the speaker 100 (such as the voice coil 50) and the components outside the speaker 100 (such as a power supply). In this way, the components inside and outside the speaker 100 can be electrically connected through the circuit board 20.
[0109] like Fig. 9 and Fig.10 As shown, exemplarily, the adhesive layer 30 includes a top surface 31a and a bottom surface 31b disposed in opposite directions, and an inner side surface 32a and an outer side surface 32b disposed in opposite directions. The top surface 31a and the bottom surface 31b of the adhesive layer 30 connect the inner side surface 32a and the outer side surface 32b of the adhesive layer 30. The top surface 31a of the adhesive layer 30 is the surface of the adhesive layer 30 close to the circuit board 20, that is, the surface on which the adhesive layer 30 is bonded to the circuit board 20. The bottom surface 31b of the adhesive layer 30 is the surface of the adhesive layer 30 away from the circuit board 20.
[0110] like Fig. 9 and Fig.10 As shown, the adhesive layer 30 may include a first adhesive portion 33 and a second adhesive portion 34. For example, the first adhesive portion 33 may be fixedly connected to the second adhesive portion 34.
[0111] Exemplarily, the shape of the adhesive layer 30 may be adapted to the shape of the circuit board 20. At this time, the second adhesive portion 34 may be substantially in a "C" shape.
[0112] It can be understood that, although the adhesive layer 30 is divided into two parts in the present embodiment, it does not affect that the adhesive layer 30 can be an integrally formed structure, that is, the second adhesive portion 34 and the first adhesive portion 33 can be integrally formed.
[0113] Exemplarily, the adhesive layer 30 is provided with a first rear leakage channel 35. Exemplarily, the first rear leakage channel 35 may be located at the first bonding portion 33 of the adhesive layer 30. The first rear leakage channel 35 may penetrate the bottom surface 31b, the inner side surface 32a, and the outer side surface 32b of the adhesive layer 30. In some embodiments, the first rear leakage channel 35 may also penetrate the bottom surface 31b, the inner side surface 32a, and the top surface 31a of the adhesive layer 30. In other embodiments, the first rear leakage channel 35 may also only penetrate the inner side surface 32a and the outer side surface 32b of the adhesive layer 30.
[0114] It is understandable that the cross-sectional shape of the first rear leakage channel 35 may not be limited to Fig. 9 The cross-sectional shape of the first rear leakage channel 35 may be a trapezoid, a triangle, a circle or an irregular shape.
[0115] like Fig.10 As shown, the width direction of the first rear leakage channel 35 may be the X-axis direction. The extension direction of the first rear leakage channel 35 may be the Y-axis direction. The depth direction of the first rear leakage channel 35 may be the Z-axis direction. Exemplarily, the width of the first rear leakage channel 35 in the X-axis direction is a. The length of the first rear leakage channel 35 in the Y-axis direction is b. The depth of the first rear leakage channel 35 in the Z-axis direction is c.
[0116] Combination Fig.10 As shown, exemplarily, the width of the first rear leakage channel 35 in the X-axis direction is a, and a satisfies: 1mm≤a≤3mm. For example, the value of a can be equal to 1, 1.01, 1.5, 1.8, 2.38, 2.66, 2.88 or 3, etc.
[0117] Exemplarily, the length of the first rear leakage channel 35 in the Y-axis direction is b, and b satisfies: 0.1 mm≤b≤1.5 mm. For example, the value of b can be equal to 0.1, 0.11, 0.23, 0.28, 0.66, 0.88, 1.23 or 1.5, etc.
[0118] Exemplarily, the depth of the first rear leakage channel 35 in the Z-axis direction is c, and c satisfies: c<0.7 mm. For example, the value of c may be equal to 0.05, 0.1, 0.22, 0.53, 0.6 or 0.699.
[0119] It can be understood that since the length, width and depth of the first rear leakage channel 35 are relatively small, on the one hand, the first rear leakage channel 35 will not have a significant impact on the sealing performance of the speaker 100, and the first rear leakage channel 35 will not reduce the sound performance of the speaker 100 and the electronic device 1000; on the other hand, providing the first rear leakage channel 35 on the adhesive layer 30 can meet the need to balance the air pressure inside and outside the speaker 100, and there is no need to provide the first rear leakage channel 35 on the magnetic circuit assembly 10, thereby avoiding affecting the performance of the speaker 100.
[0120] Fig.11 yes Figure 5 The illustrated schematic diagram of the structural assembly of a partial structure of the loudspeaker 100 in one embodiment. Fig.12 yes Fig.11 The schematic cross-sectional view of a loudspeaker 100 according to one embodiment of the present invention is shown at line CC.
[0121] like Fig.11 and Fig.12 As shown, the circuit board 20 can be fixed to the magnetic circuit assembly 10 through the adhesive layer 30. At least a portion of the circuit board 20 and at least a portion of the adhesive layer 30 are located between the magnetic circuit assembly 10 and the diaphragm assembly 40.
[0122] Exemplarily, the first portion 21 of the circuit board 20 can be fixedly connected to the surface of the first magnetic member 11 away from the first magnetic conductive member 13 through the first adhesive portion 33 of the adhesive layer 30. The first portion 21 of the circuit board 20 and the first adhesive portion 33 of the adhesive layer 30 are located at the notch 14b of the second magnetic conductive member 14. At this time, at least a portion of the first portion 21 of the circuit board 20 and at least a portion of the first adhesive portion 33 of the adhesive layer 30 can be exposed relative to the notch 14b of the second magnetic conductive member 14.
[0123] Exemplarily, the second portion 22 of the circuit board 20 can be fixedly connected to the surface of the first magnetic member 11 away from the first magnetic conductive member 13 through the second adhesive portion 34 of the adhesive layer 30. At this time, the second portion 22 of the circuit board 20 and the second adhesive portion 34 of the adhesive layer 30 can be located in the installation space 16 surrounded by the first magnetic member 11 and the second magnetic conductive member 14.
[0124] Exemplarily, the circuit board 20 and the adhesive layer 30 may be an integrally formed structure, that is, the adhesive layer 30 is a part of the circuit board 20 .
[0125] Fig.13 yes Figure 5 The diaphragm assembly 40 of the loudspeaker 100 is shown as a schematic diagram of an exploded structure in one embodiment.
[0126] like Fig.13 As shown, the diaphragm assembly 40 may include a diaphragm 41 and a steel ring 42. The diaphragm assembly 40 may be substantially disc-shaped.
[0127] Exemplarily, the diaphragm 41 may be roughly disc-shaped. It is understandable that wiring (not shown in the drawings) is provided on the diaphragm 41 to facilitate electrical connection between the diaphragm 41 and other components. The steel ring 42 may be roughly ring-shaped. The steel ring 42 may be made of rigid materials such as stainless steel and aluminum alloy.
[0128] like Fig.13 As shown, the diaphragm 41 may include a first straight portion 411, a first folded ring portion 412, a second straight portion 413 and a second folded ring portion 414. The first folded ring portion 412 may be substantially annular. The first straight portion 411 may be located outside the first folded ring portion 412 and fixedly connected to the first folded ring portion 412. The second straight portion 413 is fixedly connected between the first folded ring portion 412 and the second folded ring portion 414.
[0129] It is understandable that although the diaphragm 41 is divided into four parts in this embodiment, it does not affect the fact that the diaphragm 41 can be an integrally formed structure, that is, the first straight portion 411, the first folded ring portion 412, the second straight portion 413 and the second folded ring portion 414 can be integrally formed.
[0130] Fig.14 yes Figure 4 The illustrated diagram is a partial structural diagram of a loudspeaker 100 in one embodiment.
[0131] like Fig.14 As shown, the diaphragm assembly 40 can be fixed to the surface of the main body 141 of the second magnetic conductive component 14 away from the first magnetic component 11 .
[0132] like Fig.14 As shown, the steel ring 42 can be fixed to the side of the second magnetic conductive member 14 away from the first magnetic member 11. For example, the steel ring 42 can be fixed to the first top surface 1411 of the main body 141 of the second magnetic conductive member 14 (see Figure 7 )Fixed connection.
[0133] like Fig.14 As shown, the diaphragm 41 can be fixed to the steel ring 42. Exemplarily, the diaphragm 41 can be fixed to the side of the steel ring 42 away from the second magnetic conductive member 14. The surface of the first straight portion 411 of the diaphragm 41 close to the second magnetic conductive member 14 can be fixed to the surface of the steel ring 42 away from the second magnetic conductive member 14.
[0134] In other embodiments, the diaphragm assembly 40 may not include the steel ring 42. In this case, the diaphragm 41 may be directly connected to the first top surface 1411 of the main body 141 of the second magnetic conductive member 14 (see Figure 7 )Fixed connection.
[0135] Fig.15 yes Figure 4 The loudspeaker 100 is shown in an exploded schematic diagram in one embodiment. Fig.16 yes Fig.15 The schematic cross-sectional view of a loudspeaker 100 according to one embodiment of the present invention is shown at line DD.
[0136] like Fig.15 and Fig.16 As shown, the sealing member 60 can be fixed on the circuit board 20 and the diaphragm assembly 40 by gluing, welding, etc. Exemplarily, the sealing member 60 can be fixedly connected to the first portion 21 of the circuit board 20 .
[0137] Exemplarily, the sealing member 60 may be located at the notch 14b of the second magnetic conductive member 14, and the sealing member 60 may be used to seal the notch 14b of the second magnetic conductive member 14. It is understandable that the sealing member 60 may be made of glue, rubber, silicone, or the like.
[0138] like Fig.15 and Fig.16 As shown, the magnetic circuit assembly 10 and the diaphragm assembly 40 together enclose at least a portion of the inner cavity 70 of the speaker 100, and the inner cavity 70 can be connected to the outside of the speaker 100 through the notch 14b of the second magnetic conductive member 14. The shape of the sealing member 60 can be adapted to the shape of the notch 14b of the second magnetic conductive member 14, so that the sealing member 60 can prevent the inner cavity 70 of the speaker 100 from being connected to the outside of the speaker 100 through the notch 14b of the second magnetic conductive member 14.
[0139] Fig.17 yes Figure 4 The schematic cross-sectional view of a loudspeaker 100 according to one embodiment of the present invention is shown at line EE.
[0140] like Fig.17 As shown, by way of example, the voice coil 50 may be substantially in the shape of a ring. In other embodiments, the voice coil 50 may be substantially in the shape of a long strip, with two straight sides parallel to each other.
[0141] It is understandable that the voice coil 50 can be formed by a wire (not shown in the drawings) being wound multiple times along a plane perpendicular to the Z-axis direction (i.e., the XY plane). In some embodiments, the voice coil 50 can also be formed by multiple wires being wound multiple times along a plane perpendicular to the Z-axis direction (i.e., the XY plane). The multiple wires can be arranged along the Z-axis direction.
[0142] Exemplarily, the circuit board 20 is electrically connected to the voice coil 50. The wire of the voice coil 50 can be connected to the electrical connection terminal 20b of the circuit board 20 (see Fig. 9 )Electrical connection.
[0143] Exemplarily, the voice coil 50 may be located in the inner cavity 70 of the speaker 100. One end of the voice coil 50 may be fixed to a side of the diaphragm assembly 40 close to the magnetic circuit assembly 10. The voice coil 50 may be fixedly connected to the second straight portion 413 of the diaphragm 41. The other end of the voice coil 50 may be located in the magnetic circuit assembly 10.
[0144] For example, at least a portion of the voice coil 50 may be located between the first magnetic member 11 and the second magnetic member 12. At least a portion of the voice coil 50 may be located between the second magnetic conductive member 14 and the third magnetic conductive member 15.
[0145] The above specifically introduces the specific structures of several loudspeakers 100 in combination with the relevant drawings. The function of the first rear leakage channel 35 will be specifically introduced in combination with the relevant drawings below.
[0146] See also Fig.18 , Fig.18 for Figure 4 The illustrated embodiment is a partial cross-sectional schematic diagram of a loudspeaker 100 at line FF. Fig.18 The dotted arrow in the figure schematically shows the path connecting the inner cavity 70 of the speaker 100 with the outside of the speaker 100.
[0147] like Fig.18 As shown, the first rear leakage channel 35 connects the inner cavity 70 of the speaker 100 to the outside of the speaker 100. In this way, the internal air pressure of the speaker 100 can be balanced with the external air pressure of the speaker 100. It can be understood that, in one embodiment, the interior of the speaker 100 is not connected to the outside of the speaker 100. In this way, when the air pressure inside the speaker 100 and the outside of the speaker 100 changes, the air pressure change can easily destroy the air pressure balance inside and outside the speaker 100, thereby causing the diaphragm 41 of the diaphragm assembly 40 to deform or even rupture, causing irreversible damage to the internal components of the speaker 100, and reducing the reliability of the electronic device 1000. In the present embodiment, a first rear leakage channel 35 is provided and used to connect the interior of the speaker 100 to the exterior of the speaker 100. At this time, the first rear leakage channel 35 can balance the air pressure inside and outside the speaker 100, prevent the diaphragm 41 of the diaphragm assembly 40 from being deformed or broken, avoid irreversible damage to the components inside the speaker 100, and improve the reliability of the electronic device 1000.
[0148] It is understandable that, compared with the solution of setting the first rear leakage channel 35 on the first magnetic part 11 of the magnetic circuit assembly 10, the solution of setting the first rear leakage channel 35 on the adhesive layer 30 can avoid reducing the size of the first magnetic part 11 of the magnetic circuit assembly 10, avoid affecting the magnetic flux of the first magnetic part 11, and thus avoid affecting the performance of the magnetic circuit assembly 10 due to the reduction of the magnetic flux of the first magnetic part 11, and further avoid affecting the performance of the speaker 100 and the electronic device 1000. On the premise of ensuring that the sound performance of the speaker 100 is not affected, the first rear leakage channel 35 can balance the air pressure of the environment inside and outside the speaker 100, prevent irreversible damage to the internal components of the speaker 100, and ensure the reliability of the electronic device 1000.
[0149] In addition, compared with the solution of setting the first rear leakage channel 35 on the first magnetic part 11 of the magnetic circuit assembly 10, this embodiment sets the first rear leakage channel 35 on the glue layer 30. Since the hardness of the glue layer 30 is relatively low, the formation process of the first rear leakage channel 35 is relatively simple and easy to achieve mass production.
[0150] In addition, the solution of setting the first rear leakage channel 35 on the first magnetic member 11 of the magnetic circuit assembly 10 requires additional mesh cloth, which will occupy the volume of the inner cavity 70 of the speaker 100, increase material costs and increase assembly difficulty. However, the solution of setting the first rear leakage channel 35 on the adhesive layer 30 does not require additional mesh cloth, which can avoid the problem of occupying the volume of the inner cavity 70 of the speaker 100, increasing material costs and increasing assembly process complexity caused by the need for additional mesh cloth.
[0151] It is understandable that, combined with Figure 7 and Figure 8 As shown, in this embodiment, the second magnetic conductive member 14 is fixed to the surface of the first magnetic member 11 away from the first magnetic conductive member 13, so that the first magnetic member 11 with better strength is used to support the second magnetic conductive member 14 and the diaphragm assembly 40 thereon. In this way, the connection between the magnetic circuit assembly 10 and the diaphragm assembly 40 is more stable and more secure. In addition, combined with Fig.11As shown, by setting a notch 14b on the second magnetic conductive member 14, a channel is provided for the electronic components (such as the voice coil 50) in the inner cavity 70 of the speaker 100 to be electrically connected to the external components of the speaker 100. For example, by setting the first part 21 of the circuit board 20 and the first bonding portion 33 of the adhesive layer 30 in the notch 14b, the circuit board 20 can conveniently electrically connect the voice coil 50 set in the inner cavity 70 of the speaker 100 to the outside of the speaker 100. Finally, by setting the first rear leakage channel 35 in the first bonding portion 33 of the adhesive layer 30. It can be understood that, since the second magnetic conductive member 14 is not fixedly connected to the surface of the first magnetic member 11 away from the first magnetic conductive member 13 at the notch 14b of the second magnetic conductive member 14, the second magnetic conductive member 14 will not block the first rear leakage channel 35 from connecting to the inner cavity 70 of the speaker 100. In this way, the position setting of the first rear leakage channel 35 is relatively simple, and it is not easy to interfere with the second magnetic conductive member 14.
[0152] It can be understood that by protruding the protrusion 142 on the surface of the main body 141 of the second magnetic conductive member 14, and then using the protrusion 142 to fix to the surface of the first magnetic member 11 away from the first magnetic conductive member 13, in this way, since the protrusion 142 is directly fixed to the surface of the first magnetic member 11 away from the first magnetic conductive member 13, the first magnetic member 11 with better strength can support the second magnetic conductive member 14 and the diaphragm assembly 40 thereon. The connection between the magnetic circuit assembly 10 and the diaphragm assembly 40 is more stable and more secure. In addition, the main body 141 and the first magnetic member 11 are spaced apart, and the main body 141, the protrusion 142 and the first magnetic member 11 enclose the installation space 16, and the second part 22 and the second adhesive portion 34 are located in the installation space 16, so that the arrangement of the circuit board 20 and the magnetic circuit system 10 is more compact, thereby improving the space utilization rate of the speaker 100.
[0153] The following describes in detail the sound pressure level simulation effect of the loudspeaker 100 with different sizes of the first rear leakage channel 35 in conjunction with the relevant drawings.
[0154] The first dimension of the first rear leakage channel 35: the length of the first rear leakage channel 35 is a1, and a1 satisfies: a1 = 1.5 mm. The width of the first rear leakage channel 35 is b1, and b1 satisfies: b1 = 1.4 mm. The depth of the first rear leakage channel 35 is c1, and c1 satisfies: c1 = 0.1 mm.
[0155] Second dimension of the first rear leakage channel 35: The length of the first rear leakage channel 35 is a2, and a2 satisfies: a2 = 1.5 mm. The width of the first rear leakage channel 35 is b2, and b2 satisfies: b2 = 1.0 mm. The depth of the first rear leakage channel 35 is c2, and c2 satisfies: c2 = 0.1 mm.
[0156] Fig.191 is a schematic diagram of a simulation of the loudspeaker 100 having the first rear leakage channel 35 of different sizes.
[0157] It is understandable that Fig.19 The horizontal axis in represents the frequency f of the sound wave, in Hertz (Hz). Fig.19 The vertical axis represents the sound pressure level SPL of the sound wave. The sound pressure level is a physical quantity that measures the intensity of sound. The unit is usually decibel (dB). Decibel is a dimensionless unit and is often used to describe the intensity or volume of sound.
[0158] It is understandable that Fig.19 The "0" in the figure represents a speaker 100 without the first rear leakage channel 35, "1" represents a speaker 100 with a first rear leakage channel 35 having a length a1 of 1.5 mm, a width b1 of 1.4 mm, and a depth c1 of 0.1 mm (i.e., a first size of the first rear leakage channel 35), and "2" represents a speaker 100 with a first rear leakage channel 35 having a length a2 of 1.5 mm, a width b2 of 1.0 mm, and a depth c2 of 0.1 mm (i.e., a second size of the first rear leakage channel 35).
[0159] like Fig.19 As shown, when the sound frequency is low, compared with the speaker 100 without the first rear leakage channel 35, the sound pressure level of the speaker 100 provided with the first rear leakage channel 35 of the first size and the sound pressure level of the speaker 100 provided with the first rear leakage channel 35 of the second size both decrease. In addition, compared with the speaker 100 provided with the first rear leakage channel 35 of the second size, the phenomenon of the sound pressure level decrease of the speaker 100 provided with the first rear leakage channel 35 of the first size is more obvious. It can be understood that the first rear leakage channel 35 located in the adhesive layer 30 can reduce the sound pressure level of the speaker 100 under low-frequency sound, and has the effect of balancing the internal and external air pressures of the speaker 100.
[0160] like Fig.19 As shown, when the sound frequency is high, compared with the speaker 100 without the first rear leakage channel 35, the sound pressure level of the speaker 100 provided with the first rear leakage channel 35 of the first size and the sound pressure level of the speaker 100 provided with the first rear leakage channel 35 of the second size do not decrease. It can be understood that the first rear leakage channel 35 located in the adhesive layer 30 will not affect the sound pressure level of the speaker 100 under high-frequency sound, and will not affect the high-frequency sound performance of the speaker 100.
[0161] It can be understood that the speaker 100 provided with the first rear leakage passage 35 of the first size has a better performance of balancing the air pressure inside and outside the speaker 100 than the speaker 100 provided with the first rear leakage passage 35 of the second size.
[0162] The first rear leakage channel 35 in some embodiments is introduced above with reference to the relevant drawings. The first rear leakage channel 35 in some other embodiments will be introduced in detail below.
[0163] Second implementation: Please refer to Fig. 20 , Fig. 20 yes Figure 5 The structure diagram of the second magnetic conductive member 14 shown is shown in another embodiment at another angle.
[0164] like Fig. 20 As shown, the second magnetic conductive member 14 is provided with a second rear leakage channel 147. The second rear leakage channel 147 can penetrate the second bottom surface 1422, the second inner side surface 1423 and the second outer side surface 1424 of the protruding portion 142 of the second magnetic conductive member 14. In some embodiments, the second rear leakage channel 147 can also only penetrate the second inner side surface 1423 and the second outer side surface 1424 of the protruding portion 142 of the second magnetic conductive member 14. In other embodiments, the second rear leakage channel 147 can also penetrate the first bottom surface 1412, the first inner side surface 1413 and the first outer side surface 1414 of the main body 141 of the second magnetic conductive member 14 at the same time.
[0165] It is understood that the cross-sectional shape of the second rear leakage channel 147 may not be limited to Fig. 20 The cross-sectional shape of the second rear leakage channel 147 may be a trapezoid, a triangle, a circle or an irregular shape, etc.
[0166] Fig.21 yes Figure 4 The shown figure is a partial structural diagram of the loudspeaker 100 in another embodiment. Fig. 22 yes Figure 4 The illustrated schematic partial cross-sectional view of another embodiment of the loudspeaker 100 is taken at line FF. Fig. 22 The dotted arrow in the figure schematically shows the path connecting the inner cavity 70 of the speaker 100 with the outside of the speaker 100.
[0167] like Fig.21 and Fig. 22 As shown, the second rear leakage channel 147 connects the inner cavity 70 of the speaker 100 to the outside of the speaker 100. In this way, the internal air pressure of the speaker 100 can be balanced with the external air pressure of the speaker 100. Compared with the solution of only providing the first rear leakage channel 35, the first rear leakage channel 35 can cooperate with the second rear leakage channel 147 to provide a more stable and efficient rear leakage channel, thereby better balancing the internal air pressure and external air pressure of the speaker 100.
[0168] like Fig.21 and Fig. 22As shown, illustratively, the second rear leakage passage 147 and the first rear leakage passage 35 may be disposed opposite to each other.
[0169] It is understandable that, in one embodiment, the second rear leakage channel 147 and the first rear leakage channel 35 are not arranged opposite to each other. In this case, the rigidity of the position where the second rear leakage channel 147 and the first rear leakage channel 35 are not arranged in the inner cavity 70 of the speaker 100 is relatively large, which easily causes the speaker 100 to vibrate and sway greatly during the sound generation process, seriously affecting the sound quality of the speaker 100. In this embodiment, by arranging the second rear leakage channel 147 and the first rear leakage channel 35 to be arranged opposite to each other, the problem of the speaker 100 vibrating and swaying greatly during the sound generation process is solved, and the sound quality of the speaker 100 is greatly improved.
[0170] Fig.23 yes Fig. 22 The structure of the loudspeaker 100 shown in another embodiment is schematically shown. Fig.23 The dotted arrow in the figure schematically shows the path connecting the inner cavity 70 of the speaker 100 with the outside of the speaker 100.
[0171] like Fig.23 As shown, the first magnetic member 11 includes an inner side surface 11a and an outer side surface 11b. Exemplarily, the inner side surface 11a and the outer side surface 11b of the first magnetic member 11 may be arranged to face each other.
[0172] Exemplarily, the first magnetic member 11 is provided with a third rear leakage channel 112. Exemplarily, the third rear leakage channel 112 may penetrate the inner side surface 11a and the outer side surface 11b of the first magnetic member 11. In other embodiments, the third rear leakage channel 112 may also penetrate the surface of the first magnetic member 11 away from the first magnetic conductive member 13 and / or the surface of the first magnetic member 11 close to the first magnetic conductive member 13.
[0173] It is understandable that the cross-sectional shape of the third rear leakage channel 112 may not be limited to Fig.23 The cross-sectional shape of the third rear leakage channel 112 may be a trapezoid, a triangle, a circle or an irregular shape.
[0174] It is understandable that the relative position between the third rear leakage channel 112 and the first magnetic member 11 is not limited to Fig.23 That is, the third rear leakage channel 112 can be located at any position of the first magnetic member 11 .
[0175] Exemplarily, the speaker 100 may also include a mesh (attached Fig.23 (not shown in the figure), the mesh cloth may cover the opening of the third rear leakage channel 112 located on the inner side surface 11a of the first magnetic member 11.
[0176] It can be understood that the third rear leakage channel 112 connects the inner cavity 70 of the speaker 100 to the outside of the speaker 100. In this way, the internal air pressure of the speaker 100 can be balanced with the external air pressure of the speaker 100. Compared with the solution of only providing the first rear leakage channel 35, and / or providing the first rear leakage channel 35 and the second rear leakage channel 147 at the same time, the third rear leakage channel 112 can cooperate with the first rear leakage channel 35 to provide a more stable and efficient rear leakage channel, and the performance of balancing the internal air pressure and the external air pressure of the speaker 100 is better.
[0177] Fig.24 yes Fig. 22 The structure diagram of the loudspeaker 100 shown in another embodiment is shown. Fig.24 The dotted arrow in the figure schematically shows the path connecting the inner cavity 70 of the speaker 100 with the outside of the speaker 100.
[0178] like Fig.24 As shown, the first magnetic conductive member 13 includes a first surface 13a and a second surface 13b. Exemplarily, the first surface 13a and the second surface 13b of the first magnetic conductive member 13 may be arranged in opposite directions. The first surface 13a of the first magnetic conductive member 13 may be a surface of the first magnetic conductive member 13 facing the first magnetic member 11.
[0179] Exemplarily, the first magnetic conductive member 13 has a first region 13 c. The first region 13 c is an annular region in the middle of the first magnetic conductive member 13 that is not fixedly connected to the first magnetic member 11 and the second magnetic member 12 .
[0180] Exemplarily, the first magnetic conductive member 13 is provided with a fourth rear leakage channel 131. The fourth rear leakage channel 131 may penetrate the first surface 13a and the second surface 13b of the first magnetic conductive member 13.
[0181] It is understandable that the cross-sectional shape of the fourth rear leakage channel 131 may not be limited to Fig.24 The cross-sectional shape of the fourth rear leakage channel 112 may be a trapezoid, a triangle, a rectangle or an irregular shape, etc.
[0182] For example, the fourth rear leakage channel 131 may be located in the first region 13c of the first magnetic conductive member 13. It is understood that the relative position between the fourth rear leakage channel 131 and the first region 13c of the first magnetic conductive member 13 is not limited to Fig.24 That is, the fourth rear leakage channel 131 can be located at any position of the first area 13c of the first magnetic conductive member 13 .
[0183] It can be understood that the fourth rear leakage channel 131 connects the inner cavity 70 of the speaker 100 to the outside of the speaker 100. In this way, the internal air pressure of the speaker 100 can be balanced with the external air pressure of the speaker 100. Compared with the solution of only setting the first rear leakage channel 35, and / or setting the first rear leakage channel 35 and the second rear leakage channel 147 at the same time, and / or setting the first rear leakage channel 35, the second rear leakage channel 147 and the third rear leakage channel 112 at the same time, the first rear leakage channel 35, the second rear leakage channel 147, the third rear leakage channel 112 and the fourth rear leakage channel 131 can cooperate to provide a more stable and efficient rear leakage channel, and the performance of balancing the internal air pressure and the external air pressure of the speaker 100 is better.
[0184] It is understandable that the speaker 100 may be provided with only one of the first rear leakage channel 35, the second rear leakage channel 147, the third rear leakage channel 112 and the fourth rear leakage channel 131, or two or more of them may be provided at the same time, which is not specifically limited in the present application.
[0185] It can be understood that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.
[0186] It is understandable that all the above drawings are illustrative illustrations of the present application and do not represent the actual size of the product. And the dimensional ratio relationship between the components in the drawings does not serve as a limitation on the actual product of the present application. The above are only some embodiments and implementation methods of the present application. The protection scope of the present application is not limited to this. Any technician familiar with the field can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A loudspeaker (100), characterized in that: It comprises a magnetic circuit assembly (10), a circuit board (20), a glue layer (30), a diaphragm assembly (40) and a voice coil (50); The diaphragm assembly (40) is fixedly connected to the magnetic circuit assembly (10); the diaphragm assembly (40) and the magnetic circuit assembly (10) enclose at least a portion of an inner cavity (70) of the loudspeaker (100); the voice coil (50) is located in the inner cavity (70) of the loudspeaker (100); one end of the voice coil (50) is fixedly connected to the diaphragm assembly (40), and the other end is located in the magnetic circuit assembly (10); The circuit board (20) is fixed to the magnetic circuit assembly (10) via the adhesive layer (30); at least a portion of the circuit board (20) and at least a portion of the adhesive layer (30) are located between the magnetic circuit assembly (10) and the diaphragm assembly (40); and the circuit board (20) is electrically connected to the voice coil (50); The adhesive layer (30) is provided with a first rear leakage channel (35), and the first rear leakage channel (35) connects the inner cavity (70) of the speaker (100) to the outside of the speaker (100).
2. The loudspeaker (100) according to claim 1, characterized in that The magnetic circuit assembly (10) comprises a first magnetic component (11), a second magnetic component (12), a first magnetic conductive component (13) and a second magnetic conductive component (14); the first magnetic component (11) has a first through hole (111); The first magnetic member (11) and the second magnetic member (12) are fixed on the same side of the first magnetic conductive member (13); the second magnetic member (12) is located in the first through hole (111) of the first magnetic member (11) and is spaced apart from the first magnetic member (11); The second magnetic conductive member (14) has a notch (14b), and the notch (14b) connects the inner side of the second magnetic conductive member (14) to the outer side of the second magnetic conductive member (14); The second magnetic conductive member (14) is fixed to a surface of the first magnetic member (11) away from the first magnetic conductive member (13), and the diaphragm assembly (40) is fixed to a surface of the second magnetic conductive member (14) away from the first magnetic member (11); The circuit board (20) comprises a first part (21), the adhesive layer (30) comprises a first adhesive portion (33), the first part (21) is fixedly connected to the first magnetic member (11) via the first adhesive portion (33), and the first part (21) and the first adhesive portion (33) are located at the notch (14b); The first rear leakage channel (35) is located at the first bonding portion (33).
3. The loudspeaker (100) according to claim 2, characterized in that: The second magnetic conductive member (14) comprises a main body (141) and a protruding portion (142); the protruding portion (142) is protruding from the surface of the main body (141); the protruding portion (142) is fixed to the surface of the first magnetic member (11) away from the first magnetic conductive member (13); the main body (141) and the first magnetic member (11) are arranged at a distance; the main body (141), the protruding portion (142) and the first magnetic member (11) enclose an installation space (16); and the diaphragm assembly (40) is fixed to the surface of the main body (141) away from the first magnetic member (11); The circuit board (20) comprises a second part (22), the second part (22) is connected to the first part (21), the adhesive layer (30) comprises a second adhesive portion (34), the second adhesive portion (34) is connected to the first adhesive portion (33), the second part (22) is fixedly connected to the first magnetic part (11) via the second adhesive portion (34), and the second part (22) and the second adhesive portion (34) are located in the installation space (16).
4. The loudspeaker (100) according to claim 2 or 3, characterized in that: The second magnetic conductive member (14) is provided with a second rear leakage channel (147), and the second rear leakage channel (147) connects the inner cavity (70) of the speaker (100) to the outside of the speaker (100).
5. The loudspeaker (100) according to claim 4, characterized in that: The second rear leakage channel (147) is arranged opposite to the first rear leakage channel (35).
6. The loudspeaker (100) according to claim 2 or 3, characterized in that: The first magnetic component (11) is provided with a third rear leakage channel (112), and the third rear leakage channel (112) connects the inner cavity (70) of the speaker (100) to the outside of the speaker (100), and / or the first magnetic conductive component (13) is provided with a fourth rear leakage channel (131), and the fourth rear leakage channel (131) connects the inner cavity (70) of the speaker (100) to the outside of the speaker (100).
7. The loudspeaker (100) according to claim 2 or 3, characterized in that: The first rear leakage channel (35) passes through the inner side surface (32a), the outer side surface (32b) and the bottom surface (31b) of the first bonding portion (33), or the first rear leakage channel (35) passes through the inner side surface (32a), the outer side surface (32b), the bottom surface (31b) and the top surface (31a) of the first bonding portion (33), wherein the top surface (31a) of the first bonding portion (33) is bonded to the circuit board (20), the top surface (31a) of the first bonding portion (33) is arranged in back to back relation with the bottom surface (31b), and the inner side surface (32a) and the outer side surface (32b) of the first bonding portion (33) are arranged in back to back relation.
8. The loudspeaker (100) according to any one of claims 1 to 3, characterized in that: The width of the first rear leakage channel (35) is a, and a satisfies: 1mm≤a≤3mm; the length of the first rear leakage channel (35) is b, and b satisfies: 0.1mm≤b≤1.5mm; the depth of the first rear leakage channel (35) is c, and c satisfies: c<0.7mm.
9. The loudspeaker (100) according to claim 2 or 3, characterized in that: The loudspeaker (100) further comprises a sealing member (60), wherein the sealing member (60) is fixedly connected to the circuit board (20) and the diaphragm assembly (40), and the sealing member (60) is located in the notch (14b) and is used to seal the notch (14b).
10. The loudspeaker (100) according to claim 2 or 3, characterized in that: The adhesive layer (30) and the circuit board (20) are integrally formed.
11. The loudspeaker (100) according to claim 2 or 3, characterized in that: The magnetic circuit assembly (10) further comprises a third magnetic conductive member (15), wherein the third magnetic conductive member (15) is fixed to a side of the second magnetic member (12) away from the first magnetic conductive member (13), and the third magnetic conductive member (15) is spaced apart from the second magnetic conductive member (14).
12. The loudspeaker (100) according to claim 2 or 3, characterized in that: The diaphragm assembly (40) comprises a diaphragm (41) and a steel ring (42); the steel ring (42) is fixed to a side of the second magnetic conductive component (14) away from the first magnetic component (11); and the diaphragm (41) is fixed to a side of the steel ring (42) away from the second magnetic conductive component (14).
13. The loudspeaker (100) according to claim 2 or 3, characterized in that: The loudspeaker (100) is used to emit sound in a first frequency band, wherein the frequency of the first frequency band is in the range of 5 kHz to 20 kHz.
14. An electronic device (1000), characterized in that: The invention comprises a housing (200) and a loudspeaker (100) according to any one of claims 1 to 13, wherein the loudspeaker (100) is mounted on the housing (200).
15. The electronic device (1000) according to claim 14, characterized in that: The electronic device (1000) further comprises a second speaker (300), wherein the second speaker (300) is installed in the housing (200), and the second speaker (300) is used to emit sound in a second frequency band, wherein the frequency of the second frequency band is in the range of 20 Hz to 5 kHz.
16. The electronic device (1000) according to claim 15, characterized in that: The housing (200) is provided with a sound outlet (201), and the second speaker (300) is located on a side of the speaker (100) away from the sound outlet (201).
